CN103443537B - 照明设备 - Google Patents

照明设备 Download PDF

Info

Publication number
CN103443537B
CN103443537B CN201280012746.3A CN201280012746A CN103443537B CN 103443537 B CN103443537 B CN 103443537B CN 201280012746 A CN201280012746 A CN 201280012746A CN 103443537 B CN103443537 B CN 103443537B
Authority
CN
China
Prior art keywords
conductive layer
light source
radiator element
lighting apparatus
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280012746.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN103443537A (zh
Inventor
P·J·M·布克姆斯
A·A·M·玛里纽斯
H·尼科尔
A·范德帕德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signify Holding BV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of CN103443537A publication Critical patent/CN103443537A/zh
Application granted granted Critical
Publication of CN103443537B publication Critical patent/CN103443537B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Endoscopes (AREA)
CN201280012746.3A 2011-01-11 2012-01-04 照明设备 Expired - Fee Related CN103443537B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP11150537 2011-01-11
EP11150537.6 2011-01-11
US201161569353P 2011-12-12 2011-12-12
US61/569,353 2011-12-12
PCT/IB2012/050039 WO2012095758A2 (en) 2011-01-11 2012-01-04 Lighting device

Publications (2)

Publication Number Publication Date
CN103443537A CN103443537A (zh) 2013-12-11
CN103443537B true CN103443537B (zh) 2018-09-21

Family

ID=45470628

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280012746.3A Expired - Fee Related CN103443537B (zh) 2011-01-11 2012-01-04 照明设备

Country Status (8)

Country Link
US (2) US9115853B2 (enExample)
EP (1) EP2663805B1 (enExample)
JP (1) JP5984845B2 (enExample)
CN (1) CN103443537B (enExample)
BR (1) BR112013017690B1 (enExample)
RU (1) RU2607531C2 (enExample)
TW (1) TWI567334B (enExample)
WO (1) WO2012095758A2 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012095758A2 (en) 2011-01-11 2012-07-19 Koninklijke Philips Electronics N.V. Lighting device
RU2648267C2 (ru) * 2012-06-04 2018-03-23 Филипс Лайтинг Холдинг Б.В. Лампа, содержащая гибкую печатную плату
US9299687B2 (en) * 2012-10-05 2016-03-29 Bridgelux, Inc. Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
CN103807622B (zh) * 2012-11-09 2018-04-24 欧司朗有限公司 照明装置
EP2929239B1 (en) * 2012-12-05 2018-03-28 Philips Lighting Holding B.V. Flat lighting device
CN103388764B (zh) * 2013-01-09 2016-11-09 厦门立达信照明有限公司 Led照明灯
EP2986903B1 (en) 2013-04-10 2017-09-13 Philips Lighting Holding B.V. Lighting device and luminaire
CN105143761B (zh) * 2013-04-10 2018-01-30 飞利浦照明控股有限公司 照明设备和灯具
CN105121938A (zh) * 2013-05-14 2015-12-02 皇家飞利浦有限公司 照明设备和制造照明设备的方法
US20160131355A1 (en) * 2013-06-10 2016-05-12 Once Innovations, Inc. Led lighting assembly and method of manufacturing the same
TWI711188B (zh) * 2013-06-27 2020-11-21 晶元光電股份有限公司 發光二極體組件
EP3019790B1 (en) * 2013-07-10 2020-02-12 Goldeneye, Inc Self cooling light source
TWI610465B (zh) * 2013-10-07 2018-01-01 Epistar Corporation 發光二極體組件及製作方法
DE202013009156U1 (de) * 2013-10-16 2015-01-19 Automotive Lighting Reutlingen Gmbh Kraftfahrzeugbeleuchtungseinrichtung
RU2672096C2 (ru) * 2014-01-20 2018-11-12 Филипс Лайтинг Холдинг Б.В. Световое устройство со складным корпусом
US10655790B2 (en) 2014-01-30 2020-05-19 Signify Holding B.V. Lighting device
CN105980769B (zh) * 2014-02-10 2019-03-01 飞利浦灯具控股公司 舒适的分布式led照明
EP2918906B1 (en) * 2014-03-12 2019-02-13 TE Connectivity Nederland B.V. Socket assembly and clamp for a socket assembly
US9772097B2 (en) 2014-03-27 2017-09-26 Philips Lighting Holding B.V. Efficient board to board connection
JP6493925B2 (ja) 2014-05-09 2019-04-03 シグニファイ ホールディング ビー ヴィ 照明装置及び照明器具
JP6731354B2 (ja) * 2014-06-05 2020-07-29 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． 照明デバイス、照明器具及び製造方法
US20150369457A1 (en) * 2014-06-23 2015-12-24 Epistar Corporation Light-Emitting Device
JP6703518B2 (ja) * 2014-07-21 2020-06-03 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． 照明機器
TWI650041B (zh) * 2014-09-23 2019-02-01 億城精密光電股份有限公司 Suspended lighting device
TWM502792U (zh) * 2014-11-10 2015-06-11 Kunshan Nano New Material Technology Co Ltd 燈頭結構及其發光二極體燈具
JP2017528876A (ja) * 2014-11-17 2017-09-28 フィリップス ライティング ホールディング ビー ヴィ 照明デバイス
CN105588025B (zh) * 2014-11-17 2020-02-21 通用电气照明解决方案有限公司 Led照明装置
JP2016115645A (ja) * 2014-12-18 2016-06-23 岩崎電気株式会社 Ｌｅｄランプ
JP2016115649A (ja) * 2014-12-18 2016-06-23 岩崎電気株式会社 Ｌｅｄランプ
US9467190B1 (en) 2015-04-23 2016-10-11 Connor Sport Court International, Llc Mobile electronic device covering
DE102015216662A1 (de) * 2015-09-01 2017-03-02 Osram Gmbh Leuchtmittel mit LEDs
CN106641745A (zh) * 2015-10-30 2017-05-10 欧普照明股份有限公司 一种照明模组
CN110906180B (zh) * 2019-12-17 2021-08-20 台州市万力灯饰制造股份有限公司 双层装饰灯
JP7638811B2 (ja) * 2021-07-14 2025-03-04 日本航空電子工業株式会社 コネクタおよびコネクタ組立体
US11906133B2 (en) 2022-03-31 2024-02-20 Alliance Sports Group, L.P. Outdoor lighting apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086767B2 (en) * 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
US7348604B2 (en) * 2005-05-20 2008-03-25 Tir Technology Lp Light-emitting module
CN201412807Y (zh) * 2009-05-26 2010-02-24 东莞市乐好电子科技有限公司 改善散热的led照明灯结构
CN201611024U (zh) * 2009-12-24 2010-10-20 厦门市朗星节能照明有限公司 一种大功率led日光灯
CN101922639A (zh) * 2010-07-23 2010-12-22 苏州京东方茶谷电子有限公司 Led日光灯管

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE47624T1 (de) * 1984-11-15 1989-11-15 Japan Traffic Manage Tech Ass Signallichteinheit mit waermeabfuhr.
US5659297A (en) * 1995-03-27 1997-08-19 Eaton Corporation Display system
US6441943B1 (en) * 1997-04-02 2002-08-27 Gentex Corporation Indicators and illuminators using a semiconductor radiation emitter package
WO2002086972A1 (en) * 2001-04-23 2002-10-31 Plasma Ireland Limited Illuminator
JP4452495B2 (ja) * 2001-05-26 2010-04-21 ルミネイション リミテッド ライアビリティ カンパニー スポット照明用高パワーｌｅｄモジュール
JP4113832B2 (ja) * 2003-12-12 2008-07-09 三菱電機株式会社 面状光源装置およびこれを用いた液晶表示装置
US6991351B1 (en) * 2003-12-15 2006-01-31 Twr Lighting, Inc. Illumination system
US7285903B2 (en) * 2004-07-15 2007-10-23 Honeywell International, Inc. Display with bright backlight
JP4670323B2 (ja) * 2004-11-19 2011-04-13 ソニー株式会社 発光装置及びこれを用いた液晶表示装置用バックライト装置、照明装置
KR101115800B1 (ko) * 2004-12-27 2012-03-08 엘지디스플레이 주식회사 발광소자 패키지, 이의 제조 방법 및 백라이트 유닛
US7918591B2 (en) * 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7513659B2 (en) * 2005-09-01 2009-04-07 Star Headlight & Lantern Co., Inc. Light emitter sub-assemblies especially containing an array of light emitting devices (LEDs) and modules containing such sub-assemblies which provide lighting apparatuses, especially light bars for mounting on a vehicle
CN100464411C (zh) * 2005-10-20 2009-02-25 富准精密工业(深圳)有限公司 发光二极管封装结构及封装方法
US7465069B2 (en) * 2006-01-13 2008-12-16 Chia-Mao Li High-power LED package structure
TWM314293U (en) * 2007-01-24 2007-06-21 Unity Opto Technology Co Ltd Lamp bulb socket structure
WO2008154172A1 (en) * 2007-06-08 2008-12-18 Superbulbs, Inc. Apparatus for cooling leds in a bulb
US8317358B2 (en) * 2007-09-25 2012-11-27 Enertron, Inc. Method and apparatus for providing an omni-directional lamp having a light emitting diode light engine
US9086213B2 (en) * 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
US7726836B2 (en) * 2007-11-23 2010-06-01 Taiming Chen Light bulb with light emitting elements for use in conventional incandescent light bulb sockets
KR100910054B1 (ko) * 2007-12-18 2009-07-30 에스엘 주식회사 Ｌｅｄ방열 장치
EA020919B1 (ru) 2008-02-22 2015-02-27 БИНСТАЛК АпС Легко открываемая упаковка
RU77024U1 (ru) * 2008-06-05 2008-10-10 Закрытое Акционерное Общество "Трансвет" Осветительное устройство
JP4593661B2 (ja) * 2008-08-22 2010-12-08 株式会社小糸製作所 車両用灯具
JP5245980B2 (ja) * 2008-09-30 2013-07-24 豊田合成株式会社 発光装置及びその製造方法
US7942549B2 (en) * 2008-10-16 2011-05-17 Chia-Mao Li LED lamp having light guiding heat sink
JP4642129B2 (ja) * 2008-11-06 2011-03-02 ローム株式会社 Ｌｅｄランプ
JP5343542B2 (ja) * 2008-12-08 2013-11-13 三菱電機株式会社 点灯装置及びこの点灯装置を備える照明器具
RU2408816C2 (ru) * 2009-01-27 2011-01-10 Виктор Викторович Сысун Светодиодная лампа белого свечения
JP2010177076A (ja) * 2009-01-30 2010-08-12 Hitachi Ltd タンデム型面光源装置及びそれを用いた液晶表示装置
TW201037224A (en) * 2009-04-06 2010-10-16 Yadent Co Ltd Energy-saving environmental friendly lamp
WO2010131166A1 (en) * 2009-05-15 2010-11-18 Koninklijke Philips Electronics N.V. Electric lamp
BRPI1008263A8 (pt) 2009-05-28 2018-08-14 Koninklijke Philips Electronics Nv Dispositivo de iluminação e método para montagem de um dispositivo de iluminação
HRP20161768T1 (hr) * 2009-06-10 2017-02-24 Shirish Devidas Deshpande Prilagodljiv, dugotrajan, toplinski učinkovit, ekološki prihvatljiv rasvjetni uređaj čvrstog oblika
BRPI1011821A2 (pt) * 2009-06-25 2018-03-13 Sharp Kabushiki Kaisha "aparelho de fonte de luz, aparelho de exibição de imagem e aparelho de recepção de televisão"
US9030120B2 (en) * 2009-10-20 2015-05-12 Cree, Inc. Heat sinks and lamp incorporating same
RU95180U1 (ru) * 2010-01-25 2010-06-10 Дмитрий Сергеевич Гвоздев Светодиодная лампа
US9518715B2 (en) * 2010-02-12 2016-12-13 Cree, Inc. Lighting devices that comprise one or more solid state light emitters
TWM384974U (en) * 2010-02-26 2010-07-21 Iovision Photoelectric Co Ltd Structure of LED ball lamp
US20130100685A1 (en) 2010-07-14 2013-04-25 Koninklijke Philips Electronics N.V. Led lighting assembly with mounting element for optics
TWM394427U (en) * 2010-08-06 2010-12-11 Ji Chen Technology Inc Structure of electricity/heat separated LED bulb module
WO2012095758A2 (en) 2011-01-11 2012-07-19 Koninklijke Philips Electronics N.V. Lighting device
US8789976B2 (en) * 2012-07-06 2014-07-29 GEM Weltronics TWN Corporation Integrated multi-layered illuminating unit and integrated multi-layered illuminating assembling unit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086767B2 (en) * 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
US7348604B2 (en) * 2005-05-20 2008-03-25 Tir Technology Lp Light-emitting module
CN201412807Y (zh) * 2009-05-26 2010-02-24 东莞市乐好电子科技有限公司 改善散热的led照明灯结构
CN201611024U (zh) * 2009-12-24 2010-10-20 厦门市朗星节能照明有限公司 一种大功率led日光灯
CN101922639A (zh) * 2010-07-23 2010-12-22 苏州京东方茶谷电子有限公司 Led日光灯管

Also Published As

Publication number Publication date
JP2014507048A (ja) 2014-03-20
US9897262B2 (en) 2018-02-20
TW201239256A (en) 2012-10-01
CN103443537A (zh) 2013-12-11
EP2663805A2 (en) 2013-11-20
US20130286645A1 (en) 2013-10-31
WO2012095758A3 (en) 2012-11-08
RU2013137431A (ru) 2015-02-20
WO2012095758A2 (en) 2012-07-19
TWI567334B (zh) 2017-01-21
BR112013017690A2 (pt) 2016-10-11
EP2663805B1 (en) 2017-07-19
RU2607531C2 (ru) 2017-01-10
US20150103538A1 (en) 2015-04-16
BR112013017690B1 (pt) 2020-01-21
JP5984845B2 (ja) 2016-09-06
US9115853B2 (en) 2015-08-25

Similar Documents

Publication Publication Date Title
CN103443537B (zh) 照明设备
EP1965128B1 (en) Lighting apparatus with leds
CN102454907B (zh) 发光二极管灯及其制造方法
US8922108B2 (en) Remote component devices, systems, and methods for use with light emitting devices
WO2008056813A1 (en) Light emitting device and method for manufacturing the same
TWM437919U (en) Light emission device
CN103322437B (zh) 具有强散热能力的发光二极管球泡灯及其制造方法
WO2007126074A1 (ja) 半導体発光モジュール、装置、およびその製造方法
CN103363332B (zh) 具有大发光角度的发光二极管球泡灯及其制造方法
US20170167668A1 (en) Lens unit, led module with the lens unit, and light fixture with the led module
JP2016171147A (ja) 発光装置および照明装置
TW201203636A (en) Light emitting diode device and lighting device using the same
JP2010278246A (ja) 発光モジュール及びその製造方法
JP2010129953A (ja) Ｌｅｄランプおよびその製造方法
CN103470968A (zh) 大发光角度的发光二极管灯芯及包含该灯芯的照明装置
JP6104946B2 (ja) 発光装置およびその製造方法
EP2823226B1 (en) Light emitting device and method for manufacturing a light emitting device
WO2016197961A1 (zh) 一种led灯封装支架
CN103322438A (zh) 大功率发光二极管投光灯及其制造方法
US11175019B2 (en) Carrier for lighting modules and lighting device
JP2009283398A (ja) Ｌｅｄランプおよびその製造方法
JP2009076516A (ja) 照明装置
CN203413588U (zh) Led光源板组件、led灯芯和led照明装置
EP2806211A1 (en) Solid-state lighting device and related process
JP2009283385A (ja) 照明装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20170309

Address after: The city of Eindhoven in Holland

Applicant after: KONINKL PHILIPS NV

Address before: The city of Eindhoven in Holland

Applicant before: Koninkl Philips Electronics NV

GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Eindhoven

Patentee after: Signify Holdings Ltd.

Address before: The city of Eindhoven in Holland

Patentee before: PHILIPS LIGHTING HOLDING B.V.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180921

Termination date: 20210104