CN103379423A - Method for manufacturing electronic packaging bodies - Google Patents
Method for manufacturing electronic packaging bodies Download PDFInfo
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- CN103379423A CN103379423A CN2012101174800A CN201210117480A CN103379423A CN 103379423 A CN103379423 A CN 103379423A CN 2012101174800 A CN2012101174800 A CN 2012101174800A CN 201210117480 A CN201210117480 A CN 201210117480A CN 103379423 A CN103379423 A CN 103379423A
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- metallic plate
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- release layer
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Abstract
The invention discloses a method for manufacturing electronic packaging bodies. The method includes the following steps that metal plates provided with a plurality of cover parts which are ranked in an array-shaped mode are prepared, and the cover parts are integrally connected through bridging parts; the metal plates are welded to a circuit board, and the circuit board is provided with a plurality of regions to be packaged which are covered by the cover parts respectively; the metal plates and the circuit board are trimmed along the bridging parts, and then a plurality of electronic packaging bodies are manufactured. Due to the fact that the metal plates (namely array-type metal lids) provided with the cover parts which are ranked in the array-shaped mode are directly stacked on the regions to be packaged, compared with the prior art, the method for manufacturing the electronic packaging bodies has the advantages of being capable of effectively shortening manufacture procedure time, lowering manufacturing cost and simplifying the process.
Description
Technical field
The invention belongs to the manufacturing field of electronic packing body, particularly a kind of method that can make fast electronic packing body.
Background technology
Generally be applied to the manufacture method such as the electronic packing body of micro-electro-mechanical microphone, prior to forming a plurality of districts to be packaged that are provided with electronic building brick on the circuit board mostly, then utilize fetching device (pick and place) seriatim single metal lid repeatedly to be put in district to be packaged on the aforementioned circuit plate, and then see through reflow, the step such as cut and make electronic packing body.
Yet the method is not only loaded down with trivial details consuming time, and when the size of required electronic packing body was dwindled gradually, existing method just faced easily and is difficult for crown cap accurately is positioned district to be packaged; The problems such as the limited and manufacturing cost raising of output appear.
Summary of the invention
Main purpose of the present invention be to provide a kind of processing procedure easy, can reduce manufacturing cost and can make fast the method for a plurality of electronic packing bodies.
For realizing described purpose, the manufacture method of electronic packing body provided by the present invention mainly comprises: (a) preparation one has a plurality of metallic plates that are the cover section of array shape arrangement, respectively should connect with a bridge part one between the cover section; (b) this metallic plate is welded in a circuit board, this circuit board has a plurality of districts to be packaged of being covered by this cover section respectively; And (c) cut this metallic plate and circuit board along this bridge part respectively, to make a plurality of these electronic packing bodies.Because directly will having a plurality of metallic plates (being the array type crown cap) that are the cover section of array shape arrangement, manufacture method of the present invention is stacked in these districts to be packaged, than prior art, the present invention has can effectively shorten the processing procedure time, reduce the advantages such as manufacturing cost and simplification technique.
In manufacture method provided by the present invention, step (b) is described to be welded in this circuit board with this metallic plate, can see through a scolder is coated this metallic plate or a scolder is coated this circuit board, then carries out reflow and is finished.
In the manufacture method that provides according to a preferred embodiment of the present invention, described this metallic plate of step (a) respectively should cover section all have a sound hole that passes through for sound wave (sound wave), this metallic plate sees through the following step and is prepared: a release layer is formed on the substrate; A plurality of insulation modules that are the arrangement of array shape are formed on this release layer; One Seed Layer (seed layer) is formed on this release layer and these insulation modules, make Seed Layer have a plurality of respectively corresponding respectively these insulation modules and be used for forming the outstanding of these cover sections, and an one connects these outstanding connecting portions that is used for forming this bridge part; Be used for forming respectively with a plurality of that the insulation module of this sound hole is formed at respectively the outstanding of this Seed Layer; Electroplate one in order to the metal level that forms this metallic plate on this Seed Layer; And sequentially remove this substrate, these insulation modules and this Seed Layer with this release layer, to obtain this metallic plate.
Certainly, these cover sections of this metallic plate also can not have aforementioned sound hole, and at this moment, the step that only need omit aforementioned formation sound hole gets final product.
In addition, the metallic plate of step (a) also can be prepared into respectively should cover section all have aforementioned sound hole, and this bridge part has the aspect of plurality of through holes.At this moment, only need after Seed Layer is formed on this release layer and these insulation modules, be used for forming respectively with a plurality of that the insulation module of this sound hole is formed at respectively the outstanding of this Seed Layer first, and the connecting portion that a plurality of insulation modules that are used for forming these through holes is formed at this Seed Layer; Again carry out electroplated metal layer and remove the steps such as substrate, insulation module and Seed Layer getting final product thereafter.
By this metallic plate is prepared into the aspect that its bridge part has plurality of through holes, except reducing to form the materials'use amount that metallic plate gets metal level, stress deformation in the time of can also reducing metallic plate and welding circuit board, and can help the follow-up operation that cuts.
In addition, based on spirit of the present invention, in the step of this metallic plate of preparation, make this Seed Layer have these modes outstanding and this connecting portion and also have such as mode (including but not limited to) as described in following:
For example, will have and a plurality ofly be the release layer that outstanding and one that the array shape arranges connect these outstanding connecting portions and be formed on this substrate, Seed Layer will be formed on this release layer more afterwards; Or, release layer is formed to have a plurality ofly is the outstanding and one that the array shape arranges and connects on the substrate of these outstanding connecting portions, again Seed Layer is formed on this release layer afterwards.
Aforementioned these prepare in the step of this metallic plate, and this substrate can be silicon substrate, metallic plate, glass plate or plastic plate; This release layer can be heat conduction adhesive tape (thermal tape), ultraviolet tape (UV tape), photoresistance, metal level or dielectric materials layer; The material of this Seed Layer can be chromium/copper (Cr/Cu), titanium/copper (Ti/Cu) or tungsten titanium/copper (TiW/Cu); The material of this metal level can be nickel (Ni), copper (Cu) or nickel cobalt (alloy) (NiCo); And this insulation module can be the photoresistance insulation module.
In manufacture method provided by the present invention, the described metallic plate of step (a) also can see through mold or the mode of punching press prepares.
Description of drawings
The graphic content that following simple declaration the present invention cooperates embodiment to adopt, wherein:
Fig. 1 is the flow chart of manufacture method of the electronic packing body of a preferred embodiment of the present invention;
Fig. 2 is a schematic diagram, shows the manufacture method of the electronic packing body of the first figure;
Fig. 3 is a kind of preparation flow figure of metallic plate described in a preferred embodiment of the present invention, and wherein these cover sections of this metallic plate all have sound hole;
Fig. 4 is Fig. 3 roughly the same, does not have the preparation flow figure of the metallic plate of sound hole for showing cover section;
Fig. 5 to Figure 10 is the different preparation flow schematic diagrames of metallic plate shown in Figure 2;
Figure 11 is Fig. 6 roughly the same, for showing the position between the insulation module that insulation module is formed on this Seed Layer, correspondence forms these cover sections;
Figure 12 A and 12B schematic diagram show that the bridge part of metallic plate has the aspect of plural through hole;
Figure 13 is Fig. 5 roughly the same, has a plurality of outstanding aspects that the array shape is arranged that are for showing this release layer; Figure 14 is Fig. 5 roughly the same, has a plurality of outstanding aspects that the array shape is arranged that are for showing this substrate.
[primary clustering symbol description]
10 metallic plates, 11 sound holes
13 cover sections, 15 bridge parts
17 through holes, 20 circuit boards
30 scolders, 40 electronic packing bodies
50 substrates 501 are outstanding
503 connecting portions, 51,51 ' release layer
511 outstanding 513 connecting portions
53 insulation modules, 55 Seed Layer
551 outstanding 553 connecting portions
57 insulation modules, 58 insulation modules
59 metal levels S1～S3 step
S11, S12, S13, S13 ', S14, S14 ', S15 step
Embodiment
The technical characterictic of the manufacture method of relevant electronic packing body provided by the present invention below will be enumerated embodiment and cooperate accompanying drawing to further describe.
The manufacture method of the electronic packing body that Figure 1 and Figure 2 provides for a preferred embodiment of the present invention is used for making the electronic packing body that (but being not limited to) is used in micro-electro-mechanical microphone, and this manufacture method includes the following step:
At first, in step S1, prepare first a metallic plate 10, this metallic plate 10 has a plurality of cover sections 13 that the sound hole 11 that passes through for sound wave was arranged and had to the array shape that are, and respectively should connect with a bridge part 15 one between the cover section 13.The material of aforementioned metal plate 10 there is no specific limited, and it can use the material that generally is usually used in Electronic Packaging.
In the present embodiment, this metallic plate 10 utilize as Fig. 3, Fig. 5 extremely method shown in Figure 10 prepared.Particularly, as described in step S11, please consult simultaneously Fig. 5, form a release layer 51 on a substrate 50 surfaces first, on this release layer 51, form again a plurality of insulation modules 53 that the array shape is arranged and the space arranges that are.At this moment, aforesaid base plate 50 can use silicon substrate, metallic plate, glass plate or plastic plate, preferably uses silicon substrate; Aforementioned release layer 51 can use heat conduction adhesive tape (thermal tape), ultraviolet tape (UV tape), photoresistance (photoresist), metal level or dielectric materials layer; And aforementioned dielectric module 53 is preferably used photoresistance (photoresist) insulation module.
Afterwards, as described in step S12, please consult simultaneously Fig. 5, one Seed Layer 55 is formed on this release layer 51 and these insulation modules 53, make this Seed Layer 55 have a plurality of respectively corresponding respectively these insulation modules 53 and be used for forming the outstanding 551 of these cover sections 13, and an one connects these outstanding 551 connecting portions 553 that is used for forming this bridge part 15.At this moment, the material of the above sublayer 55 is preferably chromium/copper (Cr/Cu), titanium/copper (Ti/Cu) or tungsten titanium/copper (TiW/Cu).
Then, in step S13, please consult simultaneously Fig. 6, be used for forming the insulation module 57 of this sound hole 11 respectively and be formed at outstanding 551 of this Seed Layer 55 a plurality of.At this moment, aforementioned dielectric module 57 is preferably used the photoresistance insulation module, and its size needs less than aforementioned dielectric module 53.
Then, in step S14, please consult simultaneously Fig. 7, be plated on a metal level 59 that is used for forming this metallic plate 10 on this Seed Layer 55 and expose these insulation modules 57.At this moment, the material of aforementioned metal layer 59 is preferably nickel (Ni), copper (Cu) or nickel cobalt (alloy) (NiCo).At last then as described in the step S15, sequentially remove this substrate 50 and this release layer 51(as shown in Figure 8), remove these insulation modules 53,57(is as shown in Figure 9) and remove this Seed Layer 55(as shown in figure 10), can obtain to have the metallic plate 10 of the cover section 13 with aforementioned sound hole 11 that is the arrangement of array shape, and, respectively should connect with these bridge part 15 one between the cover section 13.Aforementioned these insulation modules 53 that removes, 57 and the mode of Seed Layer 55 there is no specific limited, can use usual manner to be finished, for example can use remover (stripper) to remove these insulation modules 53,57, and use etching mode to remove this Seed Layer 55.
After the preparation of finishing this metallic plate 10, please again consult Fig. 1 and Fig. 2, as described in step S2, aforementioned this metallic plate 10 that makes is welded in one has a plurality of respectively circuit boards 20 of the to be packaged district (not shown) corresponding with these cover sections 13, make respectively and should cover section 13 cover respectively this district to be packaged.In the present embodiment, this metallic plate 10 is for seeing through (but being not limited to) with a scolder 30, and for example tin cream is coated this metallic plate 10, is welded in this circuit board 20 through reflow again.During certain Practical manufacturing, aforementioned scolder 30 also can be coated this circuit board 20.
At last, in step S3, cut this metallic plate 10 and circuit board 20 along this bridge part 15, finally make a plurality of electronic packing bodies 40.
Because previous embodiment of the present invention is for illustrating to make the employed electronic packing body of micro-electro-mechanical microphone, so the cover section 13 of metallic plate 10 need to have the sound hole 11 that passes through for sound wave, yet during practical application, this metallic plate 10 also can not form aforementioned sound hole 11.Particularly, see also Fig. 4, at first, equally according to step S11 and S12 formation structure as shown in Figure 5, carry out afterwards S13 ', metal level 59 is plated on the Seed Layer 55, carry out at last step S14 ', sequentially remove substrate 50 and release layer 51, these insulation modules 53 and Seed Layer 55, can obtain to have the metallic plate 10 of the cover section 13 that does not have sound hole 11 that is the arrangement of array shape.
In addition of particular note, the aspect of employed metallic plate 10 is not limited with previous embodiment in the manufacture method of the present invention.For example, see also Figure 12 A and 12B, the bridge part 15 of this metallic plate 10 also can have plurality of through holes 17, be used for forming the materials'use amount that metallic plate 10 gets metal level 59 so as to minimizing, stress deformation in the time of can also reducing metallic plate 10 with circuit board 20 welding, and can help the follow-up operation that cuts.
Further it, at first, equally according to step S11 to S13 formation structure as shown in Figure 6, afterwards as shown in figure 11, the insulation module 58 that a plurality of (only showing one among the figure) are used for forming these through holes 17 is formed at the connecting portion 553 of this Seed Layer 55, be plated on this metal level 59 on this Seed Layer 55 afterwards and expose these insulation modules 57,58, sequentially remove again at last substrate 50 and release layer 51, these insulation modules 53,57,58 and the step of Seed Layer 55, can obtain the metallic plate 10 shown in Figure 12 A and 12B.In addition, the aspect of these through holes 17 becomes with the aspect of this insulation module 58, and it can be (but being not limited to) circle or oblong.
In addition, in the step of this metallic plate 10 of preparation, also can see through mode as described below (but being not limited to), make this Seed Layer 55 have these and give prominence to 551 and this connecting portion 553.Particularly, as shown in figure 13, be formed at the release layer 51 ' on this substrate 50, connect these connecting portions 513 of outstanding 511 for having a plurality of outstanding 511 and one one that are the arrangement of array shape, afterwards, again Seed Layer 55 is formed on this release layer 51 ', makes this Seed Layer 55 have the outstanding 551 of a plurality of respectively corresponding respectively these release layer outstanding 511, and to connecting portion 553 that should release layer connecting portion 513.Perhaps, as shown in figure 14, use one to have a plurality of outstanding 501 of array shape arrangements that are, and one one connect the substrate 50 ' of these connecting portions 503 of outstanding 501, afterwards, again Seed Layer 55 is formed on this release layer 51, makes this Seed Layer 55 have the outstanding 551 of a plurality of respectively corresponding respectively these substrates outstanding 501, and to connecting portion 553 that should substrate connecting portion 503.
It is worth mentioning that the preparation method of aforementioned metal plate 10 is not limited to previous embodiment, also can finish through mold or the mode of punching press.
To sum up institute is old, because the present invention is the metallic plate 10 that directly will have the cover section 13 of a plurality of arrays arrangements, be equivalent to the array type crown cap, directly be stacked on the printed circuit with a plurality of districts to be packaged, therefore compared to prior art, the present invention can accurately be positioned on the printed circuit with seasonal a plurality of cover section, therefore can effectively reduce the process time, reduce manufacturing cost and simplification of flowsheet.
Claims (10)
1. the manufacture method of an electronic packing body comprises the following steps:
(a) preparation one has a plurality of metallic plates that are the cover section of array shape arrangement, respectively should connect with a bridge part one between the cover section;
(b) this metallic plate is welded in a circuit board, this circuit board has a plurality of districts to be packaged of being covered by this cover section respectively; And
(c) cut this metallic plate and circuit board along this bridge part respectively, make a plurality of these electronic packing bodies.
2. the manufacture method of electronic packing body as claimed in claim 1, it is characterized in that: described step (b) is coated a scolder this metallic plate or a scolder is coated this circuit board for seeing through, then carry out the mode of reflow, this metallic plate is welded in this circuit board.
3. the manufacture method of electronic packing body as claimed in claim 1, it is characterized in that: described step (a) prepares this metallic plate and includes the following step:
(a1) release layer is formed on the substrate;
(a2) Seed Layer is formed on this release layer, this Seed Layer has and a plurality ofly is being used for that the array shape arranges and forms the outstanding of these cover sections, and an one connects these outstanding connecting portions that is used for forming this bridge part;
(a3) electroplate one and be used for forming the metal level of this metallic plate on this Seed Layer; And
(a4) sequentially remove this substrate and this Seed Layer with this release layer, obtain this metallic plate.
4. the manufacture method of electronic packing body as claimed in claim 3, it is characterized in that: described step (a) prepares this metallic plate and also includes the following step:
After step (a1), a plurality of insulation modules that are the arrangement of array shape are formed on this release layer;
In step (a2), Seed Layer is formed on this release layer and these insulation modules, makes Seed Layer have the outstanding of a plurality of respectively corresponding respectively these insulation modules, and this connecting portion; And
Step (a4) obtains this metallic plate for sequentially to remove this substrate, these insulation modules and this Seed Layer with this release layer.
5. the manufacture method of electronic packing body as claimed in claim 3, it is characterized in that: the release layer of described step (a1) has a plurality of the outstanding of array shape arrangement that are, and one one connect these outstanding connecting portions, so that the Seed Layer of step (a2) has outstanding outstanding of a plurality of respectively corresponding respectively these release layer, and to this connecting portion that should the release layer connecting portion.
6. the manufacture method of electronic packing body as claimed in claim 3, it is characterized in that: the substrate of step (a1) has a plurality of the outstanding of array shape arrangement that are, and one one connect these outstanding connecting portions, so that the Seed Layer of step (a2) has outstanding outstanding of a plurality of respectively corresponding respectively these substrates, and to this connecting portion that should the substrate connecting portion.
7. the manufacture method of electronic packing body as claimed in claim 3 is characterized in that: the metallic plate of described step (a) respectively should cover section all have a sound hole, and, prepare this metallic plate and also include the following step:
After step (a2), with a plurality of respectively should be outstanding in order to what form that the insulation module of this sound hole respectively is formed at respectively this Seed Layer; And
Step (a4) obtains this metallic plate for sequentially to remove this substrate, these insulation modules and this Seed Layer with this release layer.
8. the manufacture method of electronic packing body as claimed in claim 3 is characterized in that: the metallic plate of step (a) respectively should cover section all have a sound hole, and this bridge part has plurality of through holes, and, prepare this metallic plate and also include the following step:
After step (a2), with a plurality of respectively should be outstanding in order to what form that the insulation module of this sound hole respectively is formed at respectively this Seed Layer, and with a plurality of connecting portions that are formed at this Seed Layer in order to the insulation module that forms these through holes; And
Step (a4) is for sequentially to remove this substrate, these insulation modules and this Seed Layer with this release layer, to obtain this metallic plate.
9. such as the manufacture method of each described electronic packing body of claim 3-8, it is characterized in that: described substrate is silicon substrate, metallic plate, glass plate or plastic plate; Described release layer is heat conduction adhesive tape, ultraviolet tape, photoresistance, metal level or dielectric materials layer; The material of described Seed Layer is chromium/copper, titanium/copper or tungsten titanium/copper; The material of described metal level is nickel, copper or nickel cobalt (alloy).
10. such as the manufacture method of each described electronic packing body in the claim 4,7 or 8, it is characterized in that: described insulation module is the photoresistance insulation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210117480.0A CN103379423B (en) | 2012-04-20 | 2012-04-20 | The manufacturing method of electronic packing body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210117480.0A CN103379423B (en) | 2012-04-20 | 2012-04-20 | The manufacturing method of electronic packing body |
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| Publication Number | Publication Date |
|---|---|
| CN103379423A true CN103379423A (en) | 2013-10-30 |
| CN103379423B CN103379423B (en) | 2018-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210117480.0A Expired - Fee Related CN103379423B (en) | 2012-04-20 | 2012-04-20 | The manufacturing method of electronic packing body |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540525B1 (en) * | 2001-08-17 | 2003-04-01 | High Connection Density, Inc. | High I/O stacked modules for integrated circuits |
| US20070228541A1 (en) * | 2005-08-12 | 2007-10-04 | Taiwan Solutions Systems Corp. | Method for fabricating chip package structure |
| CN101552251A (en) * | 2008-03-31 | 2009-10-07 | 雅马哈株式会社 | Lead frame and package of semiconductor device |
| CN101819960A (en) * | 2010-05-07 | 2010-09-01 | 日月光半导体制造股份有限公司 | Base plate, semiconductor packaging piece applying same and manufacture method of base plate |
-
2012
- 2012-04-20 CN CN201210117480.0A patent/CN103379423B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540525B1 (en) * | 2001-08-17 | 2003-04-01 | High Connection Density, Inc. | High I/O stacked modules for integrated circuits |
| US20070228541A1 (en) * | 2005-08-12 | 2007-10-04 | Taiwan Solutions Systems Corp. | Method for fabricating chip package structure |
| CN101552251A (en) * | 2008-03-31 | 2009-10-07 | 雅马哈株式会社 | Lead frame and package of semiconductor device |
| CN101819960A (en) * | 2010-05-07 | 2010-09-01 | 日月光半导体制造股份有限公司 | Base plate, semiconductor packaging piece applying same and manufacture method of base plate |
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| Publication number | Publication date |
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| CN103379423B (en) | 2018-12-04 |
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Granted publication date: 20181204 Termination date: 20210420 |