CN103579455B - The manufacture method of light-emitting device - Google Patents
The manufacture method of light-emitting device Download PDFInfo
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- CN103579455B CN103579455B CN201310325432.5A CN201310325432A CN103579455B CN 103579455 B CN103579455 B CN 103579455B CN 201310325432 A CN201310325432 A CN 201310325432A CN 103579455 B CN103579455 B CN 103579455B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 60
- 238000009434 installation Methods 0.000 claims abstract description 81
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of manufacture method for the light-emitting device that the light-emitting device for having used light emitting diode can be more manufactured inexpensively than prior art.Multiple installation portions that the manufacture method of the light-emitting device is manufactured on wire are provided with the light-emitting device of light emitting diode, when the distance along the wire between adjacent installation portion is set into L1, so that the mode that the air line distance between the installation portion turns into L2 (L2 ＜ L1) keeps the wire, each installation portion on the wire being kept installs multiple light emitting diodes.
Description
Technical field
The present invention relates to the manufacture method for the light-emitting device for having used light emitting diode.
Background technology
In recent years, LED illumination has been used or has been opened using LED TV with the light-emitting device of the light emitting diode of backlight etc.
Begin to popularize.
However, having used the light-emitting device of light emitting diode to be gone back compared with the existing light-emitting device such as incandescent lamp or fluorescent lamp
It is high price, in order to expand the popularization of this light-emitting device for having used light emitting diode, it is necessary to realize further low price.
The content of the invention
Therefore, it can be more manufactured inexpensively than prior art it is an object of the invention to provide one kind and use luminous two
The manufacture method of the light-emitting device of the light-emitting device of pole pipe.
According to the present invention, above-mentioned problem is solved by following scheme.
The present invention provides a kind of manufacture method of light-emitting device, and its multiple installation portion for being used to manufacture on wire is provided with
The light-emitting device of light emitting diode, the manufacture method of the light-emitting device is characterised by, by between adjacent installation portion along institute
When the distance for stating wire is set to L1, so that mode of the air line distance as L2 (L2 ＜ L1) between the installation portion keeps described and led
Line, each installation portion on the wire being kept installs multiple light emitting diodes.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, make the wire and multiple rod structures
Part intersects and the air line distance is turned into L2.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, make the wire with being alternately arranged
Multiple bar members and multiple convex portions intersect and make the air line distance turn into L2.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, led on bar member described in winding
Line and make the air line distance turn into L2.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, led on bar member described in winding
The bar member is alongst cut off after line and the air line distance is turned into L2.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, so that the adjacent installation portion
Between air line distance turn into L3 (L2 ＜ L3≤L1) mode and release the holding of the wire for being provided with multiple light emitting diodes.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, the containment member of translucency is utilized
Multiple light emitting diodes on the wire are sealed.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, first containing fluorophor is utilized
After containment member is separately sealed to multiple light emitting diodes, sealed using the second containment member to described first
Component is sealed.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, first containing fluorophor is utilized
After containment member is separately sealed to multiple light emitting diodes, using the second containment member in the lump to multiple first
Containment member is sealed.
In addition, the manufacture method of the above-mentioned light-emitting device of the present invention is characterised by, the wire is pasted on matrix
On, described keep is carried out to the wire being pasted on the matrix.
【Invention effect】
In accordance with the invention it is possible to more be manufactured inexpensively the light-emitting device for having used light emitting diode than prior art.
Brief description of the drawings
Fig. 1 is the flow chart for the manufacture method for illustrating the light-emitting device that embodiments of the present invention are related to.
Fig. 2 is the figure of one for representing LED chip.
Fig. 3 is the figure for the first case for illustrating encapsulating method.
Fig. 4 is the figure for the second case for illustrating encapsulating method.
Fig. 5 is the figure for representing to have used manufacturer's rule (one) of the light-emitting device of fabric formula bending method.
Fig. 6 be represent to have used the light-emitting device of fabric formula bending method manufacturer's rule (secondly) figure.
Fig. 7 be represent to have used the light-emitting device of fabric formula bending method manufacturer's rule (thirdly) figure.
Fig. 8 is the figure for representing to have used manufacturer's rule (one) of the light-emitting device of rod male bending method.
Fig. 9 be represent to have used the light-emitting device of rod male bending method manufacturer's rule (secondly) figure.
Figure 10 be represent to have used the light-emitting device of rod male bending method manufacturer's rule (thirdly) figure.
Figure 11 is the figure for representing to have used manufacturer's rule (its four) of the light-emitting device of rod male bending method.
Figure 12 is the figure for representing to have used manufacturer's rule (one) of the light-emitting device of rod rolling bending method.
Figure 13 be represent to have used the light-emitting device of rod rolling bending method manufacturer's rule (secondly) figure.
Figure 14 be represent to have used the light-emitting device of rod rolling bending method manufacturer's rule (thirdly) figure.
Figure 15 is the figure for representing to have used manufacturer's rule of the light-emitting device of rod cutting type bending method.
【Symbol description】
1 sapphire substrate
2a semiconductor layers
2b semiconductor layers
3a p-electrodes
3b n-electrodes
4 dielectric films
5a p pad electrodes
5b n pad electrodes
11 light emitting diodes
12 grafting materials
13 wires
14 matrixes
15 containment members
The containment members of 15a first
The containment members of 15b second
16 dykes
17 bar members
18 reflecting elements
19 spacing members
20 short-circuit conductors
21 films
23 projections
25 diaphragms
27 rollers
Embodiment
Hereinafter, referring to the drawings, the mode for implementing the present invention is illustrated.
Fig. 1 is the flow chart for the manufacture method for illustrating the light-emitting device that embodiments of the present invention are related to.
As shown in figure 1, the manufacture method for the light-emitting device that embodiments of the present invention are related to is to be used to manufacture in wire 13
On installation portion be provided with multiple light emitting diodes 11 light-emitting device method, including the first process S1, the second process
S2, the 3rd process S3 and the 4th process S4.
[the first process S1]
First process S1 is so that the air line distance between adjacent installation portion on wire 13 turns into L2 (L2 ＜ L1) side
The process that formula keeps wire 13.L1 and L2 is real number more than 0, L1 represent between adjacent installation portion along wire 13 away from
From.Along the length of the distance specifically guide line 13 of wire 13.
(wire 13)
As wire 13, conductive various materials can be used, but preferably use the material of excellent electric conductivity.Example
Such as it is preferable to use the low metal wire of the resistivity of copper, gold, aluminium, silver or their composite (copper-clad aluminum conductor, conjunction
Gold thread etc.).Additionally, it is preferred that the material being easily bent, (tireless) material of breakage is not easy to even if preferably bending.
It should be noted that Pd, Pt, Ag etc. noble metal plating or tin system plating can be implemented to wire 13.Especially Ag platings, by
It is high in light reflectivity, therefore, it is possible to improve the brightness of light-emitting device, so that it is preferred that.Additionally, it is preferred that with described later by light-emitting diodes
Pipe 11 is installed on the good material of compatibility of the component of installation portion.Specifically, for example weldering has been used in the component installed
In the case of tin material, the wire of noble metal plating or tin system plating is preferable to carry out.
As wire 13, the wire with coating covered around metal wire by insulating component can be used.If using band
Coating wire, then can make multiple conductive contacts, therefore, it is possible to assemble various circuits.As band coating wire, for example, it can make
With magnet-wire (enamel-covered wire, copper strap wire, strap wire, parallel wires, copper-clad aluminum conductor, winding wire) etc..
In addition, as wire 13, lenticular wire can also be used or used the local round wires flattened by punching press, rolling
Deng.In such manner, it is possible to ensure the bonding area of wire 13 and light emitting diode 11, light emitting diode 11 can be easily installed.Separately
Outside, wire 13 can be the aggregate of multiple wire rods as such as twisted wire.Based on the characteristic required by light-emitting device, installed
The size of light emitting diode 11 etc., the thickness or width of wire 13 can be more than 0. mm~a few mm.
In addition, as wire 13, can use by being covered the surface of the line of insulator with electric conductor, using insulator again
The component of covering.It is same with having used the situation with coating wire by using such wire, multiple wires can be made
Contact, therefore, it is possible to assemble various circuits, and can realize the light-emitting device of light weight.
(the air line distance L2 between adjacent installation portion)
It is used as the method that the air line distance made between adjacent installation portion is L2, it is known to wire 13 is bent, bend, reversed
Deng method, at this point it is possible to use the auxiliary parts such as bar member.It should be noted that fabric formula bending method described later, rod are convex
Formula bending method, rod rolling bending method, rod cutting type bending method etc. are to make the air line distance between adjacent installation portion be L2
One of method.
(installation portion)
Installation portion can be multiple, can be at two, or more than at three.
In the case where using band coating wire as wire 13, at the installation portion on wire 13, pass through grinding, air
Heat of heater or scolding tin light etc. etc. removes coating and exposes cored wire, can be electrically connected with light emitting diode 11.
For installation portion, preferably after by punching press etc. by the installation portion planarization on wire 13, remove coating and make
Cored wire exposes.In such manner, it is possible to make the installation of light emitting diode 11 stable.
[the second process S2]
Second process S2 is the process that each installation portion on the wire 13 being kept installs multiple light emitting diodes 11.
(installation of light emitting diode 11)
As the mounting means of light emitting diode 11, such as in the case where installing the light emitting diode 11 before being packaged,
It can enumerate wire bonding and the chip mode that combines of engagement or be flip-chip mounted etc. and to be used as one.Especially upside-down mounting
Method for Installation, due to mounting and light emitting diode 11 on the guiding line 13 of light emitting diode 11 and wire 13 can be carried out simultaneously
Electrical connection, therefore, it is possible to improve production.In the case where being flip-chip mounted, led to constituting more than two of positive and negative electrode
Line 13 is kept in the first process S1.
The grafting material of installation portion (with reference to the symbol 12 in Fig. 3 described later, 4) is installed on as by light emitting diode 11,
In the case where carrying out the electrical connection of light emitting diode 11 and wire 13 (installation portion), can use with Au-Sn, Sn-Cu-Ag,
Sn-Cu, Sn-Bi or Sn-Zn are the gold such as the scolding tin or anisotropic conductive paste, silver paste agent, copper paste, carbon paste agent, Au of representative
Belong to the electrical grafting material of the salient point of material etc..In addition, in the case of without electrical connection, the epoxy of insulating properties can be used
The heat-curing resins such as resin, silicone resin.Alternatively, it is also possible to as such as ultrasonic bonding, fusion method without using engagement
Material and the electrode of light emitting diode 11 is directly engaged with wire 13.
Electric wire used can use the metals such as Au, Ag, Al, Cu and their alloy or be plated in terminal conjunction method
Alloy fine rule.As the middle salient point used is flip-chip mounted, it is preferable to use Au and its alloy.
(light emitting diode 11)
As light emitting diode 11, for example, it can use surface mounting LED, bullet cut LED, LED chip, chip-scale envelope
Fill the various light emitting diodes such as LED.In addition, carrying out blue-light-emitting by being laminated with the light-transmitting substrates such as sapphire substrate
LED chip of GaN semiconductor etc. is combined as light emitting diode 11 and with wavelength converting member described later, can be with especially desirable
Ground is used for the light-emitting device used as lighting device.
In the case where being flip-chip mounted, as light emitting diode 11, positive and negative electrode is preferably used with roughly equal
Size formation LED chip.Particularly preferably use and be provided between the electrode of installation and the electrode contacted with semiconductor layer
Dielectric film, the electrode of installation are with than electricity LED chip (the such LED core that greatly area is set contacted with semiconductor layer
The one of piece is for example shown in Fig. 2).Thereby, it is possible to easily carry out the installation on the limited wire of erection space, therefore, it is possible to simultaneously
Realize brightness and the production of light-emitting device.
Fig. 2 is the figure of one for representing LED chip, and Fig. 2 (a) is top view, and Fig. 2 (b) is to represent that the A-A in Fig. 2 (a) is cut
The sectional view in face.A LED chip being related to shown in Fig. 2 possesses sapphire substrate 1, p type semiconductor layer 2a and n-type semiconductor
Layer 2b, P electrode 3a and n-electrode 3b, insulating barrier 4, P pad electrode 5a and n pad electrodes 5b.
Dielectric film 4 is arranged between P pad electrode 5a and n pad electrodes 5b, and n pad electrodes 5b is in dielectric film 4
On set with the area bigger than n-type semiconductor layer 2b and n-electrode 3b contact area.In addition, p pad electrode 5a and n sides are welded
Disc electrode 5b is formed with roughly equal size.If as described above, used such LED chip as light emitting diode 11,
Then can be easily installed the installation on the limited wire 13 of area, therefore, it is possible to realize simultaneously light-emitting device brightness and
Production.For example, in Fig. 2 LED chip, two electrodes the both ends of the length direction of the rectangular shape of LED chip with
Set, observe in the longitudinal direction with the width of the width same degree of rectangle, have between side's electrode and the opposing party's electrode
Either with or without the non-electrode forming portion for forming electrode, than two electrodes of non-electrode forming portion are small.By the way that the non-electrode forming portion is used
In the light-emitting device that embodiments of the present invention are related to, thus, it is possible to easily contrast less LED chip between arbitrary
Every being flip-chip mounted.Additionally, it is preferred that using LED chip of the one side for the size of 0.1mm to 3mm or so rectangle.
[the 3rd process S3]
3rd process S3 refers to so that the air line distance between adjacent installation portion turns into L3 (L2 ＜ L3≤L1) mode solution
The process that holding except the wire 13 for being provided with multiple light emitting diodes 11 or the holding to wire 13 are adjusted.L3 be more than
0 real number.It should be noted that in embodiment described later, one is used as using L3=L1 situation., can in L3 ＜ L1
To adjust the distance between light emitting diode after mounting.
[the 4th process S4]
4th process S4 refers to the multiple light emitting diodes 11 being arranged on 15 pairs of the containment member of translucency on wire 13
Carry out sealed process.As the containment member 15 of translucency, silicone resin, epoxy resin, glass etc. can be used.Translucency
It is the property for instigating incident light to pass through more than 50%.Containment member 15 can the optical wavelength containing spontaneous optical diode 11 in the future
It is converted into the fluorophor of the light of different wave length.So, various tones, luminous light can be provided using white, light bulb color as representative
Spectrum, therefore, it is possible to tackle various market demands.
Specifically, in the case where light emitting diode 11 sends blue light, can enumerate send sodium yellow YAG systems it is glimmering
Body of light, the LAG systems fluorophor for sending green light, SiAlON systems fluorophor, the CASN fluorophor for sending red light, SCASN fluorescence
Body etc. is used as one of fluorophor.If containment member 15 contains above-mentioned fluorophor, luminous the two of blue light can sent
Combination sends the SiAlON systems fluorophor of green light and sends the CASN fluorophor of red light, therefore colorrendering quality in pole pipe 11
Height, can form the light-emitting device of the light source of backlight suitable for TV etc..If containing in addition, being combined in containment member 15
The LAG systems of green light~sodium yellow, YAG systems fluorophor, the fluorophor for sending red light etc. are sent, then with using a kind of fluorophor
Situation compare, color rendition (Ra) improve, light suitable for illuminating light source, sending white light bulb color can be formed
Light-emitting device.
Furthermore it is also possible to containing making the light pervasion component of light scattering.Thereby, it is possible to obtain desired luminous intensity distribution and prevent color
It is mutually uneven.As the material of light pervasion component, TiO can be enumerated2、SiO2、Al2O3、MgO、MgCO3、CaCO3、Mg(OH)2、Ca
(OH)2Deng.
It is preferred that containment member 15 to light emitting diode 11 in addition to sealing, also to installation portion, installation portion periphery
Wire 13 is sealed.Thereby, it is possible to improve the intensity of light-emitting device, qualification rate is improved, therefore, it is possible to inexpensively form luminous
Device.
The sealing of containment member 15 can be by using the molding of casting shell, to perfusion on light emitting diode 11, print
Brush, transmit the various methods such as molding, compression molded, injection molded to carry out.In addition, the sealing of containment member 15 can be only respectively
(first case of encapsulating method described later) on the spot is carried out to each light emitting diode 11, can also be in the lump to multiple light emitting diodes
11 carry out (second case of encapsulating method described later).
As long as this process is after the second process, it can be carried out before the 3rd process, can also be in the 3rd process
Carry out afterwards.That is, as long as this process is carried out after light emitting diode 11 is installed on installation portion, can be between installation portion away from
From as being sealed in the state of L2, distance that can also be between installation portion is sealed in the state of turning into L3.By inciting somebody to action
This process is carried out before the 3rd process, due to that can improve productive temp the reasons why the installation with light emitting diode 11 is same,
Cheap light-emitting device can be formed.
Fig. 3 is the figure for the first case for illustrating encapsulating method, and Fig. 3 (a) is top view, and Fig. 3 (b) is side view, and Fig. 3 (C) is
Front view.
As shown in figure 3, in embodiments of the present invention, dome-type first sealing containing fluorophor can be being utilized
After component 15a is separately sealed to multiple light emitting diodes 11, recycle dome-type second containment member 15b points
Independently the first containment member 15a is not sealed.So, in addition to sealing light emitting diode 11, additionally it is possible to sealing peace
Dress portion, the wire 13 on installation portion periphery.Further, since containment member 15 is formed as multilayer, therefore, it is possible to realize luminous two simultaneously
The protection of pole pipe 11 and the mechanical strength of light-emitting device.
Fig. 4 is the figure for the second case for illustrating encapsulating method, and Fig. 4 (a) is top view, and Fig. 4 (b) is side view, and Fig. 4 (C) is
Front view.
As shown in figure 4, in embodiments of the present invention, it is only using the first containment member 15a difference containing fluorophor
After on the spot being sealed to multiple light emitting diodes 11, the second containment member 15b is recycled in the lump to multiple first containment members
15a is sealed.So, in addition to sealing light emitting diode 11, installation portion, the wire on installation portion periphery can also be sealed
13.Further, since containment member 15 is formed as multilayer, therefore, it is possible to realize protection and the light-emitting device of light emitting diode 11 simultaneously
Mechanical strength.
In the first case and second case of encapsulating method described above, LED chip is preferably used as light emitting diode
11, and directly covered the LED chip using the first containment member 15a.In such manner, it is possible to realize the reduction of member of formation, process
The cost cutting that is brought of shortening.
Moreover, as the first containment member 15a, preferably using the material softer than the second containment member 15b (close as second
Component 15b is sealed, the material harder than the first containment member 15a is preferably used).In such manner, it is possible to prevent because the thermal expansion of material is different
Deng caused by the stress of generation such as electric wire fracture so electrically connect it is bad.It should be noted that " soft material " can be lifted
Go out the low material of vitrification point, the material such as silicone-based resin, " hard material " can enumerate the high material of vitrification point, example
Such as epoxy system resin material.
The manufacture method for the light-emitting device that embodiments of the present invention from the description above are related to, when manufacture is in wire 13
On installation portion when being provided with the light-emitting device of multiple light emitting diodes 11, the straight line between adjacent installation portion on wire 13 away from
It is shorter along the distance L1 of wire 13 than between the installation portion from L2, (light emitting diode 11 is pacified therefore, it is possible to reduce erecting device
Device loaded on wire 13) productive temp time, by increasing capacitance it is possible to increase the number of the installable light emitting diode 11 of time per unit.
Thus, the manufacture method for the light-emitting device being related to according to the embodiment of the present invention can realize operating efficiency
Improve, the light-emitting device for having used light emitting diode 11 can be more manufactured inexpensively out than prior art.
Then, embodiments of the invention are illustrated.
【Embodiment 1】
First, as embodiments of the invention 1, the manufacture method to the light-emitting device using fabric formula bending method is entered
Row explanation.The manufacture method for having used the light-emitting device of fabric formula bending method is to make wire 13 intersect to make with multiple bar members
Air line distance between adjacent installation portion turns into L2 method.It is close by the installation for improving light emitting diode 11 according to this method
Degree, thus, it is possible to reduce the productive temp time of erecting device, so as to promote a large amount of productions, cost to decline.In addition, this method energy
Configure to enough installation portion two dimensions (wire 13 extended direction and perpendicular direction) by wire 13, be consequently adapted to shape
Into the light-emitting device of planar.
[the manufacturer's rule (one) for having used the light-emitting device of fabric formula bending method]
Fig. 5 is the figure for representing to have used manufacturer's rule (one) of the light-emitting device of fabric formula bending method, Fig. 5 (a)
The top view of multiple bar members 17 and the wire 13 intersected with this multiple bar member 17, Fig. 5 (b) be multiple bar members 17 and with
The side view for the wire 13 that this multiple bar member 17 intersects, Fig. 5 (c) is the top view for the wire 13 being stretched.
As shown in figure 5, in manufacturer's rule (one) of the light-emitting device of fabric formula bending method has been used, making eight
Wire 13 arranges many and intersected with multiple bar members 17 substantially in parallel.In such manner, it is possible to make adjacent on eight wires 13
Air line distance between installation portion is simultaneously as L2.
Eight wires 13 are used so that two are one group, a side of multiple light emitting diodes 11 in one group of wire 13
Install to (anode) and the opposing party's (negative electrode).
In the state of the multiple bar members 17 of top view, eight wires 13 appear in difference with two groups of adjacent wires 13
The mode of upper surface of bar member 17 intersect.So, with appearing in the upper of same bar member 17 with two groups of adjacent wires 13
The situation that the mode on surface is intersected is compared, and the installation portion on two groups of adjacent wires 13 is more nearly, therefore light emitting diode 11
Packing density improve, the productive temp time of erecting device can be reduced, so as to promote a large amount of productions, cost to decline.
So that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light-emitting diodes
The wire 13 of pipe 11 is extended, and multiple light emitting diodes 11 are sealed with containment member 15 respectively.The hair so produced
Shown in electro-optical device such as Fig. 5 (c), multiple light emitting diodes 11 are connected in parallel.It should be noted that by the mode of wire 13 " elongation "
It is one of the mode for the holding for releasing wire 13.In addition, in light-emitting device as present embodiment, L2+ light-emitting diodes
Size≤L3 of pipe.
[used the light-emitting device of fabric formula bending method manufacturer's rule (secondly)]
Fig. 6 be represent to have used the light-emitting device of fabric formula bending method manufacturer's rule (secondly) figure, Fig. 6 (a)
The top view of multiple bar members 17 and the wire 13 intersected with this multiple bar member 17, Fig. 6 (b) be multiple bar members 17 and with
The side view for the wire 13 that this multiple bar member 17 intersects, Fig. 6 (c) is the top view for the wire 13 being stretched.
As shown in fig. 6, used manufacturer's rule of light-emitting device of fabric formula bending method (secondly) in, make the six roots of sensation
Wire 13 and multiple bar members 17 of proper alignment intersect.
In the state of the multiple bar members 17 of top view, six conductors 13 appear in odd number with adjacent wire 13
The mode of the upper surface of bar member 17 is intersected.
Six conductors 13 are used so that two are one group, a side of multiple light emitting diodes 11 in adjacent wire 13
(anode) and the opposing party's (negative electrode) it is flip-chip mounted.Wherein, multiple light emitting diodes 11 are in (1+n × 4) individual bar member 17
With (n for more than 0 integer) on (3+n × 4) individual bar member 17 across wire 13 it is different.That is, in (1+n × 4) individual rod
The wire 13 that the upper surface of component 17 is used as anode makes in the upper surface of (3+n × 4) individual bar member 17 as negative electrode
With the wire 13 used in the upper surface of (1+n × 4) individual bar member 17 as negative electrode is in (3+n × 4) individual bar member 17
Upper surface is used as anode.
Used manufacturer's rule of light-emitting device of fabric formula bending method (secondly) in, make multiple 17 points of bar members
For epimere and hypomere ground proper alignment, proper alignment into epimere multiple bar members 17 and proper alignment into hypomere multiple rods
Spacing member 19 is set between component 17.So, with by multiple proper alignments of bar member 17 into one section of situation compared with, energy
Each installation portion of wire 13 is more nearly each other, can further reduce productive temp time.
So that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light-emitting diodes
The six conductors 13 of pipe 11 are extended, and multiple light emitting diodes 11 are sealed with containment member 15 and top view is understood, such as Fig. 6
(c) shown in, multiple light emitting diodes 11 are connected in series or in parallel.It should be noted that as described above, by wire 13
The mode of " elongation " is one of the mode for the holding for releasing wire 13.
[used the light-emitting device of fabric formula bending method manufacturer's rule (thirdly)]
Fig. 7 be represent to have used the light-emitting device of fabric formula bending method manufacturer's rule (thirdly) figure, Fig. 7 (a)
The film 21 with insulating properties and flexibility for being provided with slit (is capable of the one of the component with insulating properties and flexibility of pasting wire
Example) top view, Fig. 7 (b) is the top view for the wire 13 being pasted onto on the film 21 provided with slit, and Fig. 7 (c) is to be pasted onto to be provided with
The top view of wire 13 and multiple bar members 17 on the film 21 of slit.
As shown in fig. 7, used the light-emitting device of fabric formula bending method manufacturer's rule (thirdly) with without using film
21 above-mentioned manufacturer's rule (secondly) difference be, the pasting wire 13 on the film 21 provided with slit, in wire
Multiple light emitting diodes 11 are installed on 13.
According to manufacturer's rule of the light-emitting device for having used fabric formula bending method (thirdly), because wire 13 is pasted onto
On film 21 with flexibility, therefore for being applied to light-emitting device is absorbed by the flexure of film 21 during fabrication and when using
Power, can reduce the mechanical stress of the electrical engagement portion that is applied to (i.e. installation portion), and can be continuously manufactured by out easily broken string (has many
Individual place of incision) light-emitting device and with low price carry out volume production.
【Embodiment 2】
Then, to the manufacture method of the light-emitting device for having used rod male bending method as embodiments of the invention 2
Illustrate.The manufacture method for having used the light-emitting device of rod male bending method be instigate wire 13 be alternately arranged it is multiple
Bar member and multiple convex portions intersect and the air line distance between adjacent installation portion is turned into L2 method.
, can even if the number of increase wire 13 is without the position adjustment for carrying out spacing member according to this method
Make to pull down a direction of the direction of bar member for top, therefore, it is possible to easily carry out reel-to-reel (reel to reel) formula
Processing, therefore, it is possible to the automation of the large area, manufacture method of easily realizing light-emitting device, the reduction of cost of implementation.In addition,
This method can two-dimensionally configure the installation portion on wire 13, be consequently adapted to combine to form the institute such as display with diffuser plate etc.
The light-emitting device of planar.It should be noted that projection 23 described later is one of convex portion.
[the manufacturer's rule (one) for having used the light-emitting device of rod male bending method]
Fig. 8 is the figure for representing to have used manufacturer's rule (one) of the light-emitting device of rod male bending method, Fig. 8 (a)
The top view of multiple bar members 17 and multiple projections 23 and the wire 13 intersected with them, Fig. 8 (b) be multiple bar members 17 and
The side view of multiple projections 23 and the wire 13 intersected with them, Fig. 8 (c) is the top view for the wire 13 being stretched.
As shown in figure 8, in manufacturer's rule (one) of the light-emitting device of rod male bending method has been used, by making
Ten wires 13 intersect with the multiple bar members 17 and multiple projections 23 that are alternately arranged, thus make the adjacent installation on wire 13
Air line distance between portion is simultaneously as L2.
In the state of the multiple bar members 17 of top view, ten wires 13 appear in each projection 23 with adjacent wire 13
The mode of upper surface intersect.
Ten wires 13 are used so that two are one group, a side of multiple light emitting diodes 11 in adjacent wire 13
Install to (anode) and the opposing party's (negative electrode).
Wire 13 is pulled down from rod, so that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be installed
Ten wires 13 for having multiple light emitting diodes 11 are extended, and multiple light emitting diodes 11 are sealed and bowed with containment member 15
Understood depending on observation, such as shown in Fig. 8 (c), multiple light emitting diodes 11 are connected in parallel.It should be noted that as described above, by wire
The mode of 13 " elongations " is one of the mode for the holding for releasing wire 13.
[used the light-emitting device of rod male bending method manufacturer's rule (secondly)]
Fig. 9 be represent to have used the light-emitting device of rod male bending method manufacturer's rule (secondly) figure, Fig. 9 (a)
The top view of multiple bar members 17 and multiple projections 23 and the wire 13 intersected with them, Fig. 9 (b) be multiple bar members 17 and
The side view of multiple projections 23 and the wire 13 intersected with them, Fig. 9 (c) is the top view for the wire 13 being stretched.
As shown in figure 9, used manufacturer's rule of light-emitting device of rod male bending method (secondly) in, by making
Six conductors 13 are intersected with the multiple bar members 17 and multiple projections 23 that are alternately arranged and make the adjacent installation portion on wire 13
Between air line distance simultaneously as L2.
In the state of the multiple bar members 17 of top view, six conductors 13 appear in each projection 23 with adjacent wire 13
The mode of upper surface intersect.
Six conductors 13 are used so that two are one group, a side of multiple light emitting diodes 11 in adjacent wire 13
Install to (anode) and the opposing party's (negative electrode).Wherein, multiple light emitting diodes 11 are in odd number bar member 17 and even number
On bar member 17 across wire 13 it is different.So, in the manufacturer's rule for the light-emitting device for having used rod male bending method
(secondly) in be installed in there is provided multiple light emitting diodes 11 wires cross position netted light-emitting device.
So that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light-emitting diodes
The six conductors 13 of pipe 11 are extended, and multiple light emitting diodes 11 are carried out sealing with containment member 15 and top view is understood, such as
Shown in Fig. 9 (c), multiple light emitting diodes 11 are connected in parallel or serial fashion.It should be noted that as described above, will lead
The mode of line 13 " elongation " is one of the mode for the holding for releasing wire 13.
It should be noted that used manufacturer's rule of light-emitting device of rod male bending method (secondly) in, it is many
Individual projection 23 is integrally formed.
In addition, used manufacturer's rule of light-emitting device of rod male bending method (secondly) in, in multiple projections
23 upper surface sets diaphragm 25 (one of the component of Pasting wire) to be bonded adjacent wire 13.
[used the light-emitting device of rod male bending method manufacturer's rule (thirdly)]
Figure 10 be represent to have used the light-emitting device of rod male bending method manufacturer's rule (thirdly) figure, Figure 10
(a)~Figure 10 (c), Figure 10 (e) and Figure 10 (f) are top views.In addition, Figure 10 (d) is top view and side view.
Used manufacturer's rule of light-emitting device of rod male bending method (thirdly) in, three wires 13 are parallel
Ground configures (reference picture 10 (a)), and three wires 13 are cut into defined length (reference picture 10 by methods such as punching presses
(b))。
Then, by three wires 13 after cut-out be pasted on one have insulating properties and flexibility matrix 14 (Pasting is led
One of component with insulating properties and flexibility of line 13) on and make their integrated (reference pictures 10 (c)), and make integration
Component intersect (reference picture 10 (d) with multiple bar members 17 and multiple projections 23.It should be noted that such as Figure 10 (d) part
Shown in enlarged drawing, matrix 14 is due to flexibility, therefore the local buckling together with wire 13).Thus, it is adjacent on wire 13
Air line distance between installation portion turns into L2.It should be noted that three wires 13 installation portion and its around reflecting element is set
18 and dyke 16 (reference picture 10 (d)).
Then, light emitting diode 11 is installed on each installation portion of three wires 13 and seals them with containment member 15
(reference picture 10 (e)).
Then, so that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light
The wire 13 of diode 11 extends (reference picture 10 (f)).As described above, being to release wire 13 by the mode of wire 13 " elongation "
One of the mode of holding.
It should be noted that as shown in Figure 10 (f), if short-circuit conductors 20 are arranged on into wire 13 using methods such as meltings
On, then multiple light emitting diodes 11 can be connected in series.
[the manufacturer's rule (its four) for having used the light-emitting device of rod male bending method]
Figure 11 is the figure for representing to have used manufacturer's rule (its four) of the light-emitting device of rod male bending method, Figure 11
(a) be the situation for making wire 13 and matrix 14 intersect with multiple bar members 17 and multiple projections 23 figure, Figure 11 (b) is to represent figure
The figure of Section A-A in 11 (a), Figure 11 (c) is the figure of situation for representing to have extended wire 13 and matrix 14.
In the example shown in Figure 11, wire 13 is cut into defined length using methods such as punching presses, after cut-out
Multiple wires 13 are pasted on netted matrix 14 and make their integrations, and make the component after integration and multiple bar members 17
And multiple projections 23 are intersected in length and breadth.
Light emitting diode 11 is installed on the installation portion of multiple wires 13, light emitting diode 11 is close by containment member 15
Envelope.It should be noted that dyke 16 is provided with around installation portion, to prevent containment member 15 to be not required to strategic point extension.
More than, manufacturer's rule of the light-emitting device using rod male bending method is illustrated, but multiple hairs
The sealing of optical diode 11 can as (one)~(thirdly) shown in release wire 13 holding after carry out, can also
Carried out as shown in (its four) before wire 13 is released.
【Embodiment 3】
Then, to the manufacture method of the light-emitting device for having used rod rolling bending method as embodiments of the invention 3
Illustrate.The manufacture method for having used the light-emitting device of rod rolling bending method is that wire 13 is wound on bar member to make
The method that air line distance turns into L2.According to this method, luminous dress can be manufactured by manufacture device simple in construction and cheap
Put, therefore, it is possible to be manufactured inexpensively light-emitting device (can also reduce the setting area of device).
[the manufacturer's rule (one) for having used the light-emitting device of rod rolling bending method]
Figure 12 is the figure for representing to have used manufacturer's rule (one) of the light-emitting device of rod rolling bending method, Figure 12
(a) be bar member 17 and the wire 13 on the bar member 17 top view and front view, Figure 12 (b) is the He of bar member 17
The side view of wire 13 on the bar member 17, Figure 12 (c) is the top view of the wire 13 after being stretched.Rolled up according to rod
Formula bending method, it is simple with fabric formula bending method, rod male bending method structure compared, suitable for manufacture Straight LED that
The linear light-emitting device of sample.
As shown in figure 12, in manufacturer's rule (one) of the light-emitting device of rod rolling bending method has been used, in rod
Two wires 13 are wound with component 17.
Two wires 13 are used so that two are one group, and the state for the bar member 17 for being wound with wire 13 is observed in side view
Under, pacify to a side (anode) and the opposing party (negative electrode) of multiple light emitting diodes 11 in two one group of adjacent wire 13
Dress.
So that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light-emitting diodes
Two wires 13 of pipe 11 are extended, and multiple light emitting diodes 11 seal using containment member 15 and top view is understood,
As shown in Figure 12 (c), multiple light emitting diodes 11 are connected in parallel.It should be noted that as described above, by wire 13 " elongation "
Mode is one of the mode for the holding for releasing wire 13.
[used the light-emitting device of rod rolling bending method manufacturer's rule (secondly)]
Figure 13 be represent to have used the light-emitting device of rod rolling bending method manufacturer's rule (secondly) figure, Figure 13
(a) be bar member 17 and the wire 13 on the bar member 17 top view and front view (before cut-out), Figure 13 (b) is rod
The top view and front view (after cut-out) of component 17 and the wire 13 on the bar member 17, Figure 13 (c) is bar member 17
With the top view and front view (after installation) of the wire 13 on the bar member 17, Figure 13 (d) is the wire after being stretched
13 top view.
As shown in figure 13, used manufacturer's rule of light-emitting device of rod rolling bending method (secondly) in, in rod
A wire 13 is wound with component 17.
A piece wire 13 is temporarily fixed in the state of using film etc. on bar member 17, and by along bar member
17 length direction cut-out.Multiple light emitting diodes 11 are using by cutting off the one end produced and the other end as anode and negative electrode
On a wire 13.
So that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light-emitting diodes
A piece wire 13 of pipe 11 is extended, and multiple light emitting diodes 11 seal using containment member 15 and top view is understood,
As shown in Figure 13 (d), multiple light emitting diodes 11 are connected in series.It should be noted that as described above, by wire 13 " elongation "
Mode is one of the mode for the holding for releasing wire 13.
[used the light-emitting device of rod rolling bending method manufacturer's rule (thirdly)]
Figure 14 be represent to have used the light-emitting device of rod rolling bending method manufacturer's rule (thirdly) figure, Figure 14
(a) it is the figure of situation that represents to be pasted on wire 13 using roller 27 on matrix 14, Figure 14 (b) is bar member 17 and wound on this
The top view (before cut-out) of wire 13 and matrix 14 on bar member 17, Figure 14 (c) is bar member 17 and wound on the bar member
The top view (after cut-out) of wire 13 and matrix 14 on 17, Figure 14 (d) is bar member 17 and on the bar member 17
The top view and front view (remove coating after) of wire 13 and matrix 14, Figure 14 (e) are bar members 17 and wound on the bar member
The top view and front view (after installation) of wire 13 and matrix 14 on 17, Figure 14 (f) are one of the wire 13 after being stretched
Figure.
As shown in figure 14, used manufacturer's rule of light-emitting device of rod rolling bending method (thirdly) in, one
Wire 13 is on bar member 17.As wire 13, enamel-covered wire can be used, enamel-covered wire after being wound on bar member 17,
By the length direction cut-out along bar member 17.
Multiple light emitting diodes 11 will be installed on one by cutting off the one end produced and the other end as anode and negative electrode
On root wire 13.
So that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light-emitting diodes
Multiple light emitting diodes 11 seal and top view are understood by the enamel-covered wire elongation of pipe 11 using containment member 15,
As shown in Figure 14 (f), multiple light emitting diodes 11 are connected in series.It should be noted that as described above, by wire 13 " elongation "
Mode is one of the mode for the holding for releasing wire 13.
【Embodiment 4】
Then, to the manufacturer of the light-emitting device for having used rod cutting type bending method as embodiments of the invention 4
Method is illustrated.The manufacture method for having used the light-emitting device of rod cutting type bending method is that wire 13 is wound with bar member
Bar member is alongst cut off afterwards and the air line distance between adjacent installation portion is turned into L2 method.According to the party
Method, can be formed can suppress the good light-emitting device of light absorbs and efficiency caused by wire 13.In addition it is possible to which being formed to subtract
Light caused by few wire 13 block and luminous intensity distribution angular width light-emitting device.
Figure 15 is the figure for representing to have used manufacturer's rule of the light-emitting device of rod cutting type bending method, and Figure 15 (a) is
The top view and front view (before cut-out) of bar member 17 and the wire 13 on the bar member 17, Figure 15 (b) is bar member
17 and the top view and front view (after cut-out) of the wire 13 on the bar member 17, Figure 15 (c) is to be provided with multiple hairs
The top view and front view of the wire 13 of optical diode 11, Figure 15 (d) are the top view and side view for the wire 13 being stretched.
As shown in figure 15, in manufacturer's rule of light-emitting device of rod cutting type bending method has been used, in bar member
On 17 after coiled electrical conductor 13, bar member 17 is alongst cut off (thus, the wire 13 on bar member 17
It is cut off).
Multiple light emitting diodes 11 will be installed on and lead as anode and negative electrode along two adjacent ends of bar member 17
On line 13.
So that the mode that the air line distance between adjacent installation portion turns into L3 (L3=L1) will be provided with multiple light-emitting diodes
The wire 13 of pipe 11 is extended, and multiple light emitting diodes 11 seal using containment member 15 and top view is understood, are such as schemed
Shown in 15 (d), multiple light emitting diodes 11 are connected in series.It should be noted that as described above, by the mode of wire 13 " elongation "
It is one of the mode for the holding for releasing wire 13.
It should be noted that in the example shown in Figure 10, Figure 11, Figure 14, wire 13 is pasted on matrix 14, to viscous
The wire 13 being affixed on the matrix 14 is kept installing light emitting diode 11, but the stickup of wire 13 to matrix 14 can also
Carried out in the example shown in other figures.
More than, embodiments of the present invention and embodiment are illustrated, but described above only relates to the one of the present invention
Example, the present invention is not limited to described above completely.
Claims (16)
1. a kind of manufacture method of light-emitting device, its multiple installation portion for being used to manufacture on wire are provided with light emitting diode
Light-emitting device,
The light emitting diode is LED chip,
When the distance along the wire between adjacent installation portion is set into L1, so that the air line distance between the installation portion turns into
L2 mode keeps the wire, wherein, L2 ＜ L1,
Each installation portion on the wire being kept installs multiple light emitting diodes,
Then by the light-emitting diodes seal of tube,
The manufacture method of the light-emitting device is characterised by,
Released in the way of the air line distance between making the adjacent installation portion turns into L3 and multiple light emitting diodes are installed
Wire holding, wherein, L2 ＜ L3≤L1.
2. the manufacture method of light-emitting device according to claim 1, it is characterised in that
The sealed process of the light emitting diode is carried out before the process of the holding of the wire is released.
3. the manufacture method of light-emitting device according to claim 1, it is characterised in that
After by multiple light-emitting diodes seals of tube, the air line distance between the adjacent installation portion is adjusted to L3 ＜
L1。
4. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The wire is set to intersect with multiple bar members and the air line distance is turned into L2.
5. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The wire is set to intersect with the multiple bar members being alternately arranged and multiple convex portions and the air line distance is turned into L2.
6. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The wire is wound on bar member and the air line distance is turned into L2.
7. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
Wound on bar member after the wire by the bar member alongst cut off and make the air line distance into
For L2.
8. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The multiple light emitting diodes being installed on the wire are sealed using the containment member of translucency.
9. the manufacture method of light-emitting device according to claim 8, it is characterised in that
The containment member contains fluorophor.
10. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
After separately being sealed using the first containment member containing fluorophor to multiple light emitting diodes, is utilized
Two containment members are separately sealed to the first containment member each described.
11. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
After separately being sealed using the first containment member containing fluorophor to multiple light emitting diodes, one is utilized
Individual second containment member is sealed to multiple first containment members in the lump.
12. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The wire is pasted on matrix, described keep is carried out to the wire being pasted on the matrix.
13. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The band coating wire covered around the wire metal wire by insulating component.
14. the manufacture method of light-emitting device according to claim 13, it is characterised in that
The installation portion is formed by removing the coating with coating wire.
15. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The installation portion is flattened.
16. according to the manufacture method of light-emitting device according to any one of claims 1 to 3, it is characterised in that
The light-emitting component is flip-chip mounted on the installation portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012170654A JP5983157B2 (en) | 2012-07-31 | 2012-07-31 | Method for manufacturing light emitting device |
| JP2012-170654 | 2012-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103579455A CN103579455A (en) | 2014-02-12 |
| CN103579455B true CN103579455B (en) | 2017-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310325432.5A Active CN103579455B (en) | 2012-07-31 | 2013-07-30 | The manufacture method of light-emitting device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9130138B2 (en) |
| JP (1) | JP5983157B2 (en) |
| CN (1) | CN103579455B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10680383B2 (en) | 2013-03-14 | 2020-06-09 | Apex Technologies, Inc. | Linear electrode systems for module attachment with non-uniform axial spacing |
| US9989223B1 (en) * | 2015-03-09 | 2018-06-05 | Automated Assembly Corporation | LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive |
| DE102017108580A1 (en) * | 2017-04-21 | 2018-10-25 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor device and tissue |
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Also Published As
| Publication number | Publication date |
|---|---|
| US9130138B2 (en) | 2015-09-08 |
| JP5983157B2 (en) | 2016-08-31 |
| JP2014029969A (en) | 2014-02-13 |
| CN103579455A (en) | 2014-02-12 |
| US20140038325A1 (en) | 2014-02-06 |
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