JP6086113B2 - Surface mount inductor and manufacturing method thereof - Google Patents
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本発明は、表面実装インダクタと、その製造方法とに関する。 The present invention relates to a surface mount inductor and a method for manufacturing the same.
特許文献１に示すように、磁性体粉末と樹脂とを混練した磁性体樹脂で巻線を封止したインダクタが、従来から広く利用されている。磁性体樹脂で巻線を封止したモールドコイルに、エポキシ樹脂などの熱硬化性樹脂とＡｇなどの金属粒子を分散させた導電性ペーストを塗布したり、金属端子を接着したりして、プリント基板等に実装するための電極を形成し、表面実装インダクタとなる。 As shown in Patent Document 1, an inductor in which a winding is sealed with a magnetic resin obtained by kneading magnetic powder and resin has been widely used. Printed by applying a conductive paste in which a thermosetting resin such as epoxy resin and metal particles such as Ag are dispersed to a molded coil whose winding is sealed with a magnetic resin, or by bonding a metal terminal. An electrode for mounting on a substrate or the like is formed to form a surface mount inductor.
導電性ペーストは高価であり、広い面積に塗布するとコストが嵩んでしまう。そのため、比較的大型な表面実装インダクタの場合は、外部端子には金属板が多用されている。そのような表面実装インダクタの製造方法として、例えば、特許文献２や特許文献３に示されるような方法が知られている。 Conductive paste is expensive, and costs increase when applied to a large area. Therefore, in the case of a relatively large surface mount inductor, a metal plate is frequently used for the external terminal. As a method for manufacturing such a surface mount inductor, for example, methods as disclosed in Patent Document 2 and Patent Document 3 are known.
特許文献２には、端末を引き出して磁性体樹脂に巻線を埋設してモールドコイルを成形し、金属板を予め所定の形状に折り曲げた金属端子をモールドコイルに貼り付けて、巻線端末と金属端子とをはんだ付けや溶接等で電気的に接続する表面実装インダクタの製造方法が記載されている。
特許文献３には、巻線端末と金属板とをはんだ付けや溶接等で電気的に接続した後に、巻線とその接続部を含む金属板の一部とを共に磁性体樹脂に埋設してモールドコイルを成形し、モールドコイルから露出している金属板をモールドコイルの外装に沿って折り曲げて金属端子とする表面実装インダクタの製造方法が記載されている。
In Patent Document 2, a terminal is pulled out, a winding is embedded in a magnetic resin, a molded coil is formed, a metal terminal in which a metal plate is bent in a predetermined shape is pasted on the molded coil, A method for manufacturing a surface-mount inductor in which a metal terminal is electrically connected by soldering or welding is described.
In Patent Document 3, after electrically connecting a winding terminal and a metal plate by soldering or welding, the winding and a part of the metal plate including the connection portion are both embedded in a magnetic resin. A method for manufacturing a surface mount inductor is described in which a mold coil is formed and a metal plate exposed from the mold coil is bent along the exterior of the mold coil to form metal terminals.
特許文献２に記載の表面実装インダクタの製造方法では、モールドコイルを作成後に金属端子を配置するため、金属端子の厚み分だけ表面実装インダクタの外形が大きくなるという問題や、金属端子は、接着剤によりモールドコイルに固定されるが、この接着剤の強度がプリント基板等への実装時のはんだ付け時の熱などにより劣化して、金属端子が脱落しやすくなるという問題がある。
また、特許文献３に記載の表面実装インダクタの製造方法では、金属端子と巻線端末との接続部がモールドコイル内に埋設されてしまうため、接続状態を目視で確認できないという問題がある。
In the method for manufacturing a surface mount inductor described in Patent Document 2, since the metal terminal is arranged after the mold coil is formed, the problem that the outer shape of the surface mount inductor increases by the thickness of the metal terminal, However, there is a problem in that the strength of the adhesive deteriorates due to heat at the time of soldering when mounted on a printed circuit board or the like, and the metal terminal is likely to drop off.
Moreover, in the manufacturing method of the surface mount inductor described in Patent Document 3, the connection portion between the metal terminal and the winding terminal is embedded in the molded coil, and thus there is a problem that the connection state cannot be visually confirmed.
本発明の表面実装インダクタは、絶縁被覆された導線を巻回した巻線を、磁性体粉末と熱硬化性樹脂とを混練して、所定の形状に仮成形した複数の仮成形体で挟み、加温とともに加圧する表面実装インダクタであって、
階段状の段差を有する一対の金属端子が、前記表面実装インダクタの外装にその厚み方向が埋設されて配置され、
前記巻線の端末は、前記面実装インダクタの底面から引き出されて、根元部で折り曲げられて、前記段差に沿って配置されていることを特徴とする。
The surface-mount inductor of the present invention is obtained by sandwiching a winding wound with an insulation-coated conductor wire between a plurality of temporary molded bodies kneaded with magnetic powder and a thermosetting resin, and temporarily molded into a predetermined shape, A surface mount inductor that pressurizes with heating,
A pair of metal terminals having a stepped step is disposed with its thickness direction embedded in the exterior of the surface mount inductor,
The end of the winding is drawn from the bottom surface of the surface-mount inductor, bent at the base, and arranged along the step.
また、本発明の表面実装インダクタの製造方法は、磁性体粉末と熱硬化性樹脂を混練して所定の形状に仮成形体を成形する工程と、
絶縁被覆された巻線の巻線端末を引き出して前記複数の仮成形体で挟み、前記仮成形体の外面に階段状の段差を有する一対の金属端子を配置し、前記巻線端末を前記金属端子外面上に配置し、加温とともに、巻線端末部を除いて加圧する工程と、
浸漬はんだによって、巻線端末と金属端子とを電気的に接続するとともに、階段状の段差を、はんだによって埋めてなだらかにする工程とを具えたことを特徴とする。
Further, the method for manufacturing a surface-mount inductor according to the present invention includes a step of kneading a magnetic powder and a thermosetting resin to form a temporary molded body into a predetermined shape,
A winding terminal of a winding coated with insulation is pulled out and sandwiched between the plurality of temporary molded bodies, a pair of metal terminals having stepped steps are arranged on the outer surface of the temporary molded body, and the winding terminal is connected to the metal A step of placing on the outer surface of the terminal, pressing together with heating, excluding the winding terminal,
The method includes the steps of electrically connecting the winding terminal and the metal terminal by immersion soldering and filling the stepped step with the solder to make it gentle.
本発明の表面実装インダクタによれば、接着剤を使用せずに表面実装インダクタを製造することができ、しかも、金属端子の一部が樹脂に埋設されているので、金属端子の脱落の虞がない。また、金属端子と巻線端末との接続部が表面実装インダクタの表面に露出しているので、接続状態を容易に目視確認することができる。 According to the surface mount inductor of the present invention, the surface mount inductor can be manufactured without using an adhesive, and a part of the metal terminal is embedded in the resin. Absent. Further, since the connection portion between the metal terminal and the winding terminal is exposed on the surface of the surface mount inductor, the connection state can be easily visually confirmed.
以下、本発明の表面実装インダクタの一実施例を、図面を用いて説明する。
図１は、本発明の表面実装インダクタの構造を説明するための、底面側を上方にした状態を示す分解斜視図であり、図２は金属端子の展開図を示す。
Hereinafter, an embodiment of a surface mount inductor according to the present invention will be described with reference to the drawings.
FIG. 1 is an exploded perspective view showing a state in which the bottom side is directed upward for explaining the structure of the surface mount inductor according to the present invention, and FIG. 2 is a development view of metal terminals.
表面実装インダクタ１０は、磁性体粉末とエポキシ樹脂等の熱硬化性樹脂とを混練した磁性体樹脂を加圧成形した仮成形体２０、３０と、仮成形体２０、３０に挟まれた絶縁被覆された導線を巻線した巻線４０と、巻線４０の両端末４１ａ、４１ｂがそれぞれ接続される薄い板状の金属板をパンチング等により打ち抜いて所定の形状に折り曲げた一対の金属端子５０ａ、５０ｂとからなる。 The surface-mount inductor 10 includes temporary molded bodies 20 and 30 obtained by pressure-molding a magnetic resin obtained by kneading a magnetic powder and a thermosetting resin such as an epoxy resin, and an insulating coating sandwiched between the temporary molded bodies 20 and 30. A pair of metal terminals 50a obtained by punching a thin plate-like metal plate to which both ends 41a and 41b of the winding 40 are respectively connected and wound into a predetermined shape by punching or the like. 50b.
仮成形体２０は、外形が直方体、内側が円筒形のポット形状で、内側底面の中央には凸部２１が設けられて、縦断面がＥ字形状をなし、外壁にはその一部が切り欠かれた開口部２２ａ、２２ｂが設けられている。 The temporary molded body 20 is a pot shape having a rectangular parallelepiped outer shape and a cylindrical shape on the inner side, and a convex portion 21 is provided at the center of the inner bottom surface. Notched openings 22a and 22b are provided.
仮成形体３０は、平面視略四角形の板状で、角部３１ａ、３１ｂが面取りされている。
巻線４０は、外形が円筒形となるように巻回され、巻線の両端末が、巻線の外形より外周に引き出され、さらに、巻線の中心軸方向に折り曲げられている。
The temporary molded body 30 is a plate having a substantially rectangular shape in plan view, and corners 31a and 31b are chamfered.
The winding 40 is wound so that the outer shape becomes a cylindrical shape, and both ends of the winding are drawn out from the outer shape of the winding to the outer periphery, and are further bent in the direction of the central axis of the winding.
図２に示すように、金属端子５０ａ、５０ｂは金属板からなり、上段面５１ａと段差面５１ｃと下段面５１ｃと側面５２とが一連に配置され、側面５２の端には舌状の埋設部５３が設けられ、上段面５１ａの端には切欠部５４が設けられている。
上段面５１ａと段差面５１ｃと下段面５１ｃとは階段状に折り曲げられ、側面５２は段差面５１ｃと同じ方向に９０°折り曲げられ、埋設部５３は下段面５１ｂと同じ方向に９０°折り曲げられている。金属端子５０ａと金属端子５０ｂとは対称形であり、段差面の高さｈは巻線４０の導線の直径より大きい。
As shown in FIG. 2, the metal terminals 50a and 50b are made of a metal plate, and an upper step surface 51a, a step surface 51c, a lower step surface 51c, and a side surface 52 are arranged in series, and a tongue-like embedded portion is disposed at the end of the side surface 52. 53 and a notch 54 is provided at the end of the upper surface 51a.
The upper step surface 51a, the step surface 51c, and the lower step surface 51c are bent stepwise, the side surface 52 is bent 90 ° in the same direction as the step surface 51c, and the embedded portion 53 is bent 90 ° in the same direction as the lower step surface 51b. Yes. The metal terminal 50 a and the metal terminal 50 b are symmetrical, and the height h of the step surface is larger than the diameter of the conducting wire of the winding 40.
本発明の表面実装インダクタの組み立て方法を説明する図であり、図４は表面実装インダクタの製造に用いる金型のパンチの側の斜視図である。以下、図３（ａ）〜（ｇ）の順に本発明の表面実装インダクタの組み立て方法を、図４とともに説明する。 FIG. 4 is a diagram illustrating a method for assembling a surface mount inductor according to the present invention, and FIG. 4 is a perspective view of a die punch side used for manufacturing a surface mount inductor. Hereinafter, the method for assembling the surface mount inductor of the present invention will be described with reference to FIG. 4 in the order of FIGS.
（ａ）巻線端末４１ａ、４１ｂが、開口部２２ａ、２２ｂに位置するように、巻線４０を仮成形体２０に収納する。 (A) The winding 40 is accommodated in the temporary molded body 20 so that the winding terminals 41a and 41b are positioned in the openings 22a and 22b.
（ｂ）仮成形体３０の対向する側面に、金属端子５０ａ、５０ｂを、角部３１ａ、３１ｂと切欠部５４、５４とが、それぞれ一致するように装着する。 (B) The metal terminals 50a and 50b are mounted on the opposing side surfaces of the temporary molded body 30 so that the corner portions 31a and 31b and the cutout portions 54 and 54 coincide with each other.
（ｃ）金属端子５０ａ、５０ｂの切欠部５４から巻線端末４１ａ、４１ｂがそれぞれ導出するように、仮成形体３０と仮成形体２０を重ねる。 (C) The temporary molded body 30 and the temporary molded body 20 are overlapped so that the winding terminals 41a and 41b are led out from the notches 54 of the metal terminals 50a and 50b, respectively.
（ｄ）、（ｅ）仮成形体から露出している巻線端末４１ａ、４１ｂを、仮成形体３０から引き出された根元部４２で折り曲げ、金属端子５０ａ、５０ｂの上面の、段差面５１ｃに沿って載置する。以降、図３（ｅ）の状態を、本成形前の表面実装インダクタ１０’’と称する。 (D), (e) The winding terminals 41a and 41b exposed from the temporary molded body are bent at the base portion 42 drawn out from the temporary molded body 30, and are formed on the step surface 51c on the upper surfaces of the metal terminals 50a and 50b. Place along. Hereinafter, the state of FIG. 3E is referred to as a surface-mount inductor 10 ″ before the main molding.
（ｆ）本成形前の表面実装インダクタ１０’’を、金型内で、加温とともに加圧（以降、本成形と称する）して、端子接続をする前の本成形後の表面実装インダクタ１０’（以降、本成形後の表面実装インダクタと称する）が得られる。この金型は図４に示すように、パンチ９０側には、巻線端末４１ａ、４１ｂを収納するためのポケット９１が設けられていて、表面実装インダクタ１０’の加圧時に巻線端末４１ａ、４１ｂは加圧はされない。ポケット９１は、巻線端末の位置ずれを許容できるように、巻線より僅かに広くなっている。そのため、磁性体樹脂の一部が根元部４２側からポケット９１に入り込み、根元部４２が膨出部７０によって埋め盛りされる。 (F) The surface-mounted inductor 10 ″ before the main molding is pressurized (hereinafter referred to as “main molding”) in the mold together with heating (hereinafter referred to as main molding), and the surface-mounted inductor 10 after the main molding before terminal connection is made. '(Hereinafter referred to as a surface-mounted inductor after the main forming) is obtained. As shown in FIG. 4, the die is provided with pockets 91 for accommodating the winding terminals 41a and 41b on the punch 90 side, and the winding terminals 41a, 41b is not pressurized. The pocket 91 is slightly wider than the winding so as to allow displacement of the winding terminal. Therefore, a part of the magnetic resin enters the pocket 91 from the root portion 42 side, and the root portion 42 is buried by the bulging portion 70.
（ｇ）端子接続前の表面実装インダクタ１０’を浸漬はんだすると、巻線端末４１ａ、４１ｂの絶縁被覆が除去されるととともに巻線端末４１ａ、４１ｂと金属端子５０ａ、５０ｂとがそれぞれ電気的に接続され、段差面５１ｃに沿って配置された巻線端末をはんだ８０で埋めるとともに段差をなだらかした表面実装インダクタ１０が得られる。 (G) When the surface mount inductor 10 ′ before terminal connection is immersed and soldered, the insulation coating of the winding terminals 41a and 41b is removed, and the winding terminals 41a and 41b and the metal terminals 50a and 50b are electrically connected to each other. The surface-mount inductor 10 is obtained in which the winding terminals connected and disposed along the step surface 51c are filled with the solder 80 and the step is smoothed.
図５（ａ）は、本成形前の表面実装インダクタ１０’’の縦断面図（図３（ｅ）においてＡ’’−Ａ’’で示す）であり、図５（ｂ）は、本成形後の表面実装インダクタ１０’の同じ位置の縦断面図（図３（ｆ）においてＡ’−Ａ’で示す）であり、図５（ｃ）は、浸漬はんだ後の表面実装インダクタ１０の同じ位置の縦断面図（図３（ｇ）においてＡ０−Ａ０で示す）である。 FIG. 5A is a longitudinal sectional view (indicated by A ″ -A ″ in FIG. 3E) of the surface mount inductor 10 ″ before the main forming, and FIG. 5B shows the main forming. FIG. 5C is a longitudinal sectional view (shown by A′-A ′ in FIG. 3F) of the same position of the subsequent surface mount inductor 10 ′, and FIG. 5C is the same position of the surface mount inductor 10 after the immersion soldering. FIG. 3 is a vertical sectional view (indicated by A 0 -A 0 in FIG. 3G).
図５（ａ）に示すように、本成形前の表面実装インダクタ１０’’は、金属端子５０ａ、５０ｂの上にそれぞれ巻線端末４１ａ、４１ｂが載置されており、仮成形体の内部には、巻線４０と仮成形体２０、３０との間の空隙６０、金属端子５０ａ、５０ｂの段差面５１ｃの内部側の空隙６１、開口部２２ａ、２２ｂの空隙（図示せず）などが存在している。 As shown in FIG. 5 (a), in the surface-mounted inductor 10 ″ before the main molding, winding terminals 41a and 41b are placed on the metal terminals 50a and 50b, respectively, Includes a gap 60 between the winding 40 and the temporary molded bodies 20, 30, a gap 61 on the inner side of the stepped surface 51c of the metal terminals 50a, 50b, a gap (not shown) of the openings 22a, 22b, and the like. doing.
図５（ｂ）に示すように、本成形後の表面実装インダクタ１０’は、加圧により仮成形体２０と仮成形体３０とが崩れて空隙６０、６１などを埋めて一体になるとともに、金属端子５０ａ、５０ｂの埋設部５３は、モールドコイル１１内部に埋設され、金属端子５０ａ、５０ｂは、その厚み分がモールドコイル１１に減り込む。そして、加温により熱硬化性樹脂が完全に硬化される。なお、加圧により磁性体樹脂がポケット内への侵入するが、磁性体樹脂は流動性は悪く、また、加温により硬化すると流動性は失われてしまうため、ポケットが磁性体樹脂で満たされることはない。 As shown in FIG. 5 (b), the surface-mounted inductor 10 ′ after the main molding is integrated with the temporary molded body 20 and the temporary molded body 30 collapsed by pressurization, filling the gaps 60 and 61, and the like. The embedded portions 53 of the metal terminals 50 a and 50 b are embedded inside the molded coil 11, and the thickness of the metal terminals 50 a and 50 b is reduced to the molded coil 11. Then, the thermosetting resin is completely cured by heating. The magnetic resin penetrates into the pocket by pressurization, but the magnetic resin has poor fluidity, and the fluidity is lost when cured by heating, so the pocket is filled with the magnetic resin. There is nothing.
図５（ｃ）に示すように、浸漬はんだ後の表面実装インダクタ１０は、段差に沿って配置された巻線端末をはんだ８０で埋めるとともに段差が、なだらかにされている。 As shown in FIG. 5C, in the surface-mounted inductor 10 after the immersion soldering, the winding terminals arranged along the step are filled with the solder 80 and the step is made gentle.
図６は、図３（ｆ）においてＢ−Ｂで示した縦断面図の根元部４２付近を拡大した図である。
図６に示すように、根元部４２付近では、巻線端末の折り曲げられた部位を樹脂が埋めるため、スプリングバックの影響を軽減することができる。
FIG. 6 is an enlarged view of the vicinity of the root portion 42 in the longitudinal sectional view indicated by BB in FIG.
As shown in FIG. 6, in the vicinity of the root portion 42, the resin fills the bent portion of the winding terminal, so that the influence of the springback can be reduced.
図７は、表面実装インダクタ１０の、図３（ｇ）にＡ−Ａで示した位置の縦断面の写真であり、図８は、表面実装インダクタ１０の、図３（ｇ）にＡ１−Ａ１で示した位置の縦断面の写真において、膨出部７０を拡大した写真である。表面実装インダクタは、横６ｍｍ×縦６ｍｍ×高さ３ｍｍ、巻線に用いる導線の直径は０．３２ｍｍ、燐青銅製の金属端子の厚みは０．０８ｍｍであり、本成形の圧力は１０Ｋｇ／ｃｍ２である。 7 is a photograph of a vertical cross section of the surface mount inductor 10 at the position indicated by AA in FIG. 3G, and FIG. 8 is a view of A 1 − of the surface mount inductor 10 in FIG. in photo of a longitudinal section of the positions indicated by a 1, it is a photograph of an enlarged bulge portion 70. The surface mount inductor is 6mm wide x 6mm long x 3mm high, the wire diameter used for the winding is 0.32mm, the thickness of the phosphor bronze metal terminal is 0.08mm, and the pressure of this molding is 10Kg / cm 2 .
図７より、段差に沿って配置された巻線端末が半田で埋められ、金属端子はその厚み方向が表面実装インダクタに減り込んでいることがわかる。また、図８より、根元部が樹脂に埋め盛りされていることがわかる。 FIG. 7 shows that the winding terminals arranged along the step are filled with solder, and the thickness direction of the metal terminal is reduced to the surface mount inductor. Further, FIG. 8 shows that the root portion is buried in the resin.
上記した表面実装インダクタは、金属端子の一部はモールドコイルに埋設されているため、金属端子の脱落の虞もなく、表面実装インダクタの外装で金属端子と巻線端末の接続部が接続されているため、接続状態を目視で確認可能である。
また、金属端子は厚み方向がモールドコイルに減り込んでいるので、表面実装インダクタの外形が金属端子により大きくなることがない。
さらに、巻線端末を折り曲げた根元部が樹脂に埋め盛りされているので、巻線端末のスプリングバックによる、巻線端末と金属端子とを電気的に接続する前の巻線端末の位置ずれ、基板実装時のはんだの再溶融による巻線端末と金属端子との接続外れを抑制することがきる。
In the surface mount inductor described above, a part of the metal terminal is embedded in the molded coil, so there is no risk of the metal terminal falling off, and the connection part between the metal terminal and the winding terminal is connected by the exterior of the surface mount inductor. Therefore, the connection state can be visually confirmed.
Further, since the thickness direction of the metal terminal is reduced to the mold coil, the outer shape of the surface mount inductor is not increased by the metal terminal.
Furthermore, since the root portion where the winding terminal is bent is buried in the resin, the position of the winding terminal before the electrical connection between the winding terminal and the metal terminal due to the spring back of the winding terminal is shifted, It is possible to suppress disconnection between the winding terminal and the metal terminal due to remelting of the solder when mounting on the board.
なお、舌部の形状は種々選択可能である。たとえば、先端部が幅広な形状にしたり、また、孔を設けたりすることにより、さらに金属端子が脱落し難い表面実装インダクタとすることができる。 Various shapes of the tongue can be selected. For example, by making the tip portion wide or providing a hole, it is possible to provide a surface-mount inductor in which the metal terminal is more difficult to drop off.
１０、１０’、１０’’ 表面実装インダクタ
１１ モールドコイル
２０、３０ 仮成形体
２１ 凸部
２２ａ、２２ｂ 開口部
３１ａ、３１ｂ 面取部
４０ 巻線
４１ａ、４１ｂ 巻線端末
４２ 根元部
５０ａ、５０ｂ 金属端子
５１ａ 上段面
５１ｂ 下段面
５１ｃ 段差面
５２ 側面
５３ 埋設部
５４ 切欠部
６０、６１ 空隙
７０ 膨出部
８０ はんだ
９０ パンチ
９１ ポケット
10, 10 ', 10''surface mount inductor 11 Mold coil 20, 30 Temporary molded body 21 Convex portions 22a, 22b Openings 31a, 31b Chamfered portion 40 Winding 41a, 41b Winding terminal 42 Root portion 50a, 50b Metal Terminal 51a Upper step surface 51b Lower step surface 51c Step surface 52 Side surface 53 Buried portion 54 Notch portion 60, 61 Gap 70 Expanded portion 80 Solder 90 Punch 91 Pocket
Claims (2)
該表面実装インダクタの外装の底面に一対の凸部が形成され、
一対の金属端子が、それぞれ巻線の端末を引き出すための切欠部を有する上断面と段差面と下段面で構成される階段状の段差と、該段差から該段差面と平行に折り曲げられた側面と、該側面から該下段面と平行に折り曲げられた埋設部を備え、該埋設部が該表面実装インダクタの内部に埋設され、該階段状の段差と該側面部が該表面実装インダクタの外装に、その厚み方向が埋設されて配置され、
該巻線の端末は、該金属端子の切欠部から該表面実装インダクタの底面に引き出して、根元部で折り曲げられて、該段差に沿って配置され、該根元部が該表面実装インダクタの外装によって該段差内に固定され、
該段差に沿って配置された該巻線の端末が、該金属端子の下段面と段差面の接続部分を覆う様に形成されたはんだに埋設されていることを特徴とする表面実装インダクタ。 A surface-mount inductor that winds a wire wound with an insulation-coated conductive wire between a plurality of temporary molded bodies kneaded with magnetic powder and a thermosetting resin and pre-formed into a predetermined shape, and pressurizes with heating. Because
A pair of convex portions are formed on the bottom surface of the exterior of the surface mount inductor,
A pair of metal terminals, each of which has a stepped step composed of an upper cross section having a notch for drawing out the end of the winding, a step surface, and a lower step surface, and side surfaces bent from the step in parallel to the step surface And an embedded portion bent from the side surface in parallel with the lower step surface, the embedded portion embedded in the surface mount inductor, and the stepped step and the side surface portion on the exterior of the surface mount inductor. , The thickness direction is buried and arranged,
Terminal of the winding, and pull out the bottom of the surface mount inductor from the notch portion of the metal terminal, is bent at the base portion, are disposed along the step,該根source unit is surface mount inductor Fixed in the step by the exterior of
A surface-mount inductor characterized in that a terminal of the winding arranged along the step is embedded in solder formed so as to cover a connection portion between the lower step surface and the step surface of the metal terminal .
絶縁被覆された導線を巻回した巻線が、その端末を引き出した状態で複数の仮成形体で挟み込み、該仮成形体の外面に、それぞれ巻線の端末を引き出すための切欠部を有する上断面と段差面と下段面で構成される階段状の段差と、該段差から該段差面と平行に折り曲げられた側面と、該側面から該下段面と平行に折り曲げられた埋設部を備えた一対の金属端子を取り付け、該巻線端末を該金属端子の切欠部から該仮成形体の底面に引き出して、該金属端子外面上に配置する工程と、
これらを加温とともに、巻線端末部を除いて加圧して、該一対の金属端子の埋設部が表面実装インダクタの内部に埋設されると共に、該表面実装インダクタの外装の底面に一対の凸部が形成され、該一対の金属端子の段差と側面が該表面実装インダクタの外装に、その厚み方向が埋設されて配置され、該巻線の端末が、該金属端子の段差に沿って配置されて、該金属端子の切欠部から該表面実装インダクタの底面に引き出された該根元部が該表面実装インダクタの外装によって該段差内に固定される工程及び、
該段差に沿って配置された該巻線の端末が、該金属端子の下段面と段差面の接続部分を覆う様に形成されたはんだに埋設する工程と、
を具えたことを特徴とする表面実装インダクタの製造方法。 As engineering molding the preliminarily molded into a predetermined shape by kneading magnetic powder and a thermosetting resin,
Windings wound insulation coated conductor wire, nipping by a plurality of preformed body in a state that draw out the terminal, the outer surface of the preformed body, the notch portion for drawing the terminals of each winding A stepped step composed of an upper cross section, a step surface and a lower step surface, a side surface bent from the step in parallel to the step surface, and a buried portion bent from the side surface in parallel to the lower step surface a step of mounting the pair of metal terminals, the winding terminal is drawn out to the bottom of the provisional formed member from the notch portion of the metal terminal is disposed on the metal terminal outer surface was,
These together with heating, under pressure except for the winding terminal portion, said with embedded portions of the pair of metal terminals are embedded in the surface mount inductors, the pair of exterior bottom of the surface mount inductor convex A step is formed, and the step and side surfaces of the pair of metal terminals are arranged in the exterior of the surface-mount inductor with the thickness direction embedded therein, and the ends of the windings are arranged along the steps of the metal terminals. A step of fixing the root portion drawn out from the notch portion of the metal terminal to the bottom surface of the surface mount inductor in the step by an exterior of the surface mount inductor;
A step of embedding in a solder formed so that a terminal of the winding disposed along the step covers a connection portion between the lower step surface and the step surface of the metal terminal ;
A method of manufacturing a surface mount inductor, comprising:
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