CN103399268A - Ejector pin type integrated circuit testing fixture - Google Patents
Ejector pin type integrated circuit testing fixture Download PDFInfo
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- CN103399268A CN103399268A CN201310304331XA CN201310304331A CN103399268A CN 103399268 A CN103399268 A CN 103399268A CN 201310304331X A CN201310304331X A CN 201310304331XA CN 201310304331 A CN201310304331 A CN 201310304331A CN 103399268 A CN103399268 A CN 103399268A
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- thimble
- spring
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- integrated circuit
- pressing plate
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Abstract
The invention relates to an ejector pin type integrated circuit testing fixture. The ejector pin type integrated circuit testing fixture consists of a cover main body, clamping hooks, pressure plates, ejector pins, first springs, cover plates, second springs and clamping hook springs, wherein the cover plates, the pressure plates, the first springs and the ejector pins 4 are fastened into an ejector pin mechanism through fastening parts; the ejector pin mechanism is arranged in an inner cavity of the cover main body; the ejector pins are stepped; the first springs are arranged between the cover plates and the ejector pins; the ejector pins are fixedly arranged in the pressure plates under the action of spring force of the first springs; the first springs and the ejector pins can freely move up and down in the inner cavity; through holes are formed in the pressure plates; one end of each ejector pin penetrates through the through hole of the corresponding pressure plate, and is raised from the bottom surface of the corresponding pressure plate; and the pinheads of the ejector pins are raised from the planes of the pressure plates in an untested state. According to the ejector pin type integrated circuit testing fixture, the magnitude of force applied to chips can be controlled through the ejector pin mechanism by regulating the amounts of compression of the springs, and damage to the chips is avoided.
Description
Technical field
The present invention is a kind of tool of using for semiconductor die testing.
Background technology
the technology of present Electronic Packaging and development trend are to have higher electrical property and thermal behavior, gently, thin, little, batch production, be convenient to install, use, the characteristic demand of reprocessing, the small-sized high density packing forms of device is more and more, as wafer stage chip packaged type (Wafer Level Chip Scale Packaging, be called for short WLCSP)), MEMS (micro electro mechanical system) (MEMS, Micro-Electro-Mechanic System), multimode encapsulation (MCM), system in package (SiP), flip-chip (FC, Flip-Chip) etc. application is more and more.The appearance of these high characteristics has proposed the more requirement of Gao Gengxin to chip testing jig.
The traditional test tool as shown in Figure 6, its principle of work is: IC is put into test jack Inner, test on lid pressing plate directly press or spinning at the chip top, the pressure that guarantees IC is even, is not shifted, and presses down steadily, the special capitiform projection of probe can puncture the oxide layer of solder sphere, contact is reliable, and can not damage the tin ball, and each pin that guarantees chip contacts and well carries out electrical testing with each pad on circuit board by probe.After with measurement jig, testing chip, the tool lid need to separate from the base of tool, and the tester will take out the chip of having tested from the chip chamber of tool base, then change to the chip that next group will be surveyed.Yet, for following novel encapsulated, some problems in urgent need to solve have appearred:
The MEMS chip, because of the special process requirement, its surface-coated one deck glue. for this chip, when traditional measurement jig in use can run into the lid of taking down tool, chip does not drop in the chip chamber of tool base, but be bonded at problem on the pressing plate of tool lid by the removing residual glue on chip surface, in case chip is stuck, this chip will be scrapped processing.
SiP chip, flip-chip are regarded as the prefered method of the low application of various stitch quantity.Due to special encapsulation technology, flip-chip is than CSP, and BGA is less thinner, also has the base material material of flip-chip more crisp, and these all require chip to control and want little and accurate the strength of pressure.
Separately, chip can produce static in test process, and static can be influential to test result.
Summary of the invention
The objective of the invention is to improve the structure of existing measurement jig, by adding ejector pin mechanism, and can control by the decrement of adjusting spring the size of the power that is applied to chip and don't defective chip.
Concrete technical scheme of the present invention is: a kind of integrated circuit testing tool of thimble-type, by with lower component, forming: cap body 1, grab 2, pressing plate 3, thimble 4, the first spring 6, cover plate 7, the second spring 8 and grab spring 9; Its cover plate 7, pressing plate 3, the first spring 6 and thimble 4 are by the fastening ejector pin mechanism that forms of securing member; This thimble structure is located at the cap body inner chamber,
Described thimble is stepped, and the first spring is located between cover plate and thimble, and thimble is fixed in pressing plate under the effect of the spring force of the first spring; The first spring and thimble can be freely up and down in chamber;
Described pressing plate is provided with through hole, and of thimble passes this plate hole and protrudes the pressing plate bottom surface, and under test mode not, the thimble syringe needle protrudes the plane of pressing plate.
In test process, after pressing plate and chip touched, thimble was subject to chip pressure, and pressure passes to the spring on thimble, and spring stress is compressed, in thimble indentation pin hole; After test finished, the thimble spring did not stress, and recovered length, and thimble is released and returned to syringe needle and protrude state, and the effect of described cover plate is the fixing spring on thimble, makes spring all the time on thimble.
Thimble structure is installed in the cap body inner chamber, can be movable or directly by screw fastener, be fixed on the cap body inner chamber in the lid cavity by the second spring 8.The cap body both sides respectively arrange a grab, are connected connection between grab and cap body with the grab spring by pin, and grab spring 9 can freely overturn to open and close about 10 degree left and right, is used for placing the measurement jig socket of below, carries out the test of chip functions.
Cap body material of the present invention can be different according to test environment and different, high temperature resistant, the aluminum component that high performance thermoplastic special engineering plastic or cost are low.
Grab material: select aluminum component or engineering plastic materials and parts.
Laminate material: preferentially select the engineering plastic materials and parts, take defective chip not as prerequisite.
Cover plate materials: preferentially select aluminum component, the engineering plastic materials and parts.
Thimble material: preferentially select the engineering plastic materials and parts.Take defective chip not as prerequisite.Select stainless steel while needing conduction.When thimble is tiny easy damage structure, select stainless steel.
The metalwork material require is made special oxidation processes on surface, prevent from getting rusty.
Effect of the present invention:
1. to solving because chip surface has chip that glue produces to be bonded to problem on the tool pressing plate, fundamentally improvement is arranged thoroughly. after having added ejector pin mechanism, by adjusting the decrement of spring, make spring force surpass the viscous force of chip gluing, thimble is pushed chip open, make chip break away from the lid top board, fall in the chip chamber.
The computing formula of spring force: F=R* (FL-L).
Wherein:
The drift of FL(FREE LENGTH)-spring;
L (LENGTH)-spring is by the actual compression length after pressing;
The rigidity of R(RATE)-spring.
2. for flip-chip, can be by adjusting the decrement of spring, precisely control thimble and be pressed in strength on chip, being stressed of chip is controlled in the scope that can be stressed, be unlikely to chip and damaged by pressure.
3. structure of the present invention is not subjected to the restriction of chip size size and strength size.Large size chip can adopt a plurality of thimbles to be uniformly distributed, and makes the chip end face stressed evenly; Small-size chips, a thimble gets final product.
4. structure of the present invention can also be eliminated the static that produces in the chip testing process.The pressing plate of measurement jig lid must be all generally working of plastics, because the hard meeting of metalwork material produces damage to chip.The present invention is working of plastics except pressing plate, and all the other all can be metalwork, and static can discharge by thimble; And the strength of thimble is very little, and syringe needle is that circle can not have infringement to chip.
The usefulness of this product is: simple for structure, use and keep in repair also to facilitate, and consistent with traditional test tool using method; Can be used for the test of large batch of scale the serviceable life of probe fully; Be not subjected to the restriction of chip size size, usable range is large.
Description of drawings
Fig. 1 is the perspective view of measurement jig of the present invention.
Fig. 2 is that in Fig. 1, the B-B side-looking cuts view.
Fig. 3 is the not test mode of C section enlarged drawing in Fig. 2.
Fig. 4 is the test mode of C section enlarged drawing in Fig. 2.
Fig. 5 is a plurality of thimble-type measurement jigs.
Fig. 6 is existing measurement jig schematic diagram.
Wherein: 1-cap body, 2-grab, 3-pressing plate, 4-thimble, 5-chip product, 6-the first spring, 7-cover plate, 8-the second spring, 9-grab spring.
Embodiment
Fig. 1 ~ Fig. 4 is described, and a kind of integrated circuit testing tool of thimble-type, by with lower component, forming: cap body 1, grab 2, pressing plate 3, thimble 4, the first spring 6, cover plate 7, the second spring 8 and grab spring 9.
Described thimble 4 is stepped, the first spring 6 is located between cover plate 7 and thimble 4, thimble 4 is fixed in pressing plate 3 under the effect of the spring force of the first spring 6, pressing plate is provided with through hole, thimble is tiny one pass this plate hole and protrude the pressing plate bottom surface, after pressing plate and chip touch, thimble is subject to chip pressure, pressure passes to the spring on thimble, and spring stress is compressed, in thimble indentation pin hole; After test finished, the thimble spring did not stress, and recovered length, and thimble is released and returned to syringe needle and protrude state, and the effect of described cover plate is the fixing spring on thimble, makes spring all the time on thimble.
Ejector pin mechanism can float or directly by screw fastener, be fixed on the cap body inner chamber by the second spring 8 in the lid cavity.The cap body both sides respectively arrange a grab, are connected connection between grab and cap body with the grab spring by pin, and grab spring 9 can freely overturn to open and close about 10 degree left and right, is used for placing the measurement jig socket of below, carries out the test of chip functions.
In addition, same cap body 1 can be mated different thimble structures, and is according to the thimble structure of different chip specifications design different sizes, cost-saved.As shown in Figure 3, be the local enlarged diagram of C section in Fig. 2.Its ejector pin mechanism can be movable vertically in the inner chamber of cap body 1 by the second spring 8, and this floats and can cover the tolerance of chip and assembling, is unlikely to dieback or under-voltage.By the first spring 6, the stairstepping of thimble 4 also can be freely up and down in chamber.Under test mode not, the thimble syringe needle must exceed pressing plate 3 planes, is of a size of A.Adjust the decrement of the first spring 6, with the clinging power in applicable certain limit.The first spring 6 is applied to the strength of thimble 4 must be greater than the clinging power of chip gluing, and thimble 4 just can have enough strength to flick chip 5, but elastic force can not be too large, in order to avoid be damaged to chip.
The computing formula of the spring force of this first spring 6: F=R* (FL-L).FL(FREE LENGTH wherein) be the drift of spring; L (LENGTH) is that spring is by the actual compression length after pressing; R(RATE) be the rigidity of spring.
During concrete operations, grab 2 is opened, and fastens the base of measurement jig, after this moment, pressing plate 3 was subject to the strength of the probe below chip, presses chip 5, and thimble 4 is pressed in the pin chamber, namely as the test mode in Fig. 4.After chip 5 test finished, grab 2 was opened again, and the tool lid breaks away from the tool base, and thimble 4 syringe needles will no longer stressed this moment, return to the not test mode of Fig. 3, and chip 5 drops in the chip chamber smoothly shaking off clinging power disengaging pressing plate under the promotion of thimble 4.
A plurality of thimble-type measurement jig lids can be used on the chip of large scale or large strength requirement.As Fig. 5, all established a thimble on four angles of chip, the chip distribution of force evenly and not can the perk dislocation.
The implementation case is for testing simultaneously 16 chips, and when using as shown in Figure 6 original traditional tool lid, chip has more than 5% and is bonded on pressing plate 3, and the chip that clings is all scrapped; And after employing the present invention, as shown in Figure 5, effect is very good, does not have chip to be glued.
Claims (5)
1. the integrated circuit testing tool of a thimble-type, is characterized in that, cap body (1), grab (2), pressing plate (3), thimble (4), the first spring (6), cover plate (7), the second spring (8) and grab spring (9), consists of; Its cover plate, pressing plate, the first spring and thimble are by the fastening ejector pin mechanism that forms of securing member; This thimble structure is located at the cap body inner chamber,
Described thimble is stepped, and the first spring is located between cover plate and thimble, and thimble is fixed in pressing plate under the effect of the spring force of the first spring; The first spring and thimble can be freely up and down in chamber;
Described pressing plate is provided with through hole, and of thimble passes this plate hole and protrudes the pressing plate bottom surface, and under test mode not, the thimble syringe needle protrudes the plane of pressing plate.
2. the integrated circuit testing tool of a kind of thimble-type according to claim 1, is characterized in that, thimble is vertically to embed the cap body inner chamber.
3. the integrated circuit testing tool of a kind of thimble-type according to claim 1, is characterized in that, the first spring is applied to power on thimble greater than the clinging power of chip gluing.
4. the integrated circuit testing tool of a kind of thimble-type according to claim 1, is characterized in that, the second spring floats or by screw fastener, is fixed on the cap body inner chamber in the lid cavity.
5. the integrated circuit testing tool of a kind of thimble-type according to claim 1, is characterized in that, the cap body both sides respectively arrange a grab, is connected with the grab spring by pin between grab and cap body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310304331XA CN103399268A (en) | 2013-07-19 | 2013-07-19 | Ejector pin type integrated circuit testing fixture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310304331XA CN103399268A (en) | 2013-07-19 | 2013-07-19 | Ejector pin type integrated circuit testing fixture |
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| CN103399268A true CN103399268A (en) | 2013-11-20 |
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| CN201310304331XA Pending CN103399268A (en) | 2013-07-19 | 2013-07-19 | Ejector pin type integrated circuit testing fixture |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104752248A (en) * | 2013-12-26 | 2015-07-01 | 东莞新科技术研究开发有限公司 | Semiconductor testing clamp and device |
| CN108990307A (en) * | 2018-07-19 | 2018-12-11 | 长沙格力暖通制冷设备有限公司 | A kind of preparation method and printing thimble template of printing thimble template |
| WO2019014932A1 (en) * | 2017-07-21 | 2019-01-24 | 深圳市汇顶科技股份有限公司 | Chip test head and chip test device |
| CN110356897A (en) * | 2019-07-30 | 2019-10-22 | 周宇凡 | A kind of rubber roller |
| CN111308194A (en) * | 2019-12-06 | 2020-06-19 | 百科荣创(北京)科技发展有限公司 | Frequency characteristic tester |
| CN111316109A (en) * | 2017-10-26 | 2020-06-19 | 赛灵思公司 | Balance adaptive force mechanism for integrated circuit packaging work press testing system |
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| JPS5712532A (en) * | 1980-06-26 | 1982-01-22 | Nec Corp | Removing method of semiconductor element |
| US5807104A (en) * | 1995-02-08 | 1998-09-15 | Texas Instruments Incorporated | Test socket for detachable IC chip |
| CN1304194A (en) * | 1999-12-28 | 2001-07-18 | 莫列斯公司 | System for testing bare integrated circuit chip and socket for said chip |
| CN2630858Y (en) * | 2003-06-03 | 2004-08-04 | 胜华科技股份有限公司 | Centre shared base |
| CN202204837U (en) * | 2011-08-05 | 2012-04-25 | 上海韬盛电子科技有限公司 | Manual type chip test fixture |
| CN202614795U (en) * | 2012-05-02 | 2012-12-19 | 苏州创瑞机电科技有限公司 | Chip module resistor test socket |
| CN202764093U (en) * | 2012-09-17 | 2013-03-06 | 佛山市蓝箭电子股份有限公司 | Demoulding device for semiconductor packaging mould |
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Patent Citations (7)
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| JPS5712532A (en) * | 1980-06-26 | 1982-01-22 | Nec Corp | Removing method of semiconductor element |
| US5807104A (en) * | 1995-02-08 | 1998-09-15 | Texas Instruments Incorporated | Test socket for detachable IC chip |
| CN1304194A (en) * | 1999-12-28 | 2001-07-18 | 莫列斯公司 | System for testing bare integrated circuit chip and socket for said chip |
| CN2630858Y (en) * | 2003-06-03 | 2004-08-04 | 胜华科技股份有限公司 | Centre shared base |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104752248A (en) * | 2013-12-26 | 2015-07-01 | 东莞新科技术研究开发有限公司 | Semiconductor testing clamp and device |
| CN104752248B (en) * | 2013-12-26 | 2018-06-05 | 东莞新科技术研究开发有限公司 | The test fixture and test device of semiconductor |
| WO2019014932A1 (en) * | 2017-07-21 | 2019-01-24 | 深圳市汇顶科技股份有限公司 | Chip test head and chip test device |
| CN111316109A (en) * | 2017-10-26 | 2020-06-19 | 赛灵思公司 | Balance adaptive force mechanism for integrated circuit packaging work press testing system |
| CN108990307A (en) * | 2018-07-19 | 2018-12-11 | 长沙格力暖通制冷设备有限公司 | A kind of preparation method and printing thimble template of printing thimble template |
| CN108990307B (en) * | 2018-07-19 | 2021-07-30 | 长沙格力暖通制冷设备有限公司 | Preparation method of printing thimble template and printing thimble template |
| CN110356897A (en) * | 2019-07-30 | 2019-10-22 | 周宇凡 | A kind of rubber roller |
| CN111308194A (en) * | 2019-12-06 | 2020-06-19 | 百科荣创(北京)科技发展有限公司 | Frequency characteristic tester |
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Application publication date: 20131120 |