CN103414006A - Ultra-thin passive wireless acoustic surface wave sensor - Google Patents
Ultra-thin passive wireless acoustic surface wave sensor Download PDFInfo
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- CN103414006A CN103414006A CN201310349977XA CN201310349977A CN103414006A CN 103414006 A CN103414006 A CN 103414006A CN 201310349977X A CN201310349977X A CN 201310349977XA CN 201310349977 A CN201310349977 A CN 201310349977A CN 103414006 A CN103414006 A CN 103414006A
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Abstract
The invention relates to an ultra-thin passive wireless acoustic surface wave sensor. The ultra-thin passive wireless acoustic surface wave sensor is characterized by comprising a PCB, a micro-strip antenna and an acoustic surface wave sensor chip. Both the micro-strip antenna and the acoustic surface wave sensor chip are arranged on the PCB, and the micro-strip antenna is connected with the acoustic surface wave sensor chip. The ultra-thin passive wireless acoustic surface wave sensor is simple and compact in structure, and small in occupied space even though the antenna is provided.
Description
Technical field
The present invention is specifically related to a kind of ultrathin Passive Wireless SAW Sensors.
Background technology
Existing Passive Wireless SAW Sensors has the characteristics such as passive and wireless, and this makes it can be applied under the particular surroundingss such as HTHP, strong magnetic strength are electric, inflammable and explosive, high speed rotating.All the time, surface acoustic wave sensor, because generally adopt external helical antenna etc., makes the size of transducer generally bigger than normal, has limited its application at the narrow and small environment of some installing space; And this split type surface acoustic wave sensor, use also inconvenient.
Summary of the invention
The objective of the invention is: provide a kind of not only simple in structure, compact, and with the antenna little ultrathin Passive Wireless SAW Sensors that also takes up room, thereby can be applicable to the narrower application scenario of installing space, to overcome the deficiencies in the prior art.
In order to achieve the above object, technical scheme of the present invention is: a kind of ultrathin Passive Wireless SAW Sensors, its innovative point is: comprise PCB substrate, microstrip antenna and sound surface wave sensor chip, described microstrip antenna and sound surface wave sensor chip all are located on the PCB substrate, and microstrip antenna is connected with sound surface wave sensor chip.
In technique scheme, described microstrip antenna is laminated structure, and is square, or rounded, or ringwise.
In technique scheme, also comprise housing and the cap of connection sealed to each other, described PCB substrate, microstrip antenna and sound surface wave sensor chip all are located in housing.
In technique scheme, described housing and cap are respectively metal shell and ceramic cap, or are respectively metal shell and plastics cap.
In technique scheme, described sound surface wave sensor chip is the sound surface wave sensor chip of measuring temperature or pressure or moment of torsion or vibrations or gas concentration.
In technique scheme, described microstrip antenna is connected with sound surface wave sensor chip by microstrip line.
In technique scheme, between described microstrip antenna and sound surface wave sensor chip, be to adopt the matching network that builds T-shaped, π type or L-type by electric capacity and inductance to be connected.
In technique scheme, described matching network is T-shaped matching network, described T-shaped matching network comprises electric capacity a, electric capacity b and inductance c, the end of described electric capacity a is connected with the end of the end of electric capacity b and inductance c, the end of electric capacity a all is connected with sound surface wave sensor chip with the other end of inductance c, and the other end of electric capacity b is connected with microstrip antenna.
In technique scheme, described matching network is π type matching network, described π type matching network comprises electric capacity b1, inductance c1 and inductance d, the end of described electric capacity b1 is connected with the end of sound surface wave sensor chip and inductance c1 simultaneously, the other end of electric capacity b1 is connected with an end and the microstrip antenna of inductance d simultaneously, and the other end of the other end of inductance c1 and inductance d is connected with sound surface wave sensor chip.
In technique scheme, described matching network is the L-type matching network, described L-type matching network comprises electric capacity a1 and inductance c2, the end of described electric capacity a1 all is connected with sound surface wave sensor chip with the end of inductance c2, and the other end of electric capacity a1 is connected with the other end and the microstrip antenna of inductance c2 simultaneously.
The good effect that the present invention has is: after having adopted above-mentioned sensor construction, by microstrip antenna and surface acoustic wave sensor integrated chip on the PCB substrate, rather than in the picture prior art, external helical antenna again, so also just dwindle the size of whole transducer, therefore, made the present invention can be applicable to the narrower application scenario of installing space, the present invention is not only simple in structure, compact, is applicable to again produce in enormous quantities.In addition, transducer involved in the present invention can be made into various applicable shapes according to actual application environment, and lightweight, and the mounting means variation is easy to safeguard.
The accompanying drawing explanation
Fig. 1 is the structural representation of the first embodiment of the present invention;
Fig. 2 is the structural representation of the second embodiment of the present invention;
Fig. 3 is the structural representation of the transducer of the subsidiary the first embodiment matching network of Fig. 1;
Fig. 4 is the structural representation of the transducer of the subsidiary the second embodiment matching network of Fig. 1;
Fig. 5 is the structural representation of the transducer of subsidiary the third embodiment matching network of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the present invention is further illustrated, but be not limited to this.
As shown in Figure 1, a kind of ultrathin Passive Wireless SAW Sensors, it is characterized in that: comprise PCB substrate 1, microstrip antenna 2 and sound surface wave sensor chip 3, described microstrip antenna 2 and sound surface wave sensor chip 3 all are located on PCB substrate 1, and microstrip antenna 2 is connected with sound surface wave sensor chip 3.
Sound surface wave sensor chip 3 of the present invention is sound surface wave sensor chips of measuring temperature or pressure or moment of torsion or vibrations or gas concentration.Certainly, be not limited to this, sound surface wave sensor chip 3 can be also the sound surface wave sensor chip of measuring chemistry or biological variable.Sound surface wave sensor chip of the present invention can be selected by French SENSEOR company and produce, and model is the SAW Temperature Sensors chip of TSE F160, certainly, is not limited to this, also can adopt the sound surface wave sensor chip of other model.
As shown in Figure 1, for the ease of assembling, described microstrip antenna 2 is connected with sound surface wave sensor chip 3 by microstrip line 7.
As shown in Fig. 3,4,5, for the performance that makes transducer more excellent, need to connect between microstrip antenna 2 and sound surface wave sensor chip 3, doing suitable coupling, can make according to actual needs between described microstrip antenna 2 and sound surface wave sensor chip 3 is to adopt the matching network 6 of, π type T-shaped by electric capacity and inductance structure or L-type to be connected.That is because if microstrip antenna 2 and sound surface wave sensor chip 3 do not mate, will cause energy loss, and affect distance sensing, and, after increase matching network 6, not only can reduce energy loss, and can the optimized transmission distance.
As shown in Figure 3, described matching network 6 is T-shaped matching network, described T-shaped matching network comprises electric capacity a, electric capacity b and inductance c, the end of described electric capacity a is connected with the end of the end of electric capacity b and inductance c, the end of electric capacity a all is connected with sound surface wave sensor chip 3 with the other end of inductance c, and the other end of electric capacity b is connected with microstrip antenna 2.
As shown in Figure 4, described matching network 6 is π type matching network, described π type matching network comprises electric capacity b1, inductance c1 and inductance d, the end of described electric capacity b1 is connected with the end of sound surface wave sensor chip 3 and inductance c1 simultaneously, the other end of electric capacity b1 is connected with an end and the microstrip antenna 2 of inductance d simultaneously, and the other end of the other end of inductance c1 and inductance d is connected with sound surface wave sensor chip 3.
As shown in Figure 5, described matching network 6 is the L-type matching network, described L-type matching network comprises electric capacity a1 and inductance c2, the end of described electric capacity a1 all is connected with sound surface wave sensor chip 3 with the end of inductance c2, and the other end of electric capacity a1 is connected with the other end and the microstrip antenna 2 of inductance c2 simultaneously.
As shown in Figure 2, be with the difference of embodiment 1: also comprise the housing be connected 5 sealed to each other and cap 4, described PCB substrate 1, microstrip antenna 2 and sound surface wave sensor chip 3 all are located in housing 5.Other structure of embodiment 2 is identical with embodiment 1.
Housing 5 of the present invention and cap 4 are respectively metal shell and ceramic cap, or are respectively metal shell and plastics cap.
The present invention is not only simple in structure, compact, and by microstrip antenna and surface acoustic wave sensor integrated chip on the PCB substrate, make take up room also little, thereby can be applicable to the narrower application scenario of installing space.
Claims (10)
1. ultrathin Passive Wireless SAW Sensors, it is characterized in that: comprise PCB substrate (1), microstrip antenna (2) and sound surface wave sensor chip (3), it is upper that described microstrip antenna (2) and sound surface wave sensor chip (3) all are located at PCB substrate (1), and microstrip antenna (2) is connected with sound surface wave sensor chip (3).
2. ultrathin Passive Wireless SAW Sensors according to claim 1 is characterized in that: described microstrip antenna (2) is laminated structure, and is square, or rounded, or ringwise.
3. ultrathin Passive Wireless SAW Sensors according to claim 1, it is characterized in that: also comprise housing (5) and the cap (4) of connection sealed to each other, described PCB substrate (1), microstrip antenna (2) and sound surface wave sensor chip (3) all are located in housing (5).
4. ultrathin Passive Wireless SAW Sensors according to claim 3, it is characterized in that: described housing (5) and cap (4) are respectively metal shell and ceramic cap, or are respectively metal shell and plastics cap.
5. ultrathin Passive Wireless SAW Sensors according to claim 1 is characterized in that: described sound surface wave sensor chip (3) is the sound surface wave sensor chip of measuring temperature or pressure or moment of torsion or vibrations or gas concentration.
6. according to the described ultrathin Passive Wireless SAW Sensors of claim 1 or 3, it is characterized in that: described microstrip antenna (2) is connected with sound surface wave sensor chip (3) by microstrip line (7).
7. according to the described ultrathin Passive Wireless SAW Sensors of claim 1 or 3, it is characterized in that: between described microstrip antenna (2) and sound surface wave sensor chip (3), be to adopt the matching network (6) that builds T-shaped, π type or L-type by electric capacity and inductance to be connected.
8. ultrathin Passive Wireless SAW Sensors according to claim 7, it is characterized in that: described matching network (6) is T-shaped matching network, described T-shaped matching network comprises electric capacity a, electric capacity b and inductance c, the end of described electric capacity a is connected with the end of the end of electric capacity b and inductance c, the end of electric capacity a all is connected with sound surface wave sensor chip (3) with the other end of inductance c, and the other end of electric capacity b is connected with microstrip antenna (2).
9. ultrathin Passive Wireless SAW Sensors according to claim 7, it is characterized in that: described matching network (6) is π type matching network, described π type matching network comprises electric capacity b1, inductance c1 and inductance d, the end of described electric capacity b1 is connected with the end of sound surface wave sensor chip (3) and inductance c1 simultaneously, the other end of electric capacity b1 is connected with an end and the microstrip antenna (2) of inductance d simultaneously, and the other end of the other end of inductance c1 and inductance d is connected with sound surface wave sensor chip (3).
10. ultrathin Passive Wireless SAW Sensors according to claim 7, it is characterized in that: described matching network (6) is the L-type matching network, described L-type matching network comprises electric capacity a1 and inductance c2, the end of described electric capacity a1 all is connected with sound surface wave sensor chip (3) with the end of inductance c2, and the other end of electric capacity a1 is connected with the other end and the microstrip antenna (2) of inductance c2 simultaneously.
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| CN201310349977XA CN103414006A (en) | 2013-08-13 | 2013-08-13 | Ultra-thin passive wireless acoustic surface wave sensor |
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| CN105318901A (en) * | 2014-08-02 | 2016-02-10 | 软控股份有限公司 | Surface acoustic wave resonator type impedance sensor and surface acoustic wave resonator type impedance detection system |
| CN107727125A (en) * | 2017-09-13 | 2018-02-23 | 浙江大学 | Wireless and passive test system and method for testing based on thin film acoustic wave sensor |
| CN109708774A (en) * | 2019-01-24 | 2019-05-03 | 上海置信电气股份有限公司 | A kind of passive wireless temperature sensor of gasket construction |
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| CN109708774B (en) * | 2019-01-24 | 2024-03-01 | 上海置信智能电气有限公司 | Passive wireless temperature sensor with gasket structure |
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Application publication date: 20131127 |