CN103474385A - 芯片粘合工作台 - Google Patents
芯片粘合工作台 Download PDFInfo
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- CN103474385A CN103474385A CN2013104111723A CN201310411172A CN103474385A CN 103474385 A CN103474385 A CN 103474385A CN 2013104111723 A CN2013104111723 A CN 2013104111723A CN 201310411172 A CN201310411172 A CN 201310411172A CN 103474385 A CN103474385 A CN 103474385A
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CN201310411172.3A CN103474385B (zh) | 2013-09-09 | 2013-09-09 | 芯片粘合工作台 |
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CN201310411172.3A CN103474385B (zh) | 2013-09-09 | 2013-09-09 | 芯片粘合工作台 |
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CN103474385A true CN103474385A (zh) | 2013-12-25 |
CN103474385B CN103474385B (zh) | 2016-06-08 |
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CN201310411172.3A Active CN103474385B (zh) | 2013-09-09 | 2013-09-09 | 芯片粘合工作台 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103921228A (zh) * | 2014-04-26 | 2014-07-16 | 普乐新能源(蚌埠)有限公司 | 可移动真空吸附平台 |
CN107831063A (zh) * | 2017-10-28 | 2018-03-23 | 庄明忠 | 一种建筑材料强度检测装置 |
CN109089409A (zh) * | 2018-08-02 | 2018-12-25 | 华天慧创科技(西安)有限公司 | 一种晶粒与基板的贴装方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58218136A (ja) * | 1982-06-14 | 1983-12-19 | Toshiba Corp | 半導体装置用ダイコレツト |
JPH1012639A (ja) * | 1996-06-18 | 1998-01-16 | Sanyo Electric Co Ltd | ボンディングコレット |
CN1222251A (zh) * | 1996-06-17 | 1999-07-07 | 松下电器产业株式会社 | 凸起粘合装置及方法 |
CN201024212Y (zh) * | 2007-03-06 | 2008-02-20 | 中芯国际集成电路制造(上海)有限公司 | 晶圆支架 |
CN102760666A (zh) * | 2012-07-05 | 2012-10-31 | 西安永电电气有限责任公司 | 用于igbt的键合真空吸附工装 |
CN203109667U (zh) * | 2013-02-04 | 2013-08-07 | 深圳市常兴技术股份有限公司 | 一种治具 |
CN203481202U (zh) * | 2013-09-09 | 2014-03-12 | 江阴迪林生物电子技术有限公司 | 芯片粘合工作台 |
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2013
- 2013-09-09 CN CN201310411172.3A patent/CN103474385B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58218136A (ja) * | 1982-06-14 | 1983-12-19 | Toshiba Corp | 半導体装置用ダイコレツト |
CN1222251A (zh) * | 1996-06-17 | 1999-07-07 | 松下电器产业株式会社 | 凸起粘合装置及方法 |
JPH1012639A (ja) * | 1996-06-18 | 1998-01-16 | Sanyo Electric Co Ltd | ボンディングコレット |
CN201024212Y (zh) * | 2007-03-06 | 2008-02-20 | 中芯国际集成电路制造(上海)有限公司 | 晶圆支架 |
CN102760666A (zh) * | 2012-07-05 | 2012-10-31 | 西安永电电气有限责任公司 | 用于igbt的键合真空吸附工装 |
CN203109667U (zh) * | 2013-02-04 | 2013-08-07 | 深圳市常兴技术股份有限公司 | 一种治具 |
CN203481202U (zh) * | 2013-09-09 | 2014-03-12 | 江阴迪林生物电子技术有限公司 | 芯片粘合工作台 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103921228A (zh) * | 2014-04-26 | 2014-07-16 | 普乐新能源(蚌埠)有限公司 | 可移动真空吸附平台 |
CN107831063A (zh) * | 2017-10-28 | 2018-03-23 | 庄明忠 | 一种建筑材料强度检测装置 |
CN109089409A (zh) * | 2018-08-02 | 2018-12-25 | 华天慧创科技(西安)有限公司 | 一种晶粒与基板的贴装方法 |
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CN103474385B (zh) | 2016-06-08 |
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Effective date of registration: 20180528 Address after: 210000 Bauhinia mansion four, Qinhuai, Nanjing, Jiangsu, 705 Patentee after: Nanjing run Nico Bo Biological Technology Co.,Ltd. Address before: 214434 room B4, No. 85, Sha Shan Road, Jiangyin, Wuxi, Jiangsu Patentee before: JIANGYIN DILIN BIOELECTRONIC TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20200930 Address after: No.30, group 18, Heping Village, Laozhou Township, Yi'an District, Tongling City, Anhui Province Patentee after: Tongling Sun Island Agricultural Technology Co.,Ltd. Address before: 210000 Bauhinia mansion four, Qinhuai, Nanjing, Jiangsu, 705 Patentee before: Nanjing run Nico Bo Biological Technology Co.,Ltd. |
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Effective date of registration: 20230302 Address after: 518000 The first and second floors of the 10th building on the first floor of the 12th building in Dayangtian Industrial Zone, Wanfeng Village, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN DONG HONG XIN STATIC EQUIPMENT Co.,Ltd. Address before: 244000 No.30, group 18, Heping Village, Laozhou Township, Yi'an District, Tongling City, Anhui Province Patentee before: Tongling Sun Island Agricultural Technology Co.,Ltd. |