CN103582781A - 半导体设备的冷却 - Google Patents

半导体设备的冷却 Download PDF

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CN103582781A
CN103582781A CN201280027043.8A CN201280027043A CN103582781A CN 103582781 A CN103582781 A CN 103582781A CN 201280027043 A CN201280027043 A CN 201280027043A CN 103582781 A CN103582781 A CN 103582781A
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G·G·德瓦尔
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QCK LEZMIN 4414 T/A MARULATECH
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    • F21V29/89—Metals
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Abstract

诸如LED照明设备的半导体设备包括衬底片（2）和多个被支撑在衬底片的正面上的LED（4）。多个孔（9）延伸通过衬底片（2）以及导管或管子（1）形式的热传导元件延伸通过孔，同时垫（10）形式的热传导元件延伸在LED与导管（1）之间。每个导管（1）设定了无障碍地延伸通过衬底片（2）的正面与背面之间的孔（9）的开放通道。在LED中产生的热量被传导至导管（1），其中热量通过对流消散。

Description

半导体设备的冷却
技术领域
本发明涉及半导体设备的冷却。特别地，本发明涉及普通印刷电路板上的大功率LED（发光二极管）的组件和冷却。本发明于此参照包含LED的照明设备进行描述，但适用于任何半导体设备。
背景技术
随着能源价格的逐步上升和节省能源必要性的增加，对LED光照（lighting）解决方案的需求有所增长。不燃烧灯丝或气体的作为固态光照的LED比大多其他形式的光照更有效。然而，LED仍然会由于流经于其的电流而产生热量，该热量会对使用期限和此类设备的性能造成不利的影响。当LED彼此极其接近地聚集时会出现过热，但是由于降低了多重阴影，LED的紧密聚集是重要的，并且因此被称为“点阵（dotting）”。
目前，在大功率LED装置中，通过结合了散热器、强制流式通风器以及特殊的铝质印刷电路板来从紧密聚集的LED中移除热量。这些方法大多依靠通过从LED的电极（导热垫）至印刷电路板的背面的直接接触来传导热量，其中热量从印刷电路板的背面扩散至散热器并消散至周围的空气。大多散热器由铝制成并且是能源密集型的以对这种LED灯的整个（生命周期）能源效率产生并具有不利的影响。
随着温度从印刷电路板的中心进一步地降低，温度梯度出现在这种散热器中。放置在板中心的LED将比放在该板的外侧的LED更热，并且对放置在中心的LED的性能和/或使用期限有不利的影响。
热量是由在放置LED的印刷电路板的正面的LED产生的，而意图移除该热量的部分被放置在印刷电路板的背面。印刷电路板本身形成了热传递的障碍。更昂贵的铝质印刷电路板被用于增强朝向电路板的背面的热传导性。
这些LED装置的示例包括：
WO2009/067558、US2008/0191231、US2002/175621和US2005/083698公开了固态散热器元件的使用，该固态散热器元件从LED的背面延伸通过其所安装的印刷电路板，从而热量通过经由散热器元件的传导性从LED转移并且在电路板的背面被扩散；
US2007/0145383公开了一种LED装置，该LED装置具有经由基膜安装在电路板的正面上的散热层的LED；
WO02/097884公开了支撑在金属电路板上LED，并且在电路板的背面具有凸出；
US5,278,432公开了支撑在散热器衬底的LED矩阵，并且可以选择在衬底的背面的具有强制气流的散热器。
所有这些为了冷却紧密聚集的LED的努力导致了成本以及LED组件的形状因素（即过大的尺寸）的增加。
本发明力图提供半导体的组件，诸如在具有改进的冷却半导体/LED的普通印刷电路板上极其接近的LED，优选地，避免了对在电路板背面安装传统散热器以及昂贵的印刷电路板的需求；并且在一些实例中不需要引起强制气流。
发明内容
根据本发明，提供了一种半导体设备，包括：
衬底片，该衬底片具有正面和背面并且设定了多个孔，每个孔延伸在所述正面与背面之间；
多个半导体，该多个半导体被支撑在所述衬底片的正面上；以及
热传导元件，该热导体元件与所述半导体以及所述孔的外围的热传播良好；
其中所述热传导元件中的至少一些热传导元件设定了开放通道，该开放通道无阻碍地延伸通过所述衬底片的正面与背面之间的所述孔。
所述半导体中的至少一些半导体可以是LED并且所述衬底片可以是普通印刷电路板。
所述热传导元件可以包括传导片材料（10），该传导片材料延伸在所述LED与所述孔之间，所述导体片材料优选地沿着所述衬底片的正面延伸。
所述热传导元件可以包括热传导导管，该热传导导管被放置在所述孔的内部，并且在所述衬底片的正面与背面之间设定所述开放通道。所述内部通道中的至少一些内部通道可以具有相对于所述衬底片横向延伸的方向，并且所述导管中的至少一些导管可以凸出超过所述衬底片的正面表面和/或背面表面。
所述设备可以包括诸如风扇的通风器，该通风器被配置为在从所述衬底片的正面至所述衬底片的背面的方向通过所述孔（以及通过所述导管的内部通道）引起气流。
附图说明
为了更好地理解本发明，以及示出本发明是如何被执行以产生效果的，本发明将参照附图以非限制的示例的方式被描述，其中：
图1根据本发明示出了半导体组件的正视图；
图2示出了图1的组件的侧视图；以及
图3示出了图1的半导体组件的印刷电路板的一部分的细节的俯视图。
具体实施方式
参照附图，照明设备或半导体组件被示出，包括普通印刷电路板（PCB）2形式的衬底片，该衬底片中填充有LED4形式的半导体阵列，这些LED在PCB的顶部以彼此非常接近的形式聚集。从诸如介电/环氧树脂层压的传统材料制成的意义上来说，PCB2是“普通”PCB并且可以是双面PCB。透镜3被安装在每个LED4的顶部来扩散或指引由LED发射的光。
组件被示出并描述为具有顶部、侧部和底部，但是本领域技术人员可以理解，其事实上可以安置于任何方向，并且这里参照的“顶部”和“底部”仅出于清楚的目的。组件的顶部可以被替代地看作是其“正面”并且底部被看作是“背面”。
多个孔或通孔9被设定在PCB2中的透镜3之间的空闲空间中并且延伸在PCB的顶部与底部之间，以及以铜管1的形式的导管被安置在通孔9的内部，每一个导管具有自顶至底的方向并且被压配或焊接至PCB。其他热传导材料可以替代铜管1而被使用，如同石墨烯。具有不同横截面形状的导管可以替代圆柱形管1而被使用，或者至少设定不同形状的内部通道——尤其是具有增加的内部表面面积的形状以改善热传递并因此减少所需的管/导管的长度并且从而改善装置的形成因素。铜管1并不必然是导管的理想选择，并且如果导管具有更大的内部面积，如如果导管具有内部散热器等，那么导管的热耗散效率将会被改善。然而，铜管1易得、划算（相比较于具有内部凸起的导管），可以被容易地焊接并具有适合的壁厚——足够厚以传导热量且足够薄以不会侵占内部通道。
可以在图3中最佳地看出，热传导材料的薄层形式的导热垫10在PCB2的顶部提供并沿着每个LED4延伸。LED4的基底被安置为与导热垫10良好地热接触并且导热垫围绕邻近的通孔9和铜管1延伸，以使得LED4的基底提供从LED至铜管1的良好的热传导的路径。通孔9的内侧镀有诸如铜的热的良导体，如上所述，铜管1通过焊接或压配而安置至通孔9以提供良好的热接触。本质上，在LED4下方的导热垫10被直接连接至铜管1，该铜管1有助于从LED驱散热量（见下文）。
可以在图2中最佳地看出，在PCB2顶部凸出的每个铜管1的长度比在底部7凸出的长，从而导管延伸在透镜3之间。如参考数字6所示，强制流式通风器5或风扇在PCB2的下方提供并且被配置为向下驱散空气。温度传感器8在PCB2的底部7提供并且可以被用于反馈环路来通过控制通风器5的速度来控制装置的温度。
在使用中，在LED中产生的热量经由导热垫10被非常有效地传导至铜管1并加热该铜管。由通风器5引起的气流6使在铜管1内的气流向下，并且来自LED4的热量在铜管内被非常有效地从铜管内壁消散（移除），成为气流6。
在组件被倒转的本发明的实施方式中，即，LED4直接向下，由LED产生的热量仍然被传导至铜管1，但是在一些实例中，向铜管内部空气传递热量已经足够使通过自然对流的气流向上——因此避免了对通风器5的需求。
在本发明的而一些实施方式中，气流可以被反转，从PCB2的背面反转至正面，无论通过强制还是自然气流。然而，在大多数应用中，优选地从照明区域移除热量，如，在设备被用于照明食品店的区域。
由于铜管1在PCB2的顶部（正面）上凸出，在与安装LED4且产生热量的同侧，热量不需要仅通过传导被传递至PCB的底部（背面），而是热量通过对流被从铜管1移除，实际上是空气可以在铜管内的通道中流动的而导致了对流。这与在PCB背面上需要散热器（因为在PCB的正面安置散热器是不切实际或不可能的）以及热量必须通过PCB被传导至散热器的现有装置形成了鲜明的对比。
由于每个LED被铜管包围，LED4与铜管1之间的距离很短，并且由于每个LED非常接近于铜管，相比较于传统散热器，从PCB的中心至周围有更少的温度梯度。
除了上述的优点，LED4非常有效地被冷却并且因此相比较于现有组件可以彼此更加接近地使用，可以在更低的温度进行操作和/或可以以更高的功率输出进行操作。获得这种优秀的冷却不需要昂贵的热传导的PCB或散热器，并且在一些情况中不需要通风器5。
同样，主要由于在PCB的背面没有大型的散热器，本发明的组件明显地比现有组件更加紧凑（具有更小的形状因素）。
本发明拥有的特别的优势在于，在与LED4的照明方向相反的方向（即，正面至背面的气流）引起（强制通风或自然对流）气流6，并且相应地，热量不会在由LED照明的组件正面的区域消散或累积。

Claims (10)

1.一种半导体设备，包括：
衬底片（2），该衬底片（2）具有正面和背面并且设定了多个孔（9），每个孔延伸在所述正面与背面之间；
多个半导体（4），该多个半导体（4）被支撑在所述衬底片的正面上；以及
热传导元件（1，10），该热传导元件与所述半导体以及所述孔的外围的热传播良好；
其特征在于，所述热传导元件（1）中的至少一些热传导元件设定了开放通道，该开放通道无阻碍地延伸通过所述衬底片的正面与背面之间的所述孔。
2.根据权利要求1所述的照明设备，其中所述半导体中的至少一些半导体是LED（4）。
3.根据权利要求1或权利要求2所述的照明设备，其特征在于，所述衬底片是普通印刷电路板（2）。
4.根据上述权利要求中的任一项权利要求所述的照明设备，其特征在于，所述热传导元件包括传导片材料（10），该传导片材料延伸在所述半导体（4）与所述孔（9）之间。
5.根据权利要求4所述的照明设备，其特征在于，所述传导片材料（10）沿着所述衬底片（2）的正面延伸。
6.根据上述权利要求中的任一项权利要求所述的照明设备，其特征在于，所述热传导元件包括热传导导管（1），该热传导导管被放置在所述孔（9）的内部，并且在所述衬底片的正面与背面之间设定了所述开放通道。
7.根据权利要求6所述的照明设备，其特征在于，所述内部通道中的至少一些内部通道具有相对于所述衬底片横向延伸的方向。
8.根据权利要求6或权利要求7所述的照明设备，其特征在于，所述导管（1）中的至少一些导管凸出超过所述衬底片（2）的正面。
9.根据权利要求6至8中的任一项权利要求所述的照明设备，其特征在于，所述导管（1）中的至少一些导管凸出超过所述衬底片（2）的背面。
10.根据上述权利要求中的任一项权利要求所述的照明设备，其特征在于，所述设备包括通风器（5），该通风器（5）被配置为在从所述衬底片（2）的正面至所述衬底片的背面的方向通过所述开放通道引起气流（6）。
CN201280027043.8A 2011-05-31 2012-02-15 半导体设备的冷却 Pending CN103582781A (zh)

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