CN103438710A - Substrate processing system - Google Patents
Substrate processing system Download PDFInfo
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- CN103438710A CN103438710A CN2013103028822A CN201310302882A CN103438710A CN 103438710 A CN103438710 A CN 103438710A CN 2013103028822 A CN2013103028822 A CN 2013103028822A CN 201310302882 A CN201310302882 A CN 201310302882A CN 103438710 A CN103438710 A CN 103438710A
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- 238000012545 processing Methods 0.000 title claims abstract description 77
- 239000000758 substrate Substances 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 claims abstract description 155
- 230000008569 process Effects 0.000 claims abstract description 155
- 230000009471 action Effects 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 description 11
- 238000000137 annealing Methods 0.000 description 5
- 238000004821 distillation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
The invention provides a substrate processing system, which comprises a conveying part, a first processing chamber, a second processing chamber, a conveying manipulator, a moving-in part, a moving-out part and a control part. The processing chamber comprises a multi-layer frame capable of supporting substrates on each layer; and a door which opens or closes in corresponding to the desired layer of the multi-layer frame when the substrate is moved in and moved out. The control part is used for controlling the process that the substrate is moved out from the first processing chamber by the conveying manipulator and stored in the moving-out part over a preset period since the substrate is moved into the first processing chamber, subsequently the conveying manipulator moves to the moving-in part, holds the substrate to be processed and moves the substrate into the first processing chamber, and then the substrate is moved out from the second processing chamber by the conveying manipulator and stored in the moving-out part over a preset period since the substrate is moved into the second processing chamber, subsequently the conveying manipulator moves to the moving-in part, holds the substrate to be processed and moves the substrate into the second processing chamber, and moreover the door closes during the process that the conveying manipulator leaves the processing chambers, and the actions are continuously and sequentially performed in the first processing chamber and the second processing chamber.
Description
The application is to be that the application number that on 03 09th, 2010, denomination of invention are " base plate processing system and substrate processing method using same " is dividing an application of 201010132170.7 patent applications the applying date.
Technical field
The present invention relates to the substrates such as liquid-crystalline glasses are carried out the heat treated base plate processing systems such as roasting (baked one-tenth).
Background technology
When in chromatic filter manufacturing engineering etc., the substrates such as liquid-crystalline glasses being heat-treated, in order effectively to carry out moving into, process and taking out of of substrate, often use systematization structure.
The Control the content of carrying with the substrate in Fig. 1 simple declaration base plate processing system in the past at this.In the past, the conveying mechanical arm 22 that the section that moves into from scheming takes out untreated workpiece, for example took out of from the superiors of the multi-layer rack 166 of the first process chamber 16 workpiece of handling, and then untreated work-piece moved in this layer be available.After this conveying mechanical arm 22 is transported to the outer section that takes out of of figure to the workpiece of handling.Then, conveying mechanical arm 22 takes out untreated work-piece from the section of moving into again, specifically from the multi-layer rack 166 of the first process chamber 16 from the second layer of number take out of the workpiece of handling, then untreated work-piece is moved in this layer be available.Repeatedly carry out same action, conveying mechanical arm 22 is being taken out of the processing of the workpiece of handling and being moved into the processing of untreated work-piece the multi-layer rack of the first process chamber 16 at first from the superiors to undermost each layer.The processing that completes the workpiece that the taking out of from the superiors to undermost each layer of the multi-layer rack 166 of the first process chamber 16 handled and moving into the processing of untreated work-piece, same as described above, being taken out of the processing of the workpiece of handling from the superiors to undermost each layer and being moved into the processing of untreated work-piece the multi-layer rack 186 of the second process chamber 18.
In this base plate processing system, when substrate is heat-treated, be coated in the composition with distillation character (composition with distillation character that for example the contains photoresist) gasification on substrate, because causing the cleanliness factor in stove, reduces this sublimate.
Therefore, the sublimate that utilizes the handle such as ventilating duct to produce had been thought to various ways from the gas extraction system of sucking-off in stove in the past.A kind of annealing device is for example arranged in order to reduce the concentration of distillation gas, to the ventilation use air heated after, import to by the upstream section of the circulated air of workpiece, and a part Bas Discharged by workpiece No. 10-141868, Japanese Patent Publication communique Unexamined Patent (for example with reference to).
In the annealing device in the past of the annealing device that comprises No. 10-141868, above-mentioned Japanese Patent Publication communique Unexamined Patent, if boost productivity (throughput), just must shorten as far as possible substrate is moved into to the time interval in stove, if but shorten the time interval of moving into substrate,, for the concentration that makes sublimate gas is low, just must increase capacity.
And, follow the increase of capacity, the adding thermal capacity and also will increase of heat exhaust or air feed,, its result is in order to make in stove to remain on design temperature, provides more heat in just must be from heater to stove.
Therefore, in the annealing device in the past of the annealing device that comprises No. 10-141868, above-mentioned Japanese Patent Publication communique Unexamined Patent, the inevitable and proportional increase of the raising of productivity ratio of power consumption, thereby will cut down power consumption and will sacrifice productivity ratio.
Summary of the invention
The purpose of this invention is to provide a kind of productivity ratio of can not sacrificing and just can realize cutting down the base plate processing system of power consumption.
Base plate processing system of the present invention is heat-treated substrate.Example as substrate can be enumerated: the semiconductor wafer used in the glass substrate that liquid crystal display and plasma scope are used, semiconductor device etc.
This base plate processing system comprises delivery section, a plurality of process chamber, moves into section, takes out of section and control part.Delivery section has the conveying mechanical arm of conveying substrate.A plurality of process chambers be configured in respectively delivery section around.Chambers has the door that can open or close when moving into and take out of substrate.
Control part is at least controlled delivery section and process chamber.Control part is controlled the action of conveying mechanical arm and door, makes conveying mechanical arm be moved into or take out of same process chamber continuously, but in turn a plurality of process chambers is moved into or taken out of.
The invention provides a kind of base plate processing system, for substrate is heat-treated, described base plate processing system comprises: a plurality of process chambers, substrate is heat-treated, conveying mechanical arm, once only carry a substrate, move into section, hold the untreatment base that will move into described process chamber, take out of section, hold the substrate from described process chamber is taken out of, and control part, control described process chamber and described conveying mechanical arm, described process chamber has: multi-layer rack, can be substrate supporting on each layer, and door, desirable layer corresponding to multi-layer rack when moving into and take out of substrate can open or close, described control part is controlled the action of described conveying mechanical arm and described door, after moving in a process chamber through the substrate of stipulated time by described conveying mechanical arm, take out of and leave the substrate of taking out of in the described section that takes out of from this process chamber, then making described conveying mechanical arm move to describedly moves into section and grips untreatment base, untreatment base is moved in this process chamber, then, after moving in another process chamber through the substrate of stipulated time by described conveying mechanical arm, take out of and deposit in the described section that takes out of from this another process chamber, then making described conveying mechanical arm move to describedly moves into section and grips untreatment base, untreatment base is moved in this another process chamber, at described conveying mechanical arm, during described process chamber leaves, described door is closed, and by described a plurality of process chambers also being continued to such action in turn later, the all substrates that are bearing on described multi-layer rack in described a plurality of process chambers are carried out to the heat treatment of stipulated time.
In addition, the invention provides a kind of base plate processing system, for substrate is heat-treated, described base plate processing system comprises: a plurality of process chambers, substrate is heat-treated, conveying mechanical arm, once carry at least two substrates, move into section, hold the untreatment base that will move into described process chamber, take out of section, hold the substrate from described process chamber is taken out of, and control part, control described process chamber and described conveying mechanical arm, described process chamber has: multi-layer rack, can be substrate supporting on each layer, and door, desirable layer corresponding to multi-layer rack when moving into and take out of substrate can open or close, described control part is controlled the action of described conveying mechanical arm and described door, in the described section of moving into, make described conveying mechanical arm grip at least one untreatment base, after moving in a process chamber through the substrate of stipulated time by described conveying mechanical arm, from this process chamber, take out of, and the untreatment base that described conveying mechanical arm is gripped is moved in this process chamber, then the substrate of taking out of from this process chamber is deposited in to the described section that takes out of, in the described section of moving into, make described conveying mechanical arm grip at least one untreatment base, after moving in another process chamber through the substrate of stipulated time by described conveying mechanical arm, from this another process chamber, take out of, and the untreatment base that described conveying mechanical arm is gripped is moved in this another process chamber, then the substrate of taking out of from this another process chamber is stored in to the described section that takes out of, in the described section of moving into, make described manipulator grip at least one untreatment base, by described a plurality of process chambers are also continued to such action in turn later, the all substrates that are bearing on described multi-layer rack in described a plurality of process chambers are carried out to the heat treatment of stipulated time.
In this structure, each productive temp time (tact time) is carried out the action that opens or closes of different process chamber doors, for different process chambers, substrate is moved in order or is taken out of.By such order that substrate is dropped into to a plurality of process chambers that changes, can be suppressed at the growing amount of the sublimate gas of time per unit in single process chamber, reduce the concentration of the sublimate gas in stove.
Its result is compared with the past, during running, can reduce capacity and air demand, and can cut down the heat extraction of following exhaust.That is, productivity ratio can be do not reduced and just energy-saving operation can be carried out.The frequency of maintenance that also can make in addition to remove the sublimate be attached in stove etc. reduces.
According to the present invention, can not sacrifice productivity ratio and just can realize the decrease power consumption.
The accompanying drawing explanation
Fig. 1 means the figure of the content that base plate processing system control substrate is in the past carried.
Fig. 2 means the top view of the base plate processing system summary of embodiment of the present invention.
Fig. 3 means the sectional view of the first process chamber, the second process chamber and conveying mechanical arm summary.
Fig. 4 means the block diagram of base plate processing system summary.
Fig. 5 means the figure of master control part Control the content.
Fig. 6 means the top view of the base plate processing system brief configuration of the embodiment that the present invention is other.
Fig. 7 is the figure of the effect of the base plate processing system of schematic representation with n process chamber.
Fig. 8 means the figure of the process chamber brief configuration of the embodiment that the present invention is other.
The specific embodiment
Fig. 2 means the summary of the base plate processing system 10 of embodiment of the present invention.In this embodiment, base plate processing system 10 carries out the manufacturing engineering of chromatic filter, but range of application of the present invention is not limited to the manufacturing engineering of chromatic filter.
Base plate processing system 10 comprises the section of moving into 12, takes out of section 14, delivery section 15, the first process chamber 16 and the second process chamber 18.Move into section 12, take out of section 14 and delivery section 15 and be configured in the cleaning unit inside covered with transparent component.
Moving into section 12 mouthful works as moving into of untreated work-piece (substrate) 20.In the present embodiment, workpiece 20 is approximately rectangle glass substrates of 2.2 meters of approximately 2.5 meters, long limit, minor face, but the kind of the workpiece 20 that heat treatment system 10 is processed is not limited to this.Take out of the workpiece 20 that section 14 can pack into and handle.
Fig. 3 means the Sketch of the first process chamber 16, the second process chamber 18 and conveying mechanical arm 22.The first process chamber 16 comprises: body of heater 164 has the peristome that workpiece 20 is moved into and taken out of; And door 162, block selectively peristome.
Body of heater 164 has multi-layer rack 166, and this multi-layer rack 166 can be bearing in workpiece 20 on each layer.Door 162 consists of a plurality of baffle plate sheets, and described a plurality of baffle plate sheets are supported to can be respectively along the axle lifting of extending in vertical direction.Each baffle plate sheet can be cooperated with each other and be carried out lifting, for example, by two adjacent baffle plate sheets are separated or contact, can move into workpiece 20 and take out of the desirable layer of multi-layer rack 166.
The second process chamber 18 is identical with the first process chamber 16, also at least comprises body of heater 184, door 182 and multi-layer rack 186.Their structure is in fact identical with the first process chamber 16, so in this description will be omitted.
Conveying mechanical arm 22 has hand 225, and this hand 225 can holding workpieces 20.Workpiece 20 be moved into and be taken out of to conveying mechanical arm 22, by making hand 225 liftings and rotation, can with respect to the layer arbitrarily of multi-layer rack 166 and multi-layer rack 186.
Fig. 4 means the block diagram of the summary of base plate processing system 10.As shown in Figure 4, the first process chamber 16 at least comprises a drive division 169, ventilation section 168, heat treatment section 167 and control part 165.Door drive division 169 can carry out the action that opens or closes of above-mentioned door 166.Ventilation section 168 has: introduction part imports extraneous gas in body of heater 164; And exhaust portion, the gas of body of heater 164 inside is discharged.Ventilation section 168 sets capacity and the air demand that is applicable to indoor sublimate gas concentration.Heat treatment section 167 for example, is heated body of heater 164 at the temperature (230 ℃) of setting, and can heat-treat the workpiece 20 of moving in body of heater 164.Control part 165, according to the control information provided by master control part 30, is controlled the action of first process chamber 16 each ones.
The second process chamber 18 at least has a drive division 189, ventilation section 188, heat treatment section 187 and control part 185.Their structure is identical with control part 165 with above-mentioned door drive division 169, ventilation section 168, heat treatment section 167, in this description will be omitted.
Conveying mechanical arm 22 comprises section of travel mechanism 226, hand-drive section 224 and control part 222.Section of travel mechanism 226 at least comprises makes conveying mechanical arm 22 mobile mechanism and mechanism that conveying mechanical arm 22 is rotated in the horizontal direction.Hand-drive section 224 can make hand 225 carry out movement, rotation action and the gripping of lifting action, horizontal direction or unclamp workpiece 20.Control part 222, according to the control information from master control part 30, is controlled the action of conveying mechanical arm 22 each ones.
Fig. 5 is for the figure of master control part 30 Control the contents is described.In the base plate processing system 10 of present embodiment, master control part 30 makes conveying mechanical arm 22 alternately to the first process chamber 16 or the second process chamber 18, be moved into or take out of.Therefore, at this, not as shown in Figure 1, the superiors of the multi-layer rack 166 to from the first process chamber 16 complete the processing of taking out of the workpiece 20 of handling and move into the processing of untreated work-piece 20 to undermost each layer, the superiors of the multi-layer rack 186 from the second process chamber 18 are taken out of the processing of the workpiece 20 of handling and moved into the processing of untreated work-piece 20 to undermost each layer, but carry out in turn the processing of workpiece 20 that taking out of of the first process chamber 16 handled and move into the processing of untreated work-piece 20; And the processing of the workpiece 20 that taking out of of the second process chamber 18 handled and move into the processing of untreated work-piece 20.
Specifically, master control part 30 makes conveying mechanical arm 22 take out the untreated work-piece 20 of moving into section 12.Then, master control part 30 is according to the storage information of the position about moving into and order, open the door 162 of the first process chamber 16, after this by controlling the action of conveying mechanical arm 22, take out of from the layer of multi-layer rack 166 correspondences the workpiece 20 of handling, untreated work-piece 20 is moved in the same layer that becomes the layer be available.Wherein the so-called workpiece 20 of handling refers in moving into the first process chamber the workpiece 20 by the necessary stipulated time of Overheating Treatment.
After this, master control part 30 makes conveying mechanical arm 22 discharge the workpiece 20 of handling to the section of taking out of 14, makes conveying mechanical arm 22 move to the front of the section of moving into 12, takes out the untreated work-piece 20 of moving into section 12.
Then, master control part 30 is according to the storage information of the position about moving into and order, open the door 182 of the second process chamber 18, after this, by controlling the action of conveying mechanical arm 22, take out of from the layer of multi-layer rack 186 correspondences the workpiece 20 of handling, untreated work-piece 20 is moved in the same layer that becomes the layer be available.
After this, master control part 30 makes conveying mechanical arm 22 discharge the workpiece 20 of handling to the section of taking out of 14, makes conveying mechanical arm 22 move to the front of the section of moving into 12, from moving into section 12, takes out untreated work-piece 20.
Control the action of conveying mechanical arm 22 and door 162,182, also by continuing that in turn the first process chamber 16 and the second process chamber 18 are carried out to above-mentioned action, all workpiece 20 that are bearing on the multi-layer rack 166,186 in the first process chamber 16 and the second process chamber 18 are carried out to the heat treatment of stipulated time after making.
The example wherein meaned is: conveying mechanical arm 22 press multi-layer rack 166 the superiors → multi-layer rack 186 the superiors → multi-layer rack 166 from number the second layer → multi-layer rack 186 from number the second layer → ... the undermost order of the orlop → multi-layer rack 186 of → multi-layer rack 166 is moved into or is taken out of, but the order of moving into or taking out of is not limited to this example.
Fig. 6 means to have the Sketch of the base plate processing system 11 of six process chambers 17.Base plate processing system 11 comprises the section of moving into 12, takes out of section 14, delivery section 150 and six process chambers 17.Base plate processing system 11 is except the number of process chamber 17 is six, and its basic structure is identical with base plate processing system 10.
In base plate processing system 11, conveying mechanical arm 22 is controlled so as in turn six process chambers 17 is moved into or taken out of, rather than continuously same process chamber 17 is moved into or taken out of.
Wherein, master control part 30, according to the storage information of the position about moving into and order, is taken out of the processing of the workpiece 20 of handling and untreated work-piece 20 is moved into to the processing in the same layer that becomes the layer be available one in six process chambers 17.After this, master control part 30 makes conveying mechanical arm 22 discharge the workpiece 20 of handling to the section of taking out of 14, makes conveying mechanical arm 22 move to the front of the section of moving into 12, takes out the untreated work-piece 20 of moving into section 12.Then, the next one in six process chambers 17 is carried out to same action.Control the action of conveying mechanical arm 22 and door 162,182, after making, also by six process chambers 17 are continued to above-mentioned action in turn, all workpiece 20 that are bearing on the multi-layer rack in six process chambers 17 are carried out to the heat treatment of stipulated time.
As mentioned above, in the situation that process chamber is two, the workpiece 20 that the first process chamber is handled take out of the paired operation such with moving into of untreated work-piece 20, after this second process chamber is carried out to same paired operation, later to this operation that repeatedly hockets of the first process chamber and the second process chamber.In addition, in the situation that six process chambers are set in base plate processing system, by the order of the first～six process chamber, carry out above-mentioned paired operation, after this also carry out same operation.
If to becoming this mode vague generalization process chamber to have the situation of n platform to describe, the workpiece 20 that 30 pairs of the first process chambers of master control part are handled take out of the paired operation such with moving into of untreated work-piece 20, then the second process chamber is carried out to same operation, the n-1 process chamber is carried out to same operation, then after the n process chamber being carried out to same processing, again the first process chamber is carried out to same operation again, continue in turn such operation later.The quantity of its result and process chamber is irrelevant, for all workpiece 20, can both make them identical in the time of indoor delay.
Generally speaking, if the process chamber quantity in base plate processing system increases, more can reduce the capacity of capacity and heater.For example with the base plate processing system 10 shown in Fig. 2, compare, the base plate processing system 11 shown in Fig. 6 can further reduce the capacity of capacity and heater.
For example, as shown in Figure 6, in the base plate processing system 11 that a plurality of process chambers are set, by distributing the ordering in launching of workpiece 20, can make the maximum of time per unit drop into the number equalization, and can suppress the growing amount of the sublimate gas of time per unit in single process chamber 17.In addition, can cut down the capacity of heater, cut down operating cost.And owing to can easily preventing that sublimate is attached in process chamber 17, so can improve the maintainability of process chamber 17.
Fig. 7 schematic representation has the effect of the base plate processing system 10 of n process chamber.Wherein, using and be all mutually front topic as the productivity ratio of base plate processing system 10 integral body and base plate processing system in the past and describe.As shown in Figure 7, in base plate processing system 10, for each the first～the n process chamber, can amplify n doubly (the process chamber quantity of n for arranging) to the making time interval of workpiece 20 in system.Its result can be suppressed to 1/n to the growing amount of following the distillation gas that drops into workpiece 20 generations in theory.And, in order to make each the first～the n process chamber remain on the needed ventilation volume of cleanliness factor that is the capacity allowed separately, in theory also can be suppressed to 1/n.Therefore, the structure of ventilation section 168 and ventilation section 188 can be simplified, in addition, the electric weight consumed in ventilation section 168 and ventilation section 188 can be reduced in.
Therefore, the capacity due to making to remain in each the first～the n process chamber the needed heater of design temperature, in theory also can be suppressed to 1/n, so can significantly cut down the power consumption of base plate processing system 10.
For example, in the base plate processing system 10 with the first process chamber 16 or second process chamber 18, if substrate is in the past moved into to the time interval, from the degree of 60 seconds, be amplified to 120 seconds, can make the growing amount of sublimate gas reduce to 15ppm from 30ppm.Therefore, in the situation that make indoor pollution level adopt standard operation as in the past, owing to can making capacity from 40m
3/ minute be reduced to 20m
3/ minute, be reduced to 45kw so can be used in theory the capacity of the heater that supplements the discharge portion heat from 90kw.That is to say, can not reduce in theory productivity ratio and just can be suppressed to half left and right in the past to power consumption.
In addition, except the action of explanation in the above-described embodiment, in base plate processing system of the present invention, according to the arm of conveying mechanical arm 22 and the structure of hand, can carry out multiple running.For example in the above-described embodiment, conveying mechanical arm 22 is when the workpiece 20 handling takes out from process chamber, carry out the untreated work-piece 20 gripped is moved into the action of process chamber, but using while once can only grip the conveying mechanical arm of single workpiece 20, also can make conveying mechanical arm 22 by take out of the workpiece 20 handled → to the section of taking out of 14 move → move → move into the such flow process action of untreated work-piece 20 to moving into section 12.In addition, in this case, preferably during leaving process chamber, conveying mechanical arm 22 closes the door of process chamber.
In addition, in the above-described embodiment, to conveying mechanical arm 22, the situation of workpiece one by one 20 turnover process chambers is illustrated, but also can makes conveying mechanical arm 22 once make a plurality of (for example close two) workpiece 20 turnover process chambers.
The structure of the process chamber used in base plate processing system of the present invention in addition, is not limited to above-mentioned structure.For example, shown in Fig. 8, also can in base plate processing system of the present invention, use such process chamber: corresponding to each layer, rotary wicket 40 is set, and utilizes air cylinder driven that each wicket 40 is opened or closed.
In the above-described embodiment, the situation that is two or six to the quantity that is arranged on the process chamber in base plate processing system 10,11 is illustrated, but the number of process chamber is not limited to above-mentioned example so long as get final product more than two.
The explanation of above-mentioned embodiment is all illustration, should not be regarded as the content of restriction.Scope of the present invention is not to be meaned by above-mentioned embodiment, but is meaned by claim.In addition, scope of the present invention comprises the content be equal to claim and all changes of carrying out within the scope of the present invention.
Claims (2)
1. a base plate processing system, it is characterized in that: for substrate is heat-treated, described base plate processing system comprises: a plurality of process chambers, substrate is heat-treated; Conveying mechanical arm, once only carry a substrate; Move into section, hold the untreatment base that will move into described process chamber; Take out of section, hold the substrate from described process chamber is taken out of; And control part, control described process chamber and described conveying mechanical arm,
Described process chamber has: multi-layer rack, and can be substrate supporting on each layer; And door, the desirable layer corresponding to multi-layer rack when moving into and take out of substrate can open or close,
Described control part is controlled the action of described conveying mechanical arm and described door, after moving in a process chamber through the substrate of stipulated time by described conveying mechanical arm, take out of and leave the substrate of taking out of in the described section that takes out of from this process chamber, then making described conveying mechanical arm move to describedly moves into section and grips untreatment base, untreatment base is moved in this process chamber, then, after moving in another process chamber through the substrate of stipulated time by described conveying mechanical arm, take out of and deposit in the described section that takes out of from this another process chamber, then making described conveying mechanical arm move to describedly moves into section and grips untreatment base, untreatment base is moved in this another process chamber, at described conveying mechanical arm, during described process chamber leaves, described door is closed, and by described a plurality of process chambers also being continued to such action in turn later, the all substrates that are bearing on described multi-layer rack in described a plurality of process chambers are carried out to the heat treatment of stipulated time.
2. a base plate processing system, it is characterized in that: for substrate is heat-treated, described base plate processing system comprises: a plurality of process chambers, substrate is heat-treated; Conveying mechanical arm, once carry at least two substrates; Move into section, hold the untreatment base that will move into described process chamber; Take out of section, hold the substrate from described process chamber is taken out of; And control part, control described process chamber and described conveying mechanical arm,
Described process chamber has: multi-layer rack, and can be substrate supporting on each layer; And door, the desirable layer corresponding to multi-layer rack when moving into and take out of substrate can open or close,
Described control part is controlled the action of described conveying mechanical arm and described door, in the described section of moving into, make described conveying mechanical arm grip at least one untreatment base, after moving in a process chamber through the substrate of stipulated time by described conveying mechanical arm, from this process chamber, take out of, and the untreatment base that described conveying mechanical arm is gripped is moved in this process chamber, then the substrate of taking out of from this process chamber is deposited in to the described section that takes out of, in the described section of moving into, make described conveying mechanical arm grip at least one untreatment base, after moving in another process chamber through the substrate of stipulated time by described conveying mechanical arm, from this another process chamber, take out of, and the untreatment base that described conveying mechanical arm is gripped is moved in this another process chamber, then the substrate of taking out of from this another process chamber is stored in to the described section that takes out of, in the described section of moving into, make described manipulator grip at least one untreatment base, by described a plurality of process chambers are also continued to such action in turn later, the all substrates that are bearing on described multi-layer rack in described a plurality of process chambers are carried out to the heat treatment of stipulated time.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-065793 | 2009-03-18 | ||
| JP2009065793A JP5280901B2 (en) | 2009-03-18 | 2009-03-18 | Substrate processing system and substrate processing method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010132170 Division CN101839644B (en) | 2009-03-18 | 2010-03-09 | Substrate processing system and substrate processing method |
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| Publication Number | Publication Date |
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| CN103438710A true CN103438710A (en) | 2013-12-11 |
| CN103438710B CN103438710B (en) | 2015-06-24 |
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| CN 201010132170 Active CN101839644B (en) | 2009-03-18 | 2010-03-09 | Substrate processing system and substrate processing method |
| CN201310302882.2A Expired - Fee Related CN103438710B (en) | 2009-03-18 | 2010-03-09 | Substrate processing system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109866208A (en) * | 2017-12-05 | 2019-06-11 | 日本电产三协株式会社 | The teaching method of robot and robot |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012212746A (en) * | 2011-03-31 | 2012-11-01 | Tokyo Electron Ltd | Substrate transfer device and substrate transfer method |
| JP7149748B2 (en) * | 2018-07-04 | 2022-10-07 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING SYSTEM, SUBSTRATE TRANSFER METHOD, AND CONTROL PROGRAM |
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| JP2002190512A (en) * | 2000-10-11 | 2002-07-05 | National Institute Of Advanced Industrial & Technology | Electrostatic chuck and its manufacturing method |
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| CN101164156A (en) * | 2005-08-05 | 2008-04-16 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate stage used for the same |
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| JP3959141B2 (en) * | 1996-11-12 | 2007-08-15 | エスペック株式会社 | Heat treatment equipment with sublimation countermeasures |
| JP3462405B2 (en) * | 1998-10-29 | 2003-11-05 | 東京エレクトロン株式会社 | Processing equipment |
| JP3582820B2 (en) * | 2000-03-24 | 2004-10-27 | 東京エレクトロン株式会社 | Processing system and interface device |
| JP5034138B2 (en) * | 2001-01-25 | 2012-09-26 | 東京エレクトロン株式会社 | Heat treatment method and heat treatment apparatus |
| JP2002368030A (en) * | 2001-06-08 | 2002-12-20 | Hitachi Ltd | Resin-sealed semiconductor device and method of manufacturing the same |
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2010
- 2010-03-08 TW TW103146534A patent/TWI524460B/en not_active IP Right Cessation
- 2010-03-08 TW TW99106575A patent/TWI471966B/en active
- 2010-03-09 CN CN 201010132170 patent/CN101839644B/en active Active
- 2010-03-09 CN CN201310302882.2A patent/CN103438710B/en not_active Expired - Fee Related
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| JP2000169169A (en) * | 1998-12-01 | 2000-06-20 | Koyo Thermo System Kk | Heat treatment apparatus |
| JP2002190512A (en) * | 2000-10-11 | 2002-07-05 | National Institute Of Advanced Industrial & Technology | Electrostatic chuck and its manufacturing method |
| CN1450346A (en) * | 2002-03-29 | 2003-10-22 | 爱斯佩克株式会社 | Article heat treatment device and device having holden |
| CN1934695A (en) * | 2004-03-25 | 2007-03-21 | 东京毅力科创株式会社 | Vertical heat treating apparatus and automatic teaching method for transfer mechanism |
| CN101164156A (en) * | 2005-08-05 | 2008-04-16 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate stage used for the same |
| CN101016188A (en) * | 2006-02-08 | 2007-08-15 | 光洋热系统股份有限公司 | Heat treatment apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109866208A (en) * | 2017-12-05 | 2019-06-11 | 日本电产三协株式会社 | The teaching method of robot and robot |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101839644A (en) | 2010-09-22 |
| JP5280901B2 (en) | 2013-09-04 |
| CN103438710B (en) | 2015-06-24 |
| TWI524460B (en) | 2016-03-01 |
| TWI471966B (en) | 2015-02-01 |
| TW201521145A (en) | 2015-06-01 |
| CN101839644B (en) | 2013-07-31 |
| TW201041074A (en) | 2010-11-16 |
| JP2010219383A (en) | 2010-09-30 |
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