CN103624323B - 一种无热阵列波导光栅波分复用器的切割工艺 - Google Patents
一种无热阵列波导光栅波分复用器的切割工艺 Download PDFInfo
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US7135385B1 (en) * | 2004-04-23 | 2006-11-14 | National Semiconductor Corporation | Semiconductor devices having a back surface protective coating |
CN102081192A (zh) * | 2010-12-29 | 2011-06-01 | 武汉光迅科技股份有限公司 | 用于阵列波导光栅芯片的切缝方法 |
CN102756432A (zh) * | 2012-08-07 | 2012-10-31 | 浙江富春江光电科技股份有限公司 | 一种plc晶圆切割方法 |
CN103235364A (zh) * | 2013-04-28 | 2013-08-07 | 四川天邑康和通信股份有限公司 | 平面光波导分路器芯片切割工艺 |
CN103345018A (zh) * | 2013-06-28 | 2013-10-09 | 武汉光迅科技股份有限公司 | 一种曲线型阵列波导光栅芯片的切割方法及其切割用夹具 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7135385B1 (en) * | 2004-04-23 | 2006-11-14 | National Semiconductor Corporation | Semiconductor devices having a back surface protective coating |
CN102081192A (zh) * | 2010-12-29 | 2011-06-01 | 武汉光迅科技股份有限公司 | 用于阵列波导光栅芯片的切缝方法 |
CN102756432A (zh) * | 2012-08-07 | 2012-10-31 | 浙江富春江光电科技股份有限公司 | 一种plc晶圆切割方法 |
CN103235364A (zh) * | 2013-04-28 | 2013-08-07 | 四川天邑康和通信股份有限公司 | 平面光波导分路器芯片切割工艺 |
CN103345018A (zh) * | 2013-06-28 | 2013-10-09 | 武汉光迅科技股份有限公司 | 一种曲线型阵列波导光栅芯片的切割方法及其切割用夹具 |
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