CN103547085A - Surface mounter and mounting method - Google Patents
Surface mounter and mounting method Download PDFInfo
- Publication number
- CN103547085A CN103547085A CN201310459047.XA CN201310459047A CN103547085A CN 103547085 A CN103547085 A CN 103547085A CN 201310459047 A CN201310459047 A CN 201310459047A CN 103547085 A CN103547085 A CN 103547085A
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- surface mount
- mount elements
- haftplatte
- surface mounted
- patch frame
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Abstract
The invention discloses a surface mounter and a mounting method, relates to the technical field of mounting and application products of surface mounted devices, and solves the problems that equipment cost is high, process is complicated, and surface mounted devices have to be braided in the prior art and application product cost of the surface mounted devices is high. The surface mounter comprises a surface mounting member and a surface mounted device storage frame with grooves. The surface mounting member comprises an adhesive plate with high-temperature-resistant double faced adhesive tapes. The mounting method includes that a plurality of surface mounted devices are arranged in the grooves of the surface mounted device storage frame; the adhesive plate tightly contacts with the surface mounted devices and is adhered with the same; the surface mounted devices adhered to the adhesive plate are arranged on surface mounted device storage positions of a circuit board after being separated from the surface mounted device storage frame; the surface mounted devices is firmly connected with the circuit board through tin soldering after heating; the adhesive plate is separated from the surface mounted devices. By the surface mounter and the mounting method, required production equipment cost is low, production process is simple, the surface mounted devices do not have to be braided, and cost of application products of the surface mounted devices is greatly reduced.
Description
Technical field
The present invention relates to surface mount elements installs and surface mount elements application product technical field.
Background technology
It is that paster LED is waited until to surface mount elements is placed into the production process on relevant position on wiring board that surface mount elements is installed, and surface mount elements application product is the application product of surface mount elements.Surface mount elements application product has LED display, LED television set and LED lamp etc.Prior art is to adopt chip mounter that the surface mount elements of braid is placed on wiring board, then through heating scolding tin, surface mount elements is firmly connected with wiring board.Owing to needing the braid of chip mounter and surface mount elements, equipment needed thereby cost is high, complex process, and required surface mount elements fringe cost is high, has improved surface mount elements and has been installed to the cost on wiring board, has improved the cost of surface mount elements application product.
Summary of the invention
The high problem of cost that the present invention exists in order to solve prior art that equipment needed thereby cost is high, complex process, surface mount elements used need braid and surface mount elements application product, proposes a kind of paster apparatus and installation method, and the technical solution used in the present invention is:
And an installation method, including raw material, raw material include wiring board, surface mount elements and are positioned at wiring board or the scolding tin of surface mount elements, and wiring board includes for placing the surface mount elements of surface mount elements and places position; Also include patch member and patch frame, patch frame is provided with 1 above for placing the groove of surface mount elements, and patch member includes the haftplatte with viscosity colloid; Include following steps:
(1), a plurality of surface mount elements are positioned in described patch frame;
(2), surface mount elements top places described haftplatte, haftplatte move down or patch frame on move, or haftplatte move down with patch frame on move simultaneously and carry out, haftplatte and surface mount elements close contact, and haftplatte clings surface mount elements;
(3) surface mount elements, clinging on haftplatte band leaves patch frame;
(4) surface mount elements, clinging on haftplatte band is positioned on described surface mount elements placement position surface mount elements;
(5), after heating, surface mount elements is firmly connected by described scolding tin with wiring board;
(6), haftplatte is separated with surface mount elements.
The below of described haftplatte is pasted with the resistant to elevated temperatures double faced adhesive tape of viscosity colloid.
Described patch frame is provided with the paster glazing bar of a plurality of network shape grids.
Described patch frame is provided with the through hole that is less than groove floor that is positioned at described bottom portion of groove.
Described patch member also includes the grid of a plurality of network shapes or the movable lattice of the paster of strip lattice, and the movable lattice of paster are connected with the detachable mode of described patch frame.
Described patch member also includes link, and link is connected with the detachable mode of described wiring board.
Described surface mount elements includes the vertical pin protruding downwards.
While being placed with described surface mount elements in described patch frame, surface mount elements end face is higher than patch frame end face.
Described haftplatte is elastic material.
The invention has the beneficial effects as follows: owing to not needing chip mounter, required production equipment cost is low, and production technology is simple, surface mount elements is without braid, required surface mount elements fringe cost is low, has reduced surface mount elements and has been installed to the cost on wiring board, has significantly reduced the cost of surface mount elements application product.Such as significantly having reduced the cost of paster LED illuminating lamp and the cost that has significantly reduced surface mounted LED display screen.
Accompanying drawing explanation
Fig. 1 is the patch frame plan structure schematic diagram of the embodiment of the present invention.
Embodiment
The present embodiment is the preferred embodiment of the present invention, and other every its principle is identical with the present embodiment or approximate with basic structure, all within protection range of the present invention.
Shown in Fig. 1, the present invention adopts a kind of paster apparatus and installation method, include raw material, raw material include wiring board, surface mount elements and are positioned at wiring board or the scolding tin of surface mount elements, and wiring board includes for placing the surface mount elements of surface mount elements and places position; Also include patch member and patch frame, patch frame is provided with a plurality of for placing the groove 1 of surface mount elements, and patch member includes the haftplatte with viscosity colloid; Include following steps:
(1), a plurality of surface mount elements are positioned in the groove 1 of described patch frame;
(2), surface mount elements top places described haftplatte, haftplatte move down or patch frame on move, or haftplatte move down with patch frame on move simultaneously and carry out, haftplatte and surface mount elements close contact, and haftplatte and surface mount elements adhesion;
(3), on haftplatte band, the surface mount elements of institute's adhesion leaves patch frame;
(4), on haftplatte band, the surface mount elements of institute's adhesion is positioned on described surface mount elements placement position surface mount elements;
(5), after heating, surface mount elements is firmly connected by described scolding tin with wiring board;
(6), haftplatte is separated with surface mount elements.
The spacing of groove 1 equals the needed spacing of surface mount elements on wiring board, be positioned on the surface mount elements pin lay down location of wiring board or surface mount elements pin and add solder(ing) paste or tin glue, scolding tin adopts Reflow Soldering heating to make melts soldering tin, surface mount elements and wiring board is electrically connected after cooling by tin.If add solder(ing) paste on surface mount elements pin, after just on haftplatte band, the surface mount elements of institute's adhesion leaves patch frame, and before being positioned over described surface mount elements placement position, surface mount elements completes.
The below of described haftplatte is pasted with the resistant to elevated temperatures double faced adhesive tape of viscosity colloid.
Described patch frame is provided with the paster glazing bar 2 of a plurality of network shape grids; Equidistant alternate setting in the horizontal direction of grid in paster glazing bar 2, the spacing that makes the spacing of described groove 1 place position with surface mount elements on wiring board is consistent, and on wiring board, the desired spacing of surface mount elements determines the spacing of groove 1.
Described patch member also includes link, and link is connected with the detachable mode of described wiring board.Link is connected with the detachable mode of haftplatte, and link top is provided with for regulating haftplatte position to make surface mount elements and surface mount elements place column pitch and suitable set screw or the reciprocating mechanism of elasticity.
Described patch member can also include the grid of a plurality of network shapes or the movable lattice of the paster of strip lattice, and the movable lattice of paster are connected with the detachable mode of described patch frame; When the movable lattice of paster are connected with described patch frame, put surface mount elements, after paster activity lattice are separated with described patch frame, surface mount elements come together, surface mount elements in gapless mode, be placed on patch frame 1 groove 1 in; Patch frame is provided with the movable blend stop that surface mount elements is close or gapless is placed that makes patch frame for mobile surface mount elements.This mode is applicable to each surface mount elements gapless or extremely closely spaced surface mount elements application product.
Described surface mount elements includes the vertical pin protruding downwards; In order conveniently there to be the surface mount elements of the pin of protrusion to be placed on patch frame, patch frame is provided with the through hole that is less than groove floor that is positioned at groove 1 bottom, and via area is less than the area of groove floor.
For haftplatte can with surface mount elements close contact, the surface mount elements end face of placing in patch frame is higher than patch frame end face.
For haftplatte and surface mount elements close contact, and haftplatte can stick together with each surface mount elements, and haftplatte is elastic material; Can on haftplatte top, firmly press down with hand or instrument, haftplatte can be sticked together with each surface mount elements.
Wiring board as herein described, surface mount elements and scolding tin are required raw material in surface mount elements application product production process.
Owing to not needing chip mounter, required production equipment cost is low, and production technology is simple, and surface mount elements is without braid, and required surface mount elements fringe cost is low, has reduced surface mount elements and has been installed to the cost on wiring board, has significantly reduced the cost of surface mount elements application product.Such as significantly having reduced the cost of paster LED illuminating lamp and the cost that has significantly reduced surface mounted LED display screen.
Claims (9)
1. paster apparatus and an installation method, include raw material, and raw material include wiring board, surface mount elements and are positioned at wiring board or the scolding tin of surface mount elements, and wiring board includes for placing the surface mount elements of surface mount elements and places position; It is characterized in that: also include patch member and patch frame, patch frame is provided with 1 above for placing the groove of surface mount elements, and patch member includes the haftplatte with viscosity colloid; Include following steps:
(1), a plurality of surface mount elements are positioned in described patch frame;
(2), surface mount elements top places described haftplatte, haftplatte move down or patch frame on move, or haftplatte move down with patch frame on move simultaneously and carry out, haftplatte and surface mount elements close contact, and haftplatte clings surface mount elements;
(3) surface mount elements, clinging on haftplatte band leaves patch frame;
(4) surface mount elements, clinging on haftplatte band is positioned on described surface mount elements placement position surface mount elements;
(5), after heating, surface mount elements is firmly connected by described scolding tin with wiring board;
(6), haftplatte is separated with surface mount elements.
2. a kind of paster apparatus according to claim 1 and installation method, is characterized in that: the below of described haftplatte is pasted with the resistant to elevated temperatures double faced adhesive tape of viscosity colloid.
3. a kind of paster apparatus according to claim 1 and installation method, is characterized in that: described patch frame is provided with the paster glazing bar of a plurality of network shape grids.
4. a kind of paster apparatus according to claim 1 and installation method, is characterized in that: described patch frame is provided with the through hole that is less than groove floor that is positioned at its bottom portion of groove.
5. a kind of paster apparatus according to claim 1 and installation method, it is characterized in that: described patch member also includes the grid of a plurality of network shapes or the movable lattice of the paster of strip lattice, and the movable lattice of paster are connected with the detachable mode of described patch frame.
6. a kind of paster apparatus according to claim 1 and installation method, is characterized in that: described patch member also includes link, and link is connected with the detachable mode of described wiring board.
7. a kind of paster apparatus according to claim 1 and installation method, is characterized in that: described surface mount elements includes the vertical pin protruding downwards.
8. a kind of paster apparatus according to claim 1 and installation method, is characterized in that: while being placed with described surface mount elements in described patch frame, surface mount elements end face is higher than patch frame end face.
9. a kind of paster apparatus according to claim 1 and installation method, is characterized in that: described haftplatte is elastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310459047.XA CN103547085A (en) | 2013-10-07 | 2013-10-07 | Surface mounter and mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310459047.XA CN103547085A (en) | 2013-10-07 | 2013-10-07 | Surface mounter and mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103547085A true CN103547085A (en) | 2014-01-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310459047.XA Pending CN103547085A (en) | 2013-10-07 | 2013-10-07 | Surface mounter and mounting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103547085A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106955426A (en) * | 2017-04-26 | 2017-07-18 | 中国科学院力学研究所 | A kind of stretchable LED facial masks and preparation method thereof |
| CN107578709A (en) * | 2016-07-05 | 2018-01-12 | 群创光电股份有限公司 | The manufacture method of display device and display device |
| CN108394710A (en) * | 2018-03-14 | 2018-08-14 | 吕家环 | A kind of mobile phone processing automatic chip mounting device |
| US10446604B2 (en) | 2016-07-05 | 2019-10-15 | Innolux Corporation | Display apparatus and fabricating method for display apparatus |
| CN109239958B (en) * | 2018-11-27 | 2022-03-08 | 深圳创维－Rgb电子有限公司 | Plate part pasting device and process |
-
2013
- 2013-10-07 CN CN201310459047.XA patent/CN103547085A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107578709A (en) * | 2016-07-05 | 2018-01-12 | 群创光电股份有限公司 | The manufacture method of display device and display device |
| US10446604B2 (en) | 2016-07-05 | 2019-10-15 | Innolux Corporation | Display apparatus and fabricating method for display apparatus |
| CN107578709B (en) * | 2016-07-05 | 2020-12-15 | 群创光电股份有限公司 | Display device and method for manufacturing display device |
| CN106955426A (en) * | 2017-04-26 | 2017-07-18 | 中国科学院力学研究所 | A kind of stretchable LED facial masks and preparation method thereof |
| CN108394710A (en) * | 2018-03-14 | 2018-08-14 | 吕家环 | A kind of mobile phone processing automatic chip mounting device |
| CN109239958B (en) * | 2018-11-27 | 2022-03-08 | 深圳创维－Rgb电子有限公司 | Plate part pasting device and process |
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| C06 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
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Application publication date: 20140129 |