CN103395181B - A kind of automation integrated circuit package system injecting mechanism - Google Patents
A kind of automation integrated circuit package system injecting mechanism Download PDFInfo
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- CN103395181B CN103395181B CN201310362142.8A CN201310362142A CN103395181B CN 103395181 B CN103395181 B CN 103395181B CN 201310362142 A CN201310362142 A CN 201310362142A CN 103395181 B CN103395181 B CN 103395181B
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- elevating bracket
- injecting mechanism
- integrated circuit
- substrate
- hole
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Abstract
Injecting mechanism while the present invention relates to integrated circuit (hereinafter to be referred as IC) plastic packaging, comprise injection moulding screw mandrel (1), elevating bracket (2), elevating bracket substrate (3), alignment pin (4), through hole (5), through hole (6), round screw thread spring (7), locating piece (8), connecting plate C(9), load sensor (10) and guide pillar hole (11). Elevating bracket substrate (3) upper surface contacts with injecting mechanism exchange portion, the upper surface of elevating bracket (2) is centered by the geometric center of elevating bracket (2), symmetrical two load sensors (10) that embed, one of them load sensor (10) is fixedly connected with elevating bracket substrate (3) lower surface. Adopt this structure, in the time that injection machine is worked, load sensor (10) can be measured the injection pressure of injecting mechanism exchange portion, and feeds back to driver, thereby controls injection pressure.
Description
Technical field
The injecting mechanism of the mechanism, particularly a kind of sealed in unit that the present invention relates to the moulding of automation integrated circuit (IC) resin injection during to integrated circuit (hereinafter to be referred as IC) plastic packaging.
Background technology
IC encapsulation, just refers to the circuit pin on silicon chip, connects and guides to external lug place, so that the process being connected with other device with wire. In IC encapsulation process, generally adopt injection machine, utilize thermosets to carry out integrated circuit (hereinafter to be referred as IC) plastic packaging. Injection machine has another name called injection (mo(u)lding) machine or injector. It is by resin
Or thermosets is made the main former of the plastic products of various shapes by mould. Be divided into vertical, horizontal, all electric.
The injection machine course of work comprises resin heating, flowing stage and the promotion resin injection phase of having moved. In the injection machine course of work, an equipment, by changing different exchange portion and mould, can be produced different products. For example QFN(quadflatnon-leadedpackage, four sides are without pin flat package, one of surface attaching type encapsulation), the slim QFP(Low-profileQuadFlatPackage of LQFP() refer to that encapsulation main body thickness is the QFP of 1.4mm) encapsulation of form. What in IC sealed in unit, injecting mechanism was taked at present is that servomotor drives the elevating bracket of two injection moulding leading screws, promotion injecting mechanism to move up and down, detect again the size of injection pressure by a bridge type magnetic sensor, feed back to motor and adjust injection pressure, injecting mechanism exchange portion is fixed on elevating bracket.
But, thereby easily there is the stuck and inhomogeneous problems such as plastic packaging product overlap, impression that cause of injection pressure of injecting mechanism motion at resin heating, flowing stage in injection machine. Trace it to its cause, while being injection machine work, the control of injection pressure is accurate not. In order to realize more accurate injection pressure control, just need Real-Time Monitoring injection pressure, and data feedback is provided, so that in time driver is adjusted, thereby adjust injection pressure.
Summary of the invention
The technical problem to be solved in the present invention is to solve IC sealed in unit in resin heating, the stuck and inhomogeneous problems such as plastic packaging product overlap, impression that cause of injection pressure of flowing stage injecting mechanism motion, and a kind of stuck and inhomogeneous injecting mechanism of injection pressure of injecting mechanism motion that prevents is provided.
In order to address the above problem, the present invention includes injection moulding leading screw, elevating bracket, elevating bracket substrate, guide pillar, circle line helical spring, load sensor, locating piece, connecting plate C and alignment pin. Wherein, injection moulding leading screw is fixedly connected with bolt with elevating bracket, and injecting mechanism exchange portion (wait press mechanism, change according to the difference of encapsulating products) is arranged on elevating bracket substrate also relative with it fixing, the edge of elevating bracket offers manhole, can be sleeved on two guide pillars and move. Elevating bracket substrate also includes an alignment pin, and the two ends of elevating bracket substrate central axis along its length offer through hole, and through hole and alignment pin are suitable.
Between elevating bracket and elevating bracket substrate, be provided with load sensor, one of them load sensor is fixed on elevating bracket substrate back, another is free stress, two the relative elevating bracket of sensor substrate center symmetries.
When injection machine work, driven by servomotor injection moulding guide screw movement also drives elevating bracket and elevating bracket substrate motion, because load sensor is symmetric in elevating bracket substrate, can measure like this injection pressure of injecting mechanism exchange portion, feed back to driver, control each stage injection pressure. In the time that injecting mechanism is changed, as long as alignment pin is pinned downwards, alignment pin enters in round screw thread spring, just injecting mechanism exchange portion can be extracted out.
In sum, beneficial effect of the present invention is: can accurately measure the injection pressure of injecting mechanism exchange portion, and feed back to driver, thereby control each stage injection pressure; In addition, drive elevating bracket because the present invention adopts injection moulding leading screw, elevating bracket substrate orientation pin can up-down adjustment, and the quick-replaceable of the press mechanisms such as realization, has facilitated debugging, has improved cost performance.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is the left cutaway view of the present invention.
Detailed description of the invention
Illustrate content of the present invention below in conjunction with accompanying drawing. In this manual, in order to narrate conveniently, the direction of pointing to the fixing one end of this product and injecting mechanism exchange portion is called, under the direction contrary with it is called.
When injection machine work, AC servomotor (not identifying in the drawings herein) drives injection moulding leading screw 1 to move up and down by Timing Belt and synchronous pulley. Elevating bracket 2 is bolted on injection moulding screw mandrel 1. Elevating bracket has a pair of copper alloy self-lubricating bearing in 2 guide pillar holes, both sides 11, and elevating bracket 2, by the guide pillar hole 11 at edge, can move up and down along bearing.
For improving the quality of injecting products, the material of elevating bracket substrate 3 is chrome-nickel steel (P20). On elevating bracket substrate 3, be also connected with a connecting plate C9, connecting plate C9 is connected with injection moulding exchange portion.
Elevating bracket substrate 3 fore-and-aft directions are located by alignment pin 4. For alignment pin 4 is installed, on elevating bracket substrate 3, the two ends of central axis along its length offer through hole 5, and described through hole 5 is suitable with alignment pin 4; Through hole opposite position place at elevating bracket 2 upper surfaces and elevating bracket substrate 3 offers through hole 6, and described through hole 6 is suitable with alignment pin 4. In order to prevent that alignment pin 4 from coming off, alignment pin 4 belows are provided with round screw thread spring 7, and round screw thread spring 7 can produce larger pressure, thereby prevents that alignment pin from coming off. In order to support round screw thread spring 7 lower ends, round screw thread spring 7 belows are provided with locating piece 8. Locating piece 8 is arranged on elevating bracket 2. Injecting mechanism exchange portion, in the time that alignment pin 4 is pressed, can extract out or push.
For accurately controlling injection pressure, on elevating bracket 2 centered by elevating bracket 2 geometric centers, along two load sensors 10 of the symmetrical installation of elevating bracket 2 length axes directions, load sensor 10 top contact elevating bracket substrates 3, one of them load sensor 10 is fixedly connected with elevating bracket substrate 3, and another load sensor 10 is not fixedly connected with elevating bracket substrate 3. Two load sensors 10 pass to controller by signal simultaneously, the pressure while calculating current injection moulding, and controller, by specific algorithm, feeds back to AC servomotor, adjusts its output torque, thereby realizes the control of injection pressure.
Claims (8)
1. an automation integrated circuit package system injecting mechanism, is characterized in that: described mechanism comprises injection moulding screw mandrel (1), elevating bracket (2) and elevating bracket substrate (3); Wherein, elevating bracket (2) lower surface middle part is fixedly connected on injection moulding screw mandrel (1) upper end with bolt; Elevating bracket substrate (3) lower surface and elevating bracket (2)
The contact of upper surface face; Elevating bracket substrate (3) upper surface is fixedly connected with injecting mechanism exchange portion; The upper surface of elevating bracket (2) is centered by the geometric center of elevating bracket (2), symmetrical two load sensors (10) that embed, one of them load sensor (10) is fixedly connected with elevating bracket substrate (3) lower surface, and another load sensor (10) top contacts elevating bracket base lower surface (3) and is not fixedly connected with elevating bracket substrate.
2. a kind of automation integrated circuit package system injecting mechanism according to claim 1, it is characterized in that: elevating bracket substrate (3) also includes an alignment pin (4), the two ends of described elevating bracket substrate (3) central axis along its length offer through hole (5), and described through hole (5) is suitable with alignment pin (4).
3. a kind of automation integrated circuit package system injecting mechanism according to claim 2, it is characterized in that: the through hole opposite position place at elevating bracket (2) upper surface and elevating bracket substrate (3) offers through hole (6), described through hole (6) is suitable with alignment pin (4).
4. a kind of automation integrated circuit package system injecting mechanism according to claim 3, is characterized in that: in the through hole (6) of described elevating bracket (2), be provided with round screw thread spring (7).
5. a kind of automation integrated circuit package system injecting mechanism according to claim 4, is characterized in that: the through hole (6) of described elevating bracket (2) is positioned on the lower surface position of elevating bracket (2) and is fixedly connected with and is useful on the locating piece (8) that supports round screw thread spring (7) lower end.
6. a kind of automation integrated circuit package system injecting mechanism according to claim 1, is characterized in that: described mechanism also comprises a connecting plate C(9), described connecting plate C is connected with injection moulding exchange portion.
7. a kind of automation integrated circuit package system injecting mechanism according to claim 1, is characterized in that: the edge of elevating bracket offers guide pillar hole (11).
8. a kind of automation integrated circuit package system injecting mechanism according to claim 1, is characterized in that: elevating bracket substrate (3) is chrome-nickel steel P20 substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310362142.8A CN103395181B (en) | 2013-08-20 | 2013-08-20 | A kind of automation integrated circuit package system injecting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310362142.8A CN103395181B (en) | 2013-08-20 | 2013-08-20 | A kind of automation integrated circuit package system injecting mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103395181A CN103395181A (en) | 2013-11-20 |
| CN103395181B true CN103395181B (en) | 2016-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310362142.8A Active CN103395181B (en) | 2013-08-20 | 2013-08-20 | A kind of automation integrated circuit package system injecting mechanism |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000047389A1 (en) * | 1999-02-10 | 2000-08-17 | Netstal Maschinen Ag | Mold closing unit |
| CN101980851A (en) * | 2008-11-05 | 2011-02-23 | 三菱重工塑胶科技股份有限公司 | Mold clamping apparatus |
| CN203472108U (en) * | 2013-08-20 | 2014-03-12 | 铜陵富仕三佳机器有限公司 | Injection moulding mechanism of automatic integrated circuit packaging system |
-
2013
- 2013-08-20 CN CN201310362142.8A patent/CN103395181B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000047389A1 (en) * | 1999-02-10 | 2000-08-17 | Netstal Maschinen Ag | Mold closing unit |
| CN101980851A (en) * | 2008-11-05 | 2011-02-23 | 三菱重工塑胶科技股份有限公司 | Mold clamping apparatus |
| CN203472108U (en) * | 2013-08-20 | 2014-03-12 | 铜陵富仕三佳机器有限公司 | Injection moulding mechanism of automatic integrated circuit packaging system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103395181A (en) | 2013-11-20 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An automatic integrated circuit packaging system injection molding mechanism Effective date of registration: 20220829 Granted publication date: 20160518 Pledgee: Tongling Rural Commercial Bank Co.,Ltd. Pledgor: TONGLING FUSHI SANJIA MACHINE Co.,Ltd. Registration number: Y2022980013783 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230614 Granted publication date: 20160518 Pledgee: Tongling Rural Commercial Bank Co.,Ltd. Pledgor: TONGLING FUSHI SANJIA MACHINE Co.,Ltd. Registration number: Y2022980013783 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An Injection Molding Mechanism for Automatic Integrated circuit packaging System Effective date of registration: 20230626 Granted publication date: 20160518 Pledgee: Tongling Rural Commercial Bank Co.,Ltd. Pledgor: TONGLING FUSHI SANJIA MACHINE Co.,Ltd. Registration number: Y2023980045784 |