CN103492173A

CN103492173A - Laminate, method for producing same, and use of same

Info

Publication number: CN103492173A
Application number: CN201280019767.8A
Authority: CN
Inventors: 江畑研一; 松山祥孝; 内田大辅; 川原健吾
Original assignee: Asahi Glass Co Ltd
Current assignee: AGC Inc
Priority date: 2011-04-22
Filing date: 2012-04-17
Publication date: 2014-01-01
Anticipated expiration: 2032-04-17
Also published as: CN103492173B; WO2012144499A1; JPWO2012144499A1; KR20140018937A; TW201249643A

Abstract

The present invention relates to a laminate which comprises a layer of a supporting plate, a resin layer, and a layer of a glass substrate with an inorganic insulating film, sequentially in this order, with the inorganic insulating film of the glass substrate with an inorganic insulating film being in contact with the resin layer. The glass substrate with an inorganic insulating film has an inorganic insulating film, which contains an oxide, nitride or oxynitride containing at least one element selected from the group consisting of silicon and aluminum, on one surface of a glass substrate. The total content of alkali metal atoms and alkaline earth metal atoms in a surface of the inorganic insulating film, said surface being in contact with the resin layer, is 0.5 at% or less. The peel strength at the interface between the layer of the supporting plate and the resin layer is higher than the peel strength at the interface between the resin layer and the inorganic insulating film. The present invention also relates to: a display device panel with a supporting plate, which comprises the laminate and a display device member that is provided on the glass substrate surface of the laminate; a display device panel which is obtained by removing the supporting plate with the resin layer from the display device panel with a supporting plate, using the interface between the inorganic insulating film and the resin layer as a releasing surface; and a display device which has the display device panel.

Description

Duplexer, its manufacture method and purposes

Technical field

The present invention relates to the manufacture method of duplexer, duplexer, with the panel for display unit of gripper shoe, panel and display unit for display unit.

Background technology

In recent years, advance slimming, the lightweight of the devices (electronic equipment) such as solar cell (PV), liquid crystal panel (LCD), organic EL panel (OLED), and advancing the thin plate of the substrate used in these devices.When the intensity of substrate is not enough due to thin plate, in the manufacturing process of device, the operability of substrate reduces.

Therefore, extensively adopt following method: on the substrate thicker than final thickness, formation for example, after member (thin film transistor (TFT)), is processed and is made the substrate thin plate by chemical etching for device all the time.But, in the method, for example, at the thickness by a plate base from the 0.7mm thin plate to 0.2mm, the situation of 0.1mm, the major part of original baseplate material is eliminated with etching solution, be therefore not preferred from viewpoints such as productivity ratio, raw-material service efficiencies.

In addition, in the thin plate method of the above-mentioned substrate that utilizes chemical etching, exist at substrate surface under the situation of fine cut, take sometimes the cut pit fine as starting point forms (etching indenture) due to etch processes, thereby form optical defect.

Recently, in order to tackle above-mentioned problem, following method has been proposed: prepare glass sheet substrate and the stacked and duplexer that obtains of reinforcement plate, form device with after member on the glass sheet substrate of duplexer, the method (for example, referring to Patent Document 1) of separating reinforcement plate from glass sheet substrate.Reinforcement plate has gripper shoe and is fixed to the resin bed on this gripper shoe, and resin bed and glass sheet substrate are adhered in the mode that can peel off.The reinforcement plate that the resin bed of duplexer and the interface of glass sheet substrate are stripped from, separate from glass sheet substrate, can be stacked with new glass sheet substrate, with the form recycling of duplexer.

The prior art document

Patent documentation

Patent documentation 1:WO2007/018028 brochure

Summary of the invention

Invent problem to be solved

But, in the duplexer of above-mentioned existing formation, when reinforcement plate is separated from glass sheet substrate, the part of resin bed can be attached on the release surface as the glass sheet substrate of goods side sometimes.After particularly under hot conditions, duplexer being carried out to heat treated, the part that can frequent produce resin bed is adhered to the release surface of the glass sheet substrate as the goods side, and, there is the worry that causes yield rate to reduce in its result.

In addition, have the situation to further implementing on the glass sheet substrate release surface after separating to process, the expectation surface is clean.

But, in the above-mentioned duplexer in the past formed, the part of resin bed composition is attached to the release surface of the glass sheet substrate after separation, even wish is removed this attachment by utilizing with the purifying processing of the washing of solvent etc. etc., also can't remove to desired level in practicality.

In addition, in the duplexer in the past formed, in the release surface of the glass sheet substrate after separation, during operation when being peeled off or after peeling off, produce sometimes in break (crackle) of glass etc., thereby sometimes cause the reduction of yield rate.

The present invention makes in view of above-mentioned problem, its purpose is to provide the manufacture method of a kind of duplexer and duplexer, even this duplexer is after implementing high-temperature heating treatment, when being peeled off, resin bed and glass substrate also can suppress resin bed adhering to the release surface of glass substrate, and the cleanliness of release surface that can be by implementing the glass substrate after purifying processing keeps separating, can be suppressed in addition in the release surface of glass substrate and crack.

In addition, panel and the display unit for display unit that the object of the present invention is to provide the panel for display unit with gripper shoe that comprises this duplexer, use the display unit with gripper shoe to form with panel.

Solve the means of problem

The inventor has carried out research extensively and profoundly in order to solve above-mentioned problem, and has completed the present invention.

, to achieve these goals, first method of the present invention is a kind of duplexer, it has the layer of gripper shoe successively, resin bed and with the layer of the glass substrate of inorganic insulating membrane, and this inorganic insulating membrane with the glass substrate of inorganic insulating membrane contacts with this resin bed, wherein, be somebody's turn to do in the glass substrate with inorganic insulating membrane, single face at glass substrate has inorganic insulating membrane, this inorganic insulating membrane contains at least one the oxide comprised in the group of selecting free silicon and aluminium to form, nitride or oxynitride, in the face contacted with this resin bed of this inorganic insulating membrane, the atom of alkali and alkaline earth metal ions total content is below 0.5 atom %, the layer of this gripper shoe and the peel strength of the peel strength at the interface of this resin bed higher than the interface of this resin bed and this inorganic insulating membrane.

In first method, this inorganic insulating membrane is preferably the film that comprises silica, silicon nitride, silicon oxynitride or aluminium oxide.

In first method, the surface roughness (Ra) of the face contacted with this resin bed of this inorganic insulating membrane preferably is less than 30nm.

In first method, the thickness of this inorganic insulating membrane is preferably 5～5000nm.

In first method, the thickness of this glass substrate is preferably 0.03～0.8mm.

In first method, the resin of this resin bed is preferably polyorganosiloxane resin.

In first method, this polyorganosiloxane resin is preferably the solidfied material that reacts of olefinic organic based polysiloxane and organic hydrogen polysiloxanes.

In first method, the thickness of this resin bed is preferably 1～100 μ m.

In first method, this gripper shoe is preferably glass plate.

The manufacture method that second method of the present invention is a kind of duplexer, for the manufacture of the layer that there is successively gripper shoe, resin bed and with the duplexer of the layer of the glass substrate of inorganic insulating membrane, wherein, preparation is with the glass substrate of inorganic insulating membrane, should there is inorganic insulating membrane at the single face of glass substrate with the glass substrate of inorganic insulating membrane, this inorganic insulating membrane contains at least one the oxide comprised in the group of selecting free silicon and aluminium to form, nitride or oxynitride, in the face contacted with this resin bed of this inorganic insulating membrane, the atom of alkali and alkaline earth metal ions total content is below 0.5 atom %, preparation, with the gripper shoe of resin bed, should have with the gripper shoe of resin bed this resin bed of the single face that is fixed to this gripper shoe, and the surface of exposing of this resin bed has non-tack, using this face with the inorganic insulating membrane of the glass substrate of inorganic insulating membrane, with should be with resin layer surface of the gripper shoe of resin bed as lamination surface, by this glass substrate with inorganic insulating membrane with should be stacked with the gripper shoe of resin bed.

In second method, should with gripper shoe of resin bed be preferably have by olefinic organic based polysiloxane and organic hydrogen polysiloxanes on this gripper shoe, react the polyorganosiloxane resin that solidifies and obtain layer gripper shoe.

Third Way of the present invention is a kind of panel of the display unit with gripper shoe, the display device component that it has the duplexer of first method of the present invention and is arranged on the glass baseplate surface of this duplexer.

Cubic formula of the present invention is a kind of display unit panel, and it is usingd the interface of this inorganic insulating membrane and this resin bed by the display unit with gripper shoe from Third Way of the present invention with panel and will peel off to remove with the gripper shoe of resin bed as release surface and form.

The 5th mode of the present invention is a kind of display unit, has the display unit panel of the cubic formula of the present invention.

The invention effect

According to the present invention, the manufacture method of a kind of duplexer and duplexer can be provided, even described duplexer is after being implemented high-temperature heating treatment, when resin bed and glass substrate are peeled off, also can suppress the resin of resin bed to the release surface of glass substrate side (, the adhering to surface of inorganic insulating membrane), and the cleanliness of release surface that can be by implementing the glass substrate side after purifying processing keeps separating, can improve in addition the glass substrate side release surface chemical-resistant and suppress the generation of crackle.

Panel and the display unit for display unit that in addition,, according to the present invention, can provide the panel for display unit with gripper shoe that comprises this duplexer, use the display unit with gripper shoe to form with panel.

The accompanying drawing explanation

The schematic cross sectional view of the embodiment that Fig. 1 is duplexer of the present invention.

Fig. 2 is the schematic cross sectional view of the display unit with gripper shoe of the present invention with an embodiment of panel.

The specific embodiment

Below, with reference to accompanying drawing, to describing for implementing mode of the present invention, but the present invention is not limited to following embodiment, under the situation do not departed from the scope of the present invention, and can be to the additional various distortion of following embodiment and displacement.

It should be noted that, in the present invention, peel strength for the peel strength at the layer of gripper shoe and the interface of resin bed higher than the interface of resin bed and inorganic insulating membrane, be referred to as hereinafter resin bed and inorganic insulating membrane and adhered in the mode that can peel off, gripper shoe and resin bed are fixed.

In the present invention, atom % refers to the ratio of each atom with respect to the total atom number.

The schematic cross sectional view of the example that Fig. 1 is duplexer of the present invention.

As shown in Figure 1, the layer that duplexer 10 is the glass substrate 24 with inorganic insulating membrane, the layer of gripper shoe 31 and be present in the duplexer of the resin bed 32 between them.

Glass substrate 24 with inorganic insulating membrane has glass substrate 20 and is arranged on its lip-deep inorganic insulating membrane 22.With the layer of the glass substrate 24 of inorganic insulating membrane, the mode contacted with resin bed 32 with its inorganic insulating membrane 22 is configured on resin bed 32, and the interface of its inorganic insulating membrane 22 and resin bed 32 is adhered in the mode that can peel off.It should be noted that, will become inorganic insulating membrane 22 and be denoted as surface 221 with the inorganic insulating membrane surface at the interface of resin bed 32, resin layer surface is denoted as to surface 321.

In addition, about resin bed 32, one face is fixed to the layer of gripper shoe 31, and its another face (surface 321) contacts with the inorganic insulating membrane 22 of glass substrate 24 with inorganic insulating membrane, and the interface of resin bed 32 and inorganic insulating membrane 22 is adhered in the mode that can peel off.The layer that comprises gripper shoe 31 and two layer segments of resin bed 32, in the operation of manufacturing the devices (electronic equipment) such as liquid crystal panel, reinforcing band has the glass substrate 24 of inorganic insulating membrane.It should be noted that, independent object is called the gripper shoe (following also referred to as reinforcement plate) with resin bed from duplexer 10 to comprise the layer of gripper shoe 31 and two layer segments of resin bed 32 in duplexer 10, and this two layer segment in duplexer 10 is called the layer of reinforcement plate 30.In reinforcement plate 30, resin bed 32 is fixed to gripper shoe 31.

Use this duplexer 10, until the manufacturing process of device midway.That is, use this duplexer 10, until at the upper device member such as thin film transistor (TFT) that forms of its glass baseplate surface second interarea 202 that does not have inorganic insulating membrane 22 of the glass substrate 24 of inorganic insulating membrane (that is, with).Then, the layer of reinforcement plate 30 is stripped from the interface of the layer of the glass substrate 24 with inorganic insulating membrane, thereby the layer of the reinforcement plate 30 of duplexer 10 does not become the part that forms device.The reinforcement plate 30 of separating from the glass substrate 24 with inorganic insulating membrane, with the gripper shoe of resin bed, can be stacked with the new glass substrate with inorganic insulating membrane 24, thus with the form of duplexer 10 recycling.

Find in the present invention, by be the duplexer 10 of the formation that contacts with resin bed 32 of inorganic insulating membrane 22, can obtain the effect of expecting.

Below, describe each in detail and form (with glass substrate, resin bed, the gripper shoe of inorganic insulating membrane).

At first, the glass substrate 24 with inorganic insulating membrane is described.

Glass substrate 24 with inorganic insulating membrane has glass substrate 20 and is arranged on its lip-deep inorganic insulating membrane 22.Inorganic insulating membrane 22 is configured in the most surface in the glass substrate 24 of inorganic insulating membrane, makes with resin bed 32 described later and is adhered in the mode that can peel off.

Below, the manufacture method of detailed description glass substrate 20, inorganic insulating membrane 22 and inorganic insulating membrane 22.

(glass substrate)

Glass substrate 20 has inorganic insulating membrane 22 on the first interarea 201 of resin bed 32 sides, thereby form device on the second interarea 202 with resin bed 32 side opposition sides, with member, forms device.At this, device refers to that with member display unit uses the member of formation of panel such as described later, member that form at least a portion of device.As concrete example, can enumerate: thin film transistor (TFT) (TFT), colour filter (CF).As device, can illustration: solar cell (PV), liquid crystal panel (LCD), organic EL panel (OLED) etc.

The kind of glass substrate 20 can be general glass substrate, can enumerate glass substrate that display unit such as LCD, OLED uses etc.The chemical-resistant of glass substrate 20, anti-excellent moisture permeability, and percent thermal shrinkage is low.As the index of percent thermal shrinkage, use the linear expansion coefficient of JIS R3102 (nineteen ninety-five revision) regulation.

When the linear expansion coefficient of glass substrate 20 is large, because the many heat tracings of the manufacturing process of device are processed, therefore easily produce variety of issue.For example, on glass substrate 20, form under the situation of TFT, the glass substrate 20 that will under heating, be formed with TFT carries out when cooling, and due to the thermal contraction of glass substrate 20, it is excessive that the position deviation of TFT likely becomes.

Glass substrate 20 is by being configured as tabular obtaining by the frit melting and by melten glass.This manufacturing process can be general method, such as using under float glass process, fusion method, discharge orifice, draws method, vertical drawing process (Off Le コー Le method), machinery winding-up cylinder method (ラバース method) etc.In addition, the glass substrate 20 that thickness is thin especially can be by first being configured as tabular glass heats to the temperature that can be shaped, and the means such as recycling extension are stretched, the method (daraf(reciprocal of farad) (リドロー method) again) of thinning obtains.

The glass of glass substrate 20 is not particularly limited, preferably alkali-free pyrex, pyrex, soda-lime glass, high silicon dioxide glass, other take the oxide based glass that silica is main component.As oxide based glass, the glass that the content that is preferably based on the silica of oxide conversion is 40～90 quality %.

As the glass of glass substrate 20, adopt kind, the matched glass of its manufacturing process with device.For example, because the stripping of alkali metal component easily impacts liquid crystal, so the glass substrate that liquid crystal panel is used forms (still, usually containing the alkaline-earth metal composition) by the glass (alkali-free glass) that does not contain in fact alkali metal component.So, the glass of glass substrate is suitably selected by the kind based on applied device and manufacturing process thereof.

The thickness of glass substrate 20 is not particularly limited, and slimming and/or light-weighted viewpoint from glass substrate 20, be generally below 0.8mm, is preferably below 0.3mm, more preferably below 0.15mm.Surpassing under the situation of 0.8mm, can't meet slimming and/or the light-weighted requirement of glass substrate 20.Under situation below 0.3mm, can give the flexibility that glass substrate 20 is good.Under situation below 0.15mm, glass substrate 20 can be batched as drum.In addition, from being easy to manufacture the reasons such as glass substrate 20, easy operating glass substrate 20, more than the thickness of glass substrate 20 is preferably 0.03mm.

It should be noted that, glass substrate 20 can comprise two-layer more than, in this case, the material that forms each layer can be same material, can be also foreign material.In addition, in this case, " thickness of glass substrate 20 " means all aggregate thickness of layer.

(inorganic insulating membrane)

Inorganic insulating membrane 22 contains at least one oxide, nitride or the oxynitride comprised in the group of selecting free silicon and aluminium to form, also can contain the mixture of these compounds.Oxide, nitride or oxynitride that preferably inorganic insulating membrane 22 contains silicon or aluminium can be also the mixture of these compounds.Inorganic insulating membrane 22 preferably comprises any one in oxide, nitride or the oxynitride of silicon or aluminium.According to circumstances, inorganic insulating membrane 22 also can contain metallic atom beyond silicon atom and aluminium atom as metallic atom.Such as containing titanium atom, tungsten atom, tantalum atom, molybdenum atom etc.But, as described later, preferably do not contain in fact alkali metal atom and alkaline earth metal atom.

Particularly, can enumerate silica (SiO ₂), aluminium oxide (Al ₂o ₃), silicon nitride (Si ₃n ₄), aluminium nitride (AlN), silicon oxynitride (SiO _xn _2-x, x is 0.1～1.9), aluminium oxynitride (Al ₂o _yn _3-y, y is 0.1～2.9), oxynitriding sial (Al _2-xsi _xo _zn _4-x, x is 0.1～1.9, z is 0.1～3.9) etc.Perhaps, can be their mixture.

Wherein, from excellent heat resistance, resistance to cracking line well, preferably enumerate silica (SiO ₂), silicon nitride (Si ₃n ₄), with SiO _xn _2-xsilicon oxynitride, the aluminium oxide (Al of shown wherein x in 0.6～1.4 scope ₂o ₃).Crystallinity silica particularly preferably.

Inorganic insulating membrane 22 preferably contains above-mentioned oxide, nitride or oxynitride as main component, particularly, more than the content of above-mentioned oxide, nitride and oxynitride is preferably 98 quality % with respect to the inorganic insulating membrane total amount, more preferably more than 99 quality %, more than being particularly preferably 99.999 quality %.

Inorganic insulating membrane 22 demonstrates excellent heat resistance.Therefore, even duplexer 10 is exposed under hot conditions, also be difficult for causing the chemical change of film itself, be difficult for and resin bed 32 between produce chemical bonding, be difficult for to produce resin the adhering to the glass substrate 24 with inorganic insulating membrane by the resin bed 32 that heavily peeling off causes.In addition, inorganic insulating membrane 22 itself has excellent mechanical strength, can give the resistance to cracking line to glass substrate 20 surfaces.

Above-mentioned heavily peeling off refer to, the peel strength at inorganic insulating membrane 22 and the interface of resin bed 32 is all larger than any one in the intensity (body intensity) of the material of the peel strength at gripper shoe 31 and the interface of resin bed 32 and resin bed 32 itself.While producing heavily peeling off in the interface of inorganic insulating membrane 22 and resin bed 32, the resin on the surface 321 of resin bed 32 easily is attached to the inorganic insulating membrane surface 221 of exposing, its surface easily become be difficult to purifying.Resin adheres to inorganic insulating membrane surface 221, refers to that resin bed 32 integral body are attached to inorganic insulating membrane surface 221, and the part of the resin on the surface 321 of the surface 321 generation damages of resin bed 32 and resin bed 32 is attached to inorganic insulating membrane surface 221 etc.

The thickness of inorganic insulating membrane 22 is not particularly limited, from further inhibition by resin bed 32 that heavily peeling off causes the viewpoint of adhering to and maintain scratch resistance to the glass substrate 24 with inorganic insulating membrane, preferably 5～5000nm, more preferably 10～500nm.

Consider will be with the glass substrate 24 of inorganic insulating membrane for aspect the device purposes time, inorganic insulating membrane 22 is preferably transparent.Particularly, the transmissivity under wavelength 380～780nm, the transmission of visible light with the glass substrate 24 of inorganic insulating membrane be preferably more than 70%, more preferably more than 80%.

Inorganic insulating membrane 22 is recited as individual layer in Fig. 1, but also can be for two-layer above stacked.For example, under inorganic insulating membrane 22 is two-layer situation, the first inorganic insulating membrane contacted with glass substrate 20 can be set and be arranged on the second inorganic insulating membrane on the first inorganic insulating membrane.Under inorganic insulating membrane 22 is two-layer situation, the first inorganic insulating membrane can be different from the composition of the second inorganic insulating membrane.In addition, can be provided with inorganic conductive film between the first inorganic insulating membrane and the second inorganic insulating membrane or between glass substrate 20 and the first inorganic insulating membrane.

In addition, for example, the surface roughness (Ra) of the face contacted with resin bed 32 of inorganic insulating membrane 22 is in being less than the scope of 30nm, and inorganic conductive film can be set to island, strip.

In addition, between glass substrate 20 and inorganic insulating membrane 22, can setting example as: prevent basic ion 22 diffusions from the alkali barrier layers from glass substrate 20 to inorganic insulating membrane, make the planarization layer of the flattening surface of inorganic insulating membrane 22.

In the scope of not damaging effect of the present invention, inorganic insulating membrane 22 can be arranged in the lip-deep part of glass substrate 20.For example, inorganic insulating membrane 22 can be set to island, strip on glass substrate 20 surfaces.

More specifically, inorganic insulating membrane 22 is in the lip-deep coverage rate of glass substrate 20, from further inhibition by resin bed 32 that heavily peeling off causes the viewpoint of adhering to the glass substrate 24 with inorganic insulating membrane, be preferably 50～100%, more preferably 75～100%.

In duplexer 10, in the face contacted with resin bed 32 of inorganic insulating membrane 22 (that is, inorganic insulating membrane surface 221), the atom of alkali and alkaline earth metal ions total content is below 0.5 atom %, more preferably below 0.1 atom %.In the glass substrate with inorganic insulating membrane 24 before stacked or in the glass substrate with inorganic insulating membrane 24 after separating from duplexer 10, in the surface of the side that the side with having glass substrate 20 of inorganic insulating membrane 22 is contrary, the atom of alkali and alkaline earth metal ions total content is below 0.5 atom % too, more preferably below 0.1 atom %.Be difficult for heavily peeling off etc. of generation by being set to above-mentioned scope, becoming, can further be suppressed at the adhering to of resin of the resin bed 32 after high-temperature process, and also more excellent surface of the removability of the resin that can obtain adhering to.Below, unless otherwise specified, by the inorganic insulating membrane surface 221 in duplexer 10 with any one party on the inorganic insulating membrane surface of the glass substrate 24 of inorganic insulating membrane itself, all be called inorganic insulating membrane surface 221.

In the present invention, the atom of alkali and alkaline earth metal ions adds up to content, refers to the alkali metal atom on the surface obtained with XPS (x-ray photoelectron spectroscopy) mensuration inorganic insulating membrane surface and the content of alkaline earth metal atom.In addition, known XPS determinator can be measured for XPS.It should be noted that, hereinafter, it is also referred to as not containing in fact alkali metal atom and alkaline earth metal atom below 0.5 atom % that the atom of alkali and alkaline earth metal ions is added up to content.

In addition, in duplexer 10, the surface roughness (Ra) of the face contacted with resin bed 32 (that is, the inorganic insulating membrane surface 221) of inorganic insulating membrane 22 preferably is less than 30nm.Similarly, in the glass substrate 24 with inorganic insulating membrane, the surface roughness on inorganic insulating membrane surface (Ra) also preferably is less than 30nm.Be difficult for heavily peeling off etc. of generation by being set to above-mentioned scope, becoming, can further suppress the adhering to of resin of the resin bed 32 after high-temperature process, and also more excellent surface of the removability of the resin that can obtain adhering to.Wherein, from making the viewpoint that effect of the present invention is more excellent, surface roughness (Ra) is preferably below 10nm, more preferably below 1nm.It should be noted that, lower limit is not particularly limited, and is preferably 0nm.

Ra is measured according to JIS B0601 (calendar year 2001 revision).

In addition, more preferably with above-mentioned two surfaces characteristic relevant with the inorganic insulating membrane side surface of the glass substrate 24 of inorganic insulating membrane, all be met.That is, the inorganic insulating membrane side surface with the glass substrate 24 of inorganic insulating membrane, more preferably do not contain in fact alkali metal atom and alkaline earth metal atom, and its surface roughness (Ra) is less than 30nm.

The alkali metal, the alkaline-earth metal composition that contain ormal weight in common glass substrate exist alkali metal atom, alkaline earth metal atom thus in its surface.For example, although do not contain in fact alkali metal component in the glass substrate consisted of the alkali-free pyrex, there is alkaline earth metal atom in the alkaline-earth metal composition that contains ormal weight thus in its surface.In addition, contain alkali metal component and the alkaline-earth metal composition of ormal weight in the glass substrate formed by soda-lime glass, have thus alkali metal atom and alkaline earth metal atom in its surface.Therefore, make glass substrate directly contact and be exposed under the situation of hot conditions with resin bed, alkali metal atom, alkaline earth metal atom occur to break away from also and carry out chemical reaction with the composition of resin bed, its result, glass baseplate surface and and the resin bed of its Surface Contact between adhesion increase.Therefore, glass substrate 20 and the difficulty that easily becomes separating of resin bed 32, and also easily cause heavily peeling off.It should be noted that, alkali metal refers to lithium, sodium and potassium, and alkaline-earth metal refers to magnesium, calcium, barium and strontium.

It is believed that, in the glass substrate 24 with inorganic insulating membrane, alkali metal atom in glass substrate 20, alkaline earth metal atom are because inorganic insulating membrane 22 is blocked, and further inorganic insulating membrane surface 221 is made as and does not contain in fact alkali metal atom, alkaline earth metal atom, thus in

duplexer

10,32 sides break away from and the chemical reaction that produces from inorganic insulating membrane surface 221 to resin bed can not carry out alkali metal atom, alkaline earth metal atom, and difficult generation is peeling off etc. heavily.Thus, at duplexer 10, by peeling off after high-temperature process, can suppress resin in the adhering to of inorganic insulating membrane surface 221, and also more excellent surface of the removability of the resin that can obtain adhering to.It is below 0.5 atom % that the alkali metal that utilizes XPS to measure in inorganic insulating membrane surface 221, the atom of alkaline-earth metal add up to content, more preferably below 0.1 atom %.

Can, by using the material that does not contain in fact alkali metal atom, alkaline earth metal atom as the material that is used to form inorganic insulating membrane 22, obtain not containing in fact the surface of alkali metal atom, alkaline earth metal atom.For example, utilizing sputtering method to form under the situation of inorganic insulating membrane 22, by using material that alkali metal atom, alkaline earth metal atom the are few material as the inorganic insulation membrane material of sputtering target etc., sputtering atmosphere gas etc., can form the inorganic insulating membrane 22 with surface of not containing in fact alkali metal atom, alkaline earth metal atom.Usually, only otherwise add alkali metal atom, alkaline earth metal atom wittingly in being used to form the material as mentioned above of inorganic insulating membrane 22, the alkali metal atom, the alkaline earth metal atom that with the impurity form, are included in this material are few.Therefore, utilize normally used material and the inorganic insulating membrane 22 that obtains, become the inorganic insulating membrane that does not contain in fact alkali metal atom, alkaline earth metal atom.

In addition, the thin especially inorganic insulating membrane 22 so long as not thickness, the alkali metal atom of glass substrate 20, alkaline earth metal atom can not permeate inorganic insulating membrane 22 and arrive the surface do not contacted with glass substrate.As mentioned above, as long as the thickness of inorganic insulating membrane 22 is more than about 5nm, can fully stop alkali metal atom, the alkaline earth metal atom of glass substrate 20.

The surface of normally used glass substrate 20 is level and smooth, and the surface of the inorganic insulating membrane 22 formed thereon also becomes level and smooth.That is, the surface roughness of normally used glass substrate 20 (Ra) is less than 30nm, and the surface roughness on the surface do not contacted with glass substrate 20 (inorganic insulating membrane surface 221) of the inorganic insulating membrane 22 formed thereon is less than 30nm.But, according to circumstances, sometimes utilize etching etc. by glass substrate 20 surface roughenings.For example,, according to the kind of inorganic insulating membrane 22, in order to improve the bond strength with glass substrate 20 surfaces, sometimes by glass substrate 20 surface roughenings.In addition, also sometimes by glass substrate 20 surface roughenings, thereby as the dazzling processing (free from glare processing) for causing from the reverberation diffusion reduction reverberation on glass substrate 20 surfaces.Under the situation by glass substrate 20 surface roughenings, the surface roughness on the surface after roughening (Ra) becomes 30nm when above, more than the surface roughness on the surface do not contacted with glass substrate 20 (inorganic insulating membrane surface 221) of the inorganic insulating membrane 22 likely formed thereon also becomes 30nm.It should be noted that, by forming inorganic insulating membrane 22, the surface roughness on glass substrate 20 surfaces not necessarily directly becomes the surface roughness on inorganic insulating membrane surface 221, also the surface roughness of inorganic insulating membrane 22 is relaxed sometimes, therefore, the surface roughness on inorganic insulating membrane surface 221 is also not only stipulated by the surface roughness on glass substrate 20 surfaces.

(manufacture method of inorganic insulating membrane)

The manufacture method of inorganic insulating membrane 22 is not particularly limited, and can adopt known method.For example can enumerate: utilize vapour deposition method or sputtering method that oxide, the nitride of regulation, the method for oxynitride are set on glass substrate 20.For example, can utilize the methods such as pecvd nitride method will carry out by the silicon dioxide film of CVD method film forming nitrogen treatment and form silicon oxynitride film, also can utilize the methods such as plasma oxidation method to carry out oxidation processes by the silicon nitride film of CVD method film forming and form silicon oxynitride film.

About creating conditions, according to oxide, nitride, the oxynitride of used metal, suitably select optimum condition.

Gripper shoe 31 is collaborative with resin bed 32, supports and reinforcing band has the glass substrate 24 of inorganic insulating membrane, and prevents distortion with the glass substrate 24 of inorganic insulating membrane in the manufacturing process of device, produce cut, breakage etc.In addition, used thickness than the situation of the thinner glass substrate with inorganic insulating membrane 24 in the past under, by forming the duplexer 10 that thickness is identical with glass substrate in the past, in the manufacturing process of device, can use the matched manufacturing technology of glass substrate, manufacturing equipment with thickness in the past, this is also one of purpose of using gripper shoe 31.

As gripper shoe 31, use metallic plates such as glass plate, resin plate, SUS plate, etc.Manufacturing process at device follows under heat treated situation, and preferably by the difference of the linear expansion coefficient with glass substrate 20, little material forms gripper shoe 31, more preferably by the material identical with glass substrate 20, is formed, and gripper shoe 31 is preferably glass plate.Especially, gripper shoe 31 is preferably the glass plate that comprises the glass material identical with the glass substrate of glass substrate 20.

The thickness of gripper shoe 31 can be thicker than the thickness of glass substrate 20, also can be thinner than the thickness of glass substrate 20.The thickness that is preferably based on the thickness of thickness with the glass substrate 24 of inorganic insulating membrane, resin bed 32 and duplexer 10 is selected the thickness of gripper shoe 31.For example, the manufacturing process of existing device is that the mode of processing the substrate that thickness is 0.5mm is designed, under the situation that is 0.1mm in the thickness sum of the thickness of the glass substrate 24 with inorganic insulating membrane and resin bed 32, the thickness of establishing gripper shoe 31 is 0.4mm.Under common situation, the thickness of gripper shoe 31 is preferably 0.2～5.0mm.

Under the situation that is glass plate in gripper shoe 31, for easy operating, be difficult for to produce the reason such as break, more than the thickness of glass plate is preferably 0.08mm.In addition, expect in the reason that does not produce the rigidity of appropriate deflection under the situation of breaking when being peeled off after device forms with member, the thickness of glass plate is preferably below 1.0mm.

The average coefficient of linear expansion under 25～300 ℃ (following only be called " average coefficient of linear expansion ") of glass substrate 20 and gripper shoe 31 poor, be preferably 500 * 10 ^-7/ ℃ below, more preferably 300 * 10 ^-7/ ℃ below, more preferably 200 * 10 ^-7/ ℃ below.When this difference is excessive, when the heating in the manufacturing process of device is cooling, the violent warpage of duplexer 10, thus likely with the glass substrate 24 of inorganic insulating membrane, with reinforcement plate 30, peel off.Under the situation identical with the material of gripper shoe 31, can suppress the generation of this problem at the material of glass substrate 20.

Resin bed 32 is fixed on gripper shoe 31, in addition, in the mode that can peel off, adheres to the glass substrate 24 with inorganic insulating membrane.Resin bed 32 prevents the position deviation with the glass substrate 24 of inorganic insulating membrane, until carry out the operation that the glass substrate 24 with inorganic insulating membrane is separated with gripper shoe 31, and be easy to peel off from the glass substrate 24 with inorganic insulating membrane by lock out operation, prevent with glass substrate 24 grades of inorganic insulating membrane damaged due to lock out operation.In addition, resin bed 32 is fixed to gripper shoe 31, the worry that does not exist resin bed 32 and gripper shoe 31 to peel off in lock out operation, thus obtain the gripper shoe (reinforcement plate 30) with resin bed by lock out operation.It should be noted that, when starting lock out operation, preferably at resin bed 32, with the interface setting of inorganic insulating membrane 22, peel off starting point and peeled off, so that its interface is easy to peel off by lock out operation.

The surface 321 contacted with inorganic insulating membrane 22 of resin bed 32, adhere to the surface 221 of inorganic insulating membrane 22 in the mode that can peel off.In the present invention, the character that can easily peel off of this resin layer surface 321 is called to fissility.

In the present invention, above-mentioned fixing with (can peel off) sticks on peel strength (that is, peeling off needed stress) and there are differences, and fixedly means that the peel strength specific adhesion is larger.In addition, the adhesion that can peel off refers to, when can peeling off, can produce under the situation of peeling off and be peeled off at the face that does not make to be fixed.Particularly, in duplexer 10 of the present invention, refer to, under the situation of the operation of carrying out the glass substrate 24 with inorganic insulating membrane is separated with gripper shoe 31, peel off at the face adhered to, do not peel off at the face be fixed.Therefore, when carrying out duplexer 10 is separated into to the operation with the glass substrate 24 of inorganic insulating membrane and gripper shoe 31, duplexer 10 be separated into the glass substrate 24 of inorganic insulating membrane and with the gripper shoe (reinforcement plate 30) of resin bed the two.

Resin bed 32 preferably is fixed to gripper shoe 31 surfaces with the strong adhesion such as adhesive tension, bonding force.For example, by making to react curable resin, react curing on gripper shoe 31 surfaces, the resin glue after solidifying sticks to gripper shoe 31 surfaces.In addition, also can make to produce between gripper shoe 31 surfaces and resin bed 32 processing (for example, using the processing of coupling agent) of strong adhesion by enforcement, improve the adhesion between gripper shoe 31 surfaces and resin bed 32.

On the other hand, resin bed 32 carries out combination with inorganic insulating membrane surface 221 with weak binding power, and the adhesion for example preferably caused with the intermolecular Van der Waals force of solid is carried out combination.Resin layer surface 321 before contacting with inorganic insulating membrane 22 is preferably the surface of non-tack, by the resin layer surface 321 that makes this non-tack, with inorganic insulating membrane surface 221, contacts, and can make two surfaces with the combination of weak binding power.That is,, when resin layer surface 321 is non-tack, with the fissility of the interface on inorganic insulating membrane surface 221, become better.Two surfaces seamlessly contact, and in the present invention, this state are called to adhesion.

It should be noted that, by for the surface of the resin bed of non-tack, not giving the surface treatment of non-tack under common meaning, also can make resin layer surface become non-tack.In addition, even under common meaning be not the resin bed of non-tack, as long as for for above-mentioned adhesion in fixing can with resin that fully low adhesion be adhered to (and, so long as can be peeled off from the peeling off of glass substrate, situations such as breakage with the glass substrate of inorganic insulating membrane or gripper shoe not producing inorganic insulating membrane), can not implement surface treatment and as the materials'use of resin bed.

Especially, under the situation that is non-tack at the resin layer surface contacted with inorganic insulating membrane, when peeling off, the part of resin layer surface is because the situation that the breakage of resin layer surface remains in the inorganic insulating membrane surface is few, in addition, the part of the material of inorganic insulating membrane is because the situation that the breakage of inorganic insulating membrane remains in resin layer surface is also few.

As mentioned above, resin bed 32, with respect to the adhesion on the surface of gripper shoe 31, is relatively higher than the adhesion of resin bed 32 with respect to inorganic insulating membrane surface 221.Therefore, the peel strength between resin bed 32 and gripper shoe 31, higher than resin bed 32 and with the peel strength between the glass substrate 24 of inorganic insulating membrane.Between resin bed 32 and gripper shoe 31 preferably with bonding or gluingly carry out combination.But be not limited to this, as long as be relatively higher than the adhesion of resin bed 32 with respect to the glass substrate 24 with inorganic insulating membrane, the power that also can be caused by other adhesions between resin bed 32 and gripper shoe 31 is carried out combination.

The size of resin bed 32 is not particularly limited.The size of resin bed 32 can be greater than the size of glass substrate 20, gripper shoe 31, also can be less than the size of glass substrate 20, gripper shoe 31.

The thickness of resin bed 32 is not particularly limited, and is preferably 1～100 μ m, more preferably 5～30 μ m, more preferably 7～20 μ m.This is because, when the thickness of resin bed 32 is this scope, resin bed 32 becomes abundant with the adhesion of glass substrate 24 with inorganic insulating membrane.Its reason is in addition, even have bubble, foreign matter between resin bed 32 and the glass substrate 24 with inorganic insulating membrane, but still inhibition zone has the generation of strain defect of the glass substrate 24 of inorganic insulating membrane.In addition, when the thickness of resin bed 32 is blocked up, the time and materials that need to be used to form, therefore uneconomical.

It should be noted that, resin bed 32 can comprise two-layer more than." thickness of resin bed 32 " refers to the aggregate thickness of whole layers in this case.

In addition, at resin bed 32, comprise under the situation more than two-layer, the kind that forms the resin of each layer can be different.

Resin bed 32 preferably comprises glass transition temperature lower than room temperature (approximately 25 ℃) or does not have the material of glass transition temperature.This be because, can more easily with the glass substrate 24 with inorganic insulating membrane, peel off, simultaneously with the adhesion of glass substrate 24 with inorganic insulating membrane, also become abundant.

In addition, resin bed 32 mostly experiences heat treated in the manufacturing process of device, therefore preferably has heat resistance.

In addition, when the elastic modelling quantity of resin bed 32 is too high, there is the tendency with the adhesiveness step-down of glass substrate 24 with inorganic insulating membrane.On the other hand, when the elastic modelling quantity of resin bed 32 is too low, the fissility step-down.

The kind that forms the resin of resin bed 32 is not particularly limited.Can enumerate for example acrylic resin, vistanex, polyurethane resin or polyorganosiloxane resin.Also several mixed with resin can be used.Wherein, preferred polyorganosiloxane resin.This be because, the heat resistance of polyorganosiloxane resin, fissility excellence.In addition also because, under the situation that is glass plate in gripper shoe 31, the condensation reaction by the silanol base with glass pane surface, be easy to be fixed to glass plate.From be loaded into gripper shoe 31 and with the state between the glass substrate 24 of inorganic insulating membrane, even if for example in atmosphere, approximately processing under 200 ℃ approximately 1 hour, fissility is substantially not deteriorated viewpoint also, the polyorganosiloxane resin layer is also preferred.

Resin bed 32 preferably comprises in polyorganosiloxane resin the polyorganosiloxane resin (solidfied material) for the peeling paper purposes.The polyorganosiloxane resin of the peel ply of peeling paper is that the layer of curing property polysiloxane resin composition by being applied to peeling paper is cured and forms.Comprise and use this curing property polysiloxane resin composition and this curing property polysiloxane resin composition is cured and the resin bed of the curing polyorganosiloxane resin that forms on the surface of gripper shoe 31, in gluing with gripper shoe 31 surfaces, its Free Surface has excellent non-tack, therefore preferably.Therefore in addition, because flexibility is high, even sneak into the foreign matters such as bubble, dust between resin bed 32 and the glass substrate 24 with inorganic insulating membrane, the generation of strain defect of the glass substrate 24 of inorganic insulating membrane also can inhibition zone be arranged.

This for the peel ply that forms peeling paper etc. and the curing property polysiloxane resin composition of using, according to its curing mechanism, be categorized as condensation reaction type polysiloxane resin composition, addition reaction-type polysiloxane resin composition, ultraviolet hardening polysiloxane resin composition and electron ray curing type polysiloxane resin composition, can use wherein any one.In these materials, preferred addition reaction-type polysiloxane resin composition.This be because, be easy to be cured reaction, the degree of the non-tack of the resin layer surface 321 after solidifying is good, and heat resistance is also high.

The addition reaction-type polysiloxane resin composition is the solidification compound that contains host and crosslinking agent and be cured under the existence of the catalyst such as platinum group catalyst.Solidifying of addition reaction-type polysiloxane resin composition promoted by heat treated.Host in the addition reaction-type polysiloxane resin composition, be preferably organopolysiloxane (that is, the olefinic organic based polysiloxane had with the thiazolinyl (vinyl etc.) of silicon atom bonding.It should be noted that, be preferably the straight chain shape), thiazolinyls etc. become crosslinking points.Crosslinking agent in the addition reaction-type polysiloxane resin composition, be preferably organopolysiloxane (that is, the organic hydrogen polysiloxanes had with the hydrogen atom (hydrogen silicyl) of silicon atom bonding.It should be noted that, be preferably the straight chain shape), hydrogen silicyl etc. becomes crosslinking points.

The crosslinking points of addition reaction-type polysiloxane resin composition by host and crosslinking agent carries out addition reaction and solidifies.

In addition, for the peel ply that forms peeling paper etc. and the curing property polysiloxane resin composition of using has solvent-borne type, emulsion-type and no-solvent type on form, can use any one type.In these, preferred no-solvent type.This be because, productivity ratio, security, environmental characteristics aspect excellence.In addition also because during curing when being formed resin bed 32, be heating and curing, when ultraviolet curing or electron ray curing, do not contain and can produce the solvent of foaming, thereby be difficult to residual bubble in resin bed 32.

In addition, as the peel ply in order to form peeling paper etc. and the curing property polysiloxane resin composition of using, specifically as commercially available trade name or model, can there are: KNS-320A, KS-847 (being polysiloxanes company of SHIN-ETSU HANTOTAI system), TPR6700 (stepping figure new high-tech material Japanese firm (モメ Application ティ Block パフォーマ Application スマテリア Le ズジャパ Application contract commercial firm) system), the combination of vinyl polysiloxanes " 8500 " (waste river chemical industrial company system) and methylhydrogenpolysi,oxane " 12031 " (waste river chemical industrial company system), the combination of vinyl polysiloxanes " 11364 " (waste river chemical industrial company system) and methylhydrogenpolysi,oxane " 12031 " (waste river chemical industrial company system), the combination of vinyl polysiloxanes " 11365 " (waste river chemical industrial company system) and methylhydrogenpolysi,oxane " 12031 " (waste river chemical industrial company system) etc.

It should be noted that, KNS-320A, KS-847 and TPR6700, for containing in advance the curing property polysiloxane resin composition of host and crosslinking agent.

In addition, form the polyorganosiloxane resin (solidfied material of above-mentioned curing property polysiloxane resin composition) of resin bed 32, preferably there is character that compositions such as low molecular weight polysiloxane in the polyorganosiloxane resin layer are difficult for shifting to the glass substrate 24 with inorganic insulating membrane, be the oligosiloxane metastatic.

(manufacture method of resin bed)

The method that resin bed 32 is fixed on gripper shoe 31 is not particularly limited, preference is as following method: the layer that is formed for becoming the hardening resin composition of resin bed 32 on gripper shoe 31 surfaces, then, by this hardening resin composition being solidified to form to the method for resin bed 32, form and be fixed to the resin bed 32 on gripper shoe 31.

In addition, also can form resin bed 32 by the method that for example membranaceous resin is fixed to the surface of gripper shoe 31.Particularly, can be listed below method: in order to give the high bed knife (high-peeling strength) for the film surface in the surface to gripper shoe 31, surface modification treatment (primary coat processing) is carried out in the surface of gripper shoe 31, it is fixed on gripper shoe 31.Can illustration such as: the chemical method (silane coupling agent processings) that silane coupler and so on improves bed knife with chemical mode, flame treatment and so on make physical method, blasting treatment of surface active groups increase and so on by making surperficial roughness increase make the mechanical processing method etc. of resistance increment.

Be formed for becoming the layer of the hardening resin composition of resin bed 32 on gripper shoe 31 surfaces, then make this hardening resin composition solidify to form in the method for resin bed 32, as the method for the layer that forms hardening resin composition on gripper shoe 31 surfaces, can enumerate for example method of coating hardening resin composition on gripper shoe 31.As the method for coating, can enumerate spraying process, mould painting method, spin-coating method, dip coated method, rolling method, scraper rubbing method, silk screen print method, intaglio plate rubbing method etc.In these methods, can suitably select according to the kind of resin combination.

In addition, on gripper shoe 31, be coated with under the situation of the hardening resin composition for becoming resin bed 32, its coating weight is preferably 1～100g/m2, more preferably 5～20g/m2.

For example, by the addition reaction-type polysiloxane resin composition, formed under the situation of resin bed 32, utilize the known methods such as above-mentioned spraying process, the hardening resin composition that will comprise the mixture of organic thiazolinyl polysiloxanes, organic hydrogen polysiloxanes and catalyst is applied on gripper shoe 31, then makes it be heating and curing.The condition that is heating and curing is according to the use level of catalyst and difference, for example, total amount 100 mass parts with respect to olefinic organic based polysiloxane and organic hydrogen polysiloxanes, under the situation of the platinum group catalyst that coordinates 2 mass parts, in atmosphere, reacted under 50 ℃～250 ℃, preferably 100 ℃～200 ℃.In addition, the reaction time under this situation is set as 5～60 minutes, preferably 10～30 minutes.

By hardening resin composition is heating and curing, when curing reaction, polyorganosiloxane resin and gripper shoe 31 chemical bond, in addition by anchoring effect, polyorganosiloxane resin layer and gripper shoe 31 combinations, gluing.By these effects, the polyorganosiloxane resin layer is fixedly secured to gripper shoe 31.It should be noted that, under the situation that is formed the resin bed that comprises polyorganosiloxane resin resin in addition by hardening resin composition, also can, by method same as described above, form the resin bed 32 that is fixed to gripper shoe 31.

The manufacture method of<duplexer and duplexer >

As mentioned above, duplexer 10 of the present invention is the duplexer that has glass substrate 24, the gripper shoe 31 with inorganic insulating membrane and be present in the resin bed 32 between them.

The manufacture method of duplexer of the present invention is not particularly limited, usually the method be preferably as follows: prepare with the glass substrate 24 of inorganic insulating membrane and the gripper shoe with resin bed of making by said method (reinforcement plate 30), the resin layer surface of usining with the face of the inorganic insulating membrane of the glass substrate 24 of inorganic insulating membrane and the above-mentioned gripper shoe with resin bed (reinforcement plate 30) is as lamination surface, and both are stacked.Lamination surface at resin bed 32 has under the situation of non-tack, utilizes common coincidence and pressurization, can easily in the mode that can peel off, be adhered to.

Particularly, the method that can be listed below after the non-tack surface of resin bed 32 overlap zone has the glass substrate 24 of inorganic insulating membrane, makes resin bed 32 and glass substrate 24 crimping with inorganic insulating membrane by using roller, press under atmospheric pressure environment.By using roller, press to carry out crimping, resin bed 32 further adheres to the glass substrate 24 with inorganic insulating membrane, therefore preferably.In addition, by the crimping of using roller, press to carry out, can remove with comparalive ease the bubble of sneaking between resin bed 32 and the glass substrate 24 with inorganic insulating membrane, therefore preferably.

If utilize vacuum layer platen press, Vacuum Pressure method for making to carry out crimping, that can suppress well bubble sneaks into, guarantees good adhesion, therefore more preferably.By carry out crimping under vacuum, also have advantages of as follows: even under the residual situation that small bubble arranged, bubble can, because heating is grown up, not be difficult for causing the strain defect with the glass substrate 24 of inorganic insulating membrane yet.

To make in the mode that can peel off resin bed 32 adhere to the glass substrate 24 of inorganic insulating membrane on the time, preferably by resin bed 32 with the face that the glass substrate 24 of inorganic insulating membrane is in contact with one another side, fully wash, carry out stacked in cleannes under high environment.Even although sneak into foreign matter between resin bed 32 and the glass substrate 24 with inorganic insulating membrane, therefore because resin bed 32 deforms, can the flatness on the surface of the glass substrate 24 with inorganic insulating membrane not impacted, but cleannes are higher, its flatness is better, therefore preferably.

Duplexer 10 of the present invention can be used in various uses, can enumerate such as: manufacture panel, PV, thin-film secondary battery for display unit described later, be formed with the purposes etc. of the electronic units such as semiconductor wafer of circuit on surface.It should be noted that, in this purposes, duplexer 10 be exposed to hot conditions (for example,, more than 320 ℃) under a lot of situations in (for example,, more than 1 hour).

At this, display unit comprises with panel: LCD, OLED, Electronic Paper, plasm display panel, field emission panel, quantum dot LED panel, MEMS (Micro Electro Mechanical Systems: MEMS) shutter face plate etc.

<with the display unit of gripper shoe with panel and with the display unit of gripper shoe the manufacture method with panel

In the present invention, by manufacture the display unit panel with gripper shoe with above-mentioned duplexer.

Fig. 2 is the schematic cross sectional view of the display unit with gripper shoe of the present invention by an example of panel.

With the panel 40 for display unit of gripper shoe, by above-mentioned duplexer 10, display unit, with the member of formation 50 of panel, formed.

(member of formation of panel for display unit)

Display unit refers to the member of formation 50 of panel, for example, in the display unit such as LCD, OLED of using glass substrate, is formed on member or its part on glass substrate.For example; in the display unit such as LCD, OLED; the member of the transparency electrode that be formed with tft array (below, referred to as " array "), protective layer, colour filter, liquid crystal on the surface of substrate, comprises ITO etc., various circuit patterns etc., or the member that their combinations are obtained.The semi-conducting material used in above-mentioned array is not particularly limited, and can enumerate such as the silicon of amorphous, crystallite, polycrystalline etc.; The metal oxide such as ZNO, IGZO; The organic matter such as thiophene derivant, pentacene derivative etc.In addition, for example, in comprising the display unit of OLED, can be set forth in the transparency electrode that forms on substrate, hole injection layer, hole transporting layer, luminescent layer, electron supplying layer etc.

The above-mentioned display unit with gripper shoe is not particularly limited by the manufacture method of panel 40, can use according to display unit the kind of the member of formation of panel, utilize known method in the past, form the member of formation 50 of display unit with panel on 24 surfaces of the glass substrate with inorganic insulating membrane of duplexer 10.

For example, the situation of manufacturing OLED of take is example, form organic EL structure for (the second interarea 202 that is equivalent to glass substrate 20) on the surface of the resin bed 32 side opposition sides at duplexer 10 and glass substrate 24 with inorganic insulating membrane is upper, formed transparency electrode, and then be formed with evaporation hole injection layer, hole transporting layer, luminescent layer, electron supplying layer etc. on the face of transparency electrode, form backplate, various layers form or process to use that sealing plate is sealed etc.Form or process as these layers, particularly, can enumerate such as the gluing processing of film forming processing, vapor deposition treatment, sealing plate etc.The formation of these member of formation can be also the part in the formation of the needed whole member of formation of panel for display unit.In this case, the glass substrate with inorganic insulating membrane 24 that this is formed with to a part of member of formation, from reinforcement plate 30 separates, forms remaining member of formation on the glass substrate 24 with inorganic insulating membrane, thereby manufactures the display unit panel.

As shown in Figure 2, panel 60 for display unit of the present invention, consist of with the member of formation 50 of panel the glass substrate 24 with inorganic insulating membrane and display unit.

Can, by from the display unit with gripper shoe, using panel 40 by the interface peel of inorganic insulating membrane 22 and resin bed 32, be separated into glass substrate 24 and reinforcement plate 30 with inorganic insulating membrane, thereby obtain panel 60 for display unit.

It should be noted that, member of formation on the glass substrate with inorganic insulating membrane 24 after separation is under the situation of display unit by the part of the formation of the needed whole member of formation of panel, afterwards, manufacture panel 60 for display unit by forming remaining member of formation on the glass substrate 24 with inorganic insulating membrane.

Inorganic insulating membrane 22 and the method for the fissility sur-face peeling of resin bed 32 are not particularly limited.But, preferably at first after inorganic insulating membrane 22 and the interface formation of resin bed 32 are peeled off starting point, peeled off.Particularly, for example, preferably the interface with resin bed 32 at inorganic insulating membrane 22, insert sharp keen cutter shape thing, gives the starting point of peeling off, and after this by winding-up water and compressed-air actuated fluid-mixing, peeled off.

It should be noted that, display unit is separated with panel 40 from the display unit with gripper shoe with panel 60, as required, on the inorganic insulating membrane 22 in display unit with the glass substrate with inorganic insulating membrane 24 in panel 60, the member of formation of display unit with panel can be set in addition.

In addition, the reinforcement plate after separation 30 can be manufactured duplexer 10 of the present invention with the new glass substrate with inorganic insulating membrane is stacked.Manufacture method of new duplexer 10 as this, preferably aforesaid manufacture method of the present invention.

In addition, can obtain display unit with panel 60 by this display unit.As display unit, can enumerate LCD, OLED.As LCD, can enumerate TN type, STN type, FE type, TFT type, mim type.

The operation that obtains display unit at this is not particularly limited, and for example, can utilize known method in the past to manufacture display unit.

Embodiment

Below, wait and illustrate the present invention by embodiment, but the present invention can't help these examples and limit.

In following embodiment 1～5, comparative example 1,4, as glass substrate, use the glass plate (vertical 720mm, horizontal 600mm, thickness of slab 0.3mm, the linear expansion coefficient 38 * 10 that comprise the alkali-free pyrex ^-7/ ℃, Asahi Glass company trade name processed " AN100 ").In addition, as gripper shoe, similarly use the glass plate (vertical 720mm, horizontal 600mm, thickness of slab 0.4mm, the linear expansion coefficient 38 * 10 that comprise the alkali-free pyrex ^-7/ ℃, Asahi Glass company trade name processed " AN100 ").

In addition, in embodiment 6 and comparative example 2, as glass substrate and gripper shoe, use the glass plate (linear expansion coefficient 85 * 10 that comprises soda-lime glass ^-7/ ℃, Asahi Glass company trade name processed " AS ").In embodiment 7 and comparative example 3, the glass plate that this is comprised to soda-lime glass floods 1 hour in the potassium nitrate fused salt of 450 ℃, carries out thus chemical enhanced processing, and using resulting strengthening glass sheets as glass substrate and gripper shoe use.The size of these glass substrates is identical with the glass substrate used in embodiment 1～5 with thickness, and the size of these gripper shoes is also identical with the gripper shoe of using in embodiment 1～5 with thickness.

It should be noted that, in embodiment described later and comparative example, by using atomic force microscope, (Seiko Instruments company (セイコーイ Application ス Star Le メ Application Star society) system, SPA300/SPI3800) measured surface roughness (Ra).

(fissility evaluation)

Fissility about the glass substrate with inorganic insulating membrane after the heating of aftermentioned duplexer, carry out heat treated under the aftermentioned rated condition after, to peel off with glass substrate and the resin bed of inorganic insulating membrane, and visually observe the face contacted with resin bed with the glass substrate of inorganic insulating membrane, estimated thus.Residue without resin bed is evaluated as well, has the residue of resin bed to be evaluated as bad.

(cleanliness evaluation)

Carry out heat treated under the aftermentioned defined terms after, the glass substrate with inorganic insulating membrane that to peel off from duplexer carries out ultrasonic processing (5 minutes) hexane, then on the face contacted with resin bed, (on the inorganic insulation face) pastes adhesive tape (trade name Sellotape (セロテープ) (registration mark), Nichiban (ニチバ Application) system), carry out 90 ° and peel off, and measure its peel strength.Peel strength is less, means on the inorganic insulation face, to have the residue of resin bed, and from practical aspect, preferably peel strength is more than 0.5N/25mm.

After first the gripper shoe of thickness of slab 0.4mm being carried out to the pure water washing, then carry out the UV washing, thus purifying.

Then, on the first interarea of gripper shoe, utilize screen process press, to indulge the size of 705mm, horizontal 595mm, by solvent-free addition reaction-type polysiloxanes (polysiloxanes company of SHIN-ETSU HANTOTAI system, KNS-320A, viscosity: 0.40Pas for peeling paper, solubility parameter (SP value): 7.3) (polysiloxanes company of SHIN-ETSU HANTOTAI system, CAT-PL-56) coating of the mixed liquor of 2 mass parts is rectangle (coating weight 30g/m for 100 mass parts and platinum group catalyst ²).

Then, under 180 ℃, in atmosphere, be heated and solidify 30 minutes, form the polyorganosiloxane resin layer of thickness 20 μ m on the first interarea of gripper shoe.

It should be noted that, above-mentioned solvent-free addition reaction-type peeling paper comprises with polysiloxanes: have with the straight chain shape olefinic organic based polysiloxane (host) of the vinyl of silicon atom bonding and methyl and have and the hydrogen atom of silicon atom bonding and the straight chain shape organic hydrogen polysiloxanes (crosslinking agent) of methyl.

Then, by the glass substrate of thickness of slab 0.3mm, with the face polyorganosiloxane resin contact side (the first interarea), carry out the pure water washing, then carry out the UV washing, thus purifying.In addition, (300 ℃ of heating-up temperatures become film pressure 4m holder, power density 3W/cm to utilize magnetron sputtering method ²), form the SiO of thickness 30nm on the face after purifying ₂film, obtain the glass substrate with inorganic insulating membrane.Inorganic insulating membrane surface (inorganic insulating membrane and surface glass substrate side opposition side.Below mean identical meanings) surface roughness (Ra) for 0.8nm.In addition, measuring (the Quantera SXM that uses ULVAC-PHI company (ア Le バッ Network Off ァイ society) to make by XPS.Below identical) to add up to content be detectability following (0.1 atom % is following) for the atom of alkali and alkaline earth metal ions in the inorganic insulating membrane surface that obtains.

Then, at room temperature, the SiO by glass substrate by vacuum pressing ₂the polyorganosiloxane resin aspect of film forming face and gripper shoe is pasted, and obtains duplexer A.

In resulting duplexer A, gripper shoe and glass substrate adhere to the polyorganosiloxane resin layer under the situation that does not produce bubble, thereby there is no strain shape defect, and flatness is also good.

(the fissility evaluation after heating)

For duplexer A, at aerial oxygen, be to implement 1 hour heat treated in the blanket of nitrogen below 0.1%, under 350 ℃.

Then, carry out disbonded test.Particularly, at first, the second interarea of the glass substrate in duplexer A is fixed on fixed station.On the other hand, the second interarea that adsorbs gripper shoe with absorption layer.Then, the place, an angle in four bights that have at duplexer A, in the interface of the glass substrate with inorganic insulating membrane and resin bed, the cutter of inserting thickness 0.4mm, slightly peel off the interface of inorganic insulating membrane and resin bed, thereby give the starting point of peeling off.Then, absorption layer is moved to the direction of leaving from fixed station, the interface integral body of inorganic insulating membrane and resin bed is peeled off, isolate with the glass substrate of inorganic insulating membrane with the gripper shoe of resin bed.

On the release surface of the glass substrate with inorganic insulating membrane after separation (on inorganic insulating membrane), there is no the residue of resin.

In addition, the glass substrate with inorganic insulating membrane after separating is carried out to above-mentioned cleanliness evaluation, peel strength is 0.7N/25mm, and known have an excellent face cleanliness.

Then, the glass substrate with inorganic insulating membrane after separating under 50 ℃ is made at the anticorrosive additive stripping liquid controlling that is diluted to 20 % by weight ((パーカーコーポレーショ Application society of Parker Corporation company), the potassium hydroxide that contains 20 quality % is as main component) the middle dipping 10 minutes, after being utilized scrubbing of water to wash, in the aqueous hydrochloric acid solution that is 0.1 mol/L in concentration under 90 ℃, dipping is 20 hours, and is utilized scrubbing of water to wash and air blast.Release surface with observation by light microscope with the glass substrate of inorganic insulating membrane, result has no crackle.

(embodiment 1b)

By the hot CVD method, (reacting gas is tetraethoxysilane and ozone/oxygen gas for 400 ℃ of heating-up temperatures, reaction pressure 1Pa, and carrier gas is nitrogen; 2000sccm, ozone/oxygen gas ratio: 3%) replace magnetron sputtering method, form the SiO of thickness 100nm ₂film, in addition, the order according to identical with embodiment 1, obtain duplexer A '.It should be noted that, be 2nm with the surface roughness (Ra) on the inorganic insulating membrane surface of the glass substrate of inorganic insulating membrane.In addition, it is 0.5 atom % that the atom of measuring the alkali and alkaline earth metal ions in the inorganic insulating membrane surface obtained by XPS adds up to content.

Then, in the mode identical with embodiment 1, duplexer A ' is carried out to the fissility evaluation.The residue that there is no resin on the release surface of the glass substrate with inorganic insulating membrane after separation.

In addition, the glass substrate with inorganic insulating membrane after separating is carried out to the cleanliness evaluation, peel strength is 0.8N/25mm, and known have an excellent face cleanliness.

Then, according to the order identical with embodiment 1, the glass substrate with inorganic insulating membrane after separating is carried out alkali, acid and scrubs and wash, and with observation by light microscope the release surface with the glass substrate of inorganic insulating membrane, result has no crackle.

It should be noted that, it is believed that, the atom of the alkali and alkaline earth metal ions in the inorganic insulating membrane surface results from the impurity in tetraethoxysilane.

By ICP-CVD method (inductively coupled plasma CVD), (400 ℃ of heating-up temperatures become film pressure 1Pa, RF power 400W, DC power 230V/0.5A/80W, gas flow (100%SiH ₄: 10sccm, N ₂: 140sccm)) form the Si of thickness 100nm ₃n ₄film replaces forming SiO ₂film, in addition, the order according to identical with embodiment 1, obtain duplexer B.It should be noted that, be 2nm with the surface roughness (Ra) on the inorganic insulating membrane surface of the glass substrate of inorganic insulating membrane.In addition, it is (0.1 atom % is following) below detectability that the atom of measuring the alkali and alkaline earth metal ions in the inorganic insulating membrane surface obtained by XPS adds up to content.

Then, in the mode identical with embodiment 1, duplexer B is carried out to the fissility evaluation.The residue that there is no resin on the release surface of the glass substrate with inorganic insulating membrane after separation.

In addition, the glass substrate with inorganic insulating membrane after separating is carried out to the cleanliness evaluation, peel strength is 0.6N/25mm, and known have an excellent face cleanliness.

By magnetron sputtering method, (300 ℃ of heating-up temperatures become film pressure 4m holder, power density 3W/cm ²) form the SiO of thickness 100nm ₂film, then carry out plasma nitridation process (300 ℃ of heating-up temperatures, cavity indoor pressure 100Pa, gas flow (N ₂: 100sccm, Ar:1000sccm, H ₂: 10sccm)), the SiO of formation thickness 100nm _an _b(a=1, b=1) film replaces forming SiO ₂film, in addition, the order according to identical with embodiment 1, obtain duplexer C.It should be noted that, be 1nm with the surface roughness (Ra) on the inorganic insulating membrane surface of the glass substrate of inorganic insulating membrane.In addition, it is (0.1 atom % is following) below detectability that the atom of measuring the alkali and alkaline earth metal ions in the inorganic insulating membrane surface obtained by XPS adds up to content.

Then, in the mode identical with embodiment 1, duplexer C is carried out to the fissility evaluation.The residue that there is no resin on the release surface of the glass substrate with inorganic insulating membrane after separation.

In addition, in the mode identical with embodiment 1, the glass substrate with inorganic insulating membrane after separating is carried out to the cleanliness evaluation, peel strength is 0.6N/25mm, and known have an excellent face cleanliness.

By the spraying of the glass baseplate surface to using in embodiment 1 (approximately 20 seconds) buffered hydrofluoric acid (hydrofluoric acid 6 % by weight: ammonium fluoride 30 % by weight, all the other are water, below identical) carry out roughening, on surface after the roughening of glass substrate, utilize the magnetron sputtering method of implementing in embodiment 1 to make the SiO of thickness 30nm on glass substrate ₂film, used this glass substrate with inorganic insulating membrane to replace the glass substrate with inorganic insulating membrane used in embodiment 1, and the order according to identical with embodiment 1, obtain duplexer D.It should be noted that, be 25nm with the surface roughness (Ra) on the inorganic insulating membrane surface of the glass substrate of inorganic insulating membrane.In addition, it is (0.1 atom % is following) below detectability that the atom of measuring the alkali and alkaline earth metal ions in the inorganic insulating membrane surface obtained by XPS adds up to content.

Then, in the mode identical with embodiment 1, duplexer D is carried out to the fissility evaluation.The residue that there is no resin on the release surface of the glass substrate with inorganic insulating membrane after separation.

In addition, the glass substrate with inorganic insulating membrane after peeling off is carried out to the cleanliness evaluation, peel strength is 0.6N/25mm, and known have an excellent face cleanliness.

By the reactive sputtering method, (the aluminium target, without heating, becomes film pressure 0.1Pa, gas flow (O ₂: 25sccm, Ar:25sccm)) form the Al of thickness 50nm ₂o ₃film replaces forming SiO ₂film, in addition, the order according to identical with embodiment 1, obtain duplexer E.It should be noted that, in the present embodiment, be 0.8nm with the surface roughness (Ra) on the inorganic insulating membrane surface of the glass substrate of inorganic insulating membrane.In addition, it is (0.1 atom % is following) below detectability that the atom of measuring the alkali and alkaline earth metal ions in the inorganic insulating membrane surface obtained by XPS adds up to content.

Then, in the mode identical with embodiment 1, duplexer E is carried out to the fissility evaluation.The residue that there is no resin on the release surface of the glass substrate with inorganic insulating membrane after separation.

The glass plate that use comprises soda-lime glass is as gripper shoe and glass substrate, and in addition, the method by identical with embodiment 1, obtain duplexer F.It should be noted that, in the present embodiment, be 0.8nm with the surface roughness (Ra) on the inorganic insulating membrane surface of the glass substrate of inorganic insulating membrane.In addition, it is (0.1 atom % is following) below detectability that the atom of measuring the alkali and alkaline earth metal ions in the inorganic insulating membrane surface obtained by XPS adds up to content.

Then, in the mode identical with embodiment 1, duplexer F is carried out to the fissility evaluation.The residue that there is no resin on the release surface of the glass substrate with inorganic insulating membrane after separation.

Use glass plate after chemical enhanced as gripper shoe and glass substrate, in addition, the method by identical with embodiment 2, obtain duplexer G.It should be noted that, be 0.8nm with the surface roughness (Ra) on the inorganic insulating membrane surface of the glass substrate of inorganic insulating membrane.In addition, it is (0.1 atom % is following) below detectability that the atom of measuring the alkali and alkaline earth metal ions in the inorganic insulating membrane surface obtained by XPS adds up to content.

Then, in the mode identical with embodiment 1, duplexer G is carried out to the fissility evaluation.The residue that there is no resin on the release surface of the glass substrate with inorganic insulating membrane after peeling off.

It should be noted that, the duplexer A～G about using in above-described embodiment 1～7 in above-mentioned disbonded test, has produced and has peeled off between polyorganosiloxane resin layer and inorganic insulating membrane, rather than between polyorganosiloxane resin layer and gripper shoe.From this point, confirm, adhesion between polyorganosiloxane resin layer and gripper shoe is greater than the adhesion between polyorganosiloxane resin layer and inorganic insulating membrane, in other words, the peel strength between polyorganosiloxane resin layer and gripper shoe is higher than the peel strength between polyorganosiloxane resin layer and inorganic insulating membrane.

Use the glass substrate that does not have inorganic insulating membrane to replace the glass substrate with inorganic insulating membrane used in embodiment 1, in addition, the order according to identical with embodiment 1, obtain duplexer H.Do not comprise inorganic insulating membrane in duplexer H.It should be noted that, to glass substrate, with the face resin layer surface contact side, carry out the pure water washing, then carry out the UV washing, thus purifying.The surface roughness (Ra) of the glass substrate after in addition, purifying is 0.5nm.In addition, it is 1.0 atom % that the atom of measuring the alkali and alkaline earth metal ions in the glass baseplate surface obtained by XPS adds up to content.

Then, according to the order identical with embodiment 1, after carrying out heat treated, carry out the fissility evaluation, the glass substrate in duplexer H is separated with the gripper shoe with resin bed.

On the face contacted with resin bed of the glass substrate after separation, be attached with the part of the resin of resin bed, the appropriate section of the resin layer surface on gripper shoe confirms breakage.

In addition, the glass substrate after separating is carried out to the cleanliness evaluation, peel strength is 0.1N/25mm, known can't fully removing being attached to lip-deep resin.

After removing resin with cutter, with light microscope, the release surface of glass substrate is observed, see crackle and produce in the part of release surface.

Use the glass plate that comprise soda-lime glass identical with embodiment 6 as gripper shoe and glass substrate, in addition, the method by identical with comparative example 1, obtain duplexer J.Do not comprise inorganic insulating membrane in duplexer J.It should be noted that, the surface roughness (Ra) of the glass substrate after purifying is 0.5nm.In addition, it is 1.5 atom % that the atom of measuring the alkali and alkaline earth metal ions in the glass baseplate surface obtained by XPS adds up to content.

Then, according to the order identical with embodiment 1, after carrying out heat treated, carry out the fissility evaluation, the glass substrate in duplexer J is separated with the gripper shoe with resin bed.

Use identical with embodiment 7 glass plate after chemical enhanced as gripper shoe and glass substrate, in addition, the method by identical with comparative example 1, obtain duplexer K.Do not comprise inorganic insulating membrane in duplexer K.It should be noted that, the surface roughness (Ra) of the glass substrate after purifying is 0.5nm.In addition, it is 1.5 atom % that the atom of measuring the alkali and alkaline earth metal ions in the glass baseplate surface obtained by XPS adds up to content.

Then, according to the order identical with embodiment 1, after carrying out heat treated, carry out the fissility evaluation, the glass substrate in duplexer K is separated with the gripper shoe with resin bed.

Carry out roughening by the spraying of the glass baseplate surface to using in comparative example 1 (approximately 60 seconds) buffered hydrofluoric acid, use this roughening glass substrate to replace the glass substrate with inorganic insulating membrane used in embodiment 1, order according to identical with embodiment 1, obtain duplexer L.Do not comprise inorganic insulating membrane in duplexer L.It should be noted that, the roughening glass substrate with the face resin bed contact side, carry out the pure water washing, then carry out the UV washing, thus purifying.

The surface roughness (Ra) on the surface (face after roughening) after resulting roughening glass substrate purifying is 100nm.In addition, it is 1.1 atom % that the atom of measuring the alkali and alkaline earth metal ions in the surface after the roughening glass substrate that obtains purifying by XPS adds up to content.

Then, according to the order identical with embodiment 1, after carrying out heat treated, carry out the fissility evaluation, the glass substrate in duplexer L is separated with the gripper shoe with resin bed.

In this example, use the duplexer C obtained in embodiment 3 to manufacture OLED.

Be supplied to the operation that forms transparency electrode, form the operation of auxiliary electrode, the operation of evaporation hole injection layer, hole transporting layer, luminescent layer, electron supplying layer etc. by the operation of gains sealing, thereby forms organic EL structure on the glass substrate of duplexer C.The duplexer C (hereinafter referred to as panel C) that has organic EL structure on glass substrate is the panel of the display unit with supporter of the present invention.

Then, by the sealing side vacuum suction of panel C to platen, then in the glass substrate in the bight of panel C and the interface of resin bed, the stainless steel cutter of inserting thickness 0.1mm, give and peel off starting point the interface of the inorganic insulation layer of glass substrate and resin bed.Then, the gripper shoe surface with 24 vacuum suction pad absorption panel C, start sequentially to make its rising from the absorption layer in the bight close to panel C afterwards.Its result, the residual glass substrate that is formed with organic EL structure only on platen, can peel off the gripper shoe with resin bed.

Then, use laser cutting method or line sliver method (ス Network ライブー Block レイ Network method), glass substrate after separating is cut, after being cut into 288 unit of vertical 41mm * horizontal 30mm, assembling is formed with glass substrate and the counter substrate of organic EL structure, implement module and form operation, thereby make OLED.The OLED obtained so can not have problems on characteristic.

With reference to detailed and specific embodiment, describe the present invention, but it is obvious to the skilled person that under the situation do not departed from the scope of the present invention with spirit, can carry out various modifications, change to the present invention.

The Japanese patent application 2011-095632 that the application submitted to based on April 22nd, 2011, in this its content is incorporated to the present invention as a reference.

Symbol description

10 duplexers

20 glass substrates

22 inorganic insulating membranes

24 glass substrates with inorganic insulating membrane

The first interarea of 201 glass substrates

The second interarea of 202 glass substrates

221 inorganic insulating membrane surfaces

30 reinforcement plates (with the gripper shoe of resin bed)

31 gripper shoes

32 resin beds

321 resin layer surfaces

40 panels of the display unit with gripper shoe

The member of formation of panel for 50 display unit

60 display unit panels

Claims

1. a duplexer, it has the layer, resin bed of gripper shoe and successively with the layer of the glass substrate of inorganic insulating membrane, and the inorganic insulating membrane of the described glass substrate with inorganic insulating membrane contacts with described resin bed, wherein,

In the described glass substrate with inorganic insulating membrane,

Single face at glass substrate has inorganic insulating membrane, and described inorganic insulating membrane contains at least one oxide, nitride or the oxynitride comprised in the group of selecting free silicon and aluminium to form,

In the face contacted with described resin bed of described inorganic insulating membrane, the atom of alkali and alkaline earth metal ions total content is below 0.5 atom %,

The layer of described gripper shoe and the peel strength of the peel strength at the interface of described resin bed higher than the interface of described resin bed and described inorganic insulating membrane.

2. duplexer as claimed in claim 1, wherein, described inorganic insulating membrane is the film that comprises silica, silicon nitride, silicon oxynitride or aluminium oxide.

3. duplexer as claimed in claim 1 or 2, wherein, the surface roughness (Ra) of the face contacted with described resin bed of described inorganic insulating membrane is less than 30nm.

4. duplexer as described as any one in claim 1～3, wherein, the thickness of described inorganic insulating membrane is 5～5000nm.

5. duplexer as described as any one in claim 1～4, wherein, the thickness of described glass substrate is 0.03～0.8mm.

6. duplexer as described as any one in claim 1～5, wherein, the resin of described resin bed is polyorganosiloxane resin.

7. duplexer as claimed in claim 6, wherein, described polyorganosiloxane resin is the olefinic organic based polysiloxane and the solidfied material that reacts of organic hydrogen polysiloxanes.

8. duplexer as described as any one in claim 1～7, wherein, the thickness of described resin bed is 1～100 μ m.

9. duplexer as described as any one in claim 1～8, wherein, described gripper shoe is glass plate.

10. the manufacture method of a duplexer, for the manufacture of the layer that there is successively gripper shoe, resin bed with the duplexer of the layer of the glass substrate of inorganic insulating membrane, wherein,

Preparation is with the glass substrate of inorganic insulating membrane, the described glass substrate with inorganic insulating membrane has inorganic insulating membrane at the single face of glass substrate, described inorganic insulating membrane contains at least one oxide, nitride or the oxynitride comprised in the group of selecting free silicon and aluminium to form, and in face contact with described resin bed of described inorganic insulating membrane, the atom of alkali and alkaline earth metal ions total content is below 0.5 atom %;

Preparation is with the gripper shoe of resin bed, and the described gripper shoe with resin bed has the described resin bed of the single face that is fixed to described gripper shoe, and the surface of exposing of this resin bed has non-tack;

Using the described glass substrate with inorganic insulating membrane inorganic insulating membrane face, with the resin layer surface of the described gripper shoe with resin bed as lamination surface, the described glass substrate with inorganic insulating membrane and described gripper shoe with resin bed is stacked.

11. the manufacture method of duplexer as claimed in claim 10, wherein, the described gripper shoe with resin bed is to have the gripper shoe of olefinic organic based polysiloxane and organic hydrogen polysiloxanes being reacted on this gripper shoe to the layer that solidifies the polyorganosiloxane resin obtained.

12. the panel of the display unit with gripper shoe, have the described duplexer of any one in claim 1～9 and be arranged on the display device component of the glass baseplate surface of described duplexer.

13. a display unit panel, it will be peeled off to remove with the gripper shoe of resin bed as release surface and form by from the described display unit with gripper shoe of claim 12, with panel, usining the interface of described inorganic insulating membrane and described resin bed.

14. a display unit, have the described display unit panel of claim 13.