CN103568612B - Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology - Google Patents
Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology Download PDFInfo
- Publication number
- CN103568612B CN103568612B CN201310543150.2A CN201310543150A CN103568612B CN 103568612 B CN103568612 B CN 103568612B CN 201310543150 A CN201310543150 A CN 201310543150A CN 103568612 B CN103568612 B CN 103568612B
- Authority
- CN
- China
- Prior art keywords
- ink
- print cartridge
- solder mask
- material based
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Abstract
The invention belongs to the field of printed electronics, and particularly discloses a method for preparing a printed electronic resistance welding material based on a household piezoelectric inkjet printing technology. A low-viscosity resistance welding ink formula is fabricated by adopting an improved household piezoelectric inkjet printer; the total time from beginning of inkjet to curing molding does not exceed 5 minutes; meanwhile, the method disclosed by the invention has the characteristics of being simple to operate, economic in material, high in reliability and the like, and is applicable to preparation of a hard plate and a flexible plate of a printed circuit board (PCB), a resistance welding coating of a rigid-flexible board.
Description
Technical field
The invention belongs to printed electronics technical field of ink, relate to a kind of method preparing printed electronics solder resist material based on piezoelectric type home ink jet printing technique.
Background technology
Solder mask is that coating is outer with pcb board pad, prevent pcb board in the infringement with high temperature in chip bonding process, prevent circuit etch from breaking, and the bridge joint of solder causes short circuit etc.Traditional solder resist coating adopts the method for silk-screen brush, and first solder resist is spread evenly across whole pcb board face.To the part of welding be needed to do lower mask, do not need the part of welding to solidify to form protective layer through UV, removing mask, then select suitable cleaning agent to remove the solder resist needing welding portion, then weld.
This subtractive process technique prepares soldermask coatings complex process, and coating engineering in a large amount of solder resists be coated on do not need protect substrate on, waste material greatly.Meanwhile, because the solder resist be coated with at the beginning is distributed in whole pcb board, solder resist is easy to enter in multiple-plate boring, especially in blind hole.Even and if this part solder resist adopts ultrasonic cleaning to be also often difficult to remove, uncured solder resist very easily causes the inefficacy of pcb board, the yield that impact is produced.Especially the fast development of high density interconnect technology in recent years, the direct spacing of solder joint is more and more less, and more and more thinner for solder resist linewidth requirements, screen printing technique can not meet prior art demand.Along with China starts to adopt lead-free solder as technical standard, welding temperature will more than 250 DEG C, and limiting temperature even may be close to 300 DEG C.Develop the focus that new solder mask and new coating solder mask technology have become PCB industry research.
The printed electronics technology of rising for 2006, through fast development in recent years, has had the trend replacing conventional preparation techniques.Low-viscosity solder mask due to preparation process simple, production efficiency is high, not easily block the features such as shower nozzle, start to be applied to the coating of solder resist in high density interconnect, because high density interconnect requires that live width is lower than 50 μm, the method of traditional serigraphy is not enough to realize this live width, and adopts inkjet technology, easily can reach the live width of 50 μm.Therefore printed electronics industry welding resistance is coated on high density interconnect field and is able to fast development, but the professional ink-jet printer that can realize this process is at present expensive, the piezoelectric type printer of what Fujifilm Dimatix Inc produced can be used for inkjet printing, price is more than 3,000,000 RMB, and the price of the consumptive material such as shower nozzle is also very expensive.Fancy price significantly limit the development of printed electronics industry, the present invention is intended to by cheap household printer, realize the inkjet printing of solder mask, and reach the effect approximate with specialized printers, to solve the expensive problem of specialized printers.
Summary of the invention
The object of the invention is to provide a kind of method preparing printed electronics solder resist material based on piezoelectric type home ink jet printing technique, adopt and improve household pressing electric-type ink-jet printer, self-control low viscosity solder mask formula, from ink-jet be no more than 5min to curing molding total time, meanwhile, this method also has simple to operate, saves material, reliability high, is suitable for the preparation of PCB hardboard, adagio and rigid-flex combined board soldermask coatings.
A kind of method preparing printed electronics solder resist material based on piezoelectric type home ink jet printing technique provided by the invention, concrete steps are as follows:
(1) design suitable ink formulations according to ink-cases of printers: ink formulations design considerations ink-cases of printers classification, design respectively, specific as follows:
For four color system print cartridges, adopt three components formula ink, design print cartridge 1 is welding resistance resin ink, and print cartridge 2 is curing agent, and print cartridge 3 is curing accelerator, and print cartridge 4 is cleaning solvent;
For N color system print cartridge, adopt N-1 component formula ink, wherein 1 or N-3 print cartridge are loaded dissimilar welding resistance resin ink, individual or 1 print cartridge of N-3 loads dissimilar curing agent, 1 print cartridge loads cleaning solvent, and all the other load dissimilar curing accelerator;
(2), before inkjet printing welding resistance figure, all black figure cleaning shower nozzle more than 3 times is first printed;
(3) flat board place, printer lower end is fixed in pcb board location, first prints four locating holes, be respectively each two up and down, need according to four locating hole measuring and calculating the position printing welding resistance figure, welding resistance figure is set in CAD software in appropriate position;
(4) solder mask formula is selected to select any one method following according to printing:
Method one: fill a prescription for heat cure solder mask, according to print conditions, heating platen temperature can be increased near solder mask solidification temperature if any heating platform, then the solder mask of inkjet printing can realize solidifying while ink-jet touches substrate, and hardening time is shorter than 30s; If without heating platform, treat that whole graphic printing is complete, be positioned in the baking oven setting solidification temperature and solidify, 1min realizes solidifying completely;
Method two: solidify solder mask formula for UV, according to print conditions, if any the synchronous UV light source of LED, UV light can be excited while printing, solidify while realizing ink contact to substrate, hardening time is shorter than 10s, if without the synchronous UV light source of LED, treat that whole graphic printing is complete, be positioned in UV environmental cabinet, open UV light source, 30s can realize solidifying completely.
In the present invention, print cartridge System Design described in step (1), realizes the technology of panchromatic printing, realizes ink formulations and mix smoothly according to printing four color separation pattern.
In the present invention, described solder mask is low-viscosity solder mask formula, includes but not limited to heat cure low-viscosity solder mask and photocuring low-viscosity solder mask.
In the present invention, described in step (1), curing agent, curing accelerator are according to the difference selecting resin, correspond to corresponding thermal curing agents, thermosetting accelerator and light curing agent, photocuring promoter.
In the present invention, locating hole described in step (3) occupy the upper left of pcb board, upper right, lower-left, bottom right respectively.Anchor point is positioned at PCB version lower edges, at least three and not on the same line.
In the present invention, curing described in step (4) is that heat cure adopts heating platform, and photocuring adopts the synchronous UV light source of LED.
According to the present invention, ink that ink-jet box loads described in step (1) to be filled a prescription appropriate design according to solder mask.
According to the present invention, described in step (1), locating hole is 4, and anchor point is no less than 3 and not on the same line.
According to the present invention, solder resist coating process is simple, is no more than 5min from printing to solidification overall process.
The present invention has following beneficial effect:
1, adopt household printer, low price, be suitable for a large amount of production, efficiency is high.
2, according to the present invention, solder resist coating scope, only in the position needing coating, effectively saves solder mask material, adds reliability and the yield of pcb board.
Accompanying drawing explanation
Fig. 1 is the cartridge designs formula of embodiment 1.
Fig. 2 is the anchor point of embodiment 2, locating hole schematic diagram.
Fig. 3 prints the PCB figure after solder resist, and in diagram, through hole covers without solder resist.
Detailed description of the invention
The following examples further illustrate of the present invention, instead of limit the scope of the invention.
Embodiment 1
Adopt Epson Me1+ piezoelectric ink jet printer, UV solidifies solder mask formula (70% welding resistance resin (PEG modification E51 epoxy resin) as shown in Figure 1,25% curing agent (DOW Chemical, UVI-6976), 5% curing accelerator (DOW CORNING, Z-6040)), respectively resin ink is loaded cyan print cartridge (C), curing agent loads magenta print cartridge (M), and curing accelerator loads yellow print cartridge (Y), and cleaning agent loads black ink box (K).First printer is adjusted to all black cleaning shower nozzle 3 times, then is PI adagio PCB(substrate to be printed) load carton, print locating hole and anchor point.Get out PCB circuit welding resistance figure to be printed, regulating amount out of ink to be cyan (C) according to CMYK chromaticity coordinates is 70%, magenta (M) is 25%, yellow (Y) is 5%, black (K) is that 0%, three kinds of inks mix at printer head place, obtains required solder mask figure, substrate is irradiated 30s as under UV lamp, completion of cure.Use terminates rear all black and repeatedly prints 3 times, cleaning shower nozzle, treats that next time uses.Solidification soldering-resistance layer, according to CPCA 4306-2011 standard testing, meets Specifications.
Embodiment 2
Adopt and reequip Epson R230 piezoelectric ink jet printer voluntarily, original paper feed system is changed into belt transmission interlock paper feed system (repacking is with reference to all-purpose printer).Heat cure solder mask formula (30% welding resistance resin Composition 1(PEG modification E51 epoxy resin), 35% welding resistance resin Composition 2(hyper-branched polyester Boltorn H20 is acrylic resin modified), 10% curing agent component 1(triethylene tetramine), 10% curing agent component 2(triethylamine), 5% curing accelerator (DMP-30 20wt% acetone soln)), respectively solder mask resin Composition 1 is loaded cyan print cartridge, solder mask resin Composition 2 loads light cyan print cartridge, curing agent component 1 loads pinkish red print cartridge, curing agent component 2 loads shallow magenta print cartridge, curing accelerator loads yellow print cartridge, cleaning solvent loads black ink box.First printer is adjusted to all black cleaning shower nozzle 3 times, then is epoxy resin composite plate hardboard PCB(substrate to be printed) load carton, print locating hole and anchor point.Get out PCB circuit welding resistance figure to be printed, below substrate, put into constant temperature heating plate simultaneously, regulate temperature of heating plate to be 120 DEG C (resin formula solidification temperatures), regulate amount out of ink to be cyan 30% according to chromaticity coordinates, light cyan 35%, magenta 10%, shallow magenta 10%, yellow 5%, black is 0%, six kinds of inks, in the mixing of printer head place, are sprayed onto on substrate and solidify immediately, obtain required solder mask figure.As shown in Figure 3, can know and see, through hole covers without solder resist.Use terminates rear all black and repeatedly prints 3 times, cleaning shower nozzle, treats that next time uses.Solidification soldering-resistance layer, according to CPCA 4306-2011 standard testing, meets Specifications.
Embodiment 3
Adopt and reequip Epson R230 piezoelectric ink jet printer and LED interlock UV light source voluntarily.UV solidifies solder mask formula (30% welding resistance resin Composition 1(PEG modification E51 epoxy resin), 35% welding resistance resin Composition 2(hyper-branched polyester Boltorn H20 is acrylic resin modified), 15% curing agent component 1 (DOW Chemical, UVI-6976), 5% curing agent component 2(DOW Chemical, UVI-6992), 5% curing accelerator (DOW CORNING, Z-6040)), respectively solder mask resin Composition 1 is loaded cyan print cartridge, solder mask resin Composition 2 loads light cyan print cartridge, curing agent component 1 loads pinkish red print cartridge, curing agent component 2 loads shallow magenta print cartridge, curing accelerator loads yellow print cartridge, cleaning solvent loads black ink box.First printer is adjusted to all black cleaning shower nozzle 3 times, then is epoxy resin composite plate hardboard PCB(substrate to be printed) load carton, print locating hole and anchor point.Get out PCB circuit welding resistance figure to be printed, open LED interlock UV light source simultaneously, regulate amount out of ink to be cyan 30% according to chromaticity coordinates, light cyan 35%, magenta 15%, shallow magenta 5%, yellow 5%, black is 0%, six kinds of inks mix at printer head place, UV light source activation while being sprayed onto on substrate, solder mask solidifies immediately, obtains required solder mask figure.Use terminates rear all black and repeatedly prints 3 times, cleaning shower nozzle, treats that next time uses.Solidification soldering-resistance layer, according to CPCA 4306-2011 standard testing, meets Specifications.
By selecting the household pressing electric-type ink-jet printer of different model, adopt appropriate solder mask formula, can realize low cost, high efficiency prepares welding resistance figure, gained welding resistance figure selecting is high, through hole can be avoided, blind hole be subject to uncured solder resist pollute, improve the quality of products and yield.
Claims (4)
1. prepare a method for printed electronics solder resist material based on piezoelectric type home ink jet printing technique, it is characterized in that concrete steps are as follows:
(1) design suitable ink formulations according to ink-cases of printers: ink formulations design considerations ink-cases of printers classification, design respectively, specific as follows:
For four color system print cartridges, adopt three components formula ink, design print cartridge 1 is welding resistance resin ink, and print cartridge 2 is curing agent, and print cartridge 3 is curing accelerator, and print cartridge 4 is cleaning solvent;
For N color system print cartridge, adopt N-1 component formula ink, wherein 1 or N-3 print cartridge are loaded dissimilar welding resistance resin ink, individual or 1 print cartridge of N-3 loads dissimilar curing agent, 1 print cartridge loads cleaning solvent, and all the other load dissimilar curing accelerator;
(2), before inkjet printing welding resistance figure, all black figure cleaning shower nozzle more than 3 times is first printed;
(3) flat board place, printer lower end is fixed in pcb board location, first prints four locating holes, be respectively each two up and down, need according to four locating hole measuring and calculating the position printing welding resistance figure, welding resistance figure is set in CAD software in appropriate position;
(4) solder mask formula is selected to select any one method following according to printing:
Method one: fill a prescription for heat cure solder mask, according to print conditions, be increased near solder mask solidification temperature if any heating platform by heating platform temperature, then the solder mask of inkjet printing realizes solidifying while ink-jet touches substrate, and hardening time is shorter than 30s; If without heating platform, treat that whole graphic printing is complete, be positioned in the baking oven setting solidification temperature and solidify, 1min realizes solidifying completely;
Method two: solidify solder mask formula for UV, according to print conditions, if any the synchronous UV light source of LED, while printing, excite UV light, solidify while realizing ink contact to substrate, hardening time is shorter than 10s, if without the synchronous UV light source of LED, treat that whole graphic printing is complete, be positioned in UV environmental cabinet, open UV light source, 30s realizes solidifying completely.
2. a kind of method preparing printed electronics solder resist material based on piezoelectric type home ink jet printing technique according to claim 1, is characterized in that: described solder mask is low-viscosity solder mask.
3. a kind of method preparing printed electronics solder resist material based on piezoelectric type home ink jet printing technique according to claim 1, it is characterized in that: described in step (1), curing agent, curing accelerator are according to the difference selecting resin, correspond to corresponding thermal curing agents, thermosetting accelerator and light curing agent, photocuring promoter.
4. a kind of method preparing printed electronics solder resist material based on piezoelectric type home ink jet printing technique according to claim 1, is characterized in that: locating hole described in step (3) occupy the upper left of pcb board, upper right, lower-left, bottom right respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310543150.2A CN103568612B (en) | 2013-11-06 | 2013-11-06 | Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310543150.2A CN103568612B (en) | 2013-11-06 | 2013-11-06 | Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103568612A CN103568612A (en) | 2014-02-12 |
| CN103568612B true CN103568612B (en) | 2015-06-17 |
Family
ID=50041669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310543150.2A Expired - Fee Related CN103568612B (en) | 2013-11-06 | 2013-11-06 | Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103568612B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337826B (en) * | 2018-02-11 | 2020-07-03 | 西安瑞特三维科技有限公司 | Multilayer PCB manufacturing tool and manufacturing method |
| CN109379850B (en) * | 2018-10-26 | 2020-07-10 | 江西旭昇电子有限公司 | Printed circuit board resistance welding pattern processing device and method |
| CN110605917B (en) * | 2019-08-29 | 2021-03-16 | 深圳市汉森软件有限公司 | Printing control method, device and equipment for PCB characters and storage medium |
| CN112036489A (en) * | 2020-08-31 | 2020-12-04 | 佛山市南海区广工大数控装备协同创新研究院 | PCB element positioning method based on welding spot color distribution |
| CN114148108B (en) * | 2021-11-26 | 2022-09-16 | 东莞市启思达智能技术有限公司 | Efficient ink-jet method and system |
| CN114401592B (en) * | 2022-03-02 | 2024-03-29 | 立川(珠海)智能科技设备有限公司 | High-precision printing method for PCB solder mask |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0221893D0 (en) * | 2002-09-20 | 2002-10-30 | Avecia Ltd | Process |
| TWI288142B (en) * | 2003-05-09 | 2007-10-11 | Taiyo Ink Mfg Co Ltd | Photocuring/thermosetting ink jet composition and printed wiring board using same |
| TWI391424B (en) * | 2005-01-12 | 2013-04-01 | Taiyo Holdings Co Ltd | A hardened resin composition for inkjet and a hardened product thereof, and a printed circuit board using the same |
| CN101600299B (en) * | 2009-06-26 | 2011-03-09 | 陈立峰 | Rapid subtractive manufacturing process of circuit boards |
| CN103042825A (en) * | 2011-10-14 | 2013-04-17 | 武汉海蓝生物技术有限公司 | Character ink of printed circuit board, and printing method of character ink of printed circuit board |
-
2013
- 2013-11-06 CN CN201310543150.2A patent/CN103568612B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103568612A (en) | 2014-02-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103568612B (en) | Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology | |
| CN205202465U (en) | Two work platform's high speed printing circuit board character spouts seal machine | |
| EP3083252B1 (en) | Method for manufacturing a pattern, manufacturing apparatus for manufacturing a pattern, method for manufacturing structural body and manufacturing apparatus therefor | |
| CN105291588A (en) | High-speed printed circuit board character jet printing machine with double work platforms and operation method of high-speed printed circuit board character jet printing machine | |
| CN109511230A (en) | A kind of wiring board welding resistance spray printing processing method | |
| ATE485948T2 (en) | PRODUCTION MANAGEMENT FOR THE PRODUCTION OF WOOD-BASED FLAT PANELS WITH A PRINTED SURFACE | |
| CN104320928B (en) | Hole plugging method of different resistance welding colors of circuit board | |
| JP5359471B2 (en) | Printing device | |
| WO2006076606A3 (en) | Optimized multi-layer printing of electronics and displays | |
| WO2014193479A1 (en) | Method and apparatus for digital pad printing | |
| CN102883544B (en) | Prevent via hole from falling the method for oil during wiring board lead-free tin spray | |
| CN102802361A (en) | Making method of semi-flexible printed circuit board | |
| CN104772981A (en) | Circuit board manufacturing method and ink-jet printer | |
| CN105730008B (en) | A kind of etching mask ink-jet direct imaging optics and technique | |
| CN106455362A (en) | PCB (printed circuit board) manufacture method and PCB | |
| JPH06183128A (en) | Printing method by ink jet printer | |
| CN201619286U (en) | PCB blue gum screen printing device | |
| JP2016172434A (en) | Method for forming pattern, apparatus for manufacturing pattern, and method for manufacturing three-dimensional object | |
| CN105291619B (en) | UV can be made, which to solidify transparent ink, has the Digital printing Method of printing of transparent color | |
| CN103112241B (en) | Coating device and solder paste printer thereof | |
| CN108864806A (en) | A kind of liquid photosensitive welding resistance laser labelling ink and production and preparation method thereof | |
| US8746872B2 (en) | Method for UV inkjet printer to generate irregular transparent matte particle surface and completed printing object thereof | |
| CN103373065A (en) | Digital inkjet printer with transparent ink | |
| JP2009088460A (en) | Circuit pattern forming method | |
| JP6832241B2 (en) | Printing method, printing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150617 Termination date: 20171106 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |