CN103624323B - 一种无热阵列波导光栅波分复用器的切割工艺 - Google Patents

一种无热阵列波导光栅波分复用器的切割工艺 Download PDF

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CN103624323B
CN103624323B CN201310517138.4A CN201310517138A CN103624323B CN 103624323 B CN103624323 B CN 103624323B CN 201310517138 A CN201310517138 A CN 201310517138A CN 103624323 B CN103624323 B CN 103624323B
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CN103624323A (zh
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蔡文龙
郭连波
胡诚
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Wuhan Yilut Technology Co ltd
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Abstract

本发明公开了一种无热阵列波导光栅波分复用器的切割工艺,包括以下步骤:(1)将特制的金属切割盘于机器之上;(2)放置3块粘接好芯片的金属底座于金属切割盘上,分别与3组螺丝孔对齐,将螺丝放入3组螺丝孔中,将螺丝锁紧,使用指定位置测高方法将刀片与金属底座高度置零,将高度参数输入在切割机中,最后调整好切割位置,便可进行切割;(3)切割完成后松开螺丝取出,即完成切割工序。本发明流程简单化,操作方便,大大提高生产效率;成本低,无需使用耗材等其他辅助设备;准确性高,避免人工测量的误差,提高了生产良率。

Description

一种无热阵列波导光栅波分复用器的切割工艺
技术领域
本发明具体为一种无热阵列波导光栅波分复用器的切割工艺。
背景技术
目前实现无热AWG 方法几种,其中平面波导移动型被各大厂家研究探索,其方法简单可靠性高,但是平面波导切割这一技术难关一直没有被攻克,基板部分厂家有使用切割方法其工艺复杂,良品率低下。传统的切割工艺是使用高精度切割机安装精密切割刀片,
刀片安装完成后,使用切割盘测高方法将刀片与切割盘高度置零,再将芯片用特定胶水粘
接于特制的金属底座之上,再将粘接好芯片的底座贴附于UV 膜上,将预先测量的UV 膜、金属底座、胶层和芯片的厚度以及其他重要参数输入在切割机里面,调整好切割位置进行切割,切割完成后使用解胶机去掉UV 膜的粘性,取下后即完成切割工序。但由于芯片呈倒V形,且夹角很小,而切割中只需要切割一边,机器的横向切割位置是以切割盘的纵向中心线为中心向两边计算,为了避免未切断或者切过头的情况发生,贴UV 膜之时,必须将芯片单边纵向中心线与切割盘纵向中心线对齐,操作起来相当负责,且位置相当严格;UV膜解胶麻烦,需要使用解胶机,UV 膜和解胶机价格都相当昂贵;因为切割刀片很薄很脆,是不可以切割金属的,否则刀片可能会发生崩刀和缺角等问题,这样的刀片切割出来的芯片是不合格的。虽然前面已经对刀片和切割盘的高度进行了置零动作,但是中间又隔了UV膜、金属底座的高度,所以每切割一片都需要反复测量UV 膜和金属底座的厚度,并且确保无误,否则会切到金属底座又或者未切透的情况。
发明内容
本发明所解决的技术问题在于提供一种无热阵列波导光栅波分复用器的切割工
艺,以解决上述背景技术中提出的问题。
为了达到上述目的,本发明采用以下技术方案来实现:一种无热阵列波导光栅波
分复用器的切割工艺,包括以下步骤:
(1)将特制的金属切割盘放于机器之上,金属切割盘上有3 组螺丝孔,孔径与金属底座
上的一致,螺丝孔位置按照金属底座粘接芯片后预切割的位置相对应;
(2)放置3 块粘接好芯片的金属底座于金属切割盘上,分别与3 组螺丝孔对齐,将螺丝放入3 组螺丝孔中,将螺丝锁紧,使用指定位置将刀片与金属底座高度置调零,将高度参数输入在切割机中,最后调整好切割位置,便可进行切割;
(3)切割完成后松开螺丝取出,即完成切割工序。
有益效果:
本发明流程简单化,操作方便,大大提高生产效率;成本低,无需使用耗材等其他辅助
设备;准确性高,避免人工测量的误差,提高了生产良率。
具体实施方式
为了使本发明的技术手段、创作特征、工作流程、使用方法达成目的与功效易于明
白了解,下面结合本发明具体实施例,进一步阐述本发明。
一种无热阵列波导光栅波分复用器的切割工艺,包括以下步骤:
(1)将特制的金属切割盘放于机器之上,金属切割盘上有3 组螺丝孔,孔径与金属底座
上的一致,螺丝孔位置按照金属底座粘接芯片后预切割的位置相对应;
(2)放置3 块粘接好芯片的金属底座于金属切割盘上,分别与3 组螺丝孔对齐,将螺丝放入3 组螺丝孔中,将螺丝锁紧,使用指定位置将刀片与金属底座高度置调零,将高度参数输入在切割机中,最后调整好切割位置,便可进行切割;
(3)切割完成后松开螺丝取出,即完成切割工序。
以上显示和描述了本发明的基本原理和主要特征及本发明的优点,本行业的技术
人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本
发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变
化和改进都落入要求保护的本发明范围内,本发明要求保护范围由所附的权利要求书及其
等效物界定。

Claims (1)

1.一种无热阵列波导光栅波分复用器的切割工艺,其特征在于,包括以下步骤:
(1)将特制的金属切割盘放于机器之上,金属切割盘上有3 组螺丝孔,孔径与金属底座上的一致,螺丝孔位置按照金属底座粘接芯片后预切割的位置相对应;
(2)放置3 块粘接好芯片的金属底座于金属切割盘上,分别与3 组螺丝孔对齐,将螺丝放入3 组螺丝孔中,将螺丝锁紧,使用指定位置将刀片与金属底座高度值 调零,将高度参数输入在切割机中,最后调整好切割位置,便可进行切割;
(3)切割完成后松开螺丝取出,即完成切割工序。
CN201310517138.4A 2013-10-29 2013-10-29 一种无热阵列波导光栅波分复用器的切割工艺 Active CN103624323B (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7135385B1 (en) * 2004-04-23 2006-11-14 National Semiconductor Corporation Semiconductor devices having a back surface protective coating
CN102081192A (zh) * 2010-12-29 2011-06-01 武汉光迅科技股份有限公司 用于阵列波导光栅芯片的切缝方法
CN102756432A (zh) * 2012-08-07 2012-10-31 浙江富春江光电科技股份有限公司 一种plc晶圆切割方法
CN103235364A (zh) * 2013-04-28 2013-08-07 四川天邑康和通信股份有限公司 平面光波导分路器芯片切割工艺
CN103345018A (zh) * 2013-06-28 2013-10-09 武汉光迅科技股份有限公司 一种曲线型阵列波导光栅芯片的切割方法及其切割用夹具

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7135385B1 (en) * 2004-04-23 2006-11-14 National Semiconductor Corporation Semiconductor devices having a back surface protective coating
CN102081192A (zh) * 2010-12-29 2011-06-01 武汉光迅科技股份有限公司 用于阵列波导光栅芯片的切缝方法
CN102756432A (zh) * 2012-08-07 2012-10-31 浙江富春江光电科技股份有限公司 一种plc晶圆切割方法
CN103235364A (zh) * 2013-04-28 2013-08-07 四川天邑康和通信股份有限公司 平面光波导分路器芯片切割工艺
CN103345018A (zh) * 2013-06-28 2013-10-09 武汉光迅科技股份有限公司 一种曲线型阵列波导光栅芯片的切割方法及其切割用夹具

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