CN103456512B - Winding type solid electrolytic capacitor packaging structure using lead frame and manufacturing method thereof - Google Patents
Winding type solid electrolytic capacitor packaging structure using lead frame and manufacturing method thereof Download PDFInfo
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- CN103456512B CN103456512B CN201310324304.9A CN201310324304A CN103456512B CN 103456512 B CN103456512 B CN 103456512B CN 201310324304 A CN201310324304 A CN 201310324304A CN 103456512 B CN103456512 B CN 103456512B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 105
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 239000007787 solid Substances 0.000 title claims abstract description 26
- 238000004804 winding Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000227 grinding Methods 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims description 34
- 238000003466 welding Methods 0.000 claims description 31
- 238000005538 encapsulation Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 229920002521 macromolecule Polymers 0.000 claims description 10
- 238000003763 carbonization Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005470 impregnation Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000006071 cream Substances 0.000 claims description 2
- 238000001727 in vivo Methods 0.000 claims 2
- 235000013312 flour Nutrition 0.000 claims 1
- 238000003801 milling Methods 0.000 claims 1
- 239000004576 sand Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
A package structure of a winding type solid electrolytic capacitor using a lead frame, comprising: a wound capacitor, a package and a conductive unit. The winding type capacitor has a winding body, a positive conductive pin and a negative conductive pin. The end of the positive conductive pin is provided with a cutting surface, and the end of the negative conductive pin is provided with a grinding surface. The package body covers the winding type capacitor. The conductive unit comprises a positive conductive terminal electrically connected with the positive conductive pin and a negative conductive terminal electrically connected with the negative conductive pin. The positive conductive terminal has a first embedded part wrapped in the package body and a first exposed part exposed outside the package body. The negative conductive terminal has a second embedded part wrapped in the packaging body and a second exposed part exposed outside the packaging body. The first exposed portion and the second exposed portion extend along the outer surface of the package body.
Description
Technical field
Present invention is directed to a kind of capacitor packaging structure and preparation method thereof, espespecially a kind of winding of use lead frame
Type solid electrolytic capacitor encapsulating structure and preparation method thereof.
Background technology
Winding-type solid electrolytic capacitor includes：Capacitor assembly, collecting component and closure member.Capacitor assembly every
Separator to be wound with the anode foils of jointed anode terminal and be connected the Cathode Foil of cathode terminal, and in anode foils and Cathode Foil it
Between be formed with dielectric substrate.House component to there is peristome and capacitor assembly can be housed.Closure member has one to be available for anode
The salable peristome for housing component of through hole and one that terminal and cathode terminal run through.Also, aforementioned closure member and aforementioned electricity
Have in predetermined space, and anode terminal and cathode terminal that at least any one is provided with the gear for guaranteeing gap between container assemblies
Only component.However, known Winding-type solid electrolytic capacitor does not carry out again any encapsulation, and cause convoluted solid state electrolysis
Capacitor is restricted in design and the electric connection mode of conductive connecting pin.
The content of the invention
The embodiment of the present invention be provide a kind of use lead frame Winding-type solid electrolytic capacitor encapsulating structure and its
Manufacture method.
A kind of Winding-type solid electrolytic capacitor encapsulation knot of use lead frame that a wherein embodiment of the invention is provided
Structure, it includes：One capacitor cell, an encapsulation unit and a conductive unit.The capacitor cell includes at least one convoluted electric capacity
There is device, convoluted capacitor described in wherein at least one wound body, one to extend from a wherein side of the wound body
And the anode conductive pin that goes out and a cathode conductive pin extended from the other side end of the wound body, it is described
The end of anode conductive pin has a facet, and the end of the cathode conductive pin has an abradant surface.The encapsulation
Unit include one cladding at least described in one convoluted capacitor packaging body, wherein the packaging body have a first side, one
Second side and one corresponding to the first side is connected to the bottom surface between the first side and the second side.
The conductive unit including one be electrically connected at the positive conductive terminal of the anode conductive pin and one be electrically connected at it is described
The cathode conductive terminal of cathode conductive pin, wherein the positive conductive terminal is separated from one another with the cathode conductive terminal.Its
In, the positive conductive terminal has an anode conductive pin in electrical contact and is covered by the encapsulation internal first
Inside bury portion and one be connected in described first portion of burying and the exposed first exposed portion external in the encapsulation, and it is described first exposed
Portion extends along the first side of the packaging body with the bottom surface.Wherein, the cathode conductive terminal is electrical with one
Contact the cathode conductive pin and be covered by the encapsulation internal second portion of burying and one be connected in described second and bury
Portion and the exposed second exposed portion external in the encapsulation, and the second exposed portion is along second side of the packaging body
Face extends with the bottom surface.
A kind of Winding-type solid electrolytic capacitor encapsulation knot of use lead frame that the other embodiment of the present invention is provided
The manufacture method of structure, it comprises the following steps：First, there is provided multiple convoluted capacitors, convoluted electricity described in each of which
Container has a wound body, one from the anode conductive pin that wherein a side extends of the wound body, one from institute
State extend at the other side end of wound body cathode conductive pin, one be welded on the end of the anode conductive pin
Positive pole welding foot and one be welded on negative pole welding foot on the end of the cathode conductive pin；Then, by described in each
The wound body of convoluted capacitor is pressed into cuboid from cylinder；Then, each described convoluted electric capacity is cut off
The negative pole welding foot of device；Next, the positive pole welding foot of each convoluted capacitor is welded on into a company
In narrow bars；And then, while allowing multiple convoluted capacitors sequentially to carry out carbonization treatment, chemical conversion treatment and impregnation macromolecule
Process；Then, the macromolecule having been formed on a terminal part of the cathode conductive pin is removed；Next, cutting off each
The positive pole welding foot of the convoluted capacitor；And then, multiple convoluted capacitors are separately positioned on multiple
On conductive unit, conductive unit described in each of which includes an institute for being electrically connected at corresponding described convoluted capacitor
The positive conductive terminal and one of stating anode conductive pin are electrically connected at the negative pole of corresponding described convoluted capacitor
The cathode conductive terminal of conductive pin；Then, multiple packaging bodies are formed to be respectively coated by multiple convoluted capacitors, wherein
The positive conductive terminal of each conductive unit has a corresponding described convoluted capacitor in electrical contact
The anode conductive pin and be covered by the corresponding encapsulation it is internal first in bury portion and one be connected to described first
Inside bury portion and the exposed first exposed portion external in the corresponding encapsulation, and the negative pole of each conductive unit
Conducting terminal has the cathode conductive pin of a corresponding described convoluted capacitor in electrical contact and is covered by phase
Portion is buried in the corresponding encapsulation internal second and one is connected in described second and is buried portion and exposed in the corresponding envelope
Fill the exposed portion of external second；Finally, the described first exposed portion for bending each conductive unit is exposed with described second
Portion, so that the first exposed portion all extends with the described second exposed portion along the outer surface of the corresponding packaging body.
Beneficial effects of the present invention can be the Winding-type solid electrolytic capacitor encapsulation that the embodiment of the present invention is provided
Structure and preparation method thereof, it can pass through " end of the cathode conductive pin has an abradant surface " and " removes and have been formed on
Macromolecule on one terminal part of the cathode conductive pin, so that the end of the cathode conductive pin forms one grinding
The design in face ", to lift welding yield and equivalent series resistance (equivalent series resistance, ESR).
Be further understood that the feature and technology contents of the present invention to enable, refer to below in connection with it is of the invention specifically
Bright and accompanying drawing, but institute's accompanying drawings are only provided with reference to using with explanation, not for the present invention person of being any limitation as.
Description of the drawings
Fig. 1 is the flow process of the manufacture method of the Winding-type solid electrolytic capacitor encapsulating structure that the present invention uses lead frame
Figure；
Fig. 2 is the schematic side view of convoluted capacitor of the invention；
Fig. 3 is the schematic perspective view that the wound body of convoluted capacitor of the invention is pressed into cuboid from cylinder；
Fig. 4 is that convoluted capacitor of the invention passes through schematic side view of the positive pole welding foot to be welded on connection strap；
Fig. 5 is the schematic side view after the positive pole welding foot of convoluted capacitor of the invention is removed with negative pole welding foot；
Fig. 6 is the schematic side view that the convoluted capacitor of the present invention is placed on electrode unit；
Fig. 7 is the schematic side view after the packed body cladding of convoluted capacitor of the present invention；
Fig. 8 is the schematic side view of the Winding-type solid electrolytic capacitor encapsulating structure that the present invention uses lead frame.
【Primary clustering symbol description】
Capacitor packaging structure Z
Capacitor cell 2
Convoluted capacitor 20
Wound body 200
Positive pole paillon foil 200A
Negative pole paillon foil 200B
Release paper 200C
Flat upper surfaces 2001
Flat bottom surface 2002
Anode conductive pin 201
First positive conductive portion 2011
Second positive conductive portion 2012
First ties surface 20121
Second ties surface 20122
Facet 20123
Cathode conductive pin 202
First negative conductive portion 2021
Second negative conductive portion 2022
First ties surface 20221
Second ties surface 20222
Abradant surface 20223
Positive pole welding foot 203
Negative pole welding foot 204
First pad 205
Second pad 206
Encapsulation unit 3
Packaging body 30
First side 301
Second side 302
Bottom surface 303
Electrode unit 4
Positive electrode structure 41
Portion 411 is buried in first
First exposed portion 412
Negative electrode structure 42
Portion 421 is buried in second
Second exposed portion 422
Connection strap S
Fixture C
Specific embodiment
Refer to shown in Fig. 1 to Fig. 8, the present invention provides a kind of Winding-type solid electrolytic capacitor encapsulation of use lead frame
The manufacture method of structure Z, it at least includes following several steps：
First, coordinate shown in Fig. 1 and Fig. 2, there is provided multiple convoluted capacitors 20, the convoluted capacitor 20 of each of which
With a wound body 200, from the anode conductive pin that wherein a side extends 201, of wound body 200 from volume
The cathode conductive pin 202, one extended around the other side end of body 200 is welded on the end of anode conductive pin 201
On positive pole welding foot 203 and be welded on negative pole welding foot 204 (step S100) on the end of cathode conductive pin 202.
For further, anode conductive pin 201 can respectively from two opposition side ends of wound body 200 with cathode conductive pin 202
Extend.In addition, positive pole welding foot 203 can pass through one first pad 205 to be welded on the end of anode conductive pin 201
On, and negative pole welding foot 204 can be by one second pad 206 being welded on the end of cathode conductive pin 202.
For example, anode conductive pin 201 all can be made by pure Al materials or Al alloys with cathode conductive pin 202
Into positive pole welding foot 203 can be by first multiple structure being made up of multiple first material layer (not shown), and negative pole is welded
Pin 204 can be by second multiple structure being made up of multiple second material layer (not shown).For further, Duo Ge
The innermost layer of the innermost layer of one material layer and multiple second material layers all can be Fe layers or Cu layers, and multiple first material layers
Outermost layer and the Sn layers that the outermost layer of multiple second material layers all can be around Fe layers or Cu layers.However, used in the present invention
Convoluted capacitor 20 is not limited with above-mentioned institute's illustrated example.
Then, coordinate shown in Fig. 1, Fig. 2 and Fig. 3, by the wound body 200 of each convoluted capacitor 20 from cylinder
Cuboid (step S102) is pressed into, so that the wound body 200 of each convoluted capacitor 20 has because pressing institute's shape
Into flat upper surfaces 2001 and one in contrast to flat upper surfaces 2001 flat bottom surface 2002.In addition, above-mentioned will be each
The wound body 200 of individual convoluted capacitor 20 from cylinder be pressed into cuboid the step of in, further include：To each
The wound body 200 of individual convoluted capacitor 20 carries out ranging approximately from the heating between 50 DEG C to 300 DEG C.
For example, coordinate shown in Fig. 2 and Fig. 3, wound body 200 can be for one by a positive pole paillon foil 200A, an anode foil
Piece 200B and one be arranged at the release paper 200C between positive pole paillon foil 200A and negative pole paillon foil 200B together with wind it is rectangular
Body capacitance core, and anode conductive pin 201 can distinguish positive pole paillon foil 200A in electrical contact and negative pole with cathode conductive pin 202
Paillon foil 200B.Furthermore, anode conductive pin 201 has in an insertion wound body 200 and positive pole paillon foil 200A in electrical contact
First positive conductive portion 2011 and a connection (being integrally formed connection) are prolonged in the first positive conductive portion 2011 and from wound body 200
The the second positive conductive portion 2012 stretched, and cathode conductive pin 202 has one to insert in wound body 200 and be electrically connected with
The first negative conductive portion 2021 of tactile negative pole paillon foil 200B and a connection (being integrally formed connection) are in the first negative conductive portion 2021
And the second negative conductive portion 2022 extended from wound body 200, wherein the first positive pole in insertion wound body 200 is led
The length in the first negative conductive portion 2021 in the length (as shown with a dotted line in fig. 2) and insertion wound body 200 in electric portion 2011
(as shown with a dotted line in fig. 2) width of wound body 200 can be generally equal to.With regard to the production method of cuboid capacitance core, more
Furthermore, it is understood that first can together wind positive pole paillon foil 200A, negative pole paillon foil 200B and release paper 200C, to form a cylinder
Capacitance core (such as the step of Fig. 3 shown in (A)), then again pressed cylinder capacitance core (can match somebody with somebody and about 50 DEG C to 300 simultaneously
DEG C heating), to form a cuboid capacitance core (such as the step of Fig. 3 shown in (B)).
Then, coordinate shown in Fig. 1, Fig. 2 and Fig. 4, cut off (the step of negative pole welding foot 204 of each convoluted capacitor 20
Rapid S104), and the second pad 206 is removed, and leave behind cathode conductive pin 202 (as shown in Figure 4)；Then, by each
The positive pole welding foot 203 of convoluted capacitor 20 is welded on a connection strap S (step S106)；Then, while allowing multiple windings
Type capacitor 20 sequentially carry out carbonization treatment, chemical conversion treatment and impregnation high score subprocessing (step S108), wherein carbonization treatment with
Chemical conversion treatment can be carried out repeatedly, with the yield of improving product.
Next, coordinating shown in Fig. 1, Fig. 4 and Fig. 5, remove and have been formed on a terminal part of cathode conductive pin 202
Macromolecule (step S110)；Then, the positive pole welding foot 203 (step S112) of each convoluted capacitor 20 is cut off, and is moved
Except the first pad 205, and leave behind anode conductive pin 201 (as shown in Figure 5).It is above-mentioned to remove shape for further
Into before the high molecular step on a terminal part of cathode conductive pin 202, further include：By a fixture C (as schemed
Shown in 4 arrow) to fix the wound body 200 of each convoluted capacitor 20, thereby avoiding convoluted capacitor 20
Generation is rocked, and is easy to remove the macromolecule having been formed on a terminal part of cathode conductive pin 202.Furthermore, positive conductive
Surface 20121 and 1 second is tied with bottom with one first respectively and tie surface 20122, and negative pole in the top of pin 201
Surface 20221 and 1 second is tied with bottom with one first respectively and tie surface 20222 in the top of conductive pin 202.In addition,
The positive pole welding foot 203 of each convoluted capacitor 20 can be removed with the first pad 205 by way of cutting, therefore
The end of anode conductive pin 201 has a facet 20123.Macromolecule on one terminal part of cathode conductive pin 202 can
By grinding, striking off or the mode such as sandblasting is being surface-treated, therefore the end of cathode conductive pin 202 has one by grinding
The abradant surface 20223 formed after mill or sandblasting processing, to lift welding yield and equivalent series resistance (equivalent
Series resistance, ESR).But the present invention is not limited with above-mentioned institute's illustrated example.
And then, coordinate shown in Fig. 1, Fig. 5 and Fig. 6, multiple convoluted capacitors 20 are separately positioned on multiple conductive single
In unit 4, each of which conductive unit 4 includes an anode conductive pin for being electrically connected at corresponding convoluted capacitor 20
201 positive conductive terminal 41 and is electrically connected at the negative of the cathode conductive pin 202 of corresponding convoluted capacitor 20
Pole conducting terminal 42 (step S114).For further, multiple convoluted capacitors 20 by welding, tin cream or can lead respectively
The modes such as electric glue, to be arranged on multiple conductive units 4.
Then, coordinate shown in Fig. 1, Fig. 6 and Fig. 7, form multiple packaging bodies 30 to be respectively coated by multiple convoluted capacitors
20, the positive conductive terminal 41 of each of which conductive unit 4 has a corresponding convoluted capacitor 20 in electrical contact
Anode conductive pin 201 and be covered by corresponding packaging body 30 first in bury portion 411 and and be connected in first and bury
Portion 411 and exposed the first exposed portion 412 outside corresponding packaging body 30, and the negative conductive end of each conductive unit 4
Son 42 has the cathode conductive pin 202 of a corresponding convoluted capacitor 20 in electrical contact and is covered by corresponding envelope
Bury in dress body 30 second portion 421 and be connected in second bury portion 421 and it is exposed outside corresponding packaging body 30 the
Two exposed portions 422 (step S116).For further, after the completion of step S116, also alternative carries out burin-in process.Encapsulation
Body 30 has the correspondence of a first side 301, one and is connected to the first side in contrast to the second side 302 and of first side 301
Bottom surface 303 between face 301 and second side 302.When multiple convoluted capacitors 20 are separately positioned on multiple conductive units 4
When, the second of anode conductive pin 201 ties surface 20122 ties surface 20222 with the second of cathode conductive pin 202 can divide
It is not close to be buried in portion 411 and second in first and buries portion 421.
Finally, coordinate shown in Fig. 1, Fig. 7 and Fig. 8, the first exposed portion 412 for bending each conductive unit 4 is naked with second
Dew portion 422, so that the first exposed portion 412 all extends with the second exposed portion 422 along the outer surface of corresponding packaging body 30
(step S118).For further, the first exposed portion 412 can enter along the first side 301 of packaging body 30 with bottom surface 303
Row extends, and the second exposed portion 422 can be extended along the second side 302 of packaging body 30 with bottom surface 303.
In sum, by the manufacturing process of above-mentioned steps S100 to step S118, as shown in figure 8, the present invention can be provided
A kind of Winding-type solid electrolytic capacitor encapsulating structure of use lead frame, it includes：One capacitor cell 2, an encapsulation unit 3 and
One conductive unit 4.
First, capacitor cell 2 includes at least one convoluted capacitor 20, wherein convoluted capacitor 20 has a winding originally
Body 200, one is from the anode conductive pin that wherein a side extends 201 and of wound body 200 from wound body 200
The cathode conductive pin 202 extended of other side end.Additionally, the end of anode conductive pin 201 has one because of cutting
Facet 20123 produced by processing, and the end of cathode conductive pin 202 has one because of the grinding produced by attrition process
Face 20223.
For further, anode conductive pin 201 has in an insertion wound body 200 and positive pole paillon foil in electrical contact
The first positive conductive portion 2011 of 200A and a connection (being integrally formed connection) are in the first positive conductive portion 2011 and from winding sheet
The second positive conductive portion 2012 that body 200 extends, and cathode conductive pin 202 has one to insert in wound body 200
And the first negative conductive portion 2021 of negative pole paillon foil 200B in electrical contact and a connection (being integrally formed connection) are led in the first negative pole
Electric portion 2021 and the second negative conductive portion 2022 extended from wound body 200.For example, wound body 200 is inserted
The length in the first negative conductive portion 2021 in the length and insertion wound body 200 in the first interior positive conductive portion 2011 is substantially
On can be equal to wound body 200 width.
Furthermore, encapsulation unit 3 includes the packaging body 30 of a convoluted capacitor 20 of cladding, and wherein packaging body 30 has one the
One side 301, one is corresponding and is connected to first side 301 and second in contrast to the second side 302 and of first side 301
Bottom surface 303 between side 302.Additionally, conductive unit 4 includes a positive conductive for being electrically connected at anode conductive pin 201
Terminal 41 and one is electrically connected at the cathode conductive terminal 42 of cathode conductive pin 202, wherein positive conductive terminal 41 and negative pole
Conducting terminal 42 is separated from one another.
For further, positive conductive terminal 41 has an anode conductive pin in electrical contact 201 and is covered by envelope
Portion 411 and one being buried in dress body 30 first and being connected in first bury portion 411 and exposed the first exposed portion outside packaging body 30
412, and the first exposed portion 412 can extend along the first side 301 of packaging body 30 and bottom surface 303.Additionally, cathode conductive terminal
42 have a cathode conductive pin in electrical contact 202 and be covered by packaging body 30 second in bury portion 421 and and be connected to
Portion 421 and exposed the second exposed portion 422 outside packaging body 30 are buried in second, and the second exposed portion 422 can be along packaging body 30
Second side 302 extend with bottom surface 303.For example, the top of anode conductive pin 201 has respectively one first with bottom
Tie surface 20121 and 1 second and tie surface 20122, top and the bottom of cathode conductive pin 202 have respectively one first
Tie surface 20221 and 1 second and tie surface 20222, and the second of anode conductive pin 201 ties surface 20122 and bears
The second of pole conductive pin 202 ties surface 20222 can respectively be close to bury in first that portion 411 and second is interior to bury portion 421.
(possibility effect of embodiment)
In sum, beneficial effects of the present invention can be, the convoluted solid state electrolysis that the embodiment of the present invention is provided
Capacitor packaging structure Z and preparation method thereof, it can pass through " end of cathode conductive pin 202 has an abradant surface 20223 "
With " macromolecule that has been formed on a terminal part of cathode conductive pin 202 is removed, so that the end of cathode conductive pin 202
The design of one abradant surface 20223 of end formation ", to lift welding yield and equivalent series resistance (equivalent series
Resistance, ESR).
The foregoing is only the preferable possible embodiments of the present invention, the scope of the claims that is non-therefore limiting to the present invention, therefore such as
With description of the invention and schema content institute for it equivalence techniques change, be both contained in the present invention in the range of.
Claims (10)
1. a kind of Winding-type solid electrolytic capacitor encapsulating structure of use lead frame, it includes：
One capacitor cell, it includes at least one convoluted capacitor, and convoluted capacitor described in wherein at least one is with a winding
Body, one from the anode conductive pin that wherein a side extends and of the wound body from the wound body
The cathode conductive pin that other side end is extended, the end of the anode conductive pin has a facet, and described negative
The end of pole conductive pin has an abradant surface；
One encapsulation unit, it includes the packaging body of a cladding convoluted capacitor at least described in, wherein the packaging body has
One first side, one corresponding to the first side second side and one be connected to the first side with second side
Bottom surface between face；And
One conductive unit, it includes a positive conductive terminal for being electrically connected at the anode conductive pin and one is electrically connected at
The cathode conductive terminal of the cathode conductive pin, wherein the positive conductive terminal divides each other with the cathode conductive terminal
From；
Wherein, the positive conductive terminal has an anode conductive pin in electrical contact and is covered by the encapsulation in vivo
First in bury portion and one be connected in described first portion of burying and the exposed first exposed portion external in the encapsulation, and described the
One exposed portion extends along the first side of the packaging body with the bottom surface；
Wherein, the cathode conductive terminal has a cathode conductive pin in electrical contact and is covered by the encapsulation in vivo
Second in bury portion and one be connected in described second portion of burying and the exposed second exposed portion external in the encapsulation, and described the
Two exposed portions extend along the second side of the packaging body with the bottom surface
The top of wherein described anode conductive pin and bottom have respectively one first to tie surface and one second tie surface, institute
Stating the top of cathode conductive pin and bottom has respectively one first to tie surface and one second tie surface, and the positive pole is led
Described the second of electric pin ties surface and ties surface with described the second of the cathode conductive pin and be close to described first respectively
Inside bury in portion and described second and bury portion
It is negative with described that wherein described wound body is arranged at the positive pole paillon foil for one by a positive pole paillon foil, a negative pole paillon foil and one
The cuboid capacitance core that release paper between the paillon foil of pole winds together, and the anode conductive pin and the negative conductive
Pin distinguishes the positive pole paillon foil in electrical contact and the negative pole paillon foil；There is an abradant surface through the end of cathode conductive pin
With remove the macromolecule having been formed on a terminal part of cathode conductive pin so that the end of cathode conductive pin forms one and grinds
Flour milling lifts welding yield and equivalent series resistance.
2. as claimed in claim 1 using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame, it is characterised in that：Its
Described in anode conductive pin have in an insertion wound body and the first positive pole of the positive pole paillon foil in electrical contact is led
Electric portion and a second positive conductive portion for being connected to the first positive conductive portion and extending from the wound body, and institute
State cathode conductive pin with an insertion wound body and the negative pole paillon foil in electrical contact the first negative conductive portion
And the second negative conductive portion for being connected to the first negative conductive portion and extending from the wound body.
3. as claimed in claim 2 using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame, it is characterised in that：Its
In the middle length for inserting the first positive conductive portion in the wound body and the insertion wound body described first
The length in negative conductive portion is all equal to the width of the wound body.
4. a kind of manufacture method of the Winding-type solid electrolytic capacitor encapsulating structure of use lead frame, it comprises the following steps：
Multiple convoluted capacitors are provided, convoluted capacitor described in each of which is with a wound body, one from the volume
The anode conductive pin that wherein a side extends around body, one extend from the other side end of the wound body
Cathode conductive pin, a positive pole welding foot being welded on the end of the anode conductive pin and one be welded on it is described negative
Negative pole welding foot on the end of pole conductive pin；
The wound body of each convoluted capacitor is pressed into into cuboid from cylinder；
Cut off the negative pole welding foot of each convoluted capacitor；
The positive pole welding foot of each convoluted capacitor is welded on a connection strap；
Multiple convoluted capacitors are allowed sequentially to carry out carbonization treatment, chemical conversion treatment and impregnation high score subprocessing simultaneously；
Remove the macromolecule having been formed on a terminal part of the cathode conductive pin；
Cut off the positive pole welding foot of each convoluted capacitor；
Multiple convoluted capacitors are separately positioned on multiple conductive units, conductive unit includes described in each of which
The positive conductive terminal of one anode conductive pin for being electrically connected at corresponding described convoluted capacitor and one electrical
It is connected to the cathode conductive terminal of the cathode conductive pin of corresponding described convoluted capacitor；
Multiple packaging bodies are formed to be respectively coated by multiple convoluted capacitors, conductive unit is described described in each of which
Positive conductive terminal has the anode conductive pin of a corresponding described convoluted capacitor in electrical contact and is wrapped by
The corresponding encapsulation it is internal first in bury portion and one be connected in described first and bury portion and exposed in corresponding institute
The first external exposed portion of encapsulation is stated, and the cathode conductive terminal of each conductive unit has a phase in electrical contact
The cathode conductive pin of the corresponding convoluted capacitor and be covered by the corresponding encapsulation it is internal second
Inside bury portion and one be connected in described second and bury portion and the exposed second exposed portion external in the corresponding encapsulation；And
The described first exposed portion and the described second exposed portion of each conductive unit are bent, so that described first is exposed
Portion all extends with the described second exposed portion along the outer surface of the corresponding packaging body；Wherein described anode conductive pin
Top and bottom have respectively one first to tie surface and one second tie surface, the top and bottom of the cathode conductive pin
Have one first to tie surface and one second tie surface respectively, and described the second of the anode conductive pin tie surface with
Described the second of the cathode conductive pin ties surface and is close to bury in described first in portion and described second respectively and bury portion, wherein
The end of the anode conductive pin has a facet, and the end of the cathode conductive pin has one by grinding or sprays
The abradant surface formed after sand processing；Through the end of cathode conductive pin there is an abradant surface to have been formed on negative pole and lead with removing
Macromolecule on one terminal part of electric pin so that cathode conductive pin end formed an abradant surface lifted welding yield and
Equivalent series resistance.
5. the manufacture method for using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame as claimed in claim 4, its
It is characterised by：Wherein described wound body be one by a positive pole paillon foil, a negative pole paillon foil and one be arranged at the positive pole paillon foil with
The cuboid capacitance core that release paper between the negative pole paillon foil winds together, and the anode conductive pin is negative with described
Pole conductive pin distinguishes the positive pole paillon foil in electrical contact and the negative pole paillon foil.
6. the manufacture method for using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame as claimed in claim 5, its
It is characterised by：Wherein described anode conductive pin has in an insertion wound body and the positive pole paillon foil in electrical contact
First positive conductive portion and second positive pole for being connected to the first positive conductive portion and extending from the wound body
Conductive part, and the cathode conductive pin have in an insertion wound body and the negative pole paillon foil in electrical contact first
Negative conductive portion and second negative conductive for being connected to the first negative conductive portion and extending from the wound body
Portion.
7. the manufacture method for using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame as claimed in claim 6, its
It is characterised by：Wherein insert the length in the first positive conductive portion in the wound body and insert in the wound body
The first negative conductive portion length all equal to the wound body width.
8. the manufacture method for using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame as claimed in claim 7, its
It is characterised by：The wherein above-mentioned wound body by each convoluted capacitor is pressed into cuboid from cylinder
In step, further include：The wound body of convoluted capacitor each described is carried out between 50 DEG C to 300 DEG C
Between heating.
9. the manufacture method for using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame as claimed in claim 8, its
It is characterised by：The plurality of convoluted capacitor respectively by welding, tin cream or conducting resinl, to be arranged on multiple described lead
On electric unit.
10. the manufacture method for using the Winding-type solid electrolytic capacitor encapsulating structure of lead frame as claimed in claim 9, its
It is characterised by：It is wherein above-mentioned to remove before the high molecular step having been formed on a terminal part of the cathode conductive pin, more
Further include：By a fixture fixing the wound body of each convoluted capacitor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101151219 | 2012-12-28 | ||
| TW101151219A TWI447768B (en) | 2012-12-28 | 2012-12-28 | Winding-type solid electrolytic capacitor package structure using a lead frame and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103456512A CN103456512A (en) | 2013-12-18 |
| CN103456512B true CN103456512B (en) | 2017-05-10 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310324304.9A Active CN103456512B (en) | 2012-12-28 | 2013-07-30 | Winding type solid electrolytic capacitor packaging structure using lead frame and manufacturing method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN103456512B (en) |
| TW (1) | TWI447768B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979099B (en) * | 2014-04-03 | 2018-08-28 | 至美电器股份有限公司 | Solid electrolytic capacitor and its preparation method |
| CN107733388A (en) * | 2017-09-20 | 2018-02-23 | 戴承萍 | The processing method of resonator and resonator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101342626A (en) * | 2008-09-05 | 2009-01-14 | 王朝 | Welding method and silver based metal for hard-alloy heavy type cutting tools |
| CN101817119A (en) * | 2010-05-20 | 2010-09-01 | 什邡市明日宇航工业股份有限公司 | Laser welding method of rhenium alloy thin sheet |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4862204B2 (en) * | 2007-12-06 | 2012-01-25 | 三洋電機株式会社 | Solid electrolytic capacitor |
| CN101510469A (en) * | 2009-01-13 | 2009-08-19 | 珠海华冠电容器有限公司 | Method for preparing solid aluminum electrolytic capacitor |
| CN101527203A (en) * | 2009-02-19 | 2009-09-09 | 富士通多媒体部品（苏州）有限公司 | Solid electrolytic capacitor and manufacture method thereof |
| TWI421888B (en) * | 2010-03-05 | 2014-01-01 | Apaq Technology Co Ltd | Stacked capacitor with many product pins |
| CN102005299A (en) * | 2010-11-23 | 2011-04-06 | 尼吉康株式会社 | Lead frame and manufacturing device therefore as well as solid electrolytic capacitor and manufacturing method thereof |
| CN102737834B (en) * | 2011-04-11 | 2015-06-24 | 佳邦科技股份有限公司 | Conductive structure with embedded electrode, solid capacitor with embedded electrode and manufacture method thereof |
-
2012
- 2012-12-28 TW TW101151219A patent/TWI447768B/en not_active IP Right Cessation
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2013
- 2013-07-30 CN CN201310324304.9A patent/CN103456512B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101342626A (en) * | 2008-09-05 | 2009-01-14 | 王朝 | Welding method and silver based metal for hard-alloy heavy type cutting tools |
| CN101817119A (en) * | 2010-05-20 | 2010-09-01 | 什邡市明日宇航工业股份有限公司 | Laser welding method of rhenium alloy thin sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201426789A (en) | 2014-07-01 |
| TWI447768B (en) | 2014-08-01 |
| CN103456512A (en) | 2013-12-18 |
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