CN103515190A - Treating apparatus for substrate - Google Patents

Treating apparatus for substrate Download PDF

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Publication number
CN103515190A
CN103515190A CN201210371923.9A CN201210371923A CN103515190A CN 103515190 A CN103515190 A CN 103515190A CN 201210371923 A CN201210371923 A CN 201210371923A CN 103515190 A CN103515190 A CN 103515190A
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CN
China
Prior art keywords
substrate
unit
treating apparatus
workbench
lid member
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Pending
Application number
CN201210371923.9A
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Chinese (zh)
Inventor
张承逸
安吉秀
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MMTECH CO Ltd
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MMTECH CO Ltd
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Filing date
Publication date
Application filed by MMTECH CO Ltd filed Critical MMTECH CO Ltd
Publication of CN103515190A publication Critical patent/CN103515190A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

A treating apparatus for a substrate comprises a treating chamber, a spraying unit, a drive unit, and a seal unit. At least a slit is arranged on a side wall of the treating chamber, and the substrate to be treated is placed in the treating chamber; the spraying unit is located in the treating chamber to spray a treating medium onto the substrate; the drive unit is located outside the treating chamber, is connected to the spraying unit through the slit and moves the spraying unit on a surface direction of the substrate; and the seal unit is arranged between the spraying unit and the drive unit and seals the drive unit to prevent the drive unit from being affected by the internal atmosphere of the treating chamber.

Description

Substrate-treating apparatus
The cross reference of related application case
The application's case is advocated the rights and interests of the 10-2012-068175 korean patent application case of in June, 2012 25 Korea S Department of Intellectual Property application, and the disclosure of this case is all incorporated herein by reference.
Technical field
The present invention relates to substrate-treating apparatus.
Background technology
The substrate of the display unit that comprises thin-film transistor and the substrate of semiconductor device experience process of surface treatment, to remove silicon dioxide film or to make the surface plane of silicon fiml from substrate surface.
By the treatment media that comprises the treatment fluids such as etchant is coated to substrate surface and actuating surface treatment process.
Due to the pollution of the treatment media that comprises treatment fluid, the substrate-treating apparatus being arranged in process chamber may easily corrode.Therefore, being arranged on the inner or outer equipment of process chamber is made by the material with highly corrosion resistant and high chemical resistance.The high reason of this equipment cost that Here it is.And, such as complicated some equipment such as elevator system, can not be arranged in or beyond process chamber.
Summary of the invention
The invention provides a kind of substrate-treating apparatus, described substrate-treating apparatus is configurable in or beyond process chamber and have low cost and a high-durability.
According to an aspect of the present invention, provide a kind of substrate-treating apparatus, comprise: process chamber, in its sidewall, there is at least one slit, wherein pending substrate is placed in process chamber; Injection unit, is positioned in process chamber so that treatment media is sprayed onto on substrate; Driver element, is positioned at outside process chamber, by described slit, is connected to injection unit and movable spray unit in the surface direction of substrate; And sealing unit, get involved between injection unit and driver element and seal internal atmosphere impact that driver element makes it not be subject to processing chamber.
Sealing unit can comprise: water jacket, near slit, settle and be filled with water; Lid member, is placed on water jacket, and the lower limb unit that covers member is soaked in water; And first connecting elements, lid member is connected to driver element.
Water jacket can comprise: the first accomodating unit, extends near slit and is filled with water; Extension apparatus, extends near the opposite side of slit and in the face of the first accomodating unit; And second accomodating unit, from extension apparatus, extend, to hold water.
Lid member can comprise with the first lid member of the first connecting elements combination and cover member with second of the first lid Component composition.
The first lid member can be formed and the second lid member can extend and contraction through forming with length direction along slit by rigid material.
The second lid member can be bellows-type.
Substrate-treating apparatus can also be included at least one bearing between the first lid member and water jacket.
Substrate-treating apparatus can also comprise the second connecting elements that is connected to the first connecting elements and injection unit.
Driver element can be included in the track that extends on the length direction of slit and along track mobile mobile unit linearly, wherein the first connecting elements is connected to mobile unit.
Substrate-treating apparatus can also comprise supply pipe, and described supply pipe is positioned in the first and second connecting elementss and by treatment media and is fed to injection unit.
Substrate-treating apparatus can also comprise: the first workbench, is positioned in process chamber and places substrate in the above; A plurality of supports, are connected to the first workbench; And lift unit, through equipping to move up and down the first workbench by least one being connected in support.
The length of slit can be greater than the length of the first workbench, and the end of slit can divide with the end of the first workbench the width that reaches injection unit.
Substrate-treating apparatus can also comprise: the second workbench, in process chamber, settle regularly to face the first workbench, and at least one in its medium-height trestle is through the second workbench; And a plurality of protection members, be placed between the first workbench and the second workbench, around each in support, and through equipment to extend and to shrink.
According to the present invention, from being blocked to processing outdoor Leakage Gas in process chamber, therefore, can prevent the pollution and harm to treatment system and/or driver element.
And, when using wet type processing device, can improve the durability of system.
In the substrate surface treatment system with arrangements in upright arrangement, lining treatment system can be used as changing the direction switching apparatus of the direction of substrate.
Due to formation, move up and down that the support of elevator system of workbench and lift unit are protected and can processed medium pollution; so there is no need by using expensive material anticorrosive and/or high chemical resistance to form support and/or lift unit, thereby reduce equipment cost.
And, although in the wet treatment system of having processed indoor location, also can be in processing indoor location elevator system.
The distribution for the treatment of media is prevented, and therefore, the upper surface of process chamber and basal surface can be protected.
Because treatment media can be handled smoothly and discharge, so can reduce environmental pollution.
Accompanying drawing explanation
By reference to accompanying drawing, one exemplary embodiment of the present invention is described in detail, above and other feature and advantage of the present invention will become more clear and easy to understand, wherein:
Fig. 1 is according to the schematic diagram of the end view of the substrate-treating apparatus of one embodiment of the invention;
Fig. 2 is according to the schematic diagram of the front view of the substrate-treating apparatus of Fig. 1 of one embodiment of the invention;
Fig. 3 is according to the sectional view of the sealing unit of the substrate-treating apparatus of Fig. 1 of one embodiment of the invention and driver element;
Fig. 4 is according to the plane graph of the sealing unit of the substrate-treating apparatus of Fig. 1 of one embodiment of the invention and driver element;
Fig. 5 is sealing unit according to another embodiment of the present invention and the plane graph of driver element; And
Fig. 6 is the schematic diagram of the end view of substrate-treating apparatus according to another embodiment of the present invention.
Embodiment
With reference to accompanying drawing, more fully describe the present invention, in accompanying drawing, illustrate one exemplary embodiment of the present invention.
Fig. 1 is according to the schematic diagram of the end view of the substrate-treating apparatus of one embodiment of the invention.
With reference to figure 1, substrate-treating apparatus according to the present invention comprises process chamber 2, is positioned at workbench 3 and injection unit 4 in process chamber 2.
Pending substrate 1 is placed on the workbench 3 being positioned in process chamber 2.
Process chamber 2 can be the chamber for the treatment of substrate 1.In process chamber 2, can carry out wet processed.Although not shown, process chamber 2 can comprise the door that enters and leave for substrate 1.
As depicted in figs. 1 and 2, long slit 22 can form in the sidewall 21 of process chamber 2.Injection unit 4 can carry out reciprocating linear along slit 22 and move, and treatment media sprays to substrate 1 from injection unit 4, and therefore, the surface of substrate 1 is processed.The length of slit 22 can be greater than the length of substrate 1.Therefore, injection unit 4 can be moved back and forth and treatment media is discharged on the surface of substrate 1 by the whole length along substrate 1.
As shown in Figure 2, injection unit 4 is placed in substrate 1 top with the surface of substrate 1 at a distance of predetermined gap, and comprise spray-hole 41 with by treatment media discharged to substrate 1.The whole length of spray-hole 41 can be greater than the width of substrate 1.Therefore, the surface treatment of substrate 1 can be by carrying out at the whole width of substrate 1 from spray-hole 41 inject process media.In Fig. 1 and Fig. 2, illustrate an injection unit 4.Yet, the invention is not restricted to this, that is to say, in process chamber 2, can settle several injection units 4.And single injection unit 4 can be through equipping with the while or spraying a plurality of identical type or different types for the treatment of media at different time.
Driver element 5 is placed in outside process chamber 2.Driver element 5 is connected to injection unit 4 by slit 22, and along length direction movable spray unit 4 in the surface direction of substrate 1 of slit 22.Driver element 5 can be along the length direction of slit 22 and any type of movable spray unit 4, and can be any linear drive system, for example linear motion system, chain type drive system or magnetic suspension system.
The treatment media of spraying from injection unit 4 can be at least one that select in the group from being comprised of deionized water (DI water), ozone, hydrofluoric acid (fluorine acid) and air, and can be the lip-deep various media that can be sprayed onto substrate 1.
Sealing unit 6 is placed between injection unit 4 and driver element 5.Driver element 5 can be sealed and the internal atmosphere that is not subject to processing chamber 2 affects by sealing unit 6.In this manual, sealing does not mean the limited sealing that process chamber 2 liquid communication between inside and outside is blocked completely, and means that the pressure condition of process chamber 2 between inside and outside can keep equating and process chamber 2 likely exists the part sealing of the circulation of air of specific degrees between inside and outside.
Sealing unit 6 is settled near slit 22, and the outside of the sidewall 21 of reliable nearly process chamber 2 and settling.
Injection unit 4 is connected to sealing unit 6 by contiguous block 42.
Storage tank 45 is placed in outside process chamber 2.Injection unit 4 is connected to storage tank 45 by the first supply pipe 43 and the second supply pipe 44.At least one in the first supply pipe 43 and the second supply pipe 44 is connected to valve 46, and at least one the supply for the treatment of media from storage tank 45 to first supply pipes 43 and the second supply pipe 44 can be controlled by valve 46.The electronic valve that the control unit that valve 46 can be served as reasons extra drives.
Fig. 3 is according to the sectional view of the sealing unit 6 of the substrate-treating apparatus of Fig. 1 of one embodiment of the invention and driver element 5, and Fig. 4 is according to the plane graph of the sealing unit 6 of one embodiment of the invention and driver element 5.
Water jacket 61 is positioned near slit 22 on the outside of sidewall 21 of process chamber 2.Water jacket 61 is filled with water 60.
Water jacket 61 can comprise the first accomodating unit 611, extension apparatus 613 and the second accomodating unit 612.
The first accomodating unit 611 is through forming with the top edge from slit 22 to process chamber 2 extensions and being bent upwards.Therefore, water 60 can be contained in the first accomodating unit 611.The first accomodating unit 611 can be through forming at least to cover the length of slit 22.A side cover of water jacket 61 can be formed by the first accomodating unit 611.
Extension apparatus 613 extends to process chamber 2 from the lower limb of slit 22, within 611 minutes, reaches predetermined distance with the first accomodating unit, and is bent upwards and extends in the face of the first accomodating unit 611.
The second accomodating unit 612 is bent upwards after the outer surface from extension apparatus 613 extends in the horizontal direction, and the inner side of the second accomodating unit 612 is filled with water 60.
Extension apparatus 613 and the second accomodating unit 612 can be through forming at least to cover the length of slit 22.The opposite side cover of water jacket 61 can be formed by extension apparatus 613 and the second accomodating unit 612.
Lid member 62 forms on water jacket 61.Lid member 62 comprise to the lower limb unit 623 of downward-extension and 624 and lower limb unit 623 and 624 both respectively through settling to be immersed in the water 60 of water jacket 61.Therefore, when etching gas, moisture, dust and the particulate (hereinafter referred to as gas) of process chamber 2 interior generations move to driver element 5 by slit 22, gas must be through the water 60 of water jacket 61, and the pollution of driver element 5 can reduce, and this is because the transfer of gas is blocked by water 60.
As shown in Figure 4, lid member 62 can comprise the first lid member 621 and the second lid member 622.
The first lid member 621 can be formed by rigid materials such as metals.Be connected to the upper surface combination of the first connecting elements 631 and the first lid member 621 of driver element 5, and be connected to the lower surface combination of the second connecting elements 632 and the first lid member 621 of contiguous block 42.
The first supply pipe 43 and the second supply pipe 44 are placed in respectively in the first connecting elements 631 and the second connecting elements 632, and the first supply pipe 43 and the second supply pipe 44 are connected to each other.In Fig. 3 and Fig. 4, first supply pipe 43 and second supply pipe 44 are placed in respectively in the first connecting elements 631 and the second connecting elements 632.Yet, the invention is not restricted to this, that is to say, kind and the quantity of the treatment media that the quantity of supply pipe can be sprayed according to injection unit 4 increase.
As shown in Figure 3, a plurality of bearings 614 are arranged between the first lid member 621 and water jacket 61, with when the first lid member 621 moves along the length direction of slit 22 by the effect of driver element 5, reduce the friction between the first lid member 621 and water jacket 61.For example, bearing 614 can be placed in respectively between the lower limb unit 623 of the first lid member 621 and the first accomodating unit 611 and between the lower limb unit 624 and extension apparatus 613 of the first lid member 621, and between the horizontal component of the first lid member 621 and the lower limb unit of the first accomodating unit 611 and first cover between the horizontal component of member 621 and the lower limb unit of extension apparatus 613.
Water 60 is filled in water jacket 61 to flow to outside, and water 60 is constantly fed to water jacket 61 by extra feeding mechanism (not shown).Therefore, the water 60 of the gaseous contamination in processed chamber 2 is constantly discharged to outside, and gas flowing from process chamber 2 to outside can be prevented.
Driver element 5 can comprise the track 51 extending along the length direction of slit 22 and the mobile unit 52 moving on track 51.Linear motion system can be used for track 51 and mobile unit 52, but the invention is not restricted to this.
The first connecting elements 631 combines with the mobile unit 52 of driver element 5, and mobile unit 52 is moved linearly along track 51, and simultaneously, mobile the first lid member 621.
The second lid member 622 and the first lid member 621 combinations, and can through equipment, with the length direction along slit 22, extend and shrink.For example, the second lid member 622 can be bellows-type.Therefore,, when the first lid member 621 moved linearly with the Linear-moving while of mobile unit 52, the second lid member 622 can constantly extend and shrink, simultaneously sealing processing chamber 2.Although not shown, the lower limb unit of the second lid member 622 also will be contained in water jacket 61, to block gas, from process chamber 2, leak, and therefore, can prevent pollution or the infringement to driver element 5 of process chamber 2 perimeters.
Fig. 5 is sealing unit according to another embodiment of the present invention and the plane graph of driver element.In Fig. 5, two first lids member 621a and 621b settle parallel to each other, and the second lid member 622 is connected to each other between the first lid member 621a and 621b.
Each combination in the edge of two the first connecting elements 631a and 631b and the first lid member 621a and 621b, and the other edge of two the first connecting elements 631a and 631b and two the mobile unit 52a and the 52b combination that are positioned on track 51.In this structure, two first lids member 621a and 621b sequentially move, and this is because two mobile unit 52a and 52b sequentially move.
Although not shown, extra injection unit can be connected to each in the first lid member 621a and 621b.Injection unit can spray the treatment media differing from one another.
Fig. 6 is the schematic diagram of the end view of substrate-treating apparatus according to another embodiment of the present invention.
With reference to figure 6, the first workbench 31 and the second workbench 32, be positioned in process chamber 2.Substrate 1 is placed on the first workbench 31 and the second workbench 32 is positioned under the first workbench 31 regularly.The downside of the second workbench 32 sealing processing chambers 2, to prevent that the surperficial treatment media that is sprayed onto substrate 1 from dropping onto on the lift unit 7 being placed under the second workbench 32.
First 231 and second 232 that for substrate 1, enter and leave form in the sidewall of process chamber 2.Can be entrance and second 232 outlet that can be substrate 1 of substrate 1 for first 231, but entrance and exit can be put upside down.Can directly under first 231, form for second 232.Yet, the invention is not restricted to this, that is to say, second 232 can form on another sidewall of process chamber 2.And, on the downside of the sidewall that can be placed in process chamber 2 for first 231 and on the upside of second 232 another sidewall that can be placed in process chamber 2.
Lift unit 7 is arranged on the downside of process chamber 2.A plurality of supports 71 are connected to lift unit 7.Support 71 upper end is connected to the lower surface of the first workbench 31.Lift unit 7 is through designing with while or non-side by side lifting or reduction support 71.Therefore, the first workbench 31 moves up and down in process chamber 2.Lift unit 7 and support 71 can be equipped with cylinder or motor and gear.
Through hole 321 forms in the second workbench 32, makes support 71 through through hole 321.And a plurality of protection members 72 form around through hole 321 between the lower surface of the first workbench 31 and the upper surface of the second workbench 32.Protection member 72 is through installing with around support 71, and protection member 72 edge is through settling to be positioned at outside through hole 321.Therefore,, although the treatment media being sprayed onto on substrate 1 is dropped on the second workbench 32, treatment media can not drop onto on lift unit 7 through through hole 321, therefore, can prevent the pollution that treatment media causes.Protection member 72 can be formed by the material of length variations, and can be bellows etc.The second workbench 32 can comprise extra water discharge device, so that the treatment media being sprayed onto on substrate 1 is discharged to outside.
In this structure, the first workbench 31 can be promoted and be reduced by lift unit 7, and therefore, during the one at substrate 1 in by first 231 and second 232 enters process chamber 2 and after processing with treatment media, change direct of travel, so that substrate 1 is discharged from process chamber 2.
In embodiment described above, the length of slit 22 can be greater than the length of the first workbench 31.And the clearance D between the end 221 of slit 22 and the end 311 of the first workbench 31 can at least be greater than the width W of injection unit 4.Therefore,, when the first workbench 31 promotes and reduces, injection unit 4 can not interrupt the movement of the first workbench 31.
Although the present invention has been done to detail display and description with reference to one exemplary embodiment, those of ordinary skill in the field will understand, and without departing from the spirit and scope of the present invention in the situation that, can make various changes to form of the present invention and details.

Claims (13)

1. a substrate-treating apparatus, comprising:
Process chamber has slit in its at least one sidewall, and wherein pending substrate is placed in described process chamber;
Injection unit, is positioned in described process chamber treatment media is sprayed onto on described substrate;
Driver element, is positioned at outside described process chamber, by described slit, is connected to described injection unit, and moves described injection unit in the surface direction of described substrate; And
Sealing unit, gets involved between described injection unit and described driver element and seals described driver element making it not affected by the internal atmosphere of described process chamber.
2. substrate-treating apparatus according to claim 1, is characterized in that described sealing unit comprises:
Water jacket, settles and is filled with water near described slit;
Lid member, is placed on described water jacket, makes the lower limb of described lid member under water; And
The first connecting elements, is connected to described driver element by described lid member.
3. substrate-treating apparatus according to claim 2, is characterized in that described water jacket comprises:
The first accomodating unit, extends near a side of described slit and is filled with water;
Extension apparatus, extends near the opposite side of described slit and in the face of described the first accomodating unit; And
The second accomodating unit, extends from described extension apparatus, to hold water.
4. substrate-treating apparatus according to claim 2, is characterized in that described lid member comprises:
The first lid member with the first connecting elements combination; And
The second lid member with described the first lid Component composition.
5. substrate-treating apparatus according to claim 4, is characterized in that described the first lid member is formed by rigid material and described the second lid member extends and shrinks through forming with the length direction along described slit.
6. substrate-treating apparatus according to claim 5, is characterized in that described the second lid member is bellows-type.
7. substrate-treating apparatus according to claim 5, is also included at least one bearing between described the first lid member and described water jacket.
8. substrate-treating apparatus according to claim 4, also comprises the second connecting elements that is connected to described the first connecting elements and described injection unit.
9. substrate-treating apparatus according to claim 2, it is characterized in that described driver element is included in the track that extends on the length direction of described slit and along described track mobile mobile unit linearly, wherein said the first connecting elements is connected to described mobile unit.
10. substrate-treating apparatus according to claim 8, also comprises supply pipe, and described supply pipe is positioned in described the first connecting elements and described the second connecting elements and treatment media is fed to described injection unit.
11. according to the substrate-treating apparatus described in arbitrary claim in claim 1 to 10, also comprises:
The first workbench, is positioned in described process chamber and places described substrate in the above;
A plurality of supports, are connected to described the first workbench; And
Lift unit, through equipping to move up and down described the first workbench by least one being connected in described support.
12. substrate-treating apparatus according to claim 11, it is characterized in that the length of described slit is greater than the length of described the first workbench, and the end of the end of described slit and described the first workbench divide the width that reaches described injection unit.
13. substrate-treating apparatus according to claim 11, also comprise:
The second workbench settles regularly to face described the first workbench in described process chamber, and at least one in wherein said support is through described the second workbench; And
A plurality of protection members, are placed between described the first workbench and described the second workbench, around each in described support, and through equipment to extend and to shrink.
CN201210371923.9A 2012-06-25 2012-09-28 Treating apparatus for substrate Pending CN103515190A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120068175A KR101426840B1 (en) 2012-06-25 2012-06-25 Treating apparatus for substrate
KR10-2012-0068175 2012-06-25

Publications (1)

Publication Number Publication Date
CN103515190A true CN103515190A (en) 2014-01-15

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CN (1) CN103515190A (en)
TW (1) TW201401362A (en)

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CN106997858A (en) * 2016-01-26 2017-08-01 弘塑科技股份有限公司 Base plate wet processing unit and the single-wafer etch cleaning device including it

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Publication number Priority date Publication date Assignee Title
CN106997858A (en) * 2016-01-26 2017-08-01 弘塑科技股份有限公司 Base plate wet processing unit and the single-wafer etch cleaning device including it
CN106997858B (en) * 2016-01-26 2020-01-21 弘塑科技股份有限公司 Substrate wet processing device and single wafer etching and cleaning device comprising same

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KR20140000820A (en) 2014-01-06
TW201401362A (en) 2014-01-01

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Application publication date: 20140115