CN103522221A - Device for bidirectionally positioning and clamping wafer - Google Patents
Device for bidirectionally positioning and clamping wafer Download PDFInfo
- Publication number
- CN103522221A CN103522221A CN201310502434.7A CN201310502434A CN103522221A CN 103522221 A CN103522221 A CN 103522221A CN 201310502434 A CN201310502434 A CN 201310502434A CN 103522221 A CN103522221 A CN 103522221A
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- CN
- China
- Prior art keywords
- positioning
- wafer
- bidirectionally
- holding device
- alignment pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
Abstract
The invention relates to the field of positioning devices, and discloses a device for bidirectionally positioning and clamping a wafer. The device for bidirectionally positioning and clamping the wafer is characterized in that an upper left positioning pin and an upper right positioning pin are arranged on a vacuum bottom plate, a left lower positioning pin and a left upper positioning pin are arranged on the left face of the vacuum bottom plate, a right upper probe ejecting device and a right lower probe ejecting device are arranged on the right upper portion of the vacuum bottom plate, and a lower right probe ejecting device and a lower left probe ejecting device are arranged on the lower face of the vacuum bottom plate. According to the technical scheme, the device for bidirectionally positioning and clamping the wafer is simple in structure, saves labor, improves production efficiency and reduces production cost.
Description
Technical field
The present invention relates to positioner field, is a kind of device stepping up for the two-way location of wafer.
Background technology
At small-sized tuning fork crystal production field, after wafer moulding, to measure the size of their frequencies, must first wafer fixedly be put well on platform, former four limits are spacing by alignment pin, because wafer profile exists error, cause location inaccurate.
Summary of the invention
The object of the invention is to provide a kind of device stepping up for the two-way location of wafer.By vacuum base plate, both sides alignment pin, both sides probe holding device three parts, formed; By cylinder, driving holding device to push away wafer puts in place and holds out against.
Technical scheme of the present invention is: a kind of device stepping up for the two-way location of wafer, it is characterized in that being provided with upper left alignment pin and upper right alignment pin on vacuum base plate, and the left side is provided with lower-left alignment pin and upper left alignment pin; Upper right probe holding device and bottom right probe holding device are installed in vacuum base plate upper right, bottom right probe holding device and bottom left probe holding device are installed below.
Owing to having adopted technique scheme, it is simple in structure, has saved manpower, has improved production efficiency, has reduced production cost.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
In the drawings: 1, upper left alignment pin; 2, upper right alignment pin; 3, vacuum base plate; 4, upper right probe holding device; 5, bottom right probe holding device; 6, bottom right probe holding device; 7, bottom left probe holding device; 8, lower-left alignment pin; 9, upper left alignment pin.
The specific embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
In Fig. 1, upper left alignment pin 1 and upper right alignment pin 2 are installed on vacuum base plate 3, the left side is provided with lower-left alignment pin 8 and upper left alignment pin 9; Upper right probe holding device 4 and bottom right probe holding device 5 are installed in vacuum base plate 3 upper rights, bottom right probe holding device 6 and bottom left probe holding device 7 are installed below.
Embodiment, is positioned over wafer on vacuum base plate 3, and manually near left and top alignment pin, then cylinder drives below probe holding device to compress wafer, is finally that cylinder drives the right probe holding device to compress wafer.
Claims (1)
1. the device stepping up for the two-way location of wafer, is characterized in that being provided with upper left alignment pin (1) and upper right alignment pin (2) on vacuum base plate (3), and the left side is provided with lower-left alignment pin (8) and upper left alignment pin (9); In vacuum base plate (3) upper right, upper right probe holding device (4) and bottom right probe holding device (5) are installed, bottom right probe holding device (6) and bottom left probe holding device (7) are installed below.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310502434.7A CN103522221A (en) | 2013-10-24 | 2013-10-24 | Device for bidirectionally positioning and clamping wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310502434.7A CN103522221A (en) | 2013-10-24 | 2013-10-24 | Device for bidirectionally positioning and clamping wafer |
Publications (1)
Publication Number | Publication Date |
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CN103522221A true CN103522221A (en) | 2014-01-22 |
Family
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Family Applications (1)
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CN201310502434.7A Pending CN103522221A (en) | 2013-10-24 | 2013-10-24 | Device for bidirectionally positioning and clamping wafer |
Country Status (1)
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CN (1) | CN103522221A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103795368A (en) * | 2014-03-05 | 2014-05-14 | 随州泰华电子科技有限公司 | Device for positioning wafer |
CN104378078A (en) * | 2014-09-19 | 2015-02-25 | 随州润晶电子科技有限公司 | Quartz crystal laser frequency modulation machine |
CN104459220A (en) * | 2014-11-05 | 2015-03-25 | 东晶锐康晶体(成都)有限公司 | Testing pressure head positioning mechanism |
CN107253075A (en) * | 2017-05-22 | 2017-10-17 | 西安精雕软件科技有限公司 | A kind of automatic bidirectional positioning clamping device |
CN112477401A (en) * | 2020-12-21 | 2021-03-12 | 四川锐坤电子技术有限公司 | Pad printing equipment |
Citations (6)
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CN201979301U (en) * | 2010-05-28 | 2011-09-21 | 上海德尔格医疗器械有限公司 | Frock jig |
CN102501101A (en) * | 2011-10-24 | 2012-06-20 | 陕西天达航空标准件有限公司 | Clamp body for machining side plate of pulley frame, and method for machining and positioning side plate of pulley frame |
CN202686796U (en) * | 2012-06-22 | 2013-01-23 | 中山市美捷时喷雾阀有限公司 | Carton clamping device for packing machine |
CN202763726U (en) * | 2012-08-15 | 2013-03-06 | 吴江市博众精工科技有限公司 | Product carrier |
CN202780913U (en) * | 2012-09-04 | 2013-03-13 | 杭州三共机械有限公司 | Positioning and clamping device for processing of square housing |
CN203527312U (en) * | 2013-10-24 | 2014-04-09 | 随州润晶电子科技有限公司 | Device used for bi-direction locating and clamping of wafer |
-
2013
- 2013-10-24 CN CN201310502434.7A patent/CN103522221A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201979301U (en) * | 2010-05-28 | 2011-09-21 | 上海德尔格医疗器械有限公司 | Frock jig |
CN102501101A (en) * | 2011-10-24 | 2012-06-20 | 陕西天达航空标准件有限公司 | Clamp body for machining side plate of pulley frame, and method for machining and positioning side plate of pulley frame |
CN202686796U (en) * | 2012-06-22 | 2013-01-23 | 中山市美捷时喷雾阀有限公司 | Carton clamping device for packing machine |
CN202763726U (en) * | 2012-08-15 | 2013-03-06 | 吴江市博众精工科技有限公司 | Product carrier |
CN202780913U (en) * | 2012-09-04 | 2013-03-13 | 杭州三共机械有限公司 | Positioning and clamping device for processing of square housing |
CN203527312U (en) * | 2013-10-24 | 2014-04-09 | 随州润晶电子科技有限公司 | Device used for bi-direction locating and clamping of wafer |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103795368A (en) * | 2014-03-05 | 2014-05-14 | 随州泰华电子科技有限公司 | Device for positioning wafer |
CN104378078A (en) * | 2014-09-19 | 2015-02-25 | 随州润晶电子科技有限公司 | Quartz crystal laser frequency modulation machine |
CN104459220A (en) * | 2014-11-05 | 2015-03-25 | 东晶锐康晶体(成都)有限公司 | Testing pressure head positioning mechanism |
CN107253075A (en) * | 2017-05-22 | 2017-10-17 | 西安精雕软件科技有限公司 | A kind of automatic bidirectional positioning clamping device |
CN112477401A (en) * | 2020-12-21 | 2021-03-12 | 四川锐坤电子技术有限公司 | Pad printing equipment |
CN112477401B (en) * | 2020-12-21 | 2023-10-20 | 四川锐坤电子技术有限公司 | Pad printing equipment |
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140122 |