CN103590044B - A kind of metal polish - Google Patents
A kind of metal polish Download PDFInfo
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- CN103590044B CN103590044B CN201310545882.5A CN201310545882A CN103590044B CN 103590044 B CN103590044 B CN 103590044B CN 201310545882 A CN201310545882 A CN 201310545882A CN 103590044 B CN103590044 B CN 103590044B
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Abstract
The present invention relates to a kind of metal polish, become and percentage by weight as follows: surfactant 7-10%, organic acid 8-10%, solubilizer 1.5-2%, water surplus; Described surfactant is sodium sulfate of polyethenoxy ether of fatty alcohol, neopelex and AEO, and organic acid is citric acid and oleic acid, and solubilizer is triethanolamine and NaOH. Metal polish prepared by the present invention is applicable to stainless steel tableware, contains organic acid oleic acid and citric acid, and oleic acid and citric acid can increase the activity of metal surface, improves polishing effect, increases the result of use of this polishing agent.
Description
Technical field
The invention belongs to metal processing aid field, especially a kind of metal polish and preparation method thereof.
Background technology
Metallic article in use, due to oxidation in air, moist or contact chemical substance and corrosivityThe reasons such as gas, cause metallic article surface corrosion, adhere to foul greasy dirt situation, in order to increase metallic articleAny surface finish, usually adopts chemical metal detergent or metal polish to process. Metal polish is goldOne important procedure of metal surface processing, for the chemical substance of metalwork surface finish processing. Be divided into paste andLiquid. Paste general types has: white antiscuffing paste, green polishing composition, red antiscuffing paste, paste polishing agent etc.
Liquid metals polishing agent product generally contains strong acid or phosphate, contaminated environment, and cleaning efficiency is low.
Solid metal antiscuffing paste is with fine gtinding sand, aluminium oxide and polishing wet goods mineral matter, through specially treated andThe toothpaste body that emulsify at a high speed is made, belongs to fine chemical product, does not do multiple granularity with meticulous being as the criterion. Effect: goldMetal surface decontamination, polishing, manually polish and the effect of metal surface protection. Can be divided into import and domestic two kinds.Imported and famous brand is a lot, and outward appearance is beautiful, but price is very expensive. For high-grade mould, precision instrument or partDecontamination is polished. Domestic, metal surface fine gtinding is polished nursing cream, and import primary raw material and technique are utilized highIt is easy to use that speed emulsification processes toothpaste-like. Due to cheap, be widely used in various metal surfaces, goDirty, polish, nurse, finer and smoother because of abrasive sand, be again manual polishing, generally can not stay in metal surfaceLower vestige, can reach again light as new outward appearance, and according to bright stock and oxide mass, content, metal is polishedCream also has clean bright cream and common two kinds of the cream of polishing fast.
According to the retrieval, finding following patent documentation metal polish (CN101532137A), is by percentage by weight2-7% neopelex, 1.5-5% enuatrol, 8-15% ethanol, 4-8% emulsifying agentNP-10,5-8% emulsifying agent TW-80,0.2-0.8% oleic acid triglycolyl amine, 1-4% coconut oil alkylAlkylolamides phosphate ester salt, 1-4% defoamer, 0.5-2.5% sodium phosphate, 1-3% natrium citricum,0.3-1.2% cysteine LBGAS, 0.35-1% potassium hydroxide and excess water are prepared into.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of cleaning performance good, polishing efficiency is high,Metal polish free from environmental pollution, cost is low and preparation method thereof.
The technical scheme that the present invention realizes object is as follows:
A kind of metal polish, become and percentage by weight as follows
Described surfactant is that sodium sulfate of polyethenoxy ether of fatty alcohol, neopelex and alkyl phenol are poly-Oxygen vinethene, organic acid is citric acid and oleic acid, solubilizer is triethanolamine and NaOH;
Or described surfactant is AEO, dodecyl phenenyl sulfate and detergent alkylateSodium sulfonate, organic acid are that oleic acid, solubilizer are triethanolamine and NaOH;
Or described surfactant is lauric acid amide of ethanol, AEO and detergent alkylateSodium sulfonate, organic acid is citric acid and oleic acid, solubilizer is triethanolamine and NaOH.
And the constituent of described metal polish and percentage by weight are:
And the constituent of described metal polish and percentage by weight are:
And, the consisting of of described metal polish:
Advantage of the present invention and beneficial effect are as follows:
1, the metal polish that prepared by the present invention is applicable to stainless steel tableware, contains organic acid oleic acid and citric acid,Oleic acid and citric acid can increase the activity of metal surface, improve polishing effect, increase the result of use of this polishing agent.
2, the metal polish that prepared by the present invention contains kinds of surface activating agent, is surface-active of different natureAgent is carried out composite, obtains having the polishing agent that functional effect is good.
3, the metal polish that prepared by the present invention can be used for shaking polishing, can be used for again tumbling, costLow, making water is base solvent, environmental protection, and free from environmental pollution, preparation method is simple.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further described, and following embodiment is illustrative, is not to limitProperty, can not limit protection scope of the present invention with following embodiment.
A kind of medal polish cream, by surfactant, solubilizer, organic acid, inorganic base and water composition, variousComponent accounts for:
Concrete recommendation shown in following 3 embodiment of composition.
Embodiment 1:
A kind of metal polish, by sodium sulfate of polyethenoxy ether of fatty alcohol, neopelex, alkyl acidPolyoxyethylene acid, citric acid, oleic acid and triethanolamine and NaOH, and water, add respectively in retortBe uniformly mixed.
The percentage by weight that various acid is shared:
Manufacture the preparation method of above-mentioned medal polish cream, water is added in retort and dissolves citric acid by solid materialAfter CL, add sodium sulfate of polyethenoxy ether of fatty alcohol, neopelex, alkyl acid APEOAnd triethanolamine, after add oleic acid and stir, sodium hydrate aqueous solution, regulates pH=5, to obtain final product.
Embodiment 2:
A kind of metal polish, by AEO, dodecyl phenenyl sulfate, detergent alkylate sulphurAcid sodium, triethanolamine, benzoic acid, oleic acid, NaOH and water, the percentage by weight that each component is shared:
Manufacture the preparation method of above-mentioned medal polish cream: after water is added, complete after benzoic solid material drops intoPortion dissolve, after add AEO, dodecyl phenenyl sulfate, neopelex and threeMonoethanolamine, after add oleic acid to stir, sodium hydrate aqueous solution is progressively added to (regulate pH=5.5),.
Embodiment 3:
A kind of metal polish, by lauric acid amide of ethanol, AEO, detergent alkylate sulphurAcid sodium and triethanolamine, citric acid, oleic acid and NaOH and water, add respectively in retort and be uniformly mixed allThe percentage by weight that even each component is shared:
Manufacture the preparation method of above-mentioned medal polish cream: after water is added, citric acid adds after adding rear whole dissolvingEnter lauric acid amide of ethanol, AEO, neopelex and triethanolamine, after addEnter oleic acid and stir and evenly mix, sodium hydrate aqueous solution is progressively added to (regulating pH=5), to obtain final product.
Above-mentioned polishing agent is for the polishing of stainless steel tableware.
The present invention compares the reality of acquisition with the composition of the disclosed embodiment 1 of patent documentation CN101712848ATest data.
Polishing fluid | Embodiment 1 | Embodiment 2 | Contrast sample (CN101712848A) |
Add concentration | 3‰ | 3‰ | 3‰ |
The temperature of vibropolish | Normal temperature | Normal temperature | Normal temperature |
The average polished time | 12-15 minute | 8-10 minute | 15-20 minute |
Cost | A | 90%A | 120%A |
Color and luster | Cold light | Cold light | White light |
Claims (2)
1. a metal polish, is characterized in that: the constituent of described metal polish and weight percentThan being:
2. a metal polish, is characterized in that: the constituent of described metal polish and weight percentThan being:
Priority Applications (1)
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CN201310545882.5A CN103590044B (en) | 2013-11-06 | 2013-11-06 | A kind of metal polish |
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CN201310545882.5A CN103590044B (en) | 2013-11-06 | 2013-11-06 | A kind of metal polish |
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CN103590044A CN103590044A (en) | 2014-02-19 |
CN103590044B true CN103590044B (en) | 2016-05-04 |
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Families Citing this family (18)
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CN104947114B (en) * | 2014-10-13 | 2020-06-19 | 庆云昊天焊材科技有限公司 | Cold water copper-plated welding wire polishing solution |
CN104450246A (en) * | 2014-11-13 | 2015-03-25 | 王爱国 | Kitchen cleaning agent |
CN105239073A (en) * | 2015-11-10 | 2016-01-13 | 荆门市拓达科技有限公司 | Polishing solution for metal polishing |
CN105463466A (en) * | 2015-11-22 | 2016-04-06 | 全椒县志宏机电设备设计有限公司 | Polishing liquid for stainless steel mechanical equipment and preparing method of polishing liquid |
CN105671555A (en) * | 2016-04-10 | 2016-06-15 | 李金平 | Metal surface polishing agent |
CN105778863B (en) * | 2016-04-20 | 2018-06-29 | 廊坊市北方天宇机电技术有限公司 | A kind of aluminium wheel centrifugal barrel finishing grinding fluid and preparation method thereof |
CN105970230A (en) * | 2016-07-10 | 2016-09-28 | 李金平 | Environment-friendly chemical polishing solution |
CN106435592B (en) * | 2016-08-17 | 2018-08-21 | 安徽红桥金属制造有限公司 | A kind of stainless steel spring chemical polishing agent and preparation method thereof |
CN106757040A (en) * | 2016-12-01 | 2017-05-31 | 三达奥克化学股份有限公司 | Powder metallurgical stainless steel precision workpiece light decorations process agent and production method |
CN106637218A (en) * | 2016-12-24 | 2017-05-10 | 李月巧 | Polishing agent and preparation method thereof |
CN106987841A (en) * | 2017-04-28 | 2017-07-28 | 舒城久联精密机械有限公司 | Apply the stainless steel polishing agent in precision optical machinery process |
WO2019006668A1 (en) * | 2017-07-04 | 2019-01-10 | 深圳市恒兆智科技有限公司 | Polishing agent, copper part and polishing process therefor |
CN107699141A (en) * | 2017-11-27 | 2018-02-16 | 苏州市宽道模具机械有限公司 | A kind of polishing agent and preparation method thereof |
CN109096925A (en) * | 2018-07-02 | 2018-12-28 | 湖州师范学院 | A kind of environmentally protective scratch resistance aqua type lapping liquid and preparation method thereof |
CN109023390A (en) * | 2018-09-28 | 2018-12-18 | 天津圳鹏清洗技术开发有限公司 | Medical metal cleaning polishing agent and preparation method thereof |
CN111015376A (en) * | 2019-12-18 | 2020-04-17 | 安徽省潜山县志发机电配件有限公司 | Surface polishing process for electromechanical equipment |
CN116286202A (en) * | 2022-09-07 | 2023-06-23 | 山东宙雨消防科技股份有限公司 | Manufacturing method of environment-friendly cleaning fluid |
CN115466574A (en) * | 2022-09-21 | 2022-12-13 | 深圳市东方亮化学材料有限公司 | Processing method of double-component metal grinding and polishing paste |
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CN1970665A (en) * | 2006-12-07 | 2007-05-30 | 西北工业大学 | Polishing liquid and method for polishing II-VI compound semiconductor wafer |
CN101532137A (en) * | 2009-04-21 | 2009-09-16 | 刘丽 | Metal polishing agent |
CN101864247A (en) * | 2010-07-20 | 2010-10-20 | 南京航空航天大学 | Abrasive material-free polishing fluid for chemical mechanical polishing of rigid fragile material |
Family Cites Families (1)
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US20010054706A1 (en) * | 1999-07-19 | 2001-12-27 | Joseph A. Levert | Compositions and processes for spin etch planarization |
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CN1970665A (en) * | 2006-12-07 | 2007-05-30 | 西北工业大学 | Polishing liquid and method for polishing II-VI compound semiconductor wafer |
CN101532137A (en) * | 2009-04-21 | 2009-09-16 | 刘丽 | Metal polishing agent |
CN101864247A (en) * | 2010-07-20 | 2010-10-20 | 南京航空航天大学 | Abrasive material-free polishing fluid for chemical mechanical polishing of rigid fragile material |
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