CN103383584A - 一种分段温度补偿的系统 - Google Patents
一种分段温度补偿的系统 Download PDFInfo
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111865219A (zh) * | 2020-05-18 | 2020-10-30 | 成都锐成芯微科技股份有限公司 | 宽温度范围自动温度补偿的振荡器 |
CN114326917A (zh) * | 2021-12-27 | 2022-04-12 | 厦门科塔电子有限公司 | 一种电流基准温度补偿电路 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483372B1 (en) * | 2000-09-13 | 2002-11-19 | Analog Devices, Inc. | Low temperature coefficient voltage output circuit and method |
US6879141B1 (en) * | 2003-09-29 | 2005-04-12 | King Billion Electronics Co., Ltd. | Temperature compensated voltage supply circuit |
CN1726641A (zh) * | 2002-12-17 | 2006-01-25 | 皇家飞利浦电子股份有限公司 | 温度补偿rc振荡器 |
CN101101492A (zh) * | 2007-07-30 | 2008-01-09 | 电子科技大学 | 一种分段线性补偿的cmos带隙基准电压源 |
CN102420568A (zh) * | 2011-09-26 | 2012-04-18 | 李晓 | 具有温度补偿的振荡器 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483372B1 (en) * | 2000-09-13 | 2002-11-19 | Analog Devices, Inc. | Low temperature coefficient voltage output circuit and method |
CN1726641A (zh) * | 2002-12-17 | 2006-01-25 | 皇家飞利浦电子股份有限公司 | 温度补偿rc振荡器 |
US6879141B1 (en) * | 2003-09-29 | 2005-04-12 | King Billion Electronics Co., Ltd. | Temperature compensated voltage supply circuit |
CN101101492A (zh) * | 2007-07-30 | 2008-01-09 | 电子科技大学 | 一种分段线性补偿的cmos带隙基准电压源 |
CN102420568A (zh) * | 2011-09-26 | 2012-04-18 | 李晓 | 具有温度补偿的振荡器 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111865219A (zh) * | 2020-05-18 | 2020-10-30 | 成都锐成芯微科技股份有限公司 | 宽温度范围自动温度补偿的振荡器 |
CN114326917A (zh) * | 2021-12-27 | 2022-04-12 | 厦门科塔电子有限公司 | 一种电流基准温度补偿电路 |
CN114326917B (zh) * | 2021-12-27 | 2023-11-03 | 厦门科塔电子有限公司 | 一种电流基准温度补偿电路 |
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Address after: 610041 4, A District, 1 building 200, Tianfu five street, hi tech Zone, Chengdu, Sichuan. Patentee after: Chengdu Rui core micro Polytron Technologies Inc Address before: 610041 room 1705, G1 building, 1800 Yizhou Road, Chengdu high tech Zone, Sichuan. Patentee before: Chengdu Ruicheng Xinwei Technology Co., Ltd. |
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Denomination of invention: Segmented temperature compensation system Effective date of registration: 20190311 Granted publication date: 20150722 Pledgee: Agricultural Bank of China Limited by Share Ltd Chengdu Shuangliu Branch Pledgor: Chengdu Rui core micro Polytron Technologies Inc Registration number: 2019510000025 |
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Date of cancellation: 20210226 Granted publication date: 20150722 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chengdu Shuangliu Branch Pledgor: CHENGDU ANALOG CIRCUIT TECHNOLOGY Inc. Registration number: 2019510000025 |
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