Summary of the invention
For the problems referred to above, the purpose of this invention is to provide a kind of medical endoscope solved the problems of the technologies described above, Medical endoscope cold light source system and temperature control system thereof.
A kind of Medical endoscope cold light source system, it has power input interface, and described Medical endoscope cold light source system comprises LED light source module and cold light source panel; Described LED light source module comprises the LED luminescence chip, for the real-time junction temperature measurement sensor of measuring the junction temperature of described LED luminescence chip, reaches the semiconductor chilling plate for described LED luminescence chip is freezed; Described cold light source panel and described LED light source module are electrically connected, described cold light source panel drives the work of described LED light source module, described cold light source panel obtains the real-time junction temperature of the described LED luminescence chip of described junction temperature measurement sensor measurement, and the default operating temperature of contrast, when the real-time junction temperature of described LED luminescence chip departs from described default operating temperature, described cold light source panel is controlled described semiconductor chilling plate work.
In the present invention's one better embodiment, described LED optical module also comprises base, fin and radiator fan, described base has relative first surface and second surface, described LED luminescence chip is fixed in described first surface by heat conductive silica gel, and and described cold light source panel is electrically connected, the cold junction of described semiconductor chilling plate fits in described second surface, and and described cold light source panel is electrically connected, described fin is arranged at the hot junction of described semiconductor chilling plate, described radiator fan is arranged at described fin by double-screw bolt or screw, relative with described semiconductor chilling plate, and and described cold light source panel is electrically connected, described semiconductor chilling plate is fixed between described base and described fin by screw or double-screw bolt.
In the present invention's one better embodiment, be provided with heat insulating mattress between described base and described fin, be provided with heat insulation cylinder between the screw of fixing described semiconductor chilling plate or double-screw bolt and described base, described heat insulating mattress is arranged at the gap between described base and described fin, described heat insulation cylinder is arranged in the screw of described base, and an end of described heat insulation cylinder radially extends to form heat insulation ear outward, described heat insulation ear is arranged between the head of described base and described screw or double-screw bolt, and described screw or double-screw bolt are arranged in heat insulation cylinder and described heat insulating mattress successively.
In the present invention's one better embodiment, described Medical endoscope cold light source system further comprise the light that described LED luminescence chip is sent carry out the concentration module of optically focused, for the display screen of man-machine interaction, control the adjusting knob of described LED luminescence chip switch and brightness size and the system radiating fan dispelled the heat for described Medical endoscope cold light source system; Described concentration module is arranged at a side of described LED luminescence chip emergent ray, and it comprises varifocal battery of lens; Described display screen, described adjusting knob and described system radiating fan all are electrically connected at described cold light source panel.
In the present invention's one better embodiment, described concentration module further comprises the light collecting barrel of grafting optical fiber, and described light collecting barrel is arranged at the side of described concentration module away from described LED luminescence chip.
In the present invention's one better embodiment, described cold light source panel comprises Temperature Setting module, temperature comparison module and temperature control modules, described Temperature Setting module and described temperature comparison module are electrically connected, described temperature comparison module and described junction temperature measurement sensor and described temperature control modules are electrically connected respectively, and described temperature control modules and described semiconductor chilling plate are electrically connected; Described Temperature Setting module is for setting described default operating temperature, described temperature comparison module is for real-time junction temperature and the described default operating temperature of described LED luminescence chip compared, and described temperature control modules calculates and regulate the refrigeration work consumption of described semiconductor chilling plate according to the comparative result of the real-time junction temperature of described LED luminescence chip and described default operating temperature.
In the present invention's one better embodiment, described Medical endoscope cold light source system further comprises medical isolating power, and described medical isolating power and described power input interface and described cold light source panel all are electrically connected.
In the present invention's one better embodiment, described Medical endoscope cold light source system also comprises a cabinet, and described power input interface is arranged at the back shroud of described cabinet, and described LED light source module and described cold light source panel all are arranged in described cabinet.
The present invention provides a kind of temperature control system for described Medical endoscope cold light source system in addition, and it comprises the junction temperature measurement sensor of the junction temperature of the described LED luminescence chip of real-time measurement, the Temperature Setting module of setting described default operating temperature, temperature comparison module, temperature control modules and the semiconductor chilling plate that described LED luminescence chip is freezed; The real-time junction temperature that described junction temperature measurement sensor will be measured the described LED luminescence chip obtained is sent to described temperature comparison module, described temperature comparison module compares real-time junction temperature and the described default operating temperature of described LED luminescence chip, and comparative result is sent to described temperature control modules, described temperature control modules calculates and regulates the refrigeration work consumption of described semiconductor chilling plate according to described comparative result, described semiconductor chilling plate is freezed to described LED luminescence chip according to described refrigeration work consumption.
The present invention also provides a kind of medical endoscope, and it comprises described Medical endoscope cold light source system.
Compared to prior art, described Medical endoscope cold light source system and described temperature control system have the following advantages: one, can carry out real-time temperature control to it according to the life characteristic (relation curve in junction temperature and life-span) of described LED luminescence chip, effectively guarantee that it can be in best operating temperature work, the performance optimal performance; Two, utilize described semiconductor chilling plate to be dispelled the heat, can obtain the efficiency higher than modes such as conventional heat pipe, water-cooleds, and because of the difference of ambient temperature, do not affect radiating effect, can make described LED luminescence chip always work in optimum state.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by embodiment, and the cooperation accompanying drawing, be described in detail as follows.
The specific embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is further detailed explanation.
Refer to Fig. 1, first embodiment of the invention provides a kind of Medical endoscope cold light source system 100, and it has power input interface 10, and described Medical endoscope cold light source system 100 comprises LED light source module 20 and cold light source panel 30.
Described power input interface 10 is connected with external power source, for described Medical endoscope cold light source system 100 provides working power.
See also Fig. 2, described LED light source module 20 comprises LED luminescence chip 21, the semiconductor chilling plate 23 reached for described LED luminescence chip 21 is freezed for the real-time junction temperature measurement sensor 22 of measuring the junction temperature of described LED luminescence chip 21.In the present embodiment, described LED optical module 20 also comprises base 25, fin 26 and radiator fan 27; Described base 25 has relative first surface and second surface (figure indicates), and described LED luminescence chip 21 is fixed in described first surface by heat conductive silica gel, and is electrically connected with described cold light source panel 30; The cold junction of described semiconductor chilling plate 23 fits in described second surface, and is electrically connected with described cold light source panel 30; Described fin 26 is arranged at the hot junction of described semiconductor chilling plate 23, described radiator fan 27 is arranged at described fin 26 by double-screw bolt or screw (figure does not indicate), relative with described semiconductor chilling plate 23, be the both sides that described radiator fan 27 and described semiconductor chilling plate 23 lay respectively at described fin 26, and described radiator fan 27 and 30 electric connections of described cold light source panel.
Further, described semiconductor chilling plate 23 is fixed between described base 25 and described fin 26 by screw 28, be that described semiconductor chilling plate 23 is located between described base 25 and described fin 26, wherein, the described base 25 of cold junction laminating contact of described semiconductor chilling plate 23, the described fin 26 of hot junction laminating contact, thus, the heat that described LED luminescence chip 21 produces can conduct to described semiconductor chilling plate 23 by described base 25 and carry out the heat exchange exchange, and radiating and cooling can be carried out by described fin 26 in the hot junction of described semiconductor chilling plate 23.
See also Fig. 3, in the present embodiment, between described base 25 and described fin 26, be provided with heat insulating mattress 281, between described screw 28 and described base 25, be provided with heat insulation cylinder 282.Particularly, described heat insulating mattress 281 is arranged at the gap between described base 25 and described fin 26, described heat insulation cylinder 282 is arranged in the screw (figure does not indicate) of described base 25, and an end of described heat insulation cylinder 282 radially extends to form heat insulation ear (figure does not indicate) outward, described heat insulation ear is arranged between the head of described base 25 and described screw 28, effectively intercepting described base 25 contacts with the head of described screw 28, described screw 28 is arranged in heat insulation cylinder 282 and described heat insulating mattress 281 successively, thus, described heat insulating mattress 281 and described heat insulation cylinder 282 can be effectively isolated by described base 25 and described screw 28, and then the heat that the hot junction that can avoid described semiconductor chilling plate 23 is passed to described fin 26 is passed described base 25 back through described screw 28, the heat that can prevent described fin 26 is given described base 25 by described screw 28 back transfer.
Be understandable that, described LED light source module 20 can not have described base 25 yet, and described semiconductor chilling plate 23 directly is arranged to described LED luminescence chip 21, be about to direct and described LED luminescence chip 21 laminatings of described semiconductor chilling plate 23, the hot junction of described semiconductor chilling plate 23 connects described fin 26, and the heat that its cold junction is obtained discharges.Particularly, in cold junction and the hot junction of described semiconductor chilling plate 23, smear respectively the heat conductive silica gel of powerful viscosity, then described LED luminescence chip 21 and described fin 26 are fixed in laminating respectively.
Described cold light source panel 30 and described LED light source module 20 are electrically connected, described cold light source panel 30 drives described LED light source module 20 work, described cold light source panel 30 obtains the real-time junction temperature of the described LED luminescence chip 21 of described junction temperature measurement sensor 22 measurements, and the default operating temperature of contrast, when the real-time junction temperature of described LED luminescence chip 21 departs from described default operating temperature, described cold light source panel 30 is controlled described semiconductor chilling plate 23 work, described LED luminescence chip 21 is carried out to refrigeration radiating, to reach the purpose of cooling, make the junction temperature of described LED luminescence chip 21 near described default operating temperature.
Refer to Fig. 4, in the present embodiment, described cold light source panel 30 comprises Temperature Setting module 31, temperature comparison module 33 and temperature control modules 35, described Temperature Setting module 31 and described temperature comparison module 33 are electrically connected, described temperature comparison module 33 and described junction temperature measurement sensor 22 and described temperature control modules 35 are electrically connected respectively, and described temperature control modules 35 and described semiconductor chilling plate 23 are electrically connected; Described Temperature Setting module 31 is for setting described default operating temperature, described temperature comparison module 33 compares for the real-time junction temperature to described LED luminescence chip 21 and described default operating temperature, and described temperature control modules 35 calculates and regulate the refrigeration work consumption of described semiconductor chilling plate 23 according to the comparative result of the real-time junction temperature of described LED luminescence chip 21 and described default operating temperature.
Particularly, the real-time junction temperature that described junction temperature measurement sensor 22 will be measured the described LED luminescence chip 21 obtained is sent to described temperature comparison module 33, the default operating temperature that the real-time junction temperature of 33 pairs of described LED luminescence chips 21 of described temperature comparison module and described Temperature Setting module 31 are set compares, and comparative result is sent to described temperature control modules 35, described temperature control modules 35 calculates and regulates the refrigeration work consumption of described semiconductor chilling plate 23 according to described comparative result, described semiconductor chilling plate 23 is freezed to described LED luminescence chip 21 according to described refrigeration work consumption.Thus, can regulate in real time the junction temperature of described LED luminescence chip 21, described LED luminescence chip 21 is worked near described default operating temperature.
Be understandable that, described cold light source panel 35 can also comprise memory module, for the refrigeration work consumption of the real-time junction temperature of the real-time junction temperature of storing the described LED luminescence chip 21 that described junction temperature measurement sensor 22 measures, described LED luminescence chip 21 and comparative result that described default operating temperature compares, described semiconductor chilling plate 23 that described temperature control modules 35 calculates according to described comparative result etc.
In the present embodiment, described junction temperature measurement sensor 22 is critesistor, and it is arranged at the periphery of described LED luminescence chip, can effectively measure the junction temperature of described LED luminescence chip 21.
Please again consult Fig. 1, further, described Medical endoscope cold light source system 100 also comprises medical isolating power 40, concentration module 50, display screen 60, adjusting knob 70 and system radiating fan 80.Described medical isolating power 40 and described power input interface 10 and described cold light source panel 30 all are electrically connected; 40 pairs of electric currents through described power input interface 10 inputs of described medical isolating power are isolated transformation, for described Medical endoscope cold light source system 100 provides required running voltage.Described concentration module 50 carries out optically focused for the light that described LED luminescence chip 21 is sent, and it is arranged at a side of described LED luminescence chip 21 emergent raies, and in the present embodiment, described concentration module 50 comprises varifocal battery of lens (figure does not indicate).Described display screen 60, described adjusting knob 70 and described system radiating fan 80 all are electrically connected at described cold light source panel 30; Described display screen 60 is for man-machine interaction; Switch and the brightness size of described adjusting knob 70 for controlling described LED luminescence chip 21; Described system radiating fan 80 is dispelled the heat for described Medical endoscope cold light source system 100.
In the present embodiment, action is regulated in the rotation that described cold light source panel 30 detects described adjusting knob 70 in real time, if the action of described adjusting knob 70 detected, the brightness of according to the action situation of described adjusting knob 70, regulating described LED luminescence chip 21.
In the present embodiment, described display screen 60 is the touch control type LCD display screen.
Further, described concentration module 50 also comprises the light collecting barrel (not shown) of grafting optical fiber, and described light collecting barrel is arranged at the side of described concentration module 50 away from described LED luminescence chip 21.
Be understandable that, described Medical endoscope cold light source system 100 also comprises that a cabinet 90(is as shown in Figure 1), described power input interface 10 is arranged at the back shroud (figure does not indicate) of described cabinet 90; Described LED light source module 20, described cold light source panel 30 and described medical isolating power 40 all are arranged in described cabinet 90; Described display screen 60 and described adjusting knob 70 all are arranged at the front panel (figure does not indicate) of described cabinet 90.
In the present embodiment, the operation principle of described Medical endoscope cold light source system 100 is as follows: the 220v alternating current, by power input interface 10 inputs, is isolated transformation by medical isolating power 40 and is produced the 12v power supply that is applicable to described Medical endoscope cold light source system 100 work; The 12v power supply enters cold light source panel 30, is respectively LED light emitting module 20, display screen 60 and system radiating fan 80 power supply is provided.Wherein, in described LED light emitting module 20, described cold light source panel 30 is specially again described LED luminescence chip 21, described semiconductor chilling plate 23 and described radiator fan 27 working power is provided.In described cold light source panel 30, the real-time junction temperature that described junction temperature measurement sensor 22 will be measured the described LED luminescence chip 21 obtained is sent to described temperature comparison module 33, the default operating temperature that the real-time junction temperature of 33 pairs of described LED luminescence chips 21 of described temperature comparison module and described Temperature Setting module 31 are set compares, and comparative result is sent to described temperature control modules 35, described temperature control modules 35 calculates and regulates the refrigeration work consumption of described semiconductor chilling plate 23 according to described comparative result, described semiconductor chilling plate 23 is freezed to described LED luminescence chip 21 according to described refrigeration work consumption.Thus, can regulate in real time the junction temperature of described LED luminescence chip 21, described LED luminescence chip 21 is worked near described default operating temperature.
Refer to Fig. 5, second embodiment of the invention provides a kind of temperature control system 200, it is for described Medical endoscope cold light source system 100, and described temperature control system 200 mainly is comprised of described junction temperature measurement sensor 22, described Temperature Setting module 31, described temperature comparison module 33, described temperature control modules 35 and described semiconductor chilling plate 23.Described junction temperature measurement sensor 22 is measured the junction temperature of described LED luminescence chip 21 in real time.Described Temperature Setting module 31 and described temperature comparison module 33 are electrically connected, described temperature comparison module 33 and described junction temperature measurement sensor 22 and described temperature control modules 35 are electrically connected respectively, and described temperature control modules 35 and described semiconductor chilling plate 23 are electrically connected; Described Temperature Setting module 31 is for setting described default operating temperature, described temperature comparison module 33 compares for the real-time junction temperature to described LED luminescence chip 21 and described default operating temperature, and described temperature control modules 35 calculates and regulate the refrigeration work consumption of described semiconductor chilling plate 23 according to the comparative result of the real-time junction temperature of described LED luminescence chip 21 and described default operating temperature.Described semiconductor chilling plate 23 is for being freezed to described LED luminescence chip 21.
Particularly, the real-time junction temperature that described junction temperature measurement sensor 22 will be measured the described LED luminescence chip 21 obtained is sent to described temperature comparison module 33, the default operating temperature that the real-time junction temperature of 33 pairs of described LED luminescence chips 21 of described temperature comparison module and described Temperature Setting module 31 are set compares, and comparative result is sent to described temperature control modules 35, described temperature control modules 35 calculates and regulates the refrigeration work consumption of described semiconductor chilling plate 23 according to described comparative result, described semiconductor chilling plate 23 is freezed to described LED luminescence chip 21 according to described refrigeration work consumption.Thus, can regulate in real time the junction temperature of described LED luminescence chip 21, described LED luminescence chip 21 is worked near described default operating temperature.
Be understandable that, the junction temperature that can provide according to the manufacturer of described LED luminescence chip 21 and the relation curve in life-span (as shown in Figure 6) of described default operating temperature are set.
Third embodiment of the invention provides a kind of medical endoscope, and it comprises described Medical endoscope cold light source system 100.
Compared to prior art, described Medical endoscope cold light source system 100 and described temperature control system 200 have the following advantages: one, can carry out real-time temperature control to it according to the life characteristic (relation curve in junction temperature and life-span) of described LED luminescence chip 21, effectively guarantee that it can be in best operating temperature work, the performance optimal performance; Two, utilize described semiconductor chilling plate 23 to be dispelled the heat, can obtain the efficiency higher than modes such as conventional heat pipe, water-cooleds, and because of the difference of ambient temperature, do not affect radiating effect, can make described LED luminescence chip 21 always work in optimum state; Three, utilize described display screen 60, the real-time junction temperature that can measure described junction temperature measurement sensor 22 be shown, contributes to the user to real-time understanding, also and in attendant's maintenance; Four, described semiconductor chilling plate 23 is with low cost, can't therefore increase too much cost.
The above, only embodiments of the invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with embodiment, yet not in order to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.