CN104979099B - Solid electrolytic capacitor and method for manufacturing the same - Google Patents
Solid electrolytic capacitor and method for manufacturing the same Download PDFInfo
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- CN104979099B CN104979099B CN201410133729.6A CN201410133729A CN104979099B CN 104979099 B CN104979099 B CN 104979099B CN 201410133729 A CN201410133729 A CN 201410133729A CN 104979099 B CN104979099 B CN 104979099B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 115
- 239000007787 solid Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title description 11
- 238000000034 method Methods 0.000 title description 10
- 238000004804 winding Methods 0.000 claims abstract description 61
- 238000002360 preparation method Methods 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 239000011888 foil Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及一种电容器及其制法,特别涉及一种指固态电解电容器及其制法。The invention relates to a capacitor and its manufacturing method, in particular to a solid electrolytic capacitor and its manufacturing method.
背景技术Background technique
电容器具有广泛的用途,例如电容器可供储存电能、改善功率因数、过滤噪声、滤波、信号耦合与共振等,因此电容器是电子电路装置中相当基本且重要的电子元件。Capacitors have a wide range of uses. For example, capacitors can be used to store electric energy, improve power factor, filter noise, filter, signal coupling and resonance, etc. Therefore, capacitors are quite basic and important electronic components in electronic circuit devices.
请参考中国台湾专利公告第M250303号的电解电容器,主要包含有一本体与一外壳,该本体设于该外壳中,该本体包含有介电质与导线端子,该外壳主要由盖板与壳套组接构成。导线端子是穿出外壳以供与外部的电路板或其他电子装置连接。然而,前述专利前案的电解电容器的构造复杂,例如该外壳由盖板与壳套组接而成,甚至在其他结构中,还包含有插孔、插柱、铆钉等构造。在组装时,需由单颗且逐个将本体置入如于壳套内后,将盖板固接在壳套上。如此机械式的组装方式,容易产生组装不完全或密合度不佳的问题,导致电解电容器产能与成品品质不易提升。Please refer to the electrolytic capacitor of Taiwan Patent Announcement No. M250303, which mainly includes a body and a shell. The body is arranged in the shell. The body includes dielectric materials and wire terminals. connected composition. The wire terminal passes through the casing for connection with an external circuit board or other electronic devices. However, the structure of the electrolytic capacitor in the aforementioned patent is complicated. For example, the casing is assembled by a cover plate and a casing, and even in other structures, it also includes structures such as sockets, posts, and rivets. When assembling, it is necessary to put the body into the casing one by one, and then fix the cover plate on the casing. Such a mechanical assembly method is prone to incomplete assembly or poor adhesion, which makes it difficult to improve the production capacity and product quality of electrolytic capacitors.
此外,该本体的两导线端子插设于该介电质中,请参考前述M250303号专利案的图1B,然而该介电质为圆筒状的卷绕体,且卷绕的结构相当密实,导致该介电质的体积无法缩减,当前述M250303号专利案的电解电容器应用于电子装置时,将占据较大的空间,不符目前电子装置体积缩小化的需求。In addition, the two wire terminals of the main body are inserted into the dielectric, please refer to Figure 1B of the aforementioned M250303 patent, however, the dielectric is a cylindrical winding body, and the winding structure is quite dense. As a result, the volume of the dielectric cannot be reduced. When the electrolytic capacitor of the aforementioned M250303 patent is applied to an electronic device, it will occupy a large space, which does not meet the current demand for size reduction of electronic devices.
发明内容Contents of the invention
因此本发明的主要目的是提供一种固态电解电容器及其制法,本发明电解电容器的结构简单且体积小,克服现有电解电容器结构复杂的缺点。Therefore, the main purpose of the present invention is to provide a solid electrolytic capacitor and its manufacturing method. The electrolytic capacitor of the present invention has a simple structure and a small volume, and overcomes the shortcomings of the existing electrolytic capacitors with complicated structures.
本发明固态电解电容器包含有:The solid electrolytic capacitor of the present invention comprises:
一扁状电容卷绕体;A flat capacitor wound body;
一第一内引脚,插设于该扁状电容卷绕体上;a first inner pin inserted on the flat capacitor wound body;
一第二内引脚,插设于该扁状电容卷绕体上且与该第一内引脚相对设置,其中该第一与第二内引脚在该扁状电容卷绕体的一端面往外延伸;A second inner pin, inserted on the flat capacitor wound body and opposite to the first inner pin, wherein the first and second inner pins are on one end surface of the flat capacitor wound body extend outward;
一绝缘封装体,包覆该扁状电容卷绕体、该第一内引脚与该第二内引脚;an insulating package covering the flat capacitor winding body, the first inner lead and the second inner lead;
一第一外引脚,具有一第一区段与一第二区段,该第一区段设于该绝缘封装体中并连接该第一内引脚,该第二区段外露于该绝缘封装体,并设于该绝缘封装体的表面;以及A first outer lead has a first section and a second section, the first section is set in the insulating package and connected to the first inner lead, the second section is exposed to the insulating package a package disposed on a surface of the insulating package; and
一第二外引脚,具有一第一区段与一第二区段,该第一区段设于该绝缘封装体中并连接该第二内引脚,该第二区段外露于该绝缘封装体,并设于该绝缘封装体的表面。A second outer pin has a first section and a second section, the first section is set in the insulating package and connected to the second inner pin, the second section is exposed to the insulating package The package body is arranged on the surface of the insulating package body.
本发明固态电解电容器的制法包含有以下步骤:The preparation method of solid electrolytic capacitor of the present invention comprises the following steps:
准备一基材,该基材包含有一筒状电容卷绕体与两个插设在该筒状电容卷绕体上的内引脚,其中该两内引脚在该扁状电容卷绕体的一端面往外延伸,该筒状电容卷绕体的最内圈为矩形的卷绕而具有四个转折部,分别为第一、第二、第三与第四转折部,该第一与第三转折部为相对设置,该第二与第四转折部为相对设置,该两内引脚分别位于该筒状电容卷绕体的最内圈相对侧并分别邻近第一与第三转折部;Prepare a base material, which includes a cylindrical capacitor winding body and two inner pins inserted on the cylindrical capacitor winding body, wherein the two inner pins are on the flat capacitor winding body One end surface extends outward, and the innermost circle of the cylindrical capacitor winding body is a rectangular winding with four turning parts, which are respectively the first, second, third and fourth turning parts. The first and third The turning parts are arranged oppositely, the second and fourth turning parts are arranged oppositely, and the two inner pins are respectively located on the opposite side of the innermost circle of the cylindrical capacitor winding body and adjacent to the first and third turning parts respectively;
从第二与第四转折部压扁该筒状电容卷绕体而形成一扁状电容卷绕体;flattening the tubular capacitor wound body from the second and fourth turning parts to form a flat capacitor wound body;
在该两个内引脚上分别连接一外引脚;connecting an external pin to the two internal pins respectively;
形成一绝缘封装体以包覆该扁状电容卷绕体与两个内引脚,并使该两外引脚外露于该绝缘封装体;forming an insulating package to cover the flat capacitor winding body and the two inner leads, and exposing the two outer leads to the insulating package;
弯折该两外引脚以使各外引脚设于该绝缘封装体的表面。The two outer leads are bent so that each outer lead is arranged on the surface of the insulating package.
本发明固态电解电容器的另一制法包含有以下步骤:Another manufacturing method of the solid electrolytic capacitor of the present invention comprises the following steps:
准备一基材,该基材包含有一筒状电容卷绕体与两个插设在该筒状电容卷绕体上的内引脚,其中该两内引脚在该扁状电容卷绕体的一端面往外延伸,该筒状电容卷绕体的最内圈为矩形的卷绕而具有四个转折部,分别为第一、第二、第三与第四转折部,该第一与第三转折部为相对设置,该第二与第四转折部为相对设置,该两内引脚分别位于该筒状电容卷绕体的最内圈相对侧并分别邻近第一与第三转折部;Prepare a base material, which includes a cylindrical capacitor winding body and two inner pins inserted on the cylindrical capacitor winding body, wherein the two inner pins are on the flat capacitor winding body One end surface extends outward, and the innermost circle of the cylindrical capacitor winding body is a rectangular winding with four turning parts, which are respectively the first, second, third and fourth turning parts. The first and third The turning parts are arranged oppositely, the second and fourth turning parts are arranged oppositely, and the two inner pins are respectively located on the opposite side of the innermost circle of the cylindrical capacitor winding body and adjacent to the first and third turning parts respectively;
从第二与第四转折部压扁该筒状电容卷绕体而形成一扁状电容卷绕体;flattening the tubular capacitor wound body from the second and fourth turning parts to form a flat capacitor wound body;
在该两个内引脚上分别连接一外引脚;connecting an external pin to the two internal pins respectively;
弯折该两外引脚,使该两外引脚的一区段与该扁状电容卷绕体平行并维持一间隔;bending the two outer leads so that a section of the two outer leads is parallel to the flat capacitor winding body and maintains a distance;
进行封装步骤以形成一绝缘封装体,使该扁状电容卷绕体位在绝缘封装体内,而该两外引脚黏着在绝缘封装体的表面,该两外引脚的表面与该绝缘封装体的表面为共平面。Carrying out the packaging step to form an insulating package body, so that the flat capacitor winding body is located in the insulating package body, and the two outer leads are adhered to the surface of the insulating package body, and the surfaces of the two outer leads are in contact with the surface of the insulating package body. The surfaces are coplanar.
综上所述,本发明的结构简单,且本发明是形成绝缘封装体以包覆该扁状电容卷绕体,相较于现有技术,本发明绝缘封装体较现有的组装结构具有更好的密封性,水气无法进入该绝缘封装体,确保本发明成品的品质。再者,本发明通过一压扁步骤以形成扁状电容卷绕体,相较于现有技术,该扁状电容卷绕体具有更小的体积,有效缩小电解电容器成品的体积,又由于该扁状电容卷绕体呈扁状,其外型较能贴近于印刷电路板或电子装置,符合电子元件缩小化的需求。To sum up, the structure of the present invention is simple, and the present invention forms an insulating package to cover the flat capacitor wound body. Compared with the prior art, the insulating package of the present invention has more advantages than the existing assembly structure. With good airtightness, moisture cannot enter the insulating package, which ensures the quality of the finished product of the present invention. Furthermore, the present invention uses a flattening step to form a flat capacitor wound body. Compared with the prior art, the flat capacitor wound body has a smaller volume, effectively reducing the volume of the finished electrolytic capacitor, and because the The flat capacitor wound body has a flat shape, and its appearance can be closer to a printed circuit board or an electronic device, which meets the requirement of miniaturization of electronic components.
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
附图说明Description of drawings
图1:本发明制法的流程示意图;Fig. 1: the schematic flow sheet of method of the present invention;
图2:本发明制法中基材的平面示意图(一);Fig. 2: the schematic plan view (1) of substrate in the preparation method of the present invention;
图3:本发明制法中基材的平面示意图(二);Fig. 3: the schematic plan view (two) of substrate in the preparation method of the present invention;
图4:本发明制法中基材的端面示意图;Fig. 4: the end face schematic diagram of base material in the preparation method of the present invention;
图5:本发明中扁状电容卷绕体的端面示意图;Fig. 5: the schematic view of the end face of the flat capacitor wound body in the present invention;
图6:本发明中扁状电容卷绕体与内引脚的平面示意图;Fig. 6: Plane schematic diagram of flat capacitor winding body and inner pin in the present invention;
图7:本发明制法中截断内引脚的平面示意图;Fig. 7: the schematic plan view of truncated inner pin in the preparation method of the present invention;
图8:本发明制法中将内引脚与外引脚连接的平面示意图(一);Fig. 8: the schematic plan view (1) that inner pin is connected with outer pin in the method for making of the present invention;
图9:本发明制法中将内引脚与外引脚连接的平面示意图(二);Fig. 9: the plane schematic diagram (two) that inner pin is connected with outer pin in the method for making of the present invention;
图10:本发明制法中形成绝缘封装体与截断引脚座后的平面示意图;Figure 10: A schematic plan view of the insulating package and the truncated pin seat in the method of the present invention;
图11:本发明制法另一实施例将内引脚与外引脚连接的平面示意图(一);Fig. 11: Another embodiment of the present invention's method of manufacture is the schematic plan view (1) that inner pin is connected with outer pin;
图12:本发明制法另一实施例将内引脚与外引脚连接的平面示意图(二);Fig. 12: another embodiment of the present invention's method of manufacture is the schematic plan view (two) that inner pin is connected with outer pin;
图13:本发明制法另一实施例形成绝缘封装体与截断引脚座后的平面示意图;Figure 13: A schematic plan view of another embodiment of the method of the present invention after forming an insulating package and truncating the pin seat;
图14:本发明固态电解电容器的立体外观示意图(一);Figure 14: A schematic diagram of the three-dimensional appearance of the solid electrolytic capacitor of the present invention (1);
图15:本发明固态电解电容器的立体外观示意图(二);Figure 15: a schematic diagram of the three-dimensional appearance of the solid electrolytic capacitor of the present invention (2);
图16:本发明固态电解电容器另一实施例的立体外观示意图;Figure 16: A schematic diagram of the three-dimensional appearance of another embodiment of the solid electrolytic capacitor of the present invention;
图17:本发明固态电解电容器再一实施例的立体外观示意图。Fig. 17: A schematic perspective view of another embodiment of the solid electrolytic capacitor of the present invention.
其中,附图标记Among them, reference signs
10 基材 101 第一转折部10 Substrate 101 First turning point
102 第二转折部 103 第三转折部102 Second Turning Section 103 Third Turning Section
104 第四转折部 11 筒状电容卷绕体104 Fourth turning part 11 Cylindrical capacitor wound body
110 扁状电容卷绕体 12 内引脚110 Flat Capacitor Winding Body 12 Inner Pins
120 衔接部 13 外引脚120 connector 13 external pins
130 引脚座 14 绝缘封装体130-pin header 14 insulated package
15 第一外引脚 151 第一区段15 First outer pin 151 First section
152 第二区段 16 第二外引脚152 The second section 16 The second external pin
161 第一区段 162 第二区段161 First section 162 Second section
20 扁状电容卷绕体 21 第一内引脚20 Flat Capacitor Winding Body 21 First Inner Pin
22 第二内引脚 23 绝缘封装体22 Second inner pin 23 Insulating package
24 第一外引脚 241 第一区段24 First outer pin 241 First segment
242 第二区段 243 第三区段242 Second segment 243 Third segment
25 第二外引脚 251 第一区段25 Second outer pin 251 First section
252 第二区段 253 第三区段252 Second Section 253 Third Section
31 第一块体 32 第二块体31 First block 32 Second block
33 间隙33 gap
具体实施方式Detailed ways
下面结合附图对本发明的结构原理和工作原理作具体的描述:Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
本发明制法可在自动化机械设备操作,请参考图1所示本发明固态电解电容器的制作流程图,并配合参考图2至图4所示,首先是准备一基材10(步骤101),该基材10包含有一筒状电容卷绕体11与两个插设在该筒状电容卷绕体11上的内引脚12,该两内引脚12是从该筒状电容卷绕体11的同一端面往外延伸,该筒状电容卷绕体11主要是由一阳极箔、一阴极箔及隔离层交替绝缘排列后卷绕而成的构件,该两内引脚12分别电连接该阳极箔与阴极箔,其中内引脚12可为铝引脚。如图4所示,该筒状电容卷绕体11可在一卷针上进行卷绕,其中该卷针为棒状,且该卷针的一端形成略呈三角形的一第一块体31与一第二块体32,如图4所示,该第一块体31与第二块体32的底边为相对设置,且该两块体31、32之间维持一间隙33,该筒状电容卷绕体11的一端设于该间隙33中而往外卷绕成形,使该筒状电容卷绕体11的最内圈沿着该两块体31、32的外围形状而形成矩形的卷绕且具有四个转折部,分别为第一转折部101、第二转折部102、第三转折部103与第四转折部104,该第一与第三转折部101、103为相对设置,该第二与第四转折部102、104为相对设置,且该两内引脚12分别位于该筒状电容卷绕体11最内圈的矩形的相对侧并分别邻近第一与第三转折部101、103,或于另一实施例中,该两内引脚12可分别位于矩形的相邻侧。The manufacturing method of the present invention can be operated in automated machinery and equipment. Please refer to the production flow chart of the solid electrolytic capacitor of the present invention shown in FIG. 1, and refer to FIG. 2 to FIG. The substrate 10 includes a cylindrical capacitor winding body 11 and two inner pins 12 inserted on the cylindrical capacitor winding body 11, and the two inner pins 12 are formed from the cylindrical capacitor winding body 11. The same end surface of the same end extends outwards. The cylindrical capacitor winding body 11 is mainly composed of an anode foil, a cathode foil, and an isolation layer, which are alternately insulated and wound. The two inner pins 12 are respectively electrically connected to the anode foil. With the cathode foil, the inner pin 12 may be an aluminum pin. As shown in Figure 4, the tubular capacitor winding body 11 can be wound on a needle, wherein the needle is rod-shaped, and one end of the needle forms a slightly triangular first block 31 and a The second block 32, as shown in Figure 4, the bottom of the first block 31 and the second block 32 are oppositely arranged, and a gap 33 is maintained between the two blocks 31, 32, the cylindrical capacitor One end of the jellyroll 11 is arranged in the gap 33 and is wound outward, so that the innermost circle of the cylindrical capacitor jellyroll 11 forms a rectangular winding along the peripheral shapes of the two blocks 31, 32. There are four turning parts, respectively the first turning part 101, the second turning part 102, the third turning part 103 and the fourth turning part 104, the first and the third turning parts 101, 103 are set oppositely, the second turning part It is opposite to the fourth turning part 102, 104, and the two inner pins 12 are respectively located on opposite sides of the innermost rectangle of the tubular capacitor winding body 11 and adjacent to the first and third turning parts 101, 103 respectively. , or in another embodiment, the two inner pins 12 may be respectively located on adjacent sides of the rectangle.
请参考图5与图6所示,接着可由夹具从该筒状电容卷绕体11最内圈的第二与第四转折部102、104(即该筒状电容卷绕体11最内圈的矩形对角方位)压扁该筒状电容卷绕体11,使该筒状电容卷绕体11变形而成为一扁状电容卷绕体110,其中该两内引脚12是从该扁状电容卷绕体110的同一端面往外延伸(步骤102)。该些转折部101~104可作为位置的标示,因为该两内引脚12分别设于邻近第一与第三转折部101、103的地方,于压扁筒状电容卷绕体11后,该两内引脚12自然位在扁状电容卷绕体110的相对两侧。此外,该两内引脚12的位置概成对角相对设置,藉此特性可供使用者分辩内引脚12的极性。Please refer to FIG. 5 and FIG. 6, and then the second and fourth turning parts 102, 104 of the innermost circle of the cylindrical capacitor winding body 11 (that is, the innermost circle of the cylindrical capacitor winding body 11) Rectangular diagonal orientation) flattens the cylindrical capacitor winding body 11, deforms the cylindrical capacitor winding body 11 and becomes a flat capacitor winding body 110, wherein the two inner pins 12 are formed from the flat capacitor winding body The same end surface of the winding body 110 is extended outward (step 102 ). These turning portions 101-104 can be used as position marks, because the two inner pins 12 are respectively arranged adjacent to the first and third turning portions 101, 103, after the cylindrical capacitor winding body 11 is flattened, the The two inner pins 12 are naturally positioned on opposite sides of the flat capacitor winding body 110 . In addition, the positions of the two inner pins 12 are arranged diagonally opposite each other, so that the user can distinguish the polarity of the inner pins 12 .
在形成该扁状电容卷绕体110后,请参考图7所示,是先由裁刀或截断装置截断该两内引脚12外露于该扁状电容卷绕体110的末段,使各内引脚12的一端设于该扁状电容卷绕体110中,各内引脚12的另端外露于该扁状电容卷绕体110而形成一衔接部120(步骤103)。在本截断的步骤中,由于该两内引脚12是从该扁状电容卷绕体110的同一端面往外延伸,故可由裁刀或截断装置同时截断该两内引脚12外露于该扁状电容卷绕体110的末段,再者,因该两内引脚12位在扁状电容卷绕体110的相对两侧而具有相当长的间距,两内引脚12不易相互接触,故不会衍生短路的问题。After forming the flat capacitor winding body 110, as shown in FIG. 7, the two inner pins 12 are first cut off by a cutter or a cutting device to expose the end section of the flat capacitor winding body 110, so that each One end of the inner pin 12 is disposed in the flat capacitor winding body 110 , and the other end of each inner pin 12 is exposed to the flat capacitor winding body 110 to form a connecting portion 120 (step 103 ). In this cutting step, since the two inner pins 12 extend outward from the same end surface of the flat capacitor winding body 110, the two inner pins 12 can be cut off at the same time by a cutter or a cutting device and exposed on the flat capacitor winding body 110. The last section of the capacitor winding body 110, moreover, because the two inner pins 12 are located on the opposite sides of the flat capacitor winding body 110 and have a rather long distance, the two inner pins 12 are not easy to contact each other, so it is not necessary to There will be a problem of short circuit.
在截断内引脚12的末端后,请参考图8与图9所示,是在该两个内引脚12的衔接部120上分别连接一外引脚13,且外引脚13为直引脚(步骤104)。该外引脚13可设于引脚座130上,以利自动化机械设备将多个扁状电容卷绕体110上的内引脚12分别连接到引脚座130的各外引脚13。本较佳实施例中,内引脚12与外引脚13是通过焊接方式而连接,且外引脚13可为锡引脚。After truncating the ends of the inner pins 12, as shown in Figure 8 and Figure 9, an outer pin 13 is respectively connected to the connecting portion 120 of the two inner pins 12, and the outer pin 13 is a direct lead. feet (step 104). The outer pins 13 can be arranged on the pin base 130 , so as to facilitate automatic mechanical equipment to connect the inner pins 12 on the plurality of flat capacitor wound bodies 110 to the outer pins 13 of the pin base 130 respectively. In this preferred embodiment, the inner pins 12 and the outer pins 13 are connected by soldering, and the outer pins 13 can be tin pins.
在连接外引脚13后,请参考图10所示,是由自动化机械设备对该些扁状电容卷绕体110进行灌模封装,以形成一绝缘封装体14包覆该扁状电容卷绕体110与两个内引脚12,并使该两外引脚13外露于该绝缘封装体。于形成封装体14后,是截断如图9所示的引脚座130,以分离该些扁状电容卷绕体110而形成独立的个体(步骤105)。After connecting the external pins 13, as shown in FIG. 10, the flat capacitor coils 110 are filled and packaged by automated mechanical equipment to form an insulating package 14 to cover the flat capacitor coils. body 110 and two inner leads 12, and make the two outer leads 13 exposed to the insulating package. After the package body 14 is formed, the lead base 130 shown in FIG. 9 is cut off to separate the flat capacitor wound bodies 110 to form an independent unit (step 105 ).
请参考图11~图13所示,于另一较佳实施例中,外引脚可为弯曲的结构。该扁状电容卷绕体110上的两个内引脚12的衔接部120分别连接到一第一外引脚15与一第二外引脚16,该第一外引脚15具有一第一区段151与一第二区段152,该第二区段152的一端连接引脚座130,该第一区段151连接该第二区段152的另端;该第二外引脚16具有一第一区段161与一第二区段162,该第二区段162的一端连接引脚座130,该第一区段161连接该第二区段162的另端。该第一外引脚15第一区段151与该第二外引脚16第一区段161之间的间距,是小于该第一外引脚15第二区段152与该第二外引脚16第二区段162之间的间距。请参考图13所示,对该些扁状电容卷绕体110进行灌模封装后,绝缘封装体14的宽度是等于该第一外引脚15第二区段152与该第二外引脚16第二区段162之间的长度。Please refer to FIG. 11 to FIG. 13 , in another preferred embodiment, the outer pin can be a curved structure. The connecting portions 120 of the two inner pins 12 on the flat capacitor winding body 110 are respectively connected to a first outer pin 15 and a second outer pin 16, and the first outer pin 15 has a first Section 151 and a second section 152, one end of the second section 152 is connected to the pin base 130, and the first section 151 is connected to the other end of the second section 152; the second outer pin 16 has A first section 161 and a second section 162 , one end of the second section 162 is connected to the pin socket 130 , and the first section 161 is connected to the other end of the second section 162 . The distance between the first section 151 of the first outer lead 15 and the first section 161 of the second outer lead 16 is smaller than the distance between the second section 152 of the first outer lead 15 and the second outer lead 16. The spacing between the second sections 162 of the feet 16 . Please refer to FIG. 13 , after these flat capacitor winding bodies 110 are filled and packaged, the width of the insulating package body 14 is equal to the width of the second section 152 of the first outer lead 15 and the second outer lead. 16 the length between the second sections 162 .
请参考图14所示第一较佳实施例(另一较佳实施例请参考图16),于截断引脚座后,接着弯折该两外引脚13,以使各外引脚13设于该绝缘封装体14的表面,完成固态电解电容器(步骤106),其中第一与第二外引脚15、16是凸出于绝缘封装体14的表面。Please refer to the first preferred embodiment shown in Figure 14 (please refer to Figure 16 for another preferred embodiment), after cutting off the pin seat, then bend the two outer pins 13 so that each outer pin 13 is set On the surface of the insulating package 14 , a solid electrolytic capacitor is completed (step 106 ), wherein the first and second outer leads 15 , 16 protrude from the surface of the insulating package 14 .
在第104步骤后,本发明提供另一制法,以图12为例,即在连接上引脚座130上的引脚后,不截断引脚座130,而是弯折第一与第二外引脚15、16,使第一外引脚15的第二区段152及第二外引脚16的第二区段162与该扁状电容卷绕体110平行并维持一间隔。于弯折该两外引脚15、16后,将扁状电容卷绕体110置入模具的模穴中进行封装步骤,在模穴灌入封胶时,封胶是包覆该扁状电容卷绕体110,因封胶具有一定的黏性,用以黏着第一、第二外引脚15、16。请参考图17所示,封胶固化形成绝缘封装体14后,该扁状电容卷绕体110是位在绝缘封装体14内,而第一与第二外引脚15、16黏着在绝缘封装体14的表面,其中第一与第二外引脚15、16第二区段152、162的表面与绝缘封装体14的表面为共平面。于形成封装体14后,才由自动化机械设备截断引脚座130,以分离该些绝缘封装体14而形成独立的个体,完成固态电解电容器。After the 104th step, the present invention provides another manufacturing method, taking Fig. 12 as an example, that is, after connecting the pins on the pin base 130, the pin base 130 is not cut off, but the first and second The outer leads 15 and 16 make the second segment 152 of the first outer lead 15 and the second segment 162 of the second outer lead 16 parallel to the flat capacitor winding body 110 and maintain a distance therebetween. After bending the two outer pins 15 and 16, the flat capacitor wound body 110 is put into the mold cavity of the mold to carry out the packaging step. When the mold cavity is filled with sealing glue, the sealing glue is to cover the flat capacitor The winding body 110 is used for adhering the first and second outer pins 15 and 16 due to the certain viscosity of the sealing glue. Please refer to FIG. 17, after the sealant is cured to form the insulating package body 14, the flat capacitor winding body 110 is located in the insulating package body 14, and the first and second outer leads 15, 16 are adhered to the insulating package body. The surface of the body 14 , wherein the surfaces of the first and second outer pins 15 , 16 and the second section 152 , 162 are coplanar with the surface of the insulating package 14 . After the package body 14 is formed, the lead base 130 is cut off by the automatic mechanical equipment to separate the insulating package bodies 14 to form an independent entity and complete the solid electrolytic capacitor.
由前述可知,本发明可由自动化机械设备生产制造,举例来说,如图8至图10所示,在引脚座130上可供连接多个扁状电容卷绕体110的内引脚12,以便大量且快速地进行灌模封装步骤,本发明在工艺上具有相当优势。As can be seen from the foregoing, the present invention can be manufactured by automated mechanical equipment. For example, as shown in FIGS. In order to carry out the steps of potting and packaging in large quantities and quickly, the present invention has considerable advantages in technology.
所以,归纳以上所述,请参考图15所示,本发明固态电解电容器包含有一扁状电容卷绕体20、一第一内引脚21、一第二内引脚22、一绝缘封装体23、一第一外引脚24与一第二外引脚25。Therefore, to summarize the above, please refer to FIG. 15, the solid electrolytic capacitor of the present invention includes a flat capacitor winding body 20, a first inner lead 21, a second inner lead 22, and an insulating package 23. . A first external pin 24 and a second external pin 25 .
该扁状电容卷绕体20主要由阳极箔、阴极箔及多个隔离层交替绝缘排列后卷绕而成。该第一内引脚21具有相对的一第一端与一第二端,该第一端设于该扁状电容卷绕体20中且连接阳极箔,该第二端外露于该扁状电容卷绕体20。同样地,该第二内引脚22具有相对的一第一端与一第二端,该第一端设于该扁状电容卷绕体20中且连接该阴极箔,该第二端外露于该扁状电容卷绕体20。其中,该第一与第二内引脚21、22的第二端是从该扁状电容卷绕体110的同一端面往外延伸,该第一与第二内引脚21、22是相对设置。The flat capacitor wound body 20 is mainly formed by winding an anode foil, a cathode foil, and a plurality of isolation layers alternately insulated and arranged. The first inner pin 21 has an opposite first end and a second end, the first end is arranged in the flat capacitor wound body 20 and connected to the anode foil, and the second end is exposed to the flat capacitor winding body 20 . Similarly, the second inner pin 22 has an opposite first end and a second end, the first end is arranged in the flat capacitor winding body 20 and connected to the cathode foil, and the second end is exposed on the The flat capacitor wound body 20 . Wherein, the second ends of the first and second inner pins 21 , 22 extend outward from the same end surface of the flat capacitor winding body 110 , and the first and second inner pins 21 , 22 are oppositely disposed.
该绝缘封装体23包覆该扁状电容卷绕体20、该第一内引脚21与该第二内引脚22。该第一外引脚24具有依序连接的一第一区段241与一第二区段242,该第二区段242可进一步延伸形成一第三区段243,该第一区段241设于该绝缘封装体23中并连接该第一内引脚21,该第二区段242是外露于该绝缘封装体23,并平贴于该绝缘封装体12的表面,该第三区段243平贴于该绝缘封装体12相对于第一区段241的表面。同样地,该第二外引脚25具有依序连接的一第一区段251与一第二区段252,该第二区段252可进一步延伸形成一第三区段253,该第一区段251设于该绝缘封装体23中并连接该第二内引脚22,该第二区段252是外露于该绝缘封装体23,是与该第一外引脚24的第二区段位在同一侧面,并平贴于该绝缘封装体23的表面,该第三区段253平贴于该绝缘封装体12相对于第一区段251的表面。从图15中可见,该第一与第二外引脚24、25的第二区段242、252是平贴于该绝缘封装体23的同一侧面,该些内引脚21、22与外引脚24、25分别为平板状引脚。The insulating package 23 covers the flat capacitor winding body 20 , the first inner lead 21 and the second inner lead 22 . The first outer pin 24 has a first segment 241 and a second segment 242 connected in sequence, the second segment 242 can be further extended to form a third segment 243, the first segment 241 is set In the insulating package 23 and connected to the first inner pin 21, the second section 242 is exposed to the insulating package 23 and flatly attached to the surface of the insulating package 12, the third section 243 It is flatly attached to the surface of the insulating package 12 opposite to the first section 241 . Similarly, the second outer pin 25 has a first segment 251 and a second segment 252 connected in sequence, and the second segment 252 can be further extended to form a third segment 253, the first segment The section 251 is arranged in the insulating package 23 and connected to the second inner pin 22, the second section 252 is exposed to the insulating package 23, and is in the same position as the second section of the first outer pin 24. On the same side and flat against the surface of the insulating package 23 , the third segment 253 is flat against the surface of the insulating package 12 opposite to the first segment 251 . It can be seen from Fig. 15 that the second sections 242, 252 of the first and second outer leads 24, 25 are flatly attached to the same side of the insulating package 23, and the inner leads 21, 22 are connected with the outer leads. The pins 24 and 25 are flat pins respectively.
请参考图16所示,为图13所示实施例弯折该第一与第二两外引脚15、16的结果,该绝缘封装体14的宽度是等于该第一外引脚15第二区段152与该第二外引脚16第二区段162之间的长度,该两外引脚15、16分别位在该绝缘封装体14的相对侧,以作为外部电子装置连接的接点,此结构类似于积层式电容器,故本发明另一实施例可用以取代现有的积层式电容器。Please refer to Figure 16, which is the result of bending the first and second outer pins 15, 16 in the embodiment shown in Figure 13, the width of the insulating package 14 is equal to the first outer pin 15 and the second The length between the section 152 and the second section 162 of the second external pin 16, the two external pins 15, 16 are respectively located on opposite sides of the insulating package 14 to serve as contacts for connecting external electronic devices, This structure is similar to a multilayer capacitor, so another embodiment of the present invention can be used to replace the existing multilayer capacitor.
本较佳实施例中,该第一外引脚24与第二外引脚25分别为锡引脚。由于本发明由外引脚24、25平贴在绝缘封装体23的表面,故使用者可直接将本发明焊接在印刷电路板上,因外引脚24、25分别为锡引脚,与焊接材料(如锡膏)的材料相同,故本发明可藉由焊接手段牢固地固定在电路板上而不易松动脱落。In this preferred embodiment, the first external pin 24 and the second external pin 25 are respectively tin pins. Since the present invention is flatly attached to the surface of the insulating package 23 by the outer pins 24, 25, the user can directly solder the present invention on the printed circuit board, because the outer pins 24, 25 are tin pins respectively, and are compatible with soldering. The materials (such as solder paste) are the same, so the present invention can be firmly fixed on the circuit board by means of soldering and is not easy to loosen and fall off.
当然,本发明还可有其他多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Of course, the present invention can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the present invention without departing from the spirit and essence of the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.
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