CN103379423B - The manufacturing method of electronic packing body - Google Patents
The manufacturing method of electronic packing body Download PDFInfo
- Publication number
- CN103379423B CN103379423B CN201210117480.0A CN201210117480A CN103379423B CN 103379423 B CN103379423 B CN 103379423B CN 201210117480 A CN201210117480 A CN 201210117480A CN 103379423 B CN103379423 B CN 103379423B
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- metal plate
- seed layer
- layer
- manufacturing
- release layer
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Abstract
The invention discloses a kind of manufacturing methods of electronic packing body, including the following steps: metal plate of (a) preparation one with a plurality of cover portions in the arrangement of array shape, respectively with a bridge part integrally connected between the cover portion；(b) metal plate is welded in a circuit board, which has a plurality of areas to be packaged covered respectively by the cover portion；And the metal plate and circuit board (c) are cut along the respectively bridge part, a plurality of electronic packing bodies are made.Since the metal plate (i.e. array type metal cover) with a plurality of cover portions in the arrangement of array shape is directly stacked on the waiting encapsulation region by the manufacturing method of the present invention, compared with the prior art, the present invention has the advantages such as processing time, reduction manufacturing cost and simplified technique that can effectively shorten.
Description
Technical field
The invention belongs to the manufacturing fields of electronic packing body, especially a kind of that electronic packing body can quickly be made
Method.
Background technique
It is generally used for the manufacturing method of the electronic packing body of such as micro-electro-mechanical microphone, is prior on a circuit board mostly
Multiple areas to be packaged for being provided with electronic building brick are formed, it then seriatim will be single using fetching device (pick and place)
Metal cover stacking in the area to be packaged on aforementioned circuit plate, then again through reflow, cut and etc. electronic packing body is made.
However, the method not only cumbersome time-consuming, but also when the size of required electronic packing body is gradually reduced, existing side
Method, which is easy for facing, to be not easy for metal cover to be accurately positioned at area to be packaged；There is yield is limited and manufacturing cost improves etc.
Problem.
Summary of the invention
The main purpose of the present invention is to provide a kind of processing procedure simplicity, manufacturing cost can be reduced and can quickly be made a plurality of
The method of electronic packing body.
In order to achieve the object, the manufacturing method of electronic packing body provided by the present invention, specifically includes that (a) preparation one
Metal plate with a plurality of cover portions in the arrangement of array shape, respectively with a bridge part integrally connected between the cover portion；(b) by the gold
Belong to plate and be welded in a circuit board, which has a plurality of areas to be packaged covered respectively by the cover portion；And (c) along respectively should
Bridge part cuts the metal plate and circuit board, a plurality of electronic packing bodies are made.Since the manufacturing method of the present invention is direct
Metal plate (i.e. array type metal cover) with a plurality of cover portions in the arrangement of array shape is stacked on the waiting encapsulation region, phase
Than in the prior art, the present invention has the advantages such as processing time, reduction manufacturing cost and simplified technique that can effectively shorten.
In manufacturing method provided by the present invention, step (b) is described to be welded in the circuit board for the metal plate, can pass through
One solder is coated on the metal plate, a solder is either coated on the circuit board, then carried out reflow and completed.
According to the present invention in manufacturing method provided by a preferred embodiment, the metal plate described in step (a) respectively should
Cover portion all has the sound hole passed through for sound wave (sound wave), which is prepared through the following steps: by a demoulding
Layer is formed on a substrate；A plurality of insulation modules in the arrangement of array shape are formed in the release layer；By a seed layer
(seed layer) is formed on the release layer and the grade insulation modules, make seed layer have it is a plurality of respectively correspond respectively this absolutely
Edge module is used to be formed the protrusion and the prominent interconnecting piece for being used to be formed the bridge part of the integrally connected grade of the cover portions such as this；
A plurality of insulation modules for being used to be formed the respectively sound hole are respectively formed in the protrusion of the seed layer；Plating one is to form the gold
Belong to the metal layer of plate in the seed layer；And sequentially remove have the release layer the substrate, this etc. insulation modules and should
Seed layer, to obtain the metal plate.
Certainly, the metal plate this etc. cover portions can also not have aforementioned sound hole, at this time, it is only necessary to omission be previously formed sound hole
Step.
In addition, the metal plate of step (a) also can be prepared into the respectively cover portion all there is aforementioned sound hole and the bridge part to have
The aspect of plurality of through holes.At this time, it is only necessary to after seed layer is formed in the release layer and the grade insulation modules, will first answer
Several insulation modules for being used to be formed the respectively sound hole are respectively formed in the protrusion of the seed layer, and are used to form this by a plurality of
The insulation module of equal through-holes is formed in the interconnecting piece of the seed layer；Thereafter electroplated metal layer is carried out again and removes substrate, insulation
Module and seed layer.
It is prepared into the aspect that its bridge part has plurality of through holes by by the metal plate, in addition to that can reduce for being formed
Metal plate obtains the materials'use amount of metal layer, moreover it is possible to reduce stress deformation when metal plate and welding circuit board, and can help
Process is cut in subsequent.
In addition, based on spirit of the invention, in the step of preparing the metal plate, make the seed layer have grade protrusion with
And there are also such as what follows mode (including but not limited to) for the mode of the interconnecting piece:
For example, by with a plurality of protrusions in the arrangement of array shape and an integrally connected this etc. interconnecting piece outstanding it is de-
Film layer is formed on the substrate, and seed layer is formed on the release layer again later；Either, release layer is formed in has again
It is several in the protrusions of array shape arrangement and an integrally connected this etc. on the substrate of interconnecting piece outstanding, later again by seed layer shape
At in the release layer.
In the aforementioned equal the step of of preparing the metal plate, which can be silicon substrate, metal plate, glass plate or plastic plate；
The release layer can be heat-conducting glue band (thermal tape), ultraviolet tape (UV tape), photoresist, metal layer or dielectric material
Layer；The material of the seed layer can be chromium/copper (Cr/Cu), titanium/copper (Ti/Cu) or titanium tungsten/copper (TiW/Cu)；The metal layer
Material can be nickel (Ni), copper (Cu) or nickel cobalt (alloy) (NiCo)；And the insulation module can be photoresist insulation module.
In manufacturing method provided by the present invention, metal plate described in step (a) also can pass through mold or punching press
It is prepared by mode.
Detailed description of the invention
The content for the schema that simple declaration present invention cooperation embodiment uses below, in which:
Fig. 1 is a preferred embodiment of the present invention the flow chart of the manufacturing method of electronic packing body；
Fig. 2 is a schematic diagram, shows the manufacturing method of the electronic packing body of the first figure；
Fig. 3 be a preferred embodiment of the present invention described in metal plate a kind of preparation flow figure, wherein the metal plate should
Etc. cover portions all there is sound hole；
The similar Fig. 3 of Fig. 4 does not have the preparation flow figure of the metal plate of sound hole for display cover portion；
Fig. 5 to Figure 10 is the different preparation flow schematic diagrames of metal plate shown in Fig. 2；
Similar Fig. 6 of Figure 11, to show the insulator die that insulation module is the cover portions such as be formed in the seed layer to, be correspondingly formed this
Position between block；
Figure 12 A and 12B schematic diagram shows that the bridge part of metal plate has the aspect of plural through-hole；
Similar Fig. 5 of Figure 13, to show that the release layer has a plurality of aspects outstanding in the arrangement of array shape；Figure 14 is similar
Fig. 5, to show that the substrate has a plurality of aspects outstanding in the arrangement of array shape.
[primary clustering symbol description]
10 metal plate, 11 sound hole
13 cover portion, 15 bridge part
17 through-hole, 20 circuit board
30 solder, 40 electronic packing body
50 substrates 501 are prominent
503 interconnecting piece, 51,51 ' release layer
511 prominent 513 interconnecting pieces
53 insulation module, 55 seed layer
551 prominent 553 interconnecting pieces
57 insulation module, 58 insulation module
59 metal layer S1~S3 steps
S11, S12, S13, S13 ', S14, S14 ', S15 step
Specific embodiment
The technical characteristic of manufacturing method in relation to electronic packing body provided by the present invention will enumerate embodiment below and match
Attached drawing is closed to be further described.
Fig. 1 and Fig. 2 show the manufacturing method of electronic packing body provided by a preferred embodiment of the present invention, for manufacturing
(but being not limited to) is used in the electronic packing body of micro-electro-mechanical microphone, which includes the following steps:
Firstly, first preparing a metal plate 10 in step S1, which has a plurality of in the arrangement of array shape and tool
There is the cover portion 13 of the sound hole 11 passed through for sound wave, respectively with 15 integrally connected of a bridge part between the cover portion 13.Aforementioned metal plate 10
Material have no specific limitation, can be used and be generally usually used in the material of Electronic Packaging.
In the present embodiment, which is prepared using the method as shown in Fig. 3, Fig. 5 to Figure 10.Specifically,
As described in step S11, please refer to Fig. 5, a release layer 51, the shape on the release layer 51 first are formed on 50 surface of a substrate
Pluralize the insulation module 53 that setting is arranged and be spaced apart from each other in array shape.At this point, silicon substrate, gold can be used in aforesaid base plate 50
Belong to plate, glass plate or plastic plate, it is best to use silicon substrate；Heat-conducting glue band (thermal can be used in aforementioned release layer 51
Tape), ultraviolet tape (UV tape), photoresist (photoresist), metal layer or dielectric materials layer；And aforementioned dielectric
Photoresist (photoresist) insulation module is preferred in module 53.
Later, as described in step S12, please refer to Fig. 5, by a seed layer 55 be formed in the release layer 51 and this etc.
On insulation module 53, make the seed layer 55 that there are a plurality of respectively insulation modules 53 that respectively correspond to be used to form the cover portions such as this 13
Protrusion 551 and integrally connected grade prominent 551 are used to be formed the interconnecting pieces 553 of the bridge part 15.At this point, aforementioned seed
The material of layer 55 is preferably chromium/copper (Cr/Cu), titanium/copper (Ti/Cu) or titanium tungsten/copper (TiW/Cu).
Then, in step s 13, please refer to Fig. 6, by a plurality of insulation modules 57 for being used to be formed the respectively sound hole 11
It is formed in the protrusion 551 of the seed layer 55.At this point, photoresist insulation module is preferred in aforementioned dielectric module 57, and its size needs
Less than aforementioned dielectric module 53.
Then, in step S14, please refer to Fig. 7, the metal layer 59 that one is used to be formed the metal plate 10 is plated on
In the seed layer 55 and expose the grade insulation modules 57.At this point, the material of aforementioned metal layer 59 is preferably nickel (Ni), copper (Cu)
Or nickel cobalt (alloy) (NiCo).It is last then as described in step S15, sequentially remove the substrate 50 and release layer 51(it is as shown in Figure 8),
The grade insulation modules 53 are removed, 57(is as shown in Figure 9) and to remove seed layer 55(as shown in Figure 10), can be obtained has
In the metal plate 10 of the cover portion 13 with aforementioned sound hole 11 of array shape arrangement, also, respectively between the cover portion 13 with the bridge part
15 integrally connecteds.It is aforementioned to remove the equal insulation modules 53,57 and the mode of seed layer 55 have no specific limitation, can be used conventional
Mode is completed, such as remover (stripper) can be used to remove the grade insulation modules 53, and 57, and use etching mode
Remove the seed layer 55.
It, as described in step S2, will be aforementioned obtained referring to Fig. 1 and Fig. 2 after completing the preparation of the metal plate 10
The metal plate 10 be welded in one with it is a plurality of respectively with this etc. the corresponding area's (not shown) to be packaged of cover portions 13 electricity
Road plate 20 makes the respectively cover portion 13 masking respectively area to be packaged.In the present embodiment, which will to penetrate (but being not limited to)
One solder 30, such as tin cream are coated on the metal plate 10, and the circuit board 20 is welded in using reflow.Certainly practical manufacture
When, aforementioned solder 30 can also be coated on the circuit board 20.
Finally, in step s3, cutting the metal plate 10 and circuit board 20 along the bridge part 15, a plurality of electricity being finally made
Sub- packaging body 40.
As present invention be with manufacture electronic packing body used in micro-electro-mechanical microphone come for example,
So the cover portion 13 of metal plate 10 needs to have the sound hole 11 passed through for sound wave, however when practical application, which also may be used
Aforementioned sound hole 11 is not formed.Specifically, referring to Fig. 4, firstly, being formed also according to step S11 and S12 as shown in Figure 5
Structure carries out S13 ' later, and metal layer 59 is plated in seed layer 55, finally carries out step S14 ', sequentially removes substrate 50
With release layer 51, this etc. insulation modules 53 and seed layer 55, can be obtained in array shape arrangement do not have sound hole 11
Cover portion 13 metal plate 10.
Additionally need special instruction, the aspect of metal plate 10 used in manufacturing method of the present invention not with
Previous embodiment is limited.For example, please referring to Figure 12 A and 12B, the bridge part 15 of the metal plate 10 can also have plurality of through holes
17, so as to reducing the materials'use amount for being used to be formed metal plate 10 and obtaining metal layer 59, moreover it is possible to reduce metal plate 10 and circuit board 20
Stress deformation when welding, and can help to subsequent cut process.
Further it, firstly, structure as shown in FIG. 6 is formed also according to step S11 to S13, later such as Figure 11 institute
Show, the insulation module 58 that a plurality of (only showing one in figure) are used to be formed the grade through-holes 17 is formed in the company of the seed layer 55
The metal layer 59 is plated in the seed layer 55 later and exposes the grade insulation modules 57,58 by socket part 553, finally again according to
Sequence remove substrate 50 and release layer 51, this etc. insulation modules 53,57,58 and the step of seed layer 55, can be obtained such as Figure 12 A
With metal plate 10 shown in 12B.In addition, the aspect of the grade through-holes 17 becomes with the aspect of the insulation module 58, can be (but not
It is limited to) round or oblong.
In addition to this, in the step of preparing metal plate 10, it also can pass through mode as described below (but being not limited to), make this
There is seed layer 55 this to wait prominent 551 and the interconnecting piece 553.Specifically, as shown in figure 13, being formed on the substrate 50
Release layer 51 ', for the interconnecting piece with a plurality of protrusions 511 in the arrangement of array shape and an integrally connected equal protrusion 511
513, and then seed layer 55 is formed on the release layer 51 ', there is the seed layer 55 and a plurality of respectively correspond respectively that this is de-
The protrusion 551 of film layer prominent 511, and the interconnecting piece 553 of the corresponding release layer interconnecting piece 513.Alternatively, as shown in figure 14, making
With the base of an interconnecting piece 503 with a plurality of protrusions 501 in the arrangement of the array shape and an integrally connected equal protrusions 501
Plate 50 ', and then seed layer 55 is formed on the release layer 51, make the seed layer 55 that there is a plurality of respectively correspond respectively should
The protrusion 551 of substrate prominent 501, and the interconnecting piece 553 of the corresponding substrate connecting portion 503.
It is noted that the preparation method of aforementioned metal plate 10 is not limited to previous embodiment, mold also can pass through
Or the mode of punching press is completed.
To sum up institute is old, since the present invention is the metal plate 10 directly by the cover portion 13 arranged with a plurality of arrays, quite
In array type metal cover, directly it is stacked on the printed circuit with multiple areas to be packaged, therefore compared to the prior art, this hair
It is bright to be accurately positioned on printed circuit with season multiple cover portions, thus can effectively reduce the process time, reduce manufacturing cost,
And simplification of flowsheet.
Claims (8)
1. a kind of manufacturing method of electronic packing body, including the following steps:
(a) metal plate of the preparation one with a plurality of cover portions in the arrangement of array shape, respectively with bridge part one between the cover portion
Connection；
(b) metal plate is welded in a circuit board, the circuit board have it is a plurality of covered respectively by the cover portion it is to be packaged
Area；And
(c) metal plate and circuit board are cut along the respectively bridge part, a plurality of electronic packing bodies is made；
It includes the following steps that the step (a), which prepares the metal plate:
(a1) release layer is formed on a substrate；
(a2) seed layer is formed on the release layer, which is used to be formed with a plurality of in the arrangement of array shape
The interconnecting piece outstanding for being used to be formed the bridge part described in the protrusion of cover portion and an integrally connected；
(a3) plating one is used to be formed the metal layer of the metal plate in the seed layer；And
(a4) substrate and the seed layer with the release layer are sequentially removed, the metal plate is obtained；
The step (b) is to penetrate that a solder is coated on the metal plate or a solder is coated on the circuit board, then
The mode for carrying out reflow, is welded in the circuit board for the metal plate.
2. the manufacturing method of electronic packing body as described in claim 1, it is characterized in that: the step (a) prepares the metal plate
Also include the following steps:
After step (a1), a plurality of insulation modules in the arrangement of array shape are formed on the release layer；
Seed layer is formed on the insulation module described in the release layer and step (a1) in step (a2), makes seed layer
The respectively protrusion of the insulation module and the interconnecting piece are respectively corresponded with a plurality of；And
Step (a4) is sequentially to remove the substrate, insulation module and the seed layer with the release layer, obtains the metal plate.
3. the manufacturing method of electronic packing body as described in claim 1, it is characterized in that: the release layer of the step (a1) has
A plurality of protrusions and the integrally connected protrusion in the arrangement of array shape so that the seed layer of step (a2) have it is a plurality of
Respectively correspond respectively release layer protrusion outstanding, and the interconnecting piece of the corresponding release layer interconnecting piece.
4. the manufacturing method of electronic packing body as described in claim 1, it is characterized in that: the substrate of step (a1) is with a plurality of
In the protrusion and the integrally connected protrusion of the arrangement of array shape so that the seed layer of step (a2) have it is a plurality of right respectively
It should respectively substrate protrusion outstanding, and the interconnecting piece of the corresponding substrate connecting portion.
5. the manufacturing method of electronic packing body as described in claim 1, it is characterized in that: the metal plate of the step (a) is each
The cover portion all has a sound hole, also, preparing the metal plate also includes the following steps:
After step (a2), by a plurality of insulation modules to form the respectively sound hole be respectively formed in the seed layer respectively this dash forward
Out；And
Step (a4) is sequentially to remove the substrate, insulation module and the seed layer with the release layer, obtains the metal plate.
6. the manufacturing method of electronic packing body as described in claim 1, it is characterized in that: respectively cover of the metal plate of step (a)
All there is a sound hole and the bridge part to have plurality of through holes in portion, also, preparing the metal plate also includes the following steps:
After step (a2), by a plurality of insulation modules to form the respectively sound hole be respectively formed in the seed layer respectively this dash forward
Out, and by a plurality of insulation modules to form through-hole it is formed in the interconnecting piece of the seed layer；And
Step (a4) is sequentially to remove the substrate, insulation module and the seed layer with the release layer, to obtain the metal
Plate.
7. such as the manufacturing method of the described in any item electronic packing bodies of claim 2-6, it is characterized in that: the substrate is silicon substrate
Plate, metal plate, glass plate or plastic plate；The release layer is heat-conducting glue band, ultraviolet tape, photoresist, metal layer or dielectric material
The bed of material；The material of the seed layer is chromium/copper, titanium/copper or titanium tungsten/copper；The material of the metal layer is that nickel, copper or nickel cobalt are closed
Gold.
8. the manufacturing method of the electronic packing body as described in any one of claim 2,5 or 6, it is characterized in that: the insulator die
Block is photoresist insulation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210117480.0A CN103379423B (en) | 2012-04-20 | 2012-04-20 | The manufacturing method of electronic packing body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210117480.0A CN103379423B (en) | 2012-04-20 | 2012-04-20 | The manufacturing method of electronic packing body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103379423A CN103379423A (en) | 2013-10-30 |
| CN103379423B true CN103379423B (en) | 2018-12-04 |
Family
ID=49463896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210117480.0A Expired - Fee Related CN103379423B (en) | 2012-04-20 | 2012-04-20 | The manufacturing method of electronic packing body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103379423B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540525B1 (en) * | 2001-08-17 | 2003-04-01 | High Connection Density, Inc. | High I/O stacked modules for integrated circuits |
| CN101552251A (en) * | 2008-03-31 | 2009-10-07 | 雅马哈株式会社 | Lead frame and package of semiconductor device |
| CN101819960A (en) * | 2010-05-07 | 2010-09-01 | 日月光半导体制造股份有限公司 | Base plate, semiconductor packaging piece applying same and manufacture method of base plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI283916B (en) * | 2005-12-08 | 2007-07-11 | Taiwan Solutions Systems Corp | Manufacturing method of chip package structure |
-
2012
- 2012-04-20 CN CN201210117480.0A patent/CN103379423B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540525B1 (en) * | 2001-08-17 | 2003-04-01 | High Connection Density, Inc. | High I/O stacked modules for integrated circuits |
| CN101552251A (en) * | 2008-03-31 | 2009-10-07 | 雅马哈株式会社 | Lead frame and package of semiconductor device |
| CN101819960A (en) * | 2010-05-07 | 2010-09-01 | 日月光半导体制造股份有限公司 | Base plate, semiconductor packaging piece applying same and manufacture method of base plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103379423A (en) | 2013-10-30 |
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Granted publication date: 20181204 Termination date: 20210420 |