CN103547054A - 一种等离子处理设备冷却用连接管 - Google Patents
一种等离子处理设备冷却用连接管 Download PDFInfo
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CN201310497371.0A CN103547054A (zh) | 2013-10-21 | 2013-10-21 | 一种等离子处理设备冷却用连接管 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1323905A (zh) * | 2000-03-24 | 2001-11-28 | Km欧洲钢铁股份有限公司 | 冷却板 |
CN101070159A (zh) * | 2007-05-24 | 2007-11-14 | 成都晶硅科技有限公司 | 一种去除金属硅中p、b杂质的新方法 |
CN101182628A (zh) * | 2007-12-13 | 2008-05-21 | 上海交通大学 | 溅射镀膜离子束辐照增强方法 |
CN101338413A (zh) * | 2007-07-06 | 2009-01-07 | 应用材料股份有限公司 | 用于cvd腔室清洗的远程诱导耦接的等离子体源 |
CN101805902A (zh) * | 2010-03-09 | 2010-08-18 | 河南省煤科院耐磨技术有限公司 | 手持式气冷等离子炬 |
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- 2013-10-21 CN CN201310497371.0A patent/CN103547054A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1323905A (zh) * | 2000-03-24 | 2001-11-28 | Km欧洲钢铁股份有限公司 | 冷却板 |
CN101070159A (zh) * | 2007-05-24 | 2007-11-14 | 成都晶硅科技有限公司 | 一种去除金属硅中p、b杂质的新方法 |
CN101338413A (zh) * | 2007-07-06 | 2009-01-07 | 应用材料股份有限公司 | 用于cvd腔室清洗的远程诱导耦接的等离子体源 |
CN101182628A (zh) * | 2007-12-13 | 2008-05-21 | 上海交通大学 | 溅射镀膜离子束辐照增强方法 |
CN101805902A (zh) * | 2010-03-09 | 2010-08-18 | 河南省煤科院耐磨技术有限公司 | 手持式气冷等离子炬 |
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Owner name: WUHU DINGHAN REMANUFACTURING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WUHU DINGHENG MATERIAL TECHNOLOGY CO., LTD. Effective date: 20150828 |
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Effective date of registration: 20150828 Address after: 241000 Anhui City, Yijiang Province, Wuhu national hi tech Zone in the Southern District Science and Technology Park (SME Venture Park) Venture Park, building 9, comprehensive Applicant after: WUHU DINGHAN REMANUFACTURING TECHNOLOGY CO., LTD. Address before: 241000 Wuhu high tech Industrial Development Zone in Southern District of small and medium enterprises in the park, building No. 11, Anhui Applicant before: Wuhu Dingheng Materials Technology Co., Ltd. |
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RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140129 |
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RJ01 | Rejection of invention patent application after publication |