CN103433186B - 一种二极管台面保护胶低温固化工艺 - Google Patents
一种二极管台面保护胶低温固化工艺 Download PDFInfo
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EP2055756A1 (en) * | 2006-08-25 | 2009-05-06 | Sumitomo Bakelite Company, Ltd. | Adhesive tape, joint structure, and semiconductor package |
BRPI0813201A2 (pt) * | 2007-08-02 | 2014-12-23 | Dow Global Technologies Inc | "composição curável, compósito e método para formar um compósito" |
CN101935453A (zh) * | 2009-07-01 | 2011-01-05 | 东丽纤维研究所(中国)有限公司 | 一种热固型聚苯并噁嗪-聚酰亚胺树脂组合物/介孔分子筛杂化材料及其制备方法 |
CN101959372B (zh) * | 2010-05-24 | 2012-03-14 | 大连太平洋多层线路板有限公司 | 一种超厚铜线路板阻焊加工方法 |
CN102134254B (zh) * | 2011-01-05 | 2014-04-02 | 山东大学 | 含硅苯并噁嗪树脂及其制备方法与应用 |
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Effective date of registration: 20191121 Address after: Room 1,020, Nanxun Science and Technology Pioneering Park, No. 666 Chaoyang Road, Nanxun District, Huzhou City, Zhejiang Province, 313000 Patentee after: Huzhou You Yan Intellectual Property Service Co.,Ltd. Address before: 226500, Jiangsu, Nantong City, Rugao City, the original industrial concentration zone Patentee before: RUGAO RIXIN ELECTRONIC Co.,Ltd. |
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Effective date of registration: 20231225 Address after: No. 40, dianjiangtai Road, Jiangbei new area, Nanjing, Jiangsu 210000 Patentee after: Nanjing Fangqiang Technology Development Co.,Ltd. Address before: 313000 room 1020, science and Technology Pioneer Park, 666 Chaoyang Road, Nanxun Town, Nanxun District, Huzhou, Zhejiang. Patentee before: Huzhou You Yan Intellectual Property Service Co.,Ltd. |
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