CN103441090B - Be applicable to the single-face corrosion device of semiconductor chip - Google Patents
Be applicable to the single-face corrosion device of semiconductor chip Download PDFInfo
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- CN103441090B CN103441090B CN201310357862.5A CN201310357862A CN103441090B CN 103441090 B CN103441090 B CN 103441090B CN 201310357862 A CN201310357862 A CN 201310357862A CN 103441090 B CN103441090 B CN 103441090B
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Abstract
The present invention relates to a kind of single-face corrosion device being applicable to semiconductor chip, comprise workbench (1), etching system (2), upper liquid system (3) and circulating reflux system (4), each etching system (2) comprises a cell body (21), cell body (21) bottom is provided with a corrosive liquid inlet (22), corrosive liquid inlet (22) outlet is provided with one first damping sheet (23), cell body (21) middle part is provided with one second damping sheet (24), second damping sheet (24) is vertically provided with and multiplely holds sheet post (25), cell body (21) top cell wall is provided with spout hole (26), described upper liquid system (3) comprises a reservoir (31) and upper liquid pump (32), described circulating reflux system (4) comprises one the 3rd pipeline (41).The present invention changes traditional single-face corrosion device, more abundant to the corrosion of semiconductor chip, and it is semi-automatic to realize corrosion, effectively improves the reliability of product and the efficiency of work simultaneously.
Description
Technical field
The present invention relates to a kind of single-face corrosion device being applicable to semiconductor chip.Belong to integrated circuit or discrete device field of chip manufacture technology.
Background technology
Along with the fieriness of market competition in recent years, the aspect such as rate of finished products, reliability, surface of encapsulation producer to product proposes requirements at the higher level, semiconductor manufacturing producer is the reliability improving product, simultaneously for meeting Subsequent semiconductor encapsulation producer to requirements such as semiconductor chip front pressure point aluminium laminations, each semiconductor producer all starts to adopt a kind of new technique---single-sided corrosion technique.But all there is various weak point in the single-face corrosion device that each producer adopts at present.
Before the present invention makes, the conventional single-face corrosion device being applicable to the pre-treatment of semiconductor chip back face metalization mainly adopts following two kinds of devices:
Contemporary devices one:
Semiconductor chip is put into and is equipped with in the box of corrosive liquid by mode manually one by one, and its front does not contact with corrosive liquid, thus realizes single-sided corrosion.Its weak point is:
1, higher to the requirement of operating personnel, and the easy etch front of corrosive liquid;
2, there is local corrosion non-uniform phenomenon in semiconductor chip centre easily residual bubble;
3, inefficiency, and etching fluid is comparatively large to the suction of chip, rupture diaphragm.
Contemporary devices two:
Adopt circulating water or film protection by automanual mode one side, the mode that one side adopts corrosive liquid to spray carries out single-sided corrosion.Its weak point is:
1, comparatively seriously, cost is higher for corrosive liquid and water waste;
2, complicated operation, cannot process thin slice;
3, inefficiency.
In sum,
There is inefficiency in two kinds of existing devices, cost is higher, poor reliability, the weak points such as complicated operation, and this device overcomes above-mentioned weak point.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, a kind of device that chip corrosion quality can improve again chip reliability and operating efficiency that can ensure is provided.
The object of the present invention is achieved like this: a kind of single-face corrosion device being applicable to semiconductor chip, comprises workbench, etching system, upper liquid system and circulating reflux system,
Described etching system is placed in workbench, and etching system has multiple, and multiple etching system is arranged side by side in workbench; Each etching system comprises a cell body, be provided with a corrosive liquid inlet bottom cell body, the outlet of corrosive liquid inlet is provided with one first damping sheet, is provided with one second damping sheet in the middle part of cell body, second damping sheet is vertically provided with and multiplely holds sheet post, cell body top cell wall is provided with spout hole;
Described upper liquid system comprises a reservoir and upper liquid pump, upper liquid pump import is connected with reservoir by the first pipeline, export the corrosive liquid inlet bottom by the cell body of a second pipe access etching system, first pipeline leads to one first arm, first arm is equipped with recovery valve, second pipe also leads to one second arm, the reservoir of the described upper liquid system of the second arm access, the second arm is also equipped with return valve;
Described circulating reflux system comprises one the 3rd pipeline, 3rd pipeline is connected with bottom workbench, the 3rd pipeline picks out one the 3rd arm, the reservoir of the upper liquid system of the 3rd arm access, 3rd arm is equipped with a spill valve, the 3rd pipeline after the 3rd arm is equipped with a cleaning valve.
Compared with prior art, the invention has the beneficial effects as follows:
Its overall process achieves semi-automation.Its feature is:
1, can realize in corrosion process, input/grab chips does not directly contact with corrosive liquid, simple to operation, and reliability is high;
2, be provided with acid storing tank, corrosive liquid reusable edible, and have independently discharge opeing reclaim line system, energy-conserving and environment-protective;
3, all corrosion processes are able to programme: upper liquid time, liquid level retention time, return the liquid time, operation completes prompting, cycle frequency, the circulation frequency etc. all can free setting; Corrosion process is reliable and stable.
In sum, the present invention changes traditional single-face corrosion device, more abundant to the corrosion of semiconductor chip, and it is semi-automatic to realize corrosion, effectively improves the reliability of product and the efficiency of work simultaneously.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram that the present invention is applicable to the single-face corrosion device of semiconductor chip.
Fig. 2 is etching system Facad structure schematic diagram of the present invention.
Fig. 3 is the vertical view of Fig. 2.
Fig. 4 is that semiconductor chip of the present invention extracts schematic diagram.
Reference numeral in figure:
Workbench 1
Etching system 2, cell body 21, corrosive liquid inlet 22, first damping sheet 23, second damping sheet 24, hold sheet post 25, spout hole 26;
Upper liquid system 3, reservoir 31, upper liquid pump 32, first pipeline 33, first arm 331, recovery valve 332, second pipe 34, second arm 341, return valve 342;
Circulating reflux system 4, the 3rd pipeline 41, the 3rd arm 411, spill valve 412, cleaning valve 413;
Semiconductor chip 5
Corrosive liquid 6
Liquid level tension force 7.
Embodiment
Be the general structure schematic diagram that the present invention is applicable to the single-face corrosion device of semiconductor chip see Fig. 1, Fig. 1.As seen from Figure 1, the present invention is applicable to the single-face corrosion device of semiconductor chip, comprises workbench 1, etching system 2, upper liquid system 3 and circulating reflux system 4,
Described etching system 2 is placed in workbench 1, and etching system 2 has multiple, and multiple etching system 2 is arranged side by side in workbench 1; Each etching system 2 comprises a cell body 21, a corrosive liquid inlet 22 is provided with bottom cell body 21, corrosive liquid inlet 22 outlet is provided with one first damping sheet 23, one second damping sheet 24 is provided with in the middle part of cell body 21, second damping sheet 24 is vertically provided with and multiplely holds sheet post 25, cell body 21 top cell wall is provided with spout hole 26;
Described upper liquid system 3 comprises a reservoir 31 and upper liquid pump 32, the import of upper liquid pump 32 is connected with reservoir 31 by the first pipeline 33, outlet accesses the corrosive liquid inlet 22 bottom the cell body 21 of etching system 2 by a second pipe 34, first pipeline 33 leads to one first arm 331, first arm 331 is equipped with recovery valve 332, second pipe 34 also leads to one second arm 341, reservoir 31, second arm 341 that second arm 341 accesses described upper liquid system 3 is also equipped with return valve 342;
Described circulating reflux system 4 comprises one the 3rd pipeline 41,3rd pipeline 41 is connected with bottom workbench 1,3rd pipeline 41 picks out one the 3rd arm 411,3rd arm 411 accesses the reservoir 31 of upper liquid system 3,3rd arm 411 is equipped with on the 3rd pipeline 41 after spill valve the 412, three arm 411 and a cleaning valve 413 is housed.
Its operating process is as follows:
Step one, semiconductor chip extract
Adopt tweezers gripping or inhale pen and draw semiconductor chip 5, be put in single-face corrosion device workbench 1 on etching system 2 successively, the large I according to device puts into single semiconductor chip, as Fig. 4 simultaneously.
Liquid on step 2, semiconductor chip single-sided corrosion
After semiconductor chip has been placed, upper liquid system 3 is upper corrosive liquid automatically, swims in etching fluid by corrosive liquid buoyancy by semiconductor chip, simultaneously can effective control corrosion rate system 2 cell body internal corrosion liquid height, when liquid level position is higher, corrosive liquid can reflux from circulating reflux system 4.
Step 3, semiconductor chip single-sided corrosion
After semiconductor chip floats by corrosive liquid, device stops upper corrosive liquid automatically, and corrosive liquid liquid level remains unchanged simultaneously, allows it carry out single-sided corrosion.
Step 4, the discharge opeing of semiconductor chip single-sided corrosion liquid
After terminating according to technological requirement corrosion, corrosive liquid liquid level can decline automatically, and reflux from circulating reflux system 4, semiconductor chip 5 can rest on etching system 2 automatically, automatically to take.
Step 5, semiconductor chip erosional surface rinse
Adopt tweezers gripping or inhale pen and draw the semiconductor chip 5 etched, carry out deionized water rinsing to the erosional surface of semiconductor chip 5, the acid residual to erosional surface is removed, further in order to avoid impact another side.
Claims (1)
1. be applicable to a single-face corrosion device for semiconductor chip, it is characterized in that described device comprises workbench (1), etching system (2), upper liquid system (3) and circulating reflux system (4),
Described etching system (2) is placed in workbench (1), and etching system (2) has multiple, and multiple etching system (2) is arranged side by side in workbench (1); Each etching system (2) comprises a cell body (21), cell body (21) bottom is provided with a corrosive liquid inlet (22), corrosive liquid inlet (22) outlet is provided with one first damping sheet (23), cell body (21) middle part is provided with one second damping sheet (24), second damping sheet (24) is vertically provided with and multiplely holds sheet post (25), cell body (21) top cell wall is provided with spout hole (26);
Described upper liquid system (3) comprises a reservoir (31) and upper liquid pump (32), upper liquid pump (32) import is connected with reservoir (31) by the first pipeline (33), export the corrosive liquid inlet (22) of cell body (21) bottom by a second pipe (34) access etching system (2), first pipeline (33) leads to one first arm (331), recovery valve (332) first arm (331) is equipped with, second pipe (34) also leads to one second arm (341), second arm (341) accesses the reservoir (31) of described upper liquid system (3), return valve (342) second arm (341) is also equipped with,
Described circulating reflux system (4) comprises one the 3rd pipeline (41), 3rd pipeline (41) is connected with workbench (1) bottom, 3rd pipeline (41) picks out one the 3rd arm (411), the reservoir (31) of liquid system (3) in 3rd arm (411) access, 3rd arm (411) is equipped with a spill valve (412), the 3rd pipeline (41) after the 3rd arm (411) is equipped with a cleaning valve (413).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310357862.5A CN103441090B (en) | 2013-08-16 | 2013-08-16 | Be applicable to the single-face corrosion device of semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310357862.5A CN103441090B (en) | 2013-08-16 | 2013-08-16 | Be applicable to the single-face corrosion device of semiconductor chip |
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| CN103441090A CN103441090A (en) | 2013-12-11 |
| CN103441090B true CN103441090B (en) | 2016-03-09 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
| CN102586779A (en) * | 2011-11-30 | 2012-07-18 | 常州亿晶光电科技有限公司 | Liquid-separation type wet etching device for silicon wafer |
| CN202901681U (en) * | 2012-11-02 | 2013-04-24 | 辽阳自动化仪表集团有限公司 | Flow limiting device |
| CN203456426U (en) * | 2013-08-16 | 2014-02-26 | 江阴新顺微电子有限公司 | Single-face corrosion device suitable for semiconductor chip |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002129360A (en) * | 2000-10-23 | 2002-05-09 | Asahi Giken Kk | Etching equipment |
| JP2003193271A (en) * | 2001-12-27 | 2003-07-09 | Shiizu:Kk | Substrate treatment apparatus |
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- 2013-08-16 CN CN201310357862.5A patent/CN103441090B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
| CN102586779A (en) * | 2011-11-30 | 2012-07-18 | 常州亿晶光电科技有限公司 | Liquid-separation type wet etching device for silicon wafer |
| CN202901681U (en) * | 2012-11-02 | 2013-04-24 | 辽阳自动化仪表集团有限公司 | Flow limiting device |
| CN203456426U (en) * | 2013-08-16 | 2014-02-26 | 江阴新顺微电子有限公司 | Single-face corrosion device suitable for semiconductor chip |
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| CN103441090A (en) | 2013-12-11 |
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Address after: 214434 Chengjiang East Road, Binjiang Development Zone, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: Jiangsu Xinshun Microelectronics Co.,Ltd. Address before: 214434 Chengjiang East Road, Binjiang Development Zone, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: XINSUN Co.,Ltd. |