CN216138341U - Cutting head cooling device of laser cutting machine - Google Patents
Cutting head cooling device of laser cutting machine Download PDFInfo
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- CN216138341U CN216138341U CN202122081242.6U CN202122081242U CN216138341U CN 216138341 U CN216138341 U CN 216138341U CN 202122081242 U CN202122081242 U CN 202122081242U CN 216138341 U CN216138341 U CN 216138341U
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Abstract
The utility model discloses a cooling device for a cutting head of a laser cutting machine, which comprises a laser cutting head, a cooling jacket, a semiconductor refrigeration sheet and a radiator, wherein the cooling jacket is arranged outside the laser cutting head, the semiconductor refrigeration sheet and the radiator are arranged outside the cooling jacket, the semiconductor refrigeration sheet is clamped between the cooling jacket and the radiator, and the semiconductor refrigeration sheet is used for transferring the heat of the cooling jacket to the radiator. The utility model can utilize the heat transfer property of the semiconductor refrigerating sheet to transfer the heat of the cooling jacket to the radiator, and then the radiator radiates the heat, thereby achieving the purpose of reducing the temperature of the laser cutting head, solving the heat radiation problem of the laser cutting head and obviously prolonging the service life of the protective lens and the nozzle of the laser cutting head.
Description
Technical Field
The utility model relates to the technical field of laser cutting machines, in particular to a cooling device for a cutting head of a laser cutting machine.
Background
In recent years, with the increasing maturity of high-power fiber laser technology, the price is lower and lower, which leads to the wider market acceptance of high-power cutting machines of ten-thousand watt level and above. The increase of cutting power can lead to the follow-up head part of the laser cutting head to generate heat seriously in the continuous cutting process, thereby influencing the follow-up in the cutting process and leading to the integral temperature rise of the laser cutting head. The temperature rise of the laser cutting head can cause the cutting protection lens to work in a high-temperature environment for a long time, so that the service life of the protection lens is shortened. Cutting a bright panel can also result in excessive nozzle temperatures on the cutting head, which can accelerate nozzle wear. The protection lens and the nozzle of laser cutting head all belong to the cutting consumptive material, and the life shortens and can cause the increase of cutting cost, and causes the main reason that the two life shortens to be in laser cutting head and work under the high temperature state for a long time. However, in the prior art, the laser cutting head mainly depends on the casing of the cutting head to dissipate heat or depends on the heat dissipation block installed outside the cutting head to dissipate heat, and the heat dissipation efficiency is low, so that the laser cutting head is not suitable for heat dissipation of the cutting head of the laser cutting machine with higher and higher power.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to provide a cooling device for a cutting head of a laser cutting machine according to the defects of the prior art, the cooling device is provided with a cooling jacket, a semiconductor refrigeration sheet and a radiator, the cooling jacket is arranged outside the laser cutting head, the heat transfer property of the semiconductor refrigeration sheet is utilized to transfer the heat of the cooling jacket to the radiator, and then the heat is radiated by the radiator, so that the purpose of reducing the temperature of the laser cutting head is achieved, the heat radiation problem of the laser cutting head is solved, and the service lives of a protective lens and a nozzle of the laser cutting head are obviously prolonged.
In order to solve the technical problems, the technical scheme of the utility model is as follows: the utility model provides a laser cutting machine cutting head cooling device, includes laser cutting head, cooling jacket, semiconductor refrigeration piece and radiator, the cooling jacket is installed outside the laser cutting head, semiconductor refrigeration piece and radiator are installed outside the cooling jacket, the semiconductor refrigeration piece presss from both sides and locates between cooling jacket and the radiator, the semiconductor refrigeration piece is used for giving the radiator with the heat transfer of cooling jacket.
Preferably, the cooling sleeve is provided with a temperature control switch and a temperature control switch fixing block, and the temperature control switch is fixed on the cooling sleeve by the temperature control switch fixing block; the temperature control switch is electrically connected with the semiconductor refrigerating sheet and controls the semiconductor refrigerating sheet to work or stop working. Or the cooling sleeve is provided with a temperature sensor and a sensor fixing block, and the sensor fixing block fixes the temperature sensor on the cooling sleeve; the control device is electrically connected with the temperature sensor and the semiconductor refrigerating piece respectively, and controls the semiconductor refrigerating piece to work or stop working after receiving temperature information sensed by the temperature sensor.
Preferably, the cooling jacket is provided with a cylindrical inner cavity and a square outer wall, the cylindrical inner cavity is sleeved outside the laser cutting head, and the square outer wall is provided with a plurality of outer wall surfaces; the semiconductor refrigeration pieces and the radiators are respectively provided with two groups, wherein one group of semiconductor refrigeration pieces and the radiators are arranged outside one outer wall surface, and the other group of semiconductor refrigeration pieces and the radiators are arranged outside the other outer wall surface. The two groups of semiconductor refrigerating fins and the radiator are opposite in position and are symmetrical to each other.
Preferably, a radiator screw hole and a fixing screw are arranged on the radiator, an outer wall surface screw hole corresponding to the radiator screw hole is formed in the outer wall surface of the square outer wall, and the fixing screw penetrates through the radiator screw hole and is screwed in the outer wall surface screw hole so as to fix the radiator and the semiconductor refrigeration piece outside the outer wall surface of the square outer wall. Or, the outside of radiator still is equipped with the radiator fixed plate, be provided with fixed plate screw and fixed screw on the radiator fixed plate, the outer wall of square outer wall is equipped with the outer wall screw corresponding with the fixed plate screw, fixed screw passes behind the fixed plate screw, and the spiro union is in outer wall screw to compress tightly the radiator through the radiator fixed plate, and fix radiator and semiconductor refrigeration piece outside the outer wall of square outer wall.
Preferably, the heat sink is of a plate-mounted structure. And the radiator is provided with a water cooling pipeline which is used for communicating with an external cooling water circulation system to dissipate heat in a water cooling mode. Or a cooling fan is arranged on the radiator to radiate heat in an air cooling mode.
The utility model has the beneficial effects that: because the cooling jacket is installed outside the laser cutting head, semiconductor refrigeration piece and radiator are installed outside the cooling jacket, and the semiconductor refrigeration piece presss from both sides and locates between cooling jacket and the radiator, consequently, can utilize the heat transfer attribute of semiconductor refrigeration piece, give off the heat transfer of cooling jacket for the radiator, distribute away the heat by the radiator again to reach the purpose that reduces the laser cutting head temperature, solve the heat dissipation problem of laser cutting head, show the life who improves the protection lens and the nozzle of laser cutting head.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic view of the dispersion structure of the present invention.
In the figure: 1. a laser cutting head; 2. a cooling jacket; 21. a cylindrical cavity; 22. a square outer wall; 221. screw holes on the outer wall surface; 3. a semiconductor refrigeration sheet; 4. a heat sink; 41. a radiator screw hole; 42. a water-cooled pipeline; 5. a temperature control switch; 6. temperature detect switch fixed block.
Detailed Description
The structural and operational principles of the present invention are explained in further detail below with reference to the accompanying drawings.
As shown in fig. 1 and 2, the utility model relates to a cooling device for a cutting head of a laser cutting machine, which comprises a laser cutting head 1, a cooling jacket 2, a semiconductor refrigeration sheet 3 and a radiator 4, wherein the cooling jacket 2 is installed outside the laser cutting head 1, the semiconductor refrigeration sheet 3 and the radiator 4 are installed outside the cooling jacket 2, the semiconductor refrigeration sheet 3 is clamped between the cooling jacket 2 and the radiator 4, and the semiconductor refrigeration sheet 3 is used for transferring heat of the cooling jacket 2 to the radiator 4. The semiconductor refrigerating sheet is a heat transfer tool, when a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material has current passing through, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold and hot end. The utility model can utilize the heat transfer property of the semiconductor refrigerating sheet 3 to transfer the heat of the cooling jacket 2 to the radiator 4, and then the radiator 4 radiates the heat, thereby achieving the purpose of reducing the temperature of the laser cutting head, solving the heat radiation problem of the laser cutting head 1 and obviously prolonging the service life of the protective lens and the nozzle.
As shown in fig. 1 and 2, a temperature controlled switch 5 and a temperature controlled switch fixing block 6 are mounted on the cooling jacket 2, and the temperature controlled switch fixing block 6 fixes the temperature controlled switch 5 on the cooling jacket 1; the temperature control switch 5 is electrically connected with the semiconductor refrigerating sheet 3 and controls the semiconductor refrigerating sheet 3 to work or stop working. The temperature control switch 5 is used for detecting the temperature of the cooling jacket 2, and when the temperature of the cooling jacket 2 reaches or exceeds a set value, the temperature control switch 5 is closed to enable the semiconductor chilling plate 3 to work; when the temperature of the cooling jacket 2 is lower than another set value, the temperature control switch 5 is opened to stop the semiconductor chilling plate 3.
Another mode for controlling the semiconductor refrigerating sheet 3 to work is that a temperature sensor and a sensor fixing block are arranged on the cooling jacket 2, and the temperature sensor is fixed on the cooling jacket 2 by the sensor fixing block; the control device is electrically connected with the temperature sensor and the semiconductor refrigerating piece respectively, and controls the semiconductor refrigerating piece to work or stop working after receiving temperature information sensed by the temperature sensor. The temperature sensor is used for detecting the temperature of the cooling jacket 2, when the temperature of the cooling jacket 2 reaches or exceeds a set value, the temperature sensor transmits sensed temperature information to the control device, and the control device controls the semiconductor chilling plates 3 to work or stop working according to the temperature information.
As shown in fig. 1 and fig. 2, the cooling jacket 1 has a cylindrical inner cavity 21 and a square outer wall 22, the cylindrical inner cavity 21 is sleeved outside the laser cutting head 1, and the square outer wall 22 has a plurality of outer wall surfaces; the semiconductor refrigerating fins 3 and the radiator 4 are respectively provided with two groups, wherein one group of semiconductor refrigerating fins 3 and the radiator 4 are arranged outside one outer wall surface, and the other group of semiconductor refrigerating fins 3 and the radiator 4 are arranged outside the other outer wall surface. The two groups of semiconductor refrigerating fins 3 and the radiator 4 are opposite in position and are symmetrical to each other. Through setting up two sets of semiconductor refrigeration pieces 3 and radiator 4, can make laser cutting head 1 cooling down more fast.
As shown in fig. 1 and 2, the heat sink 4 is provided with a heat sink screw hole 41 and a fixing screw (not shown), the outer wall surface of the square outer wall 22 is provided with an outer wall surface screw hole 221 corresponding to the heat sink screw hole 41, and the fixing screw passes through the heat sink screw hole 41 and is screwed into the outer wall surface screw hole 221, so as to fix the heat sink 4 and the semiconductor cooling fins 3 outside the outer wall surface of the square outer wall 22.
Another way of installing the heat sink according to the present invention is to further provide a heat sink fixing plate (not shown in the figure) on the outer side of the heat sink, the heat sink fixing plate is provided with a fixing plate screw hole and a fixing screw, the outer wall surface of the square outer wall 22 is provided with an outer wall surface screw hole 221 corresponding to the fixing plate screw hole, the fixing screw passes through the fixing plate screw hole and is screwed into the outer wall surface screw hole 221, so as to press the heat sink 4 through the heat sink fixing plate, and fix the heat sink 4 and the semiconductor cooling fins 3 outside the outer wall surface of the square outer wall 22.
As shown in fig. 1 and 2, the heat sink 4 has a plate-like structure. The radiator 4 is provided with a water cooling pipeline 42 for communicating with an external cooling water circulation system to radiate heat in a water cooling mode. Alternatively, a cooling fan (not shown) may be provided in the heat sink 4 to dissipate heat in an air-cooling manner.
The following field test effect of the cooling device of the cutting head of the laser cutting machine is as follows:
1. when the laser cutting head is in a non-working state, the cooling device of the laser cutting head uses two TEC1-24106 refrigeration pieces, the working voltage of 24V and the peak power consumption are 288W, the refrigeration body can be cooled to-6 ℃ from 34 ℃ after the laser cutting head runs for 3 minutes, and the cooling effect exceeds an expected value.
2. The cutting head of the laser cutting machine continuously cuts for 1 hour and 2 hours, the double-layer 1.6 nozzle is used for cutting at 12kw full power, the cooling device of the cutting head of the laser cutting machine uses two TEC1-24106 refrigeration pieces, the working voltage is 24V, the peak power consumption is 288W, the temperature of the protective mirror of the laser cutting head is always kept at 37 ℃, and the temperature of the protective mirror is often and quickly increased to be higher than 50 ℃ in the previous debugging process.
3. Before this laser cutting machine cutting head cooling device of installation, the customer nozzle burns out one on average two days probably, and the cutting head nozzle that burns out has obvious burn trace, and the inlayer can't use because the deformation that burns out. After the cooling device of the cutting head of the laser cutting machine is installed, the nozzle of the cutting head with the same specification is used for five days, so that the mark of burning loss is not generated, and only the mark of scraping the plate is partially generated.
4. Before the cooling device of the cutting head of the laser cutting machine is installed, the protective lens of the cutting head frequently rises to more than 50 ℃, and only one protective lens of the cutting head is used for 3-4 days on average. And after installing this laser cutting machine cutting head cooling device, the cutting head protective glass can keep 37 degrees centigrade, and a cutting head protective glass still can normal use after continuously using for 6 days.
5. Before this laser cutting machine cutting head cooling device of installation, the cutting effect is not stable enough, and when cutting 25mm panel, often cut and sound unusual midway hearing, need suspend cutting again after, the cutting start phase, midway, last partial section effect have obvious difference, and some cutting can not the blanking, has the adhesion. After the cooling device of the cutting head of the laser cutting machine is installed, the cooling device is obviously improved, the cutting effect is stable, a 25mm manganese plate can be continuously cut, the cutting is stable from beginning to end, and a cutting piece can smoothly drop.
The above description is only a preferred embodiment of the present invention, and all the minor modifications, equivalent changes and modifications made to the above embodiment according to the technical solution of the present invention are within the scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides a laser cutting machine cutting head cooling device which characterized in that: including laser cutting head, cooling jacket, semiconductor refrigeration piece and radiator, the cooling jacket is installed outside the laser cutting head, semiconductor refrigeration piece and radiator are installed outside the cooling jacket, the semiconductor refrigeration piece presss from both sides and locates between cooling jacket and the radiator, the semiconductor refrigeration piece is used for transmitting the heat of cooling jacket for the radiator.
2. The cutting head cooling device of a laser cutting machine according to claim 1, characterized in that: the cooling sleeve is provided with a temperature control switch and a temperature control switch fixing block, and the temperature control switch is fixed on the cooling sleeve by the temperature control switch fixing block; the temperature control switch is electrically connected with the semiconductor refrigerating sheet and controls the semiconductor refrigerating sheet to work or stop working.
3. The cutting head cooling device of a laser cutting machine according to claim 1, characterized in that: the cooling sleeve is provided with a temperature sensor and a sensor fixing block, and the sensor fixing block fixes the temperature sensor on the cooling sleeve; the control device is electrically connected with the temperature sensor and the semiconductor refrigerating piece respectively, and controls the semiconductor refrigerating piece to work or stop working after receiving temperature information sensed by the temperature sensor.
4. The cutting head cooling device of a laser cutting machine according to claim 1, characterized in that: the cooling jacket is provided with a cylindrical inner cavity and a square outer wall, the cylindrical inner cavity is sleeved outside the laser cutting head, and the square outer wall is provided with a plurality of outer wall surfaces; the semiconductor refrigeration pieces and the radiators are respectively provided with two groups, wherein one group of semiconductor refrigeration pieces and the radiators are arranged outside one outer wall surface, and the other group of semiconductor refrigeration pieces and the radiators are arranged outside the other outer wall surface.
5. The cutting head cooling device of the laser cutting machine according to claim 4, wherein: the two groups of semiconductor refrigerating fins and the radiator are opposite in position and are symmetrical to each other.
6. The cutting head cooling device of the laser cutting machine according to claim 4, wherein: the radiator is provided with a radiator screw hole and a fixing screw, the outer wall surface of the square outer wall is provided with an outer wall surface screw hole corresponding to the radiator screw hole, and the fixing screw penetrates through the radiator screw hole and is in threaded connection with the outer wall surface screw hole so as to fix the radiator and the semiconductor refrigeration piece outside the outer wall surface of the square outer wall.
7. The cutting head cooling device of the laser cutting machine according to claim 4, wherein: the radiator is characterized in that a radiator fixing plate is further arranged on the outer side of the radiator, a fixing plate screw hole and a fixing screw are arranged on the radiator fixing plate, an outer wall surface screw hole corresponding to the fixing plate screw hole is formed in the outer wall surface of the square outer wall, the fixing screw penetrates through the fixing plate screw hole and then is screwed into the outer wall surface screw hole to tightly press the radiator through the radiator fixing plate, and the radiator and the semiconductor refrigerating sheet are fixed outside the outer wall surface of the square outer wall.
8. The cutting head cooling device of a laser cutting machine according to claim 1, characterized in that: the radiator is of a plate-mounted structure.
9. The cutting head cooling device of a laser cutting machine according to claim 1, characterized in that: and the radiator is provided with a water cooling pipeline for communicating with an external cooling water circulation system.
10. The cutting head cooling device of a laser cutting machine according to claim 1, characterized in that: and a cooling fan is arranged on the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122081242.6U CN216138341U (en) | 2021-08-31 | 2021-08-31 | Cutting head cooling device of laser cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122081242.6U CN216138341U (en) | 2021-08-31 | 2021-08-31 | Cutting head cooling device of laser cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216138341U true CN216138341U (en) | 2022-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122081242.6U Active CN216138341U (en) | 2021-08-31 | 2021-08-31 | Cutting head cooling device of laser cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216138341U (en) |
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2021
- 2021-08-31 CN CN202122081242.6U patent/CN216138341U/en active Active
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