CN103512953A - Ultrasonic testing method adopting multiple probes - Google Patents
Ultrasonic testing method adopting multiple probes Download PDFInfo
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- CN103512953A CN103512953A CN201310450041.6A CN201310450041A CN103512953A CN 103512953 A CN103512953 A CN 103512953A CN 201310450041 A CN201310450041 A CN 201310450041A CN 103512953 A CN103512953 A CN 103512953A
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Abstract
The invention discloses an ultrasonic testing method adopting multiple probes. The method is implemented through a multi-probe device, wherein the multi-probe device comprises a shell, a left wedge, a middle wedge, a right wedge, a left wafer, a left damping block, a left cable, an ultrasonic instrument, a middle wafer, a middle damping block, a middle cable, a right wafer, a right damping block, a right cable, a sound isolating groove and a silencing groove. The method comprises the steps as follows: (1) calibrating the device through CSK-IA and CSK-IIIA briquettes, inputting all parameters of the three wafers in the ultrasonic instrument according to the calibrating result, and determining the flaw detection sensitivity of the device through the CSK-IIIA briquette; (2) checking whether the sensitivities of the three wafers in the device are normal and whether the alarming state is normal when the device moves; (3) using the device to test the inspected workpieces, wherein the testing is begun from the wafer at the edge; (4) implementing front-back, left-right, turning angle and surrounding inspection for the flaws by using the wafer with highest echo amplitude after the device finds out the flaws.
Description
Technical field
The invention belongs to the manual detection field of the super reflectometry of A, it relates to the multi-probe supersonic testing method of employing.
Background technology
Ultrasound wave is frequency higher than the sound wave of 20000 hertz, its good directionality, and penetration capacity is strong, is easy to obtain more concentrated acoustic energy, in water transmission distance, can be used for finding range, tests the speed, cleans, welding, rubble, sterilizing etc.In medical science, military affairs, industry, agricultural, there is a lot of application.Ultrasound wave is gained the name because of the upper limit of hearing that its lower-frequency limit approximates greatly people.
At present, when the super reflectometry of ultrasound wave A is manually checked, be all to use Traditional Man method of detection, the i.e. detection of a people, a machine, a probe.When a weld seam need to adopt the probe of multiple angles to test, need several individuals to detect or a people repeats detection several times to this weld seam simultaneously, just can complete the check of weld seam.As carrying out U.S. ASME standard, to carry out French RCCM standard, carry out that China JB/T4730.3-2005C level detects be exactly, same weld seam to use respectively two or three even the probe of four kinds of angles test, just can complete check.Expended a large amount of human and material resources and valuable time, detected loaded down with trivial details especially.
The relevant multiple probe detector existing in existing patent, as Chinese patent application CN201120263270.3 Twin-lamellae K 1 probe, in the disclosed probe of this patent, two probes have been used, yet this class probe is used pugging between wafer, increased the cost of this class probe; The pitch angle of the wafer in this class probe is fixed simultaneously, makes this class probe application underaction; The easily generation that is limited in scope of two probe detections is undetected.
Due to the problems referred to above, the inventor carries out critical and analyzes existing probe technologies, so as to produce have simple in structure, cost is low, use is flexible, can the multi-probe supersonic testing method of disposable employing of simultaneously detecting a flaw from a plurality of angles during inspected area Datong District.
Summary of the invention
In order to address the above problem, the inventor has carried out research with keen determination, found that: by the many probe apparatus after improving, undertaken, described many probe apparatus comprise: shell, left wedge, middle wedge, right wedge, left-handed crystal sheet, left damping block, middle wafer, middle damping block, right-handed crystal sheet, right damping block and Ultrasound Instrument, wherein, between left-handed crystal sheet and middle wafer, arrange between sound insulation groove, middle wafer and right-handed crystal sheet sound insulation groove is set, left-handed crystal sheet, middle wafer and right-handed crystal sheet three's front end arranges respectively anechoic trap; This method of inspection comprises the following steps: proofread and correct this device by CSK-I A and CSK-III A test block (1); And according to the parameters of proofreading and correct result and input three wafers in Ultrasound Instrument; By CSK-III A test block, determine the flaw detection sensitivity of this device; (2) normally whether the sensitivity that checks this device inner three wafers of this device when mobile, whether alarm condition normal; (3) use this device to test to tested workpiece: one, Shi Cong edge of check wafer starts; (4) when this device is found after defect, with the highest wafer of echo amplitude, aim at defect carry out all around, corner and around scanning, then by standard, respectively defect is made to character, size judgement and defect grading in conjunction with DAC curve separately.Thereby complete the present invention.
The object of the present invention is to provide following aspect:
The first, adopt multi-probe supersonic testing method, it is characterized in that:
The following many probe apparatus of the method application, described many probe apparatus comprise:
Left-handed crystal sheet 5a, its front is affixed on left wedge inclined-plane, and left chip back surface and left damping block 6a are affixed, and left-handed crystal sheet is connected with Ultrasound Instrument 1 by left cable 3a,
Middle wafer, its front is affixed on middle wedge inclined-plane, and middle chip back surface and middle damping block are affixed, and middle wafer is connected with Ultrasound Instrument by middle cable 3b,
Right-handed crystal sheet, its front is affixed on right wedge inclined-plane, and right chip back surface and right damping block are affixed, and right-handed crystal sheet is connected with Ultrasound Instrument by right cable 3c,
Wherein, arrange between sound insulation groove, middle wafer and right-handed crystal sheet sound insulation groove is set between left-handed crystal sheet and middle wafer, the front end of left-handed crystal sheet, middle wafer and three wafers of right-handed crystal sheet arranges respectively anechoic trap;
This method of inspection comprises the following steps:
(1) by CSK-I A and CSK-III A test block, this device is proofreaied and correct: the transverse wave velocity value of using CSK-I A test block calibration materials, and by CSK-I A test block, the angle of inclination of three wafers, zero migration, Front distance distance are proofreaded, and calibration values is input in Ultrasound Instrument; By CSK-III A test block, determine the flaw detection sensitivity of each wafer in this device and preserve;
(2) check flaw detection sensitivity and the panalarm of three wafers that this device this device when mobile is inner;
(3) use this device to test to detected test specimen: one, Shi Cong edge of check wafer starts, the wafer of close test block at first when one, described edge wafer starts to check for this device; One, described edge wafer is left-handed crystal sheet or right-handed crystal sheet, scanning orientation determination during according to check;
(4) when this device is found after defect 11, with the highest wafer of echo amplitude, aim at defect carry out all around, corner and around scanning, wherein, these four kinds of scanning modes are standard JB4730.3-2005 regulation four kinds of scanning modes (as shown in Figure 7); Again in conjunction with three wafers separately flaw detection sensitivity by standard, respectively defect is made to character, size judgement and defect grading.
The second, according to the multi-probe supersonic testing method of employing described in above-mentioned first aspect, it is characterized in that: in left-handed crystal sheet, middle wafer and three wafers of right-handed crystal sheet, between each wafer and shell bottom surface, the size of angle is adjustable.
Three, according to the multi-probe supersonic testing method of employing described in above-mentioned first aspect, it is characterized in that: in step (3), one, Shi Cong edge of check wafer starts, this installs mobile pattern is sawtooth pattern and horizontal parallel or oblique parallel carrying out, and the described sawtooth pattern i.e. route of this device is fold-line-shaped; Described laterally parallel refer to when weld reinforcement polishes, many probe apparatus are put parallel with bead direction in welded joints, for detection of weld seam transverse defect; The scanning direction that oblique parallel finger is popped one's head in when weld reinforcement does not polish becomes the angle of 10～20 ° with the direction of weld seam, and the each direction of travel of many probe apparatus is parallel to each other.Concrete diagram is shown in Fig. 8 a and 8b.
Four, according to the multi-probe supersonic testing method of employing described in above-mentioned first aspect, it is characterized in that: in step (3), this device moves forward and backward the product that width distance is greater than the tangent value at detected specimen thickness Yu compare great refraction angle, described compare great refraction angle is the refraction angle that in three wafers, second largest wafer in refraction angle produces.
Five, according to the multi-probe supersonic testing method of employing described in above-mentioned first aspect, it is characterized in that: the material of this crust of the device bottom is organic glass.
Six, many probe apparatus, it is if above-mentioned first aspect is to as described in any one in Wu aspect.
According to the multi-probe supersonic testing method of employing provided by the invention, have simple in structure, cost is low, use is flexible, can disposablely from a plurality of angles, detect a flaw during inspected area Datong District simultaneously; The method specifically has following beneficial effect:
The first, this device has been used the probe that several angle resultant wafer form, and just can complete the scanning of detection separately of a plurality of angles in scanning once detects, and makes to check work efficiency at double or the raising of several times;
The second, this device simultaneously multi-angle be used in conjunction with, once check just can be carried out multi-angle to same defect and mutually verifies, qualitative to defect provides more information;
Three, because several wafer set merge row, increase wafer width, the mobile covering of this device each in check increased, reduced because covering undetected that deficiency causes;
Four, because several wafers coexist, by acoustic beam, spread and form angle of a roof and reflect, can detect some inclination defect;
Five, the method is applicable to carry out the product of U.S. ASME standard, the product that JB/T4730.3-2005C level detects, the occasion of carrying out the product of French RCCM standard detection or having many probe checks to need.
Accompanying drawing explanation
Fig. 1 illustrates the working state figure that adopts according to the preferred embodiment of the present invention multi-probe supersonic testing method;
Fig. 2 illustrates the structural representation that adopts according to the preferred embodiment of the present invention many probe apparatus in multi-probe supersonic testing method;
Fig. 3 illustrates the left view that adopts according to the preferred embodiment of the present invention many probe apparatus in multi-probe supersonic testing method;
Fig. 4 illustrates and adopts according to the preferred embodiment of the present invention multi-probe supersonic testing method roof reflector schematic diagram;
Fig. 5 illustrates the schematic diagram that adopts according to the preferred embodiment of the present invention the detected test specimen of multi-probe supersonic testing method;
Fig. 6 illustrates the schematic diagram of the super reflectometry pick-up unit of conventional A;
Fig. 7 illustrates four kinds of determining defects mode schematic diagram
Fig. 8 a illustrates oblique parallel mode schematic diagram in the mobile pattern that adopts according to the preferred embodiment of the present invention multi-probe supersonic testing method;
Fig. 8 b illustrates horizontal parallel mode schematic diagram in the mobile pattern that adopts according to the preferred embodiment of the present invention multi-probe supersonic testing method;
Fig. 9 illustrates the many probe apparatus structural representation that adopts according to the preferred embodiment of the present invention multi-probe supersonic testing method;
Figure 10 illustrates and adopts according to the preferred embodiment of the present invention multi-probe many probe apparatus of supersonic testing method structural representation.
Drawing reference numeral explanation:
1-Ultrasound Instrument
2-shell
The left cable of 3a-
Cable in 3b-
The right cable of 3c-
The left wedge of 4a-
5a-left-handed crystal sheet
The left damping block of 6a-
The 7-groove that insulates against sound
8-anechoic trap
11-defect
13-A type ultra-sonic defect detector
The mono-probe of 14-
15-is detected test specimen
Embodiment
Below by the present invention is described in detail, the features and advantages of the invention will become more clear, clear and definite along with these explanations.
Here special-purpose word " exemplary " means " as example, embodiment or illustrative ".Here as " exemplary " illustrated any embodiment, needn't be interpreted as being better than or being better than other embodiment.Although the various aspects of embodiment shown in the drawings, unless otherwise indicated, needn't draw accompanying drawing in proportion.
According in a preferred embodiment of the present invention, as shown in Fig. 1-5, provide and adopt multi-probe supersonic testing method, the following many probe apparatus of the method application, described many probe apparatus comprise:
Left-handed crystal sheet 5a, its front is affixed on left wedge inclined-plane, and left chip back surface and left damping block 6a are affixed, and left-handed crystal sheet is connected with Ultrasound Instrument 1 by left cable 3a,
Middle wafer, its front is affixed on middle wedge inclined-plane, and middle chip back surface and middle damping block are affixed, and middle wafer is connected with Ultrasound Instrument by middle cable 3b,
Right-handed crystal sheet, its front is affixed on right wedge inclined-plane, and right chip back surface and right damping block are affixed, and right-handed crystal sheet is connected with Ultrasound Instrument by right cable 3c,
Wherein, arrange between sound insulation groove, middle wafer and right-handed crystal sheet sound insulation groove is set between left-handed crystal sheet and middle wafer, the front end of left-handed crystal sheet, middle wafer and three wafers of right-handed crystal sheet arranges respectively anechoic trap;
This method of inspection comprises the following steps:
(1) by CSK-I A and CSK-III A test block, this device is proofreaied and correct: the transverse wave velocity value of using CSK-I A test block calibration materials, and by CSK-I A test block, the angle of inclination of three wafers, zero migration, Front distance distance are proofreaded, and calibration values is input in Ultrasound Instrument; By CSK-III A test block, determine the flaw detection sensitivity of each wafer in this device and preserve, by flaw detection sensitivity, drawing DAC curve;
(2) check flaw detection sensitivity and the panalarm of three wafers that this device this device when mobile is inner;
(3) use this device to test to detected test specimen: one, Shi Cong edge of check wafer starts;
(4) when this device is found after defect, with the highest wafer of echo amplitude, aim at defect carry out all around, corner and around scanning, then in conjunction with three wafers separately flaw detection sensitivity by standard, respectively defect is made to character, size judgement and defect grading.
Wherein, the single probe of tradition detection method is used device as shown in Figure 6, this device is connected with an A-mode ultrasonic wave inspection instrument 13 by a single probe 14, this unit efficiency is low, detection method described in the present invention is used many probe apparatus as shown in Figure 1, and these many probe apparatus have improved detection efficiency, increased sensing range.
Wherein, in the present invention, three wafers are launched respectively incident wave, with intermittent pulse pattern, and are detected in test specimen and propagate with diffusion with angle separately, will produce diffraction and reflection and change with wave mode when incident wave runs into heterogeneous interface (defect).Diffracted wave returns to wafer with shortest path, and reflection wave equals incident angle reflection with reflection angle, if the direction of defect is perpendicular with incident wave direction or near when vertical, diffracted wave and reflection wave are received by wafer after superposeing, thus discovery defect.Several wafer package are in a shell time, when in detected test specimen, ultrasonic propagation is to certain distance, because the diffusion of acoustic beam can be met several roads ultrasound wave, superposition principle by ripple: the vibration of the place's of meeting particle is the synthetic of each train wave vibration, particle displacement is the vector of each train wave displacement, after meeting, each row sound wave still keeps own original frequency, wavelength, direction of vibration continues to propagate, just as not running into other ripple, hyperacoustic independence that Here it is, so mutually do not interfere when several roads ultrasound wave detects and affect detection simultaneously, it is very clear that each passage echo shows, not disorderly.
One preferred embodiment in, as shown in Figure 2, described shell 2 bottoms are transparent, here, outer casing bottom material is preferably organic glass; Enclosure is provided with acoustic absorbant;
Wherein, left wedge, middle wedge and right wedge are installed successively by straight line from left to right in shell 2 bottoms; Described left wedge, middle wedge and right wedge are transparent, and three's shape is identical, it is leg-of-mutton prism that left wedge, middle wedge and right wedge three are xsect, wedge can change the angle that enters that ultrasound wave enters wafer, by left wedge, middle wedge and right wedge are set, can be so that this device coverage increase, the dirigibility that has improved this device.
In concrete example, the inclined-plane of described left wedge and shell bottom surface angle are 45 degree; The inclined-plane of described middle wedge and shell bottom surface angle 60 degree; The inclined-plane of described right wedge and shell bottom surface angle 70 degree.
One preferred embodiment in, as shown in Figure 2, left-handed crystal sheet is affixed on the inclined-plane of left wedge, middle wafer is affixed on the inclined-plane of middle wedge, right-handed crystal sheet is affixed on the inclined-plane of right wedge; Here the material of described left-handed crystal sheet, three wafers of middle wafer and right-handed crystal sheet is identical, and the size of three wafers is 13mm * 13mm, and frequency is 2.5MHz; Described wafer is for internal loopback ultrasound wave
Wherein, left-handed crystal sheet is connected with Ultrasound Instrument 1 by left cable 3a; Middle wafer is connected with Ultrasound Instrument by middle cable, and right-handed crystal sheet is connected with Ultrasound Instrument by right cable, and described left cable, three cables of middle cable and right cable are identical, are 75 Ω concentric cable.
Wherein, because three wafers of this device are different from the angle of shell bottom surface, therefore this device is when detecting detected test specimen, easily there is roof reflector, easy like this some unconspicuous defects that detect, the detectability of this device is improved, described roof reflector as shown in Figure 4, when the ultrasound wave sending when 45 degree wafers runs into defect, according to wave reflection principle, the ultrasound wave that 45 degree wafers send can not return on Yan Yuan road, be refracted to the wafer place at 60Du angle, outside the scope that the wafer at 60Du angle can receive, and then the wafer at Bei60Du angle or the acceptance of 70Du angle wafer, make like this some unconspicuous defects be detected, improved the detectability of the method.
In further preferred embodiment, because the inclined-plane of three wedges and the angle between shell bottom surface are adjustable, therefore the angle of three wafers and outer casing bottom is also adjustable, increased like this dirigibility of this device, this device can, according to the needs of actual conditions, be regulated the angle between three wafers and shell bottom surface.
One preferred embodiment in, as shown in Figure 2, left damping block is affixed on to left chip back surface, middle damping block is affixed on to middle chip back surface, right damping block is affixed on to right chip back surface, the material of described left damping block, three damping blocks of middle damping block and right damping block is identical, is conventional damping block.
One preferred embodiment in, as shown in Figure 2, between adjacent wafer, be provided with sound insulation groove 7, front end at each wafer is provided with anechoic trap 8, sound insulation groove 7 makes non-interference between the ultrasound wave of each wafer transmitting, anechoic trap 8 is eliminated the reflection echo that wafer is supervened when producing refraction wave, makes reflection echo not disturb flaw detection.Sound insulation groove and anechoic trap can, so that this device has reduced the cost of production cost, sound insulation groove and anechoic trap lower than common sound insulating material when improving soundproof effect, make the cost of this device.
One preferred embodiment in, as shown in Figure 9, step (1) is used the transverse wave velocity value of CSK-I A test block calibration materials, and by CSK-I A test block, the angle of inclination of three wafers, zero migration, Front distance distance is proofreaded, and calibration values is input in Ultrasound Instrument; By CSK-III A test block, determine the flaw detection sensitivity of each wafer in this device and preserve;
Wherein, the transverse wave velocity value of described material refers to the velocity of propagation of ultrasound wave in tested workpiece; The velocity of sound of this paper middle finger in steel.
Zero migration is that the ultrasound wave of wafer transmitting arrives time, as shown in Figure 9 the travel-time T2 of route between many probe apparatus and detected surface of the work.Only have and obtain zero shift accurately, ultrasound wave is location accurately.
Described Front distance distance is that wafer acoustic beam central point is the distance L 1 that incidence point arrives many probe apparatus shell front bottom edge, as shown in Figure 9.
One preferred embodiment in, this device of step (3) moves forward and backward the product that width distance is greater than the tangent value at detected specimen thickness Yu compare great refraction angle, formula is as follows:
This device moves forward and backward width distance > TH * K, wherein, TH is detected specimen thickness, the tangent value at K Wei compare great refraction angle;
Here ， compare great refraction angle is in three wafers, to have the wafer at second largest refraction angle, is preferably the middle wafer that becomes 60 degree angles with shell bottom surface; Described move forward and backward in as Fig. 5 along the movement of X-direction.Refraction angle refers to the angle between wave beam and detected workpiece normal.As shown in figure 10.Only have when wave beam is vertical with defect direction and can obtain maximum reflection ripple, and the direction of defect is diversified, therefore need to adopt the ultrasound beamformer at multiple refraction angle to detect.In ASME standard, General Requirements adopts 0 °, 45 °, the probe at 60 °,70° refraction angles.
One preferred embodiment in, in step (4), when this device finds that detected time has defect, this device converts different angles to this defect and detects.For a directive defect, while only having beam direction vertical with defect direction, obtain maximum echo amplitude.For the defect of different directions, the wafer that obtains maximum echo amplitude is different.With the highest wafer of echo amplitude, aim at defect do all around, corner, around etc. form scanning, determine size, direction and the character of defect.In conjunction with DAC curve, press standard again, each wafer is made grading to defect respectively.By this step, make the method when detecting detected test specimen, efficiency improves, and accuracy improves, and makes testing more careful, avoids undetected.
Embodiment 1
Detected test specimen is set, the mother metal material 20MnMoR steel of its weld seam, specification 1000 * 320 * 62.This weld seam adopts JB/T4730.3-2005 standard, CSK-I A and CSK-III A test block.
Use the super reflectometry pick-up unit of conventional A to detect detected test specimen, check sensitivity φ 1 * 6-6dB, need to check three times, finds that two place's defects are as shown in table 1 below:
Table 1
| Probe | Defect is the degree of depth/amplitude 1. | Defect is the degree of depth/ |
| 450 | 35/φ1×6+4dB | 34/φ1×6-2dB |
| 600 | 35/φ1×6+5dB | 34/φ1×6+4dB |
| 700 | 35/φ1×6+4dB | 34/φ1×6+7dB |
Use many probe apparatus of the present invention to detect detected test specimen, check sensitivity φ 1 * 6-6dB, only needs to detect once, and testing result is as following table 2:
Table 2
| Probe | Defect is the degree of depth/amplitude 1. | Defect is the degree of depth/ |
| 450 | 35/φ1×6+3dB | 34/φ1×6-2dB |
| 600 | 35/φ1×6+5dB | 34/φ1×6+4dB |
| 700 | 35/φ1×6+4dB | 34/φ1×6+8dB |
From above-mentioned table 1 and table 2 contrast, the super reflectometry of conventional A detects while same detected test specimen being detected to same defect with the present invention, and two kinds of testing results almost do not have difference, and small echo amplitude difference, is negligible.
Wherein, adopt the alignment time of super each probe of reflection wave of conventional A to be about 5 minutes, each probe scanning time is about 35 minutes, needs 120 minutes whole detection time.And the multi-probe alignment time be about 35 minutes while adopting many probe apparatus, and the scanning time is 45 minutes, be 80 minutes whole detection time.Although therefore visible many probe apparatus alignment times longer, the scanning time is short, whole weld seam detection time decreased 1/3.To long weld seam and the large weld seam of thickness, will greatly shorten detection time with respect to the super reflectometry of conventional A multi-probe detection time.
According to the multi-probe supersonic testing method of employing provided by the invention, have simple in structure, cost is low, use is flexible, can disposablely from a plurality of angles, detect a flaw during inspected area Datong District simultaneously; The method specifically has following beneficial effect:
The first, this device has been used the probe that several angle resultant wafer form, and just can complete the scanning of detection separately of a plurality of angles in scanning once detects, and makes to check work efficiency at double or the raising of several times;
The second, this device simultaneously multi-angle be used in conjunction with, once check just can be carried out multi-angle to same defect and mutually verifies, qualitative to defect provides more information;
Three, because several wafer set merge row, increase wafer width, the mobile covering of this device each in check increased, reduced because covering undetected that deficiency causes;
Four, because several wafers coexist, by acoustic beam, spread and form angle of a roof and reflect, can detect some inclination defect;
Five, the method is applicable to carry out the product of U.S. ASME standard, the product that JB/T4730.3-2005C level detects, the occasion of carrying out the product of French RCCM standard detection or having many probe checks to need.
More than engage embodiment and exemplary example has been described in detail the present invention, but these explanations can not be interpreted as limitation of the present invention.It will be appreciated by those skilled in the art that in the situation that not departing from spirit and scope of the invention, can carry out multiple replacement of equal value, modify or improve technical solution of the present invention and embodiment thereof, these all fall within the scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (6)
1. adopt multi-probe supersonic testing method, it is characterized in that:
The following many probe apparatus of the method application, described many probe apparatus comprise:
Shell (2), its bottom is transparent, and transparent left wedge, transparent middle wedge and transparent right wedge are set respectively on its inner bottom surface,
Left-handed crystal sheet (5a), its front is affixed on left wedge inclined-plane, and left chip back surface and left damping block (6a) are affixed, and left-handed crystal sheet is connected with Ultrasound Instrument (1) by left cable (3a),
Middle wafer, its front is affixed on middle wedge inclined-plane, and middle chip back surface and middle damping block are affixed, and middle wafer is connected with Ultrasound Instrument by middle cable (3b),
Right-handed crystal sheet, its front is affixed on right wedge inclined-plane, and right chip back surface and right damping block are affixed, and right-handed crystal sheet is connected with Ultrasound Instrument by right cable (3c),
Wherein, arrange between sound insulation groove (7), middle wafer and right-handed crystal sheet sound insulation groove (7) is set between left-handed crystal sheet and middle wafer, the front end of left-handed crystal sheet, middle wafer and three wafers of right-handed crystal sheet arranges respectively anechoic trap (8);
This method of inspection comprises the following steps:
(1) by CSK-I A and CSK-III A test block, this device is proofreaied and correct: the transverse wave velocity value of using CSK-I A test block calibration materials, and by CSK-I A test block, the angle of inclination of three wafers, zero migration, Front distance distance are proofreaded, and calibration values is input in Ultrasound Instrument; By CSK-III A test block, determine the flaw detection sensitivity of each wafer in this device and preserve;
(2) check flaw detection sensitivity and the panalarm of three wafers that this device this device when mobile is inner;
(3) use this device to test to detected test specimen (15): one, Shi Cong edge of check wafer starts, the wafer of close test block at first when one, described edge wafer starts to check for this device.One, described edge wafer is left-handed crystal sheet or right-handed crystal sheet;
(4) when this device is found after defect, with the highest wafer of echo amplitude, aim at defect carry out all around, corner and around scanning, then in conjunction with three wafers separately flaw detection sensitivity by standard, respectively defect is made to character, size judgement and defect grading.
2. the multi-probe supersonic testing method of employing according to claim 1, is characterized in that: in left-handed crystal sheet, middle wafer and three wafers of right-handed crystal sheet, between each wafer and shell bottom surface, the size of angle is adjustable.
3. the multi-probe supersonic testing method of employing according to claim 1, is characterized in that: in step (3), one, Shi Cong edge of check wafer starts, and this installs mobile pattern is sawtooth pattern and horizontal parallel or oblique parallel carrying out.
4. the multi-probe supersonic testing method of employing according to claim 1, it is characterized in that: in step (3), this device moves forward and backward the product that width distance is greater than the tangent value at detected specimen thickness Yu compare great refraction angle, described compare great refraction angle is the refraction angle that in three wafers, second largest wafer in refraction angle produces.
5. the multi-probe supersonic testing method of employing according to claim 1, is characterized in that: the material of this crust of the device bottom is organic glass.
6. probe apparatus more than, it is if the claims 1 are to as described in any one in claim 5.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105259254A (en) * | 2015-11-12 | 2016-01-20 | 湖南高速铁路职业技术学院 | Scanning device for steel rail bottom transverse cracks |
| CN108088912A (en) * | 2018-01-04 | 2018-05-29 | 常州市常超电子研究所有限公司 | Diffraction reflection combination method is popped one's head in |
| CN110907764A (en) * | 2019-12-18 | 2020-03-24 | 国网河北省电力有限公司魏县供电分公司 | Device for detecting cable breakpoint |
| CN112191574A (en) * | 2020-09-22 | 2021-01-08 | 南京金陵检测工程有限公司 | Pipeline circumferential weld phased array detection reference block and detection method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2444242Y (en) * | 2000-09-08 | 2001-08-22 | 武进市鸣凰电子器材厂 | Tricrystal piece combined probe of ultrasonic inspection for wheel axle |
| CN202066838U (en) * | 2011-03-03 | 2011-12-07 | 中国石油天然气集团公司 | Ultrasonic dually-oblique probe for welding seam detection |
| CN202533412U (en) * | 2012-04-18 | 2012-11-14 | 武汉钢铁(集团)公司 | Adjustable probe box for probes |
| CN202710519U (en) * | 2012-05-09 | 2013-01-30 | 河北省电力研究院 | Compound probe for detecting defects of weld joints of workpieces |
| CN203479758U (en) * | 2013-09-27 | 2014-03-12 | 哈电集团（秦皇岛）重型装备有限公司 | Multi-probe device |
-
2013
- 2013-09-27 CN CN201310450041.6A patent/CN103512953B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2444242Y (en) * | 2000-09-08 | 2001-08-22 | 武进市鸣凰电子器材厂 | Tricrystal piece combined probe of ultrasonic inspection for wheel axle |
| CN202066838U (en) * | 2011-03-03 | 2011-12-07 | 中国石油天然气集团公司 | Ultrasonic dually-oblique probe for welding seam detection |
| CN202533412U (en) * | 2012-04-18 | 2012-11-14 | 武汉钢铁(集团)公司 | Adjustable probe box for probes |
| CN202710519U (en) * | 2012-05-09 | 2013-01-30 | 河北省电力研究院 | Compound probe for detecting defects of weld joints of workpieces |
| CN203479758U (en) * | 2013-09-27 | 2014-03-12 | 哈电集团（秦皇岛）重型装备有限公司 | Multi-probe device |
Cited By (6)
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| CN105259254A (en) * | 2015-11-12 | 2016-01-20 | 湖南高速铁路职业技术学院 | Scanning device for steel rail bottom transverse cracks |
| CN105259254B (en) * | 2015-11-12 | 2018-11-13 | 湖南高速铁路职业技术学院 | Rail flange of rail transversal crack scanning equipment |
| CN108088912A (en) * | 2018-01-04 | 2018-05-29 | 常州市常超电子研究所有限公司 | Diffraction reflection combination method is popped one's head in |
| CN110907764A (en) * | 2019-12-18 | 2020-03-24 | 国网河北省电力有限公司魏县供电分公司 | Device for detecting cable breakpoint |
| CN112191574A (en) * | 2020-09-22 | 2021-01-08 | 南京金陵检测工程有限公司 | Pipeline circumferential weld phased array detection reference block and detection method thereof |
| CN112191574B (en) * | 2020-09-22 | 2022-06-03 | 南京金陵检测工程有限公司 | Pipeline circumferential weld phased array detection reference block and detection method thereof |
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