CN103624396B - 传热板的制造方法 - Google Patents

传热板的制造方法 Download PDF

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Publication number
CN103624396B
CN103624396B CN201310548745.7A CN201310548745A CN103624396B CN 103624396 B CN103624396 B CN 103624396B CN 201310548745 A CN201310548745 A CN 201310548745A CN 103624396 B CN103624396 B CN 103624396B
Authority
CN
China
Prior art keywords
mentioned
hardware
thermal medium
medium pipe
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310548745.7A
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English (en)
Chinese (zh)
Other versions
CN103624396A (zh
Inventor
濑尾伸城
堀久司
牧田慎也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008259396A external-priority patent/JP5141487B2/ja
Priority claimed from JP2008263694A external-priority patent/JP5163419B2/ja
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Publication of CN103624396A publication Critical patent/CN103624396A/zh
Application granted granted Critical
Publication of CN103624396B publication Critical patent/CN103624396B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/129Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding specially adapted for particular articles or workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D9/00Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/04Tubular or hollow articles
    • B23K2101/14Heat exchangers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CN201310548745.7A 2008-10-06 2009-09-04 传热板的制造方法 Active CN103624396B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008259396A JP5141487B2 (ja) 2008-10-06 2008-10-06 伝熱板の製造方法
JP2008-259396 2008-10-06
JP2008-263694 2008-10-10
JP2008263694A JP5163419B2 (ja) 2008-10-10 2008-10-10 伝熱板の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200980138293.7A Division CN102159357B (zh) 2008-10-06 2009-09-04 传热板的制造方法

Publications (2)

Publication Number Publication Date
CN103624396A CN103624396A (zh) 2014-03-12
CN103624396B true CN103624396B (zh) 2016-06-22

Family

ID=42100484

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201310548745.7A Active CN103624396B (zh) 2008-10-06 2009-09-04 传热板的制造方法
CN200980138293.7A Active CN102159357B (zh) 2008-10-06 2009-09-04 传热板的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200980138293.7A Active CN102159357B (zh) 2008-10-06 2009-09-04 传热板的制造方法

Country Status (4)

Country Link
KR (1) KR101249186B1 (ko)
CN (2) CN103624396B (ko)
TW (1) TWI402477B (ko)
WO (1) WO2010041529A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102226568A (zh) * 2011-05-05 2011-10-26 苏宇贵 空调悬挂式辐射换热板及空调机组
JP2014094409A (ja) 2012-10-10 2014-05-22 Nippon Light Metal Co Ltd 伝熱板の製造方法及び摩擦攪拌接合方法
AT514053A1 (de) * 2013-02-26 2014-09-15 Neuman Aluminium Fliesspresswerk Gmbh Verfahren zur Herstellung eines Kühlkörpers und Kühlkörper für elektrische Bauteile
KR102109557B1 (ko) * 2013-11-15 2020-05-13 재단법인 포항산업과학연구원 발열체 일체형 가열기구의 제조 장치
WO2016013072A1 (ja) * 2014-07-23 2016-01-28 日本軽金属株式会社 放熱器
JP2016064484A (ja) * 2014-09-25 2016-04-28 日本軽金属株式会社 放熱器の製造方法及び放熱器
JP6617834B2 (ja) * 2016-07-01 2019-12-11 日本軽金属株式会社 伝熱板の製造方法
CN107900593B (zh) * 2017-12-25 2023-10-31 苏州格洛佛精密科技有限公司 动铁喇叭传导杆焊接用多功能装置
US11562911B2 (en) 2019-07-25 2023-01-24 Hitachi Energy Switzerland Ag Power semiconductor module and method of forming the same
KR102529141B1 (ko) * 2021-05-07 2023-06-07 (주) 성부 마찰 교반 용접을 통한 내부공간을 갖는 밀폐수로 제작 방법
TWI820476B (zh) * 2021-08-25 2023-11-01 均賀科技股份有限公司 熱交換器結構

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366480A (zh) * 2000-04-28 2002-08-28 马自达汽车株式会社 加工金属构件的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001313357A (ja) * 2000-04-27 2001-11-09 Hitachi Ltd ヒートシンク板の製作方法及びヒートシンク構造
JP3818084B2 (ja) * 2000-12-22 2006-09-06 日立電線株式会社 冷却板とその製造方法及びスパッタリングターゲットとその製造方法
WO2003001136A1 (fr) * 2001-06-20 2003-01-03 Showa Denko K.K. Plaque de refroidissement et son procede de production
JP4325260B2 (ja) * 2003-04-15 2009-09-02 日本軽金属株式会社 伝熱素子の製造方法
JP4305273B2 (ja) * 2004-05-11 2009-07-29 日本軽金属株式会社 熱交換板の製造方法、および、熱交換器の製造方法
JP2006102777A (ja) * 2004-10-06 2006-04-20 Hitachi Industries Co Ltd ひずみ矯正方法とその装置
JP4808949B2 (ja) * 2004-10-12 2011-11-02 助川電気工業株式会社 埋込ヒータを有する発熱体の製造方法
JP5151036B2 (ja) * 2006-02-07 2013-02-27 株式会社日立製作所 摩擦攪拌接合方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366480A (zh) * 2000-04-28 2002-08-28 马自达汽车株式会社 加工金属构件的方法

Also Published As

Publication number Publication date
WO2010041529A1 (ja) 2010-04-15
KR20110082164A (ko) 2011-07-18
CN103624396A (zh) 2014-03-12
CN102159357B (zh) 2014-04-16
TW201022620A (en) 2010-06-16
KR101249186B1 (ko) 2013-04-02
CN102159357A (zh) 2011-08-17
TWI402477B (zh) 2013-07-21

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