CN103568564B - 用于喷墨打印机中的静电致动器的隔膜 - Google Patents
用于喷墨打印机中的静电致动器的隔膜 Download PDFInfo
- Publication number
- CN103568564B CN103568564B CN201310324286.4A CN201310324286A CN103568564B CN 103568564 B CN103568564 B CN 103568564B CN 201310324286 A CN201310324286 A CN 201310324286A CN 103568564 B CN103568564 B CN 103568564B
- Authority
- CN
- China
- Prior art keywords
- barrier film
- electrode layer
- section
- electrodeposited coating
- actuator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000004888 barrier function Effects 0.000 title claims abstract description 95
- 239000010408 film Substances 0.000 claims description 93
- 239000000758 substrate Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims description 6
- 239000011104 metalized film Substances 0.000 claims description 2
- 230000003068 static effect Effects 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 29
- 238000000034 method Methods 0.000 abstract description 23
- 230000009467 reduction Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/567514 | 2012-08-06 | ||
| US13/567,514 | 2012-08-06 | ||
| US13/567,514 US8684500B2 (en) | 2012-08-06 | 2012-08-06 | Diaphragm for an electrostatic actuator in an ink jet printer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103568564A CN103568564A (zh) | 2014-02-12 |
| CN103568564B true CN103568564B (zh) | 2016-03-23 |
Family
ID=50025080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310324286.4A Expired - Fee Related CN103568564B (zh) | 2012-08-06 | 2013-07-30 | 用于喷墨打印机中的静电致动器的隔膜 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8684500B2 (enExample) |
| JP (1) | JP6105429B2 (enExample) |
| KR (1) | KR101979032B1 (enExample) |
| CN (1) | CN103568564B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014205117A1 (de) * | 2014-03-19 | 2015-09-24 | Gemü Gebr. Müller Apparatebau Gmbh & Co. Kommanditgesellschaft | Membran und Verfahren zu deren Herstellung |
| US10488502B2 (en) * | 2017-04-26 | 2019-11-26 | General Electric Company | Ultrasound probe with thin film flex circuit and methods of providing same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4374707A (en) * | 1981-03-19 | 1983-02-22 | Xerox Corporation | Orifice plate for ink jet printing machines |
| US5534900A (en) * | 1990-09-21 | 1996-07-09 | Seiko Epson Corporation | Ink-jet recording apparatus |
| CN1167520A (zh) * | 1995-01-11 | 1997-12-10 | Amtx股份有限公司 | 电铸多层喷射引导器及其制造方法 |
| US6100477A (en) * | 1998-07-17 | 2000-08-08 | Texas Instruments Incorporated | Recessed etch RF micro-electro-mechanical switch |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10211697A (ja) * | 1997-01-30 | 1998-08-11 | Ricoh Co Ltd | 記録ヘッド |
| JP2003053974A (ja) * | 2001-08-08 | 2003-02-26 | Nano Dynamics Inc | 圧電式インクジェットプリンタヘッドとその製造方法 |
| US6608268B1 (en) * | 2002-02-05 | 2003-08-19 | Memtronics, A Division Of Cogent Solutions, Inc. | Proximity micro-electro-mechanical system |
| US7052117B2 (en) * | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
| US7188931B2 (en) * | 2004-11-22 | 2007-03-13 | Eastman Kodak Company | Doubly-anchored thermal actuator having varying flexural rigidity |
| JP2007143342A (ja) * | 2005-11-21 | 2007-06-07 | Seiko Epson Corp | 静電アクチュエータ、液滴吐出ヘッド及び液滴吐出装置並びにそれらの製造方法 |
| WO2007135595A1 (en) * | 2006-05-19 | 2007-11-29 | Koninklijke Philips Electronics N.V. | Electrostatic actuator for ink jet heads |
| JP2008030337A (ja) * | 2006-07-31 | 2008-02-14 | Ricoh Co Ltd | 液体吐出ヘッド、液体吐出装置、画像形成装置 |
| US7630121B2 (en) * | 2007-07-02 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
| EP2342081B1 (en) * | 2008-10-31 | 2014-03-19 | Hewlett-Packard Development Company, L.P. | Electrostatic liquid-ejection actuation mechanism |
-
2012
- 2012-08-06 US US13/567,514 patent/US8684500B2/en active Active
-
2013
- 2013-07-29 KR KR1020130089360A patent/KR101979032B1/ko not_active Expired - Fee Related
- 2013-07-29 JP JP2013156808A patent/JP6105429B2/ja not_active Expired - Fee Related
- 2013-07-30 CN CN201310324286.4A patent/CN103568564B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4374707A (en) * | 1981-03-19 | 1983-02-22 | Xerox Corporation | Orifice plate for ink jet printing machines |
| US5534900A (en) * | 1990-09-21 | 1996-07-09 | Seiko Epson Corporation | Ink-jet recording apparatus |
| CN1167520A (zh) * | 1995-01-11 | 1997-12-10 | Amtx股份有限公司 | 电铸多层喷射引导器及其制造方法 |
| US6100477A (en) * | 1998-07-17 | 2000-08-08 | Texas Instruments Incorporated | Recessed etch RF micro-electro-mechanical switch |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140036005A1 (en) | 2014-02-06 |
| US8684500B2 (en) | 2014-04-01 |
| JP6105429B2 (ja) | 2017-03-29 |
| CN103568564A (zh) | 2014-02-12 |
| JP2014031009A (ja) | 2014-02-20 |
| KR101979032B1 (ko) | 2019-05-15 |
| KR20140019734A (ko) | 2014-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160323 Termination date: 20210730 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |