CN103795368A - Device for positioning wafer - Google Patents

Device for positioning wafer Download PDF

Info

Publication number
CN103795368A
CN103795368A CN201410077868.1A CN201410077868A CN103795368A CN 103795368 A CN103795368 A CN 103795368A CN 201410077868 A CN201410077868 A CN 201410077868A CN 103795368 A CN103795368 A CN 103795368A
Authority
CN
China
Prior art keywords
wafer
positioning
pin
positioning pins
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410077868.1A
Other languages
Chinese (zh)
Inventor
王斌
黄大勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUIZHOU TAIHUA ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
SUIZHOU TAIHUA ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUIZHOU TAIHUA ELECTRONIC TECHNOLOGY Co Ltd filed Critical SUIZHOU TAIHUA ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201410077868.1A priority Critical patent/CN103795368A/en
Publication of CN103795368A publication Critical patent/CN103795368A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the field of wafers, in particular to a device for positioning a wafer. The device for positioning the wafer is characterized in that circular-arc-shaped positioning pins are fixed on a horizontal cylinder, and spring positioning needles are fixed on a longitudinal cylinder; longitudinal positioning pins and horizontal positioning pins are fixed on a platform, and the number of the longitudinal positioning pins, the number of the horizontal positioning pins, the number of the circular-arc-shaped positioning pins and the number of the spring positioning needles are both two. According to the technical scheme, the two longitudinal positioning pins and the two horizontal positioning pins form accurate right angle reference positioning to the wafer, one side of the wafer is positioned by two fixing circular-arc-shaped positioning pins, the other side of the wafer is positioned by two spring positioning needles, and thus accurate positioning to the wafer is achieved.

Description

A kind of device for positions wafer
Technical field
The present invention relates to wafer art, is a kind of device for positions wafer.
Background technology
At tuning fork crystal production field, by the wafer after the cutting of square crystal raw material, due to thin, crisp, be difficult to entirely true location.
Summary of the invention
The object of the invention is to provide a kind of device that can disposable accurate equidirectional positions wafer.
Technical scheme of the present invention is: a kind of device for positions wafer, it is characterized in that circular arc alignment pin is fixed on lateral air cylinder, and spring pilot pin is fixed on longitudinal cylinder; Longitudinal register pin and located lateral pin are fixed on platform; Longitudinal register pin, located lateral pin, circular arc alignment pin, spring pilot pin respectively have two.
Owing to having adopted technique scheme, two longitudinal register pins and two located lateral pins form right angle origin reference location accurately to wafer, one side is located by 2 fixing circular arc alignment pins, and opposite side is located by 2 spring pilot pins, realizes the accurate location to wafer.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
In the drawings: 1, longitudinal register pin; 2, platform; 3, circular arc alignment pin; 4, wafer; 5, spring pilot pin; 6, longitudinal cylinder; 7, lateral air cylinder; 8, located lateral pin.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
In Fig. 1, circular arc alignment pin 3 is fixed on lateral air cylinder 7, and spring pilot pin 5 is fixed on longitudinal cylinder 6; Longitudinal register pin 1 and located lateral pin 8 are fixed on platform 2; Longitudinal register pin 1, located lateral pin 8, circular arc alignment pin 3, spring pilot pin 5 respectively have two.
Wafer 4 is positioned on platform 2, first under the effect of lateral air cylinder 7, carries out a side location by two circular arc alignment pins 3, and then opposite side is positioned by two spring pilot pins 5 under the effect of longitudinal cylinder 6; Location rear spring pilot pin 5 is first moved back, and circular arc alignment pin 3 retreats again, like this wafer 4 can be due to strain off normal.

Claims (1)

1. for a device for positions wafer, it is characterized in that circular arc alignment pin (3) is fixed on lateral air cylinder (7) upper, spring pilot pin (5) is fixed on longitudinal cylinder (6); Longitudinal register pin (1) and located lateral pin (8) are fixed on platform (2); Longitudinal register pin (1), located lateral pin (8), circular arc alignment pin (3), spring pilot pin (5) respectively have two.
CN201410077868.1A 2014-03-05 2014-03-05 Device for positioning wafer Pending CN103795368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410077868.1A CN103795368A (en) 2014-03-05 2014-03-05 Device for positioning wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410077868.1A CN103795368A (en) 2014-03-05 2014-03-05 Device for positioning wafer

Publications (1)

Publication Number Publication Date
CN103795368A true CN103795368A (en) 2014-05-14

Family

ID=50670743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410077868.1A Pending CN103795368A (en) 2014-03-05 2014-03-05 Device for positioning wafer

Country Status (1)

Country Link
CN (1) CN103795368A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201979301U (en) * 2010-05-28 2011-09-21 上海德尔格医疗器械有限公司 Frock jig
CN202763726U (en) * 2012-08-15 2013-03-06 吴江市博众精工科技有限公司 Product carrier
CN103522221A (en) * 2013-10-24 2014-01-22 随州润晶电子科技有限公司 Device for bidirectionally positioning and clamping wafer
CN103569672A (en) * 2012-07-20 2014-02-12 上海微电子装备有限公司 Silicon wafer and glass substrate compatible conveying device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201979301U (en) * 2010-05-28 2011-09-21 上海德尔格医疗器械有限公司 Frock jig
CN103569672A (en) * 2012-07-20 2014-02-12 上海微电子装备有限公司 Silicon wafer and glass substrate compatible conveying device
CN202763726U (en) * 2012-08-15 2013-03-06 吴江市博众精工科技有限公司 Product carrier
CN103522221A (en) * 2013-10-24 2014-01-22 随州润晶电子科技有限公司 Device for bidirectionally positioning and clamping wafer

Similar Documents

Publication Publication Date Title
GB2555062A (en) Intelligent holster spacer
AR092162A1 (en) ELECTRONIC CONTROL AND INDICATION UNIT
TW201613202A (en) Connector
BR112013029013A2 (en) OCCLUSION DEVICE
TW201612098A (en) Micromechanical sensor and method for manufacturing a micromechanical sensor
EP3059635A4 (en) Method for aligning square wafer in first photolithographic process
EP2874168A3 (en) Switch
MX2016001577A (en) Information processing device, and determination result provision method.
CN103522221A (en) Device for bidirectionally positioning and clamping wafer
BR112016024783A8 (en) method of setting a guard period in a half-duplexing frequency division duplexing operation, computer program, and wireless device
CN203775159U (en) Device for positioning wafer
CN103795368A (en) Device for positioning wafer
SG10201708010QA (en) System and method for mounting a flip chip
WO2014147493A3 (en) Device assembly to form loops in slings
CN103915668A (en) Same-frequency combiner
CN203527312U (en) Device used for bi-direction locating and clamping of wafer
CN203908471U (en) Tool for rapidly inspecting spatial dimension of rod-kind part
TW201614317A (en) Displays having reduced optical sensitivity to aperture alignment at stepper field boundary
CN103287073B (en) A kind of method realizing PCB and steel mesh rapid-aligning in printing machine
CN204018904U (en) With the Linear cut water spray plate of protective device
CN204266060U (en) A kind of location structure of rocking arm
CN104455150A (en) Buffer base
CN204606927U (en) Slide plate feeding initial point reset attachment
CN103904400A (en) 3dB bridge
CN103009166A (en) Two-hole locating device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140514

WD01 Invention patent application deemed withdrawn after publication