JP6172214B2 - Manufacturing method of surface mount inductor - Google Patents

Manufacturing method of surface mount inductor Download PDF

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JP6172214B2
JP6172214B2 JP2015110971A JP2015110971A JP6172214B2 JP 6172214 B2 JP6172214 B2 JP 6172214B2 JP 2015110971 A JP2015110971 A JP 2015110971A JP 2015110971 A JP2015110971 A JP 2015110971A JP 6172214 B2 JP6172214 B2 JP 6172214B2
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coil
tablet
winding
mount inductor
molded body
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JP2016225479A (en
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千寿 境
千寿 境
佐々森 邦夫
邦夫 佐々森
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Murata Manufacturing Co Ltd
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Description

本発明は、導線を巻回して形成したコイルと、樹脂と磁性材料を含む封止材を用いて形成され、コイルを内蔵する成形体を備えた表面実装インダクタの製造方法に関する。   The present invention relates to a method of manufacturing a surface-mount inductor that includes a coil formed by winding a conductive wire and a sealing material that includes a resin and a magnetic material, and includes a molded body that incorporates the coil.

従来の表面実装インダクタに、図10に示す様に、導線を巻回してコイル101を形成し、このコイル101を磁性粉末と樹脂を含む封止材で形成された成形体102内に埋設し、コイル101を成形体102の表面に外部端子104に接続したものがある(例えば、特許文献1を参照。)。この表面実装インダクタは、導線を巻回して形成したコイル101をタブレットに載置し、コイル101の引き出し端部101bをタブレットの柱状凸部の外側面に沿わせて、図11に示す様に、コイル101の引き出し端部101bが成型金型110の内壁面とタブレットの柱状凸部の外側面の間に挟まれるようにコイルとタブレットを成型金型内に配置し、樹脂成形法もしくは圧粉成形法によりコイル101を内蔵する成形体102が形成され、この成形体の端面と端面に隣接する4つの面に外部端子104が形成される。   As shown in FIG. 10, a coil 101 is formed by winding a conductive wire on a conventional surface mount inductor, and this coil 101 is embedded in a molded body 102 formed of a sealing material containing magnetic powder and resin. There is one in which the coil 101 is connected to the external terminal 104 on the surface of the molded body 102 (see, for example, Patent Document 1). In this surface mount inductor, a coil 101 formed by winding a conductive wire is placed on a tablet, and the leading end 101b of the coil 101 is placed along the outer surface of the columnar protrusion of the tablet, as shown in FIG. The coil and the tablet are placed in the molding die so that the lead-out end portion 101b of the coil 101 is sandwiched between the inner wall surface of the molding die 110 and the outer side surface of the columnar convex portion of the tablet. A molded body 102 containing the coil 101 is formed by this method, and external terminals 104 are formed on the end surface of the molded body and four surfaces adjacent to the end surface.

特開2010−245473号公報JP 2010-245473 A

近年、スマートフォンやウェアラブル端末等の電子機器の更なる小型化に伴い、この種の表面実装インダクタが高密度で実装される様になってきている。
この様な状況の中、従来の表面実装インダクタは、外部端子104が成形体102の5つの面に形成されているため、上面に形成された外部端子がシールド板と接触するという問題があった。この様な問題を解決するために、外部端子をL字状に形成することが行われる(例えば、特開2013−98282号公報、特開2013−98283号公報)。しかしながら、この様な従来の表面実装インダクタは、外部端子が成形体の端面や側面にも形成されているために、端面や側面に形成された外部電極が周囲の電子部品の外部電極と接触したり、表面実装インダクタを電子機器の基板に実装し、回路パターンに半田付けした際に、はんだフィレットが形成されて隣接する電子部品との間にはんだブリッジが発生したりしてショートする可能性があった。
従って、従来の表面実装インダクタは、電子部品が高密度で実装される電子機器に用いることができなかった。
In recent years, along with the further miniaturization of electronic devices such as smartphones and wearable terminals, this type of surface-mount inductor has been mounted with high density.
Under such circumstances, the conventional surface mount inductor has a problem in that the external terminals 104 are formed on the five surfaces of the molded body 102, so that the external terminals formed on the upper surface come into contact with the shield plate. . In order to solve such a problem, external terminals are formed in an L shape (for example, JP 2013-98282 A, JP 2013-98283 A). However, in such a conventional surface mount inductor, since the external terminals are also formed on the end face and side surface of the molded body, the external electrodes formed on the end face and side surfaces are in contact with the external electrodes of the surrounding electronic components. When a surface mount inductor is mounted on an electronic device board and soldered to a circuit pattern, a solder fillet may be formed and a solder bridge may occur between adjacent electronic components, resulting in a short circuit. there were.
Therefore, the conventional surface-mount inductor cannot be used for an electronic device in which electronic components are mounted at a high density.

本発明は、電子機器において高密度で実装することが可能な表面実装インダクタを形成することができる表面実装インダクタの製造方法を提供することを目的とする。   An object of the present invention is to provide a method for manufacturing a surface-mount inductor capable of forming a surface-mount inductor that can be mounted with high density in an electronic device.

本発明は、導線を巻回して形成したコイルと、樹脂と磁性材料を含む封止材を用いて形成され、コイルを内蔵する成形体を備えた表面実装インダクタの製造方法において、導線を巻回した巻回部と、巻回部から引き出された引き出し端部を備え、引き出し端部に段差が形成されたコイルを形成し、封止材を平板上にコイルの巻軸を挿入するための凸部と凸部の周囲に位置する壁部を設けた形状に予備成形されたタブレットを形成し、コイルの巻回部をタブレットの凸部に挿入し、引き出し端部の先端部を壁部の上面に配置してコイルをタブレット内に収納し、タブレットを成型金型内に配置し、成型金型を用いてコイルを内蔵し、コイルの引き出し端部の先端部表面が実装面に露出、延在した成形体を形成し、成形体の実装面においていずれの辺からも離間して外部端子が形成される。   The present invention relates to a method of manufacturing a surface-mount inductor formed by using a coil formed by winding a conductive wire and a sealing material including a resin and a magnetic material, and including a molded body incorporating the coil. A coil having a winding portion and a drawing end portion drawn out from the winding portion, having a step formed at the drawing end portion, and a convex member for inserting the coil winding shaft on the flat plate. A pre-molded tablet is formed in a shape provided with a wall portion located around the periphery and the convex portion, the coil winding portion is inserted into the convex portion of the tablet, and the tip end of the drawer end is the upper surface of the wall portion Place the coil in the tablet, place the tablet in the molding die, incorporate the coil using the molding die, and expose and extend the tip end surface of the coil drawing end to the mounting surface Forming the molded body, and on the mounting surface of the molded body, External terminals are formed apart from the side.

本発明は、導線を巻回して形成したコイルと、樹脂と磁性材料を含む封止材を用いて形成され、コイルを内蔵する成形体を備えた表面実装インダクタの製造方法において、導線を巻回した巻回部と、巻回部から引き出された引き出し端部を備え、引き出し端部に段差が形成されたコイルを形成し、封止材を平板上にコイルの巻軸を挿入するための凸部と凸部の周囲に位置する壁部を設けた形状に予備成形されたタブレットを形成し、コイルの巻回部をタブレットの凸部に挿入し、引き出し端部の先端部を壁部の上面に配置してコイルをタブレット内に収納し、タブレットを成型金型内に配置し、成型金型を用いてコイルを内蔵し、コイルの引き出し端部の先端部表面が実装面に露出、延在した成形体を形成し、成形体の実装面においていずれの辺からも離間して外部端子が形成されるので、電子機器において高密度で実装することが可能な表面実装インダクタを形成することができる。   The present invention relates to a method of manufacturing a surface-mount inductor formed by using a coil formed by winding a conductive wire and a sealing material including a resin and a magnetic material, and including a molded body incorporating the coil. A coil having a winding portion and a drawing end portion drawn out from the winding portion, having a step formed at the drawing end portion, and a convex member for inserting the coil winding shaft on the flat plate. A pre-molded tablet is formed in a shape provided with a wall portion located around the periphery and the convex portion, the coil winding portion is inserted into the convex portion of the tablet, and the tip end of the drawer end is the upper surface of the wall portion Place the coil in the tablet, place the tablet in the molding die, incorporate the coil using the molding die, and expose and extend the tip end surface of the coil drawing end to the mounting surface Forming the molded body, and on the mounting surface of the molded body, Since the external terminals spaced is also formed from the side, it is possible to form a surface mount inductor capable of high density mounting in electronic equipment.

本発明の表面実装インダクタの実施例を示す斜視図である。It is a perspective view which shows the Example of the surface mount inductor of this invention. 本発明の表面実装インダクタの第1の実施例で使用されるコイルの斜視図である。It is a perspective view of the coil used in the 1st example of the surface mount inductor of the present invention. 本発明の表面実装インダクタの第1の実施例で使用されるタブレットの斜視図である。It is a perspective view of the tablet used in the 1st example of the surface mount inductor of the present invention. 本発明の表面実装インダクタの第1の実施例のコイルとタブレットの配置を示す斜視図である。It is a perspective view which shows arrangement | positioning of the coil and tablet of 1st Example of the surface mount inductor of this invention. 本発明の表面実装インダクタの第1の実施例の成形体の成形工程を説明する断面図である。It is sectional drawing explaining the formation process of the molded object of the 1st Example of the surface mount inductor of this invention. 本発明の表面実装インダクタの第2の実施例で使用されるコイルの斜視図である。It is a perspective view of the coil used in the 2nd Example of the surface mount inductor of this invention. 本発明の表面実装インダクタの第2の実施例で使用されるタブレットの斜視図である。It is a perspective view of the tablet used in the 2nd example of the surface mount inductor of the present invention. 本発明の表面実装インダクタの第2の実施例の成形体の成形工程を説明する斜視図である。It is a perspective view explaining the formation process of the molded object of the 2nd Example of the surface mount inductor of this invention. 本発明の表面実装インダクタの第2の実施例の成形体の成形工程を説明する断面図である。It is sectional drawing explaining the formation process of the molded object of the 2nd Example of the surface mount inductor of this invention. 従来の表面実装インダクタの斜視図である。It is a perspective view of the conventional surface mount inductor. 従来の表面実装インダクタの製造工程を説明する断面図である。It is sectional drawing explaining the manufacturing process of the conventional surface mount inductor.

本発明の表面実装インダクタは、導線を巻回して形成したコイルと、樹脂と磁性材料を含む封止材を用いて形成され、コイルを内蔵する成形体を備える。コイルは、導線を巻回した巻回部と、巻回部から引き出された引き出し端部を備え、引き出し端部に段差が形成される。成形体は、封止材を平板上にコイルの巻軸を挿入するための凸部と凸部の周囲に位置する壁部を設けた形状に予備成形されたタブレットを用いて形成される。コイルは、巻回部の巻軸がタブレットの凸部に挿入され、引き出し端部の先端部がタブレットの壁部の上面に配置される。このコイルが収納されたタブレットは、成型金型内に配置され、圧縮成形することにより、コイルを内蔵し、コイルの引き出し端部の先端部表面が実装面に露出、延在した成形体が形成される。この成形体の実装面においていずれの辺からも離間して外部端子が形成される。
従って、本発明の表面実装インダクタは、成形体の底面以外に外部端子が形成されることがなく、しかも底面に隣接する面に外部端子が露出することがないので、外部端子がシールド板や周囲の電子部品の外部電極と接触したり、電子機器の基板の回路パターンに半田付けした際に、はんだフィレットが形成されたりすることがない。
The surface-mount inductor of the present invention includes a coil formed by winding a conductive wire, and a molded body that is formed using a sealing material including a resin and a magnetic material, and that incorporates the coil. The coil includes a winding portion around which the conductive wire is wound and a lead-out end portion drawn out from the winding portion, and a step is formed at the lead-out end portion. The molded body is formed using a tablet that is preformed into a shape in which a sealing material is provided on a flat plate with a convex portion for inserting a winding axis of a coil and a wall portion positioned around the convex portion. In the coil, the winding shaft of the winding part is inserted into the convex part of the tablet, and the leading end part of the drawer end part is disposed on the upper surface of the wall part of the tablet. The tablet in which this coil is stored is placed in a molding die and compressed to form a built-in coil, forming a molded body in which the tip end surface of the coil drawing end is exposed and extended. Is done. External terminals are formed on the mounting surface of the molded body so as to be separated from any side.
Therefore, the surface mount inductor of the present invention has no external terminals other than the bottom surface of the molded body, and the external terminals are not exposed on the surface adjacent to the bottom surface. The solder fillet is not formed when it is in contact with the external electrode of the electronic component or soldered to the circuit pattern of the board of the electronic device.

以下、本発明の表面実装インダクタの製造方法の実施例を図1乃至図9を参照して説明する。
図1は本発明の表面実装インダクタの実施例を示す斜視図、図2は本発明の表面実装インダクタの第1の実施例で使用されるコイルの斜視図である。
図1、図2において、11はコイル、12は成形体である。
コイル11は、導線をその両端部が外周に位置するように2段の外外巻きに巻回した巻回部11aと、巻回部11aから引き出された引き出し端部11bを備えた空芯コイルが形成される。導線は断面が平角状の平角線が用いられる。引き出し端部11bは、巻回部11aの同側面から引き出され、巻回部11aの底面側に一度折り曲げた後、先端部が巻回部11aの底面と平行に巻回部11aから離れる方向に延在する様に折り曲げられる。これにより引き出し端部11bに段差が形成される。
成形体12は、樹脂と磁性材料を含む封止材を用いてコイル11を内包する様に形成される。封止材としては、磁性材料として例えば鉄系の金属磁性粉末を、樹脂として例えばエポキシ樹脂をそれぞれ用い、これらを混合したものが用いられる。この成形体12の底面には、コイル11の引き出し端部11bの先端部の表面が露出する。また、成形体12の底面には、このコイル11の引き出し端部11bの先端部の表面を覆い、かつ、底面のいずれの辺からも離間して1対の外部端子14が形成され、それぞれコイル11の引き出し端部11bと接続される。
Hereinafter, an embodiment of a method for manufacturing a surface mount inductor according to the present invention will be described with reference to FIGS.
FIG. 1 is a perspective view showing an embodiment of the surface mount inductor according to the present invention, and FIG. 2 is a perspective view of a coil used in the first embodiment of the surface mount inductor according to the present invention.
1 and 2, 11 is a coil, and 12 is a molded body.
The coil 11 is an air-core coil including a winding part 11a in which a conductive wire is wound in two stages of outer and outer windings so that both ends thereof are positioned on the outer periphery, and a lead-out end part 11b drawn from the winding part 11a. Is formed. The conducting wire is a rectangular wire having a rectangular cross section. The lead-out end portion 11b is pulled out from the same side surface of the winding portion 11a, and once bent to the bottom surface side of the winding portion 11a, the leading end portion is parallel to the bottom surface of the winding portion 11a and away from the winding portion 11a. It is bent so as to extend. Thereby, a level | step difference is formed in the drawer | drawing-out edge part 11b.
The molded body 12 is formed so as to enclose the coil 11 using a sealing material including a resin and a magnetic material. As the sealing material, for example, an iron-based metal magnetic powder is used as a magnetic material, and an epoxy resin is used as a resin, and a mixture thereof is used. On the bottom surface of the molded body 12, the surface of the leading end portion of the lead-out end portion 11b of the coil 11 is exposed. Further, a pair of external terminals 14 are formed on the bottom surface of the molded body 12 so as to cover the surface of the leading end portion of the lead-out end portion 11b of the coil 11 and to be separated from any side of the bottom surface. 11 is connected to the drawer end 11b.

この様な表面実装インダクタは以下の様にして形成される。まず、コイル11とタブレット13が準備される。コイル11は、図2に示す様に、断面が平角状の絶縁被覆が施された導線を、幅広面が巻軸と平行な状態で、導線の両端が外周に位置する様に2段の外外巻きに巻回して巻回部11aを形成した後、導線の両端を巻回部の外周から引き出して引き出し端部11bを形成して空芯コイルが形成される。本実施例で用いる導線は絶縁被膜としてイミド変成ポリウレタン層を有するものを用いた。絶縁被膜は、ポリアミド系やポリエステル系などでもよく、耐熱温度が高いものの方が好ましい。このコイル11の引き出し端部11bは、巻回部11aの同側面から引き出されて互いに反対方向に延在した状態で、それぞれ巻回部11aの底面側に一度折り曲げた後、先端部が巻回部11aの底面と平行になる様に折り曲げられる。これにより引き出し端部11bに段差が形成される。
タブレット13は、磁性材料として例えば鉄系の金属磁性粉末を、樹脂として例えばエポキシ樹脂をそれぞれ用い、これらを混合した封止材を用いて、図3に示す様に、平板上にコイルの巻軸を挿入するための凸部13aと凸部13aの周囲に位置する壁部13bを設け、コイル11を収納するための有底のスペースを有する形状に予備成形して形成される。この時、タブレット13の内底面から壁部13bの上面までの距離は、コイル11の引き出し端部11bの先端部の上面から巻回部11aの上面までの距離よりも大きく形成される。
次に、コイル11の上面を下にした状態で、図4に示す様に、巻回部11aの空芯部分をタブレット13の凸部13aに挿入し、引き出し端部11bの先端部を壁部13bの上面に配置することにより、コイル11をタブレット13内に収納する。この時、コイル11の巻回部11aとタブレット13の内底面間には空間が形成される。
続いて、図5(A)に示す様に、このコイル11が収納されたタブレット13を成型金型50内に配置する。成型金型50は、本実施例では、第1の上型51a、第2の上型51b、下型52を有し、これらを組み合わせることによりキャビティが形成されるものを用いた。また、タブレット13は、壁部13bの上面が上に向いた状態で金型内に配置される。
さらに、図5(B)に示す様に、この成型金型50のキャビティにパンチPをセットし、加熱した状態で圧縮することにより、タブレットのスペースに封止材を充填すると共に、磁性材料の密度を上昇させて、コイル11が埋設された成形体12が形成される。この成形体12のパンチPが接する面には、コイル11の引き出し端部11bの先端部の表面が露出する。このとき、コイル11の引き出し端部11bの先端部は、その表面が成形体12の表面と同一面に位置した状態で成形体12のパンチPが接する面の幅方向に延在する。なお、コイル11が収納されたタブレット13を成型金型50内に配置する際に、成型金型50を封止材の軟化温度以上に予熱しておいてもよい。
次に、得られた成形体12を成形金型50より取り出し、成形体12の表面に露出するコイル11の引き出し端部11bの先端部の表面の絶縁被膜を剥離した後、図5(C)に示す様に、成形体12のコイル11の引き出し端部11bの先端部が露出した面に外部端子14が形成される。外部端子14は、コイル11の引き出し端部11bの先端部の表面を覆った状態で、成形体12の幅方向に延在し、両端が隣接する面に露出しない様に成形体12の幅方向の長さよりも短く形成される。この時、外部端子14は、成形体12に銀等の導電材料を用いて下地電極を形成し、これにニッケルと錫を含有する導電材料によりメッキを施して形成すると良い。
この様に形成された成形体12は、外部端子14が形成された面が底面として用いられ、この面が電子機器の基板等に実装され、外部端子14が基板等の配線にはんだ付けされる。
Such a surface mount inductor is formed as follows. First, the coil 11 and the tablet 13 are prepared. As shown in FIG. 2, the coil 11 is a two-step outer conductor with a rectangular insulation coating and a wide surface parallel to the winding axis, with both ends of the conductor positioned on the outer periphery. After winding the outer winding to form the winding part 11a, both ends of the conducting wire are pulled out from the outer periphery of the winding part to form a lead-out end part 11b to form an air-core coil. The conducting wire used in this example used an insulating coating having an imide-modified polyurethane layer. The insulating coating may be polyamide or polyester, and preferably has a high heat resistance temperature. The leading end portion 11b of the coil 11 is pulled out from the same side surface of the winding portion 11a and extends in the opposite direction, and is bent once on the bottom surface side of the winding portion 11a. It is bent so as to be parallel to the bottom surface of the portion 11a. Thereby, a level | step difference is formed in the drawer | drawing-out edge part 11b.
The tablet 13 uses, for example, an iron-based metal magnetic powder as a magnetic material, and an epoxy resin as a resin, and a sealing material obtained by mixing them, as shown in FIG. Are formed by pre-molding into a shape having a bottomed space for housing the coil 11, by providing a convex portion 13 a for inserting a coil and a wall portion 13 b positioned around the convex portion 13 a. At this time, the distance from the inner bottom surface of the tablet 13 to the upper surface of the wall portion 13b is formed larger than the distance from the upper surface of the leading end portion of the leading end portion 11b of the coil 11 to the upper surface of the winding portion 11a.
Next, with the upper surface of the coil 11 down, as shown in FIG. 4, the air core part of the winding part 11a is inserted into the convex part 13a of the tablet 13, and the leading end part of the drawer end part 11b is the wall part. The coil 11 is accommodated in the tablet 13 by arrange | positioning on the upper surface of 13b. At this time, a space is formed between the winding portion 11 a of the coil 11 and the inner bottom surface of the tablet 13.
Subsequently, as shown in FIG. 5A, the tablet 13 in which the coil 11 is accommodated is placed in the molding die 50. In the present embodiment, the molding die 50 has a first upper die 51a, a second upper die 51b, and a lower die 52, and these are combined to form a cavity. Moreover, the tablet 13 is arrange | positioned in a metal mold | die in the state in which the upper surface of the wall part 13b was faced up.
Furthermore, as shown in FIG. 5 (B), the punch P is set in the cavity of the molding die 50 and compressed in a heated state, so that the space of the tablet is filled with the sealing material and the magnetic material The molded body 12 in which the coil 11 is embedded is formed by increasing the density. The surface of the tip end portion of the lead-out end portion 11b of the coil 11 is exposed on the surface of the molded body 12 that is in contact with the punch P. At this time, the leading end portion of the lead-out end portion 11 b of the coil 11 extends in the width direction of the surface with which the punch P of the molded body 12 is in contact with the surface thereof being flush with the surface of the molded body 12. Note that when the tablet 13 in which the coil 11 is housed is placed in the molding die 50, the molding die 50 may be preheated to a temperature higher than the softening temperature of the sealing material.
Next, the obtained molded body 12 is taken out from the molding die 50, and the insulating coating on the surface of the leading end portion of the drawing end portion 11b of the coil 11 exposed on the surface of the molded body 12 is peeled off, and then FIG. As shown in FIG. 3, the external terminal 14 is formed on the surface of the molded body 12 where the leading end portion of the leading end portion 11b of the coil 11 is exposed. The external terminal 14 extends in the width direction of the molded body 12 while covering the surface of the leading end portion of the lead-out end portion 11b of the coil 11, and the width direction of the molded body 12 so that both ends are not exposed to the adjacent surfaces. It is formed shorter than the length of. At this time, the external terminal 14 may be formed by forming a base electrode on the molded body 12 using a conductive material such as silver and plating it with a conductive material containing nickel and tin.
In the molded body 12 formed in this way, the surface on which the external terminals 14 are formed is used as the bottom surface, and this surface is mounted on a substrate of an electronic device, and the external terminals 14 are soldered to wiring such as the substrate. .

図6は本発明の表面実装インダクタの第2の実施例で使用されるコイルの斜視図、図7は本発明の表面実装インダクタの第2の実施例で使用されるタブレットの斜視図である。
コイル61は、断面が平角状の絶縁被覆が施された導線を、幅広面が巻軸と垂直な状態で巻回した巻回部61aと巻回部61aから引き出された1対の引き出し端部61bを備えた空芯コイルが形成される。1対の引き出し端部61bは、巻回部61aから巻軸と垂直な方向に互いに平行に延在する様に引き出され、巻回部61aの底面側に一度折り曲げた後、先端部が巻回部61aの底面と平行になる様に折り曲げられる。これにより引き出し端部61bに段差が形成される。
タブレット63は、樹脂と磁性材料を混合した封止材を用いて、図7に示す様に、平板上にコイルの巻軸を挿入するための凸部63aと凸部63aの周囲に位置する壁部63bを設け、コイル61を収納するための有底のスペースを有する形状に予備成形して形成される。この時、壁部63bは部分的に高さの高い部分63b1を有する様に形成され、タブレット63の内底面から壁部の高い部分63b1の上面までの距離が、コイル61の引き出し端部61bの先端部の上面から巻回部61aの上面までの距離と同じになる様に形成される。
コイル61は、上面を下にした状態で、図8(A)に示す様に、巻回部61aの空芯部分をタブレット63の凸部63aに挿入し、引き出し端部61bの先端部を壁部の高い部分63b1の上面に配置することにより、タブレット63内に収納される。この時、コイル61の巻回部61aとタブレット63の内底面は接触した状態となる。このタブレット63の開口面に、タブレット63と同じ材料を用い、図8(B)に示す様に、壁部の高い部分63b1以外の部分を覆うことができる大きさに形成された板状のタブレット65を配置する。この時、板状のタブレット65の厚みは、タブレット63の壁部63bの高さの低い部分の上面と壁部の高い部分63b1の上面間の距離よりも大きく形成される。
このコイル61が内部に収納されたタブレット63、65は、図9(A)に示す様に、タブレット65が上に位置する状態で、第1の上型91a、第2の上型91b、下型52を有し、これらを組み合わせることによりキャビティが形成される成型金型90内に配置される。
この成型金型90のキャビティにパンチPをセットし、加熱した状態で圧縮してタブレット63とタブレット65を一体化し、タブレットのスペースに封止材を充填すると共に、磁性材料の密度を上昇させることにより、コイル61を内包する成形体62が形成される。この成形体62のパンチPが接する面には、図9(B)に示す様に、コイル61の引き出し端部61bの先端部の表面が露出する。このとき、コイル61の引き出し端部61bの先端部は、その表面が成形体62の表面と同一面に位置した状態で成形体62のパンチPが接する面の幅方向に延在する。なお、コイル61が収納されたタブレット63、65を成型金型90内に配置する際に、成型金型90を封止材の軟化温度以上に予熱しておいてもよい。
この様にして得られた成形体62を成形金型90より取り出し、成形体62の表面に露出するコイル61の引き出し端部61bの先端部の表面の絶縁被膜を剥離した後、図9(C)に示す様に、成形体62のコイル61の引き出し端部61bの先端部が露出した面に外部端子64が形成される。外部端子64は、コイル61の引き出し端部61bの先端部の表面を覆った状態で、成形体62の幅方向に延在し、両端が隣接する面に露出しない様に成形体62の幅方向の長さよりも短く形成される。この時、外部端子64は、成形体62に銀等の導電材料を用いて下地電極を形成し、これにニッケルと錫を含有する導電材料によりメッキを施して形成すると良い。
この様な成形体62は、外部端子64が形成された面が底面として用いられ、この面が電子機器の基板等に実装され、外部端子64が基板等の配線にはんだ付けされる。
FIG. 6 is a perspective view of a coil used in the second embodiment of the surface mount inductor of the present invention, and FIG. 7 is a perspective view of a tablet used in the second embodiment of the surface mount inductor of the present invention.
The coil 61 includes a winding portion 61a obtained by winding a conducting wire having a flat rectangular insulating coating and a wide surface perpendicular to the winding axis, and a pair of leading ends drawn from the winding portion 61a. An air-core coil having 61b is formed. The pair of drawer end portions 61b are drawn out from the winding portion 61a so as to extend in parallel to each other in a direction perpendicular to the winding axis, and once bent to the bottom surface side of the winding portion 61a, the tip end portion is wound. It is bent so as to be parallel to the bottom surface of the portion 61a. As a result, a step is formed at the drawer end 61b.
As shown in FIG. 7, the tablet 63 uses a sealing material in which a resin and a magnetic material are mixed, and a convex portion 63a for inserting a coil winding shaft on a flat plate and a wall positioned around the convex portion 63a. A portion 63b is provided, and is formed by preforming into a shape having a bottomed space for housing the coil 61. At this time, the wall portion 63b is formed so as to have a portion 63b1 that is partially high, and the distance from the inner bottom surface of the tablet 63 to the top surface of the high portion 63b1 is such that the leading end portion 61b of the coil 61 It is formed to be the same as the distance from the upper surface of the tip portion to the upper surface of the winding portion 61a.
As shown in FIG. 8 (A), the coil 61 is inserted with the air core portion of the winding portion 61a into the convex portion 63a of the tablet 63 and the tip end portion of the lead-out end portion 61b on the wall with the upper surface facing down. By being arranged on the upper surface of the high portion 63b1, the tablet 63 is accommodated. At this time, the winding portion 61a of the coil 61 and the inner bottom surface of the tablet 63 are in contact with each other. The same material as the tablet 63 is used for the opening surface of the tablet 63, and as shown in FIG. 8B, a plate-like tablet formed in a size capable of covering a portion other than the high wall portion 63b1. 65 is arranged. At this time, the thickness of the plate-like tablet 65 is formed larger than the distance between the upper surface of the lower part of the wall 63b of the tablet 63 and the upper surface of the higher part 63b1 of the wall.
As shown in FIG. 9 (A), the tablets 63 and 65 in which the coils 61 are housed are the first upper mold 91a, the second upper mold 91b, It has the type | mold 52, It arrange | positions in the molding die 90 in which a cavity is formed by combining these.
The punch P is set in the cavity of the molding die 90 and compressed in a heated state so that the tablet 63 and the tablet 65 are integrated, the space of the tablet is filled with a sealing material, and the density of the magnetic material is increased. Thus, a molded body 62 including the coil 61 is formed. As shown in FIG. 9B, the surface of the tip end portion of the lead-out end portion 61b of the coil 61 is exposed on the surface of the molded body 62 that is in contact with the punch P. At this time, the leading end portion of the lead-out end portion 61 b of the coil 61 extends in the width direction of the surface with which the punch P of the molded body 62 is in contact with the surface thereof being flush with the surface of the molded body 62. Note that when the tablets 63 and 65 in which the coil 61 is housed are placed in the molding die 90, the molding die 90 may be preheated to a temperature higher than the softening temperature of the sealing material.
The molded body 62 obtained in this way is taken out from the molding die 90, and the insulating coating on the surface of the leading end portion of the lead-out end portion 61b of the coil 61 exposed on the surface of the molded body 62 is peeled off, and then FIG. ), The external terminal 64 is formed on the surface of the formed body 62 where the leading end of the leading end 61b of the coil 61 is exposed. The external terminal 64 extends in the width direction of the molded body 62 while covering the surface of the leading end portion of the lead-out end portion 61b of the coil 61, and the width direction of the molded body 62 so that both ends are not exposed to the adjacent surfaces. It is formed shorter than the length of. At this time, the external terminal 64 is preferably formed by forming a base electrode on the molded body 62 using a conductive material such as silver and plating it with a conductive material containing nickel and tin.
In such a molded body 62, the surface on which the external terminals 64 are formed is used as a bottom surface, and this surface is mounted on a substrate of an electronic device or the like, and the external terminals 64 are soldered to wiring such as the substrate.

以上、本発明の表面実装インダクタの製造方法の実施例を述べたが、本発明はこの実施例に限られるものではない。例えば、実施例では封止材として磁性材料に鉄系金属磁性粉末、樹脂にエポキシ樹脂を用いたが、磁性材料として他の組成の金属磁性粉末、その表面がガラス等の絶縁体で被覆された金属磁性粉末、表面を改質した金属磁性粉末を用いても良い。また、樹脂として、ポリイミド樹脂やフェノール樹脂などの熱硬化性樹脂や、ポリエチレン樹脂やポリアミド樹脂などの熱可塑性樹脂を用いても良い。また、コイルを構成する導線として断面が平角状の平角線を用いる場合を示したが、断面が円形、長方形、多角形等様々な形状のものを用いることができる。
さらに、第1の実施例において、タブレットの開口面に、コイルの引き出し端部の先端部が露出する様に、タブレットと同じ材質で板状に形成されたタブレットを搭載し、成形金型で加熱、圧縮することにより、コイルが埋設された成形体が形成されてもよい。また、第1の実施例において、タブレットの開口面からタブレットと同じ材質の封止材を粉状にしたものを充填し、これを成形金型で加熱、圧縮することにより、コイルが埋設された成形体が形成されてもよい。
またさらに、第2の実施例において、板状のタブレットの変わりに、タブレットと同じ材質の封止材を粉状にしたものを充填し、これを成形金型で加熱、圧縮することにより、コイルが埋設された成形体が形成されてもよい。
As mentioned above, although the Example of the manufacturing method of the surface mount inductor of this invention was described, this invention is not limited to this Example. For example, in the examples, iron-based metal magnetic powder was used as the sealing material as the sealing material, and epoxy resin was used as the resin, but the metal magnetic powder of another composition was used as the magnetic material, and its surface was coated with an insulator such as glass. Metal magnetic powder or metal magnetic powder with a modified surface may be used. Further, as the resin, a thermosetting resin such as a polyimide resin or a phenol resin, or a thermoplastic resin such as a polyethylene resin or a polyamide resin may be used. Moreover, although the case where the rectangular wire used as a conducting wire which comprises a coil was shown was shown, the thing of various shapes, such as circular, a rectangle, and a polygon, can be used for a cross section.
Furthermore, in the first embodiment, a tablet formed in a plate shape with the same material as the tablet is mounted on the opening surface of the tablet so that the tip end of the coil drawing end is exposed, and heated with a molding die. The molded body in which the coil is embedded may be formed by compression. Further, in the first embodiment, the coil was embedded by filling a powdery sealing material made of the same material as the tablet from the opening surface of the tablet, and heating and compressing it with a molding die. A molded body may be formed.
Furthermore, in the second embodiment, instead of a plate-shaped tablet, a powdery sealing material made of the same material as the tablet is filled, and this is heated and compressed with a molding die to produce a coil. A molded body in which is embedded may be formed.

11 コイル
12 成形体
11 Coil 12 Molded body

Claims (6)

導線を巻回して形成したコイルと、樹脂と磁性材料を含む封止材を用いて形成され、該コイルを内蔵する成形体を備えた表面実装インダクタの製造方法において、
導線を巻回した巻回部と、該巻回部から引き出された引き出し端部を備え、該引き出し端部に段差が形成されたコイルを形成し、
該封止材を平板上に該コイルの巻軸を挿入するための凸部と該凸部の周囲に位置する壁部を設けた形状に予備成形されたタブレットを形成し、
該コイルの巻回部をタブレットの凸部に挿入し、該引き出し端部の先端部を該壁部の上面に配置して該コイルを該タブレット内に収納し、
該タブレットを成型金型内に配置し、該成型金型を用いて該コイルを内蔵し、該コイルの引き出し端部の先端部表面が実装面に露出、延在した成形体を形成し、
該成形体の実装面においていずれの辺からも離間して外部端子が形成されたことを特徴とする表面実装インダクタの製造方法。
In a method of manufacturing a surface-mount inductor formed by using a coil formed by winding a conductive wire and a sealing material containing a resin and a magnetic material, and including a molded body incorporating the coil,
A winding portion wound with a conducting wire, and a drawing end portion drawn out from the winding portion, forming a coil in which a step is formed in the drawing end portion;
Forming a tablet preformed into a shape in which a convex portion for inserting the winding axis of the coil on the flat plate and a wall portion located around the convex portion are provided on the flat plate;
Inserting the winding portion of the coil into the convex portion of the tablet, placing the leading end of the drawer end on the upper surface of the wall portion, and storing the coil in the tablet,
The tablet is placed in a molding die, the coil is built using the molding die, and a molded body is formed in which the surface of the leading end of the leading end of the coil is exposed and extended on the mounting surface,
A method for manufacturing a surface-mount inductor, wherein an external terminal is formed apart from any side on the mounting surface of the molded body.
前記タブレットは、前記壁部に高さの異なる部分が形成され、該壁部の高さの高い部分に前記コイルの引き出し端部の先端部が配置されてコイルが収納され、
該コイルが収納されたタブレット上に、該コイルの引き出し端部の先端部が露出する様に、該タブレットとは別に前記封止材を予備成形して形成した板状のタブレットを配置し、前記成型金型を用いて該コイルを内蔵し、該コイルの引き出し端部の先端部表面が実装面に露出、延在した成形体を形成する請求項1に記載の表面実装インダクタの製造方法。
The tablet is formed with a portion having a different height on the wall portion, the leading end portion of the drawing end portion of the coil is disposed on the high portion of the wall portion, and the coil is housed therein.
A plate-like tablet formed by preforming the sealing material separately from the tablet is disposed on the tablet in which the coil is stored so that the tip of the leading end of the coil is exposed. The method for manufacturing a surface mount inductor according to claim 1, wherein the coil is built in using a molding die, and a molded body is formed in which a tip end surface of a leading end portion of the coil is exposed and extended on the mounting surface.
前記タブレットは、前記壁部に高さの異なる部分が形成され、該壁部の高さの高い部分に前記コイルの引き出し端部の先端部が配置されてコイルが収納され、
該コイルが収納されたタブレット上に、該コイルの引き出し端部の先端部が露出する様に、前記封止材を粉末状にしたものを充填し、前記成型金型を用いて該コイルを内蔵し、該コイルの引き出し端部の先端部表面が実装面に露出、延在した成形体を形成する請求項1に記載の表面実装インダクタの製造方法。
The tablet is formed with a portion having a different height on the wall portion, the leading end portion of the drawing end portion of the coil is disposed on the high portion of the wall portion, and the coil is housed therein.
The tablet containing the coil is filled with the sealing material powdered so that the leading end of the drawing end of the coil is exposed, and the coil is built in using the molding die. The method of manufacturing a surface-mount inductor according to claim 1, wherein a formed body is formed in which a tip end surface of a lead-out end portion of the coil is exposed and extended on a mounting surface.
前記コイルは、導線の両端が巻回部の外周に位置する様に巻回して形成された請求項1乃至請求項3に記載の表面実装インダクタの製造方法。   4. The method for manufacturing a surface mount inductor according to claim 1, wherein the coil is formed by winding so that both ends of the conducting wire are positioned on an outer periphery of the winding portion. 前記導線が平角線である請求項1乃至請求項4に記載の表面実装インダクタの製造方法。   The method for manufacturing a surface mount inductor according to claim 1, wherein the conducting wire is a rectangular wire. 前記コイルは、前記導線として平角線が用いられ、該平角線はその幅広面が該コイルの巻軸に対して垂直になる様に巻回されて巻回部が形成された請求項1乃至請求項3に記載の表面実装インダクタの製造方法。   The coil includes a rectangular wire as the conducting wire, and the rectangular wire is wound so that a wide surface thereof is perpendicular to a winding axis of the coil to form a winding portion. Item 4. A method for manufacturing a surface-mount inductor according to Item 3.
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