CN101800351B - Slice antenna and manufacturing method thereof - Google Patents
Slice antenna and manufacturing method thereof Download PDFInfo
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- CN101800351B CN101800351B CN 200910300369 CN200910300369A CN101800351B CN 101800351 B CN101800351 B CN 101800351B CN 200910300369 CN200910300369 CN 200910300369 CN 200910300369 A CN200910300369 A CN 200910300369A CN 101800351 B CN101800351 B CN 101800351B
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- conductive foil
- antenna
- substrate
- chip antenna
- manufacturing approach
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Abstract
The invention discloses a slice antenna and a manufacturing method thereof. The slice antenna comprises a substrate, an electric conduction foil pasted on the substrate and a feeder line, wherein the electric conduction metallic foil can work at least on a first working frequency band, and the feeder line is welded on corresponding position on the metallic foil.
Description
[technical field]
The invention relates to a kind of chip antenna and manufacturing approach thereof, especially refer to a kind of chip antenna and manufacturing approach that electronic equipment internal is used for wireless transmission that be installed on.
[background technology]
Wireless communication function is increasing to be incorporated in the modern electronic equipment.And antenna is used in the electronic equipment as a kind of indispensable element of wireless telecommunications is also increasing.Along with electronics miniaturization, the development of attractive in appearanceization, and the progress of antenna technology, antenna is increasing to be built in the electronic equipment.Chip antenna becomes a kind of built-in aerial kind commonly used because its thickness is little, in light weight.But could keep the antenna pattern of fixing on the dieelctric sheet because thin slice need be fixed on conductor sheet, and all possiblely in the process on the moulding of its conductor sheet and fixed conductor thin slice to the dieelctric sheet cause antenna pattern to change because deviation occurring and antenna performance is affected.Therefore, in the prior art, utilize the method for making printed circuit board (PCB) to make chip antenna usually, produce the antenna pattern that needs through technology such as etching or illumination.But such manufacturing process is complicated, is unfavorable for saving cost.
[summary of the invention]
The object of the present invention is to provide a kind of simple in structure, lower-cost chip antenna, and simple, be beneficial to the method for saving cost and not influencing the manufacturing chip antenna of antenna performance.
To achieve these goals; Chip antenna of the present invention adopts following technical scheme: a kind of chip antenna; It comprises by substrate, sticks on conductive foil and feeder line on the substrate; Conductive foil provides the Department of Radiation that can work in a working band, and feeder line is welded on the conductive foil and gives said Department of Radiation feed.
To achieve these goals, the present invention's method of making antenna adopts following technical scheme: a kind of manufacturing approach of chip antenna comprises the steps:
The first step, the conductive foil that one side is had viscose glue does not have the one side attaching thin film of viscose glue to form first base material;
Second step; First base material is carried out the moulding first time; The one side that for the first time has a viscose glue towards conductive foil in the moulding cuts conductive foil, after cutting the conductor circuit of antenna is separated with unnecessary conductor material and forms some antennas, forms second base material thereby remove unnecessary conductor material then;
The 3rd step provided a substrate, formed the 3rd base material thereby second base material is attached on the first surface of substrate;
The 4th step, the 3rd base material is carried out the moulding second time, substrate is cut size and shape to needs, have a complete antenna structure on each plate base and make.
Compared to prior art, chip antenna of the present invention has the following advantages: manufacturing approach is convenient, low-cost and be difficult for causing the distortion of antenna.
[description of drawings]
Fig. 1 is the stereogram that utilizes chip antenna of the present invention.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Fig. 3 is the voltage standing wave ratio figure of the chip antenna of Fig. 1.
Fig. 4 is the manufacture process sketch map of chip antenna manufacturing approach of the present invention.
[embodiment]
With reference to Fig. 1, shown in Figure 2, chip antenna 100 antenna manufacturing method thereof according to the present invention is produced among the figure.Chip antenna 100 comprises substrate 110 and is fixed in conductive foil (for label) and the feeder line 150 on the substrate 110.Conductive foil is divided into two parts; Comprise grounding parts 120; The Department of Radiation 130 that was arranged in 120 minutes with grounding parts, with the parasitic metal arm 140 that grounding parts 120 links to each other and separates with Department of Radiation 130, wherein grounding parts 120 is a first with parasitic metal arm 140, Department of Radiation 130 is a second portion.In the present embodiment; Conductive foil is a Copper Foil; Among other embodiment; Conductive foil can be other metal formings, metal forming that for example constitutes by gold, silver, aluminium or the like monometallic or the metal forming that alloy formed, also can adopt with conducting metal or its alloy with vapor deposition, water plating or coat mould, the insulating material (like silastic (Silicone), fourth rubber (NBR), SBR styrene butadiene rubbers (SBR), acryl (Acrylic), polyethylene (PE) or the like) of rubber membrane goes up formed electric conducting material.
The material of processing substrate 110 can be polyethylene (Polyethylene; PE), polyvinyl chloride (PolyvinylChloride, PVC), polypropylene (Polypropylene, PP), PET (PolyethyleneTerephthalate; PET), ABS resin (Acrylonitrile Butadiene Styrene; ABS), Merlon (Polycarbonate, PC), paper or the like, the perhaps composite material of some insulating material.Substrate 110 has first 112 and second 114 and a pair of fixing hole 116 that runs through first 112 and second 114.Grounding parts 120 is positioned at an end of first 112 of substrate 110, has a pair of installing hole 122.Form a pair of through hole thereby installing hole 122 and fixing hole 116 be corresponding, this through hole is used for chip antenna is fixed to electronic equipment.
Department of Radiation 130 is fixed in first 112 of substrate 110, and its first end 132 that the closes on grounding parts 120 roughly center line (not shown) with grounding parts 120 is relative.Second side arm 138 that comprises with grounding parts 120 U-shaped that forms first side arm 136 of the angle of an on-right angle, extends from first side arm 136 from first end, 132 Departments of Radiation 130 respectively.The end of second side arm 138 forms second end 134 of Department of Radiation 130 towards grounding parts 120.One side of second side arm 138 is longer, and it is shorter to close on one side of second end 134, so Department of Radiation 130 is an open structure.
With reference to shown in Figure 3, this chip antenna 100 is a double frequency antenna, and it works in the frequency band of centre frequency 2.4GHz and 5GHz.But because the complex structure of the Department of Radiation 130 of chip antenna 100 and need keep parallel with Department of Radiation 130, such structure on processing procedure, to be easy to generate deviation and to cause antenna to be affected again because of the change of shape performance with parasitic metal arm 140.Therefore the present invention adopts following steps to make this chip antenna 100:
The first step does not have the one side of viscose glue to attach thin film 210 formation first base material 230 conductive foil 220 that one side has viscose glue;
Second step was carried out the moulding first time with first base material; The one side 222 that for the first time has a viscose glue towards conductive foil 220 in the moulding cuts conductive foil; Conductor circuit with antenna after cutting separates with unnecessary conductor material, forms second base material 240 thereby remove unnecessary conductor material then;
The 3rd step provided a substrate 250, formed the 3rd base material 260 on the surface of first base thereby second base material 240 is attached to;
The 4th step was carried out the moulding second time to the 3rd base material 260, and substrate 250 is cut size and shape to needs, had a complete antenna structure on each plate base 250;
The 5th step was removed the film that is attached on the antenna and forms required antenna structure;
The 6th step provided a feeder line, and feeder line is welded on the correspondence position on the antenna structure, promptly formed chip antenna 100 (shown in Figure 1).
If desired, manufacturing approach can also comprise for the 7th step, provides a conductive foil to be pasted on second of substrate 250 and the grounding parts 120 (shown in Figure 1) of this conductive foil and antenna structure is electrically connected.This conductive foil plays and enlarges antenna ground portion area to improve the effect of antenna performance.
Conductive foil in the above-mentioned manufacturing method thereof can be a metal forming; Metal forming that for example constitutes by gold, silver, copper or the like monometallic or the metal forming that its alloy formed, also can adopt with conducting metal or alloy with vapor deposition, water plating or coat mould, the insulating material (like silastic (Silicone), fourth rubber (NBR), SBR styrene butadiene rubbers (SBR), acryl (Acrylic), polyethylene (PE) or the like) of rubber membrane goes up formed electric conducting material.Conductive foil 220 with viscose glue can directly use the conductive foil adhesive tape.Earlier the conductive foil adhesive tape is cut into required strip before the conductive foil adhesive tape uses, stick the film 210 of strip then.The material of processing substrate 250 can be polyethylene (Polyethylene; PE), polyvinyl chloride (PolyvinylChloride, PVC), polypropylene (Polypropylene, PP), PET (PolyethyleneTerephthalate; PET), ABS resin (Acrylonitrile Butadiene Styrene; ABS), Merlon (Polycarbonate, PC), paper or the like, the perhaps composite material of some material.When cutting was by the conductive foil 220 of glue in the forming process for the first time, die-cut stamping capable of using was cut, and circular cutting die rolling cut also capable of using forms.After the conductive foil cutting, antenna structure and unnecessary conductive foil are separated, and film 210 is still complete, and film 210 is accurately located for the complete sum that keeps antenna structure just and is provided with.When unnecessary conductive foil is removed; Because film 210 has certain viscosity, but viscosity ratio a little less than, therefore; Conductive foil can easier tear and don't can influence the position and the evenness of antenna structure off from film 210, antenna structure is still stayed on the film 210 simultaneously.Utilize film 210 that antenna structure is sticked on the substrate 250 then, antenna structure is pasted by the one side of glue and substrate 250.Therefore a little less than the viscosity ratio antenna structure and the viscosity between the substrate 250 between film 210 and the antenna structure, can be easy to film 210 is torn from antenna structure, and still firm being pasted on the substrate of antenna structure.During the second last time moulding, can cut out the required shape size of substrate 250 after utilizing location hole with substrate 250 location.
Through above six steps, promptly process required chip antenna 100.Such manufacturing method thereof makes that the shape of antenna, the position of on substrate, arranging can be because of pasting or other manufacture processes and uncertain variation at random takes place and cause the performance of antenna to be affected.Simultaneously; Because the viscosity between film 250 and the conductive foil is not strong; Make and when removing unnecessary electric conducting material, can antenna structure not pullled distortion; With respect to the mode of punching and shaping again after directly being pasted on conductive foil 220 on the substrate 250, the utilization of film 250 more help antenna structure precisely.The antenna pattern of processing like this is accurate, and yield is high, but simple and convenient on fabrication schedule, and cost is lower, and tool primary Calculation, manufacturing cost are the half the of same shape PCB chip antenna, make cost obtain effective reduction.
Claims (8)
1. the manufacturing approach of a chip antenna is characterized in that, comprises the steps:
The first step, the film that does not have one side attaching one deck of viscose glue to have viscosity the conductive foil that simultaneously has viscose glue forms first base material, and wherein the viscosity between film and the conductive foil far is weaker than the viscosity of conductive foil viscose glue;
Second step; First base material is carried out the moulding first time; The one side that for the first time has a viscose glue towards conductive foil in the moulding cuts conductive foil, after cutting the conductor circuit of antenna is separated with unnecessary conductor material and forms some antennas, forms second base material thereby remove unnecessary conductor material then;
The 3rd step provided a substrate, formed the 3rd base material thereby the one side that second base material has a viscose glue is attached on the first surface of substrate;
The 4th step, the 3rd base material is carried out the moulding second time, substrate is cut size and shape to needs, have a complete antenna structure on each plate base and make;
In the 5th step, remove the film that is attached on the antenna and form required antenna structure.
2. the manufacturing approach of chip antenna as claimed in claim 1, it is characterized in that: said manufacturing approach also comprised for the 6th step, and a feeder line is provided, and feeder line is welded in position corresponding on the antenna structure.
3. the manufacturing approach of chip antenna as claimed in claim 2, it is characterized in that: said manufacturing approach also comprised for the 7th step, and a metal forming is provided, and was pasted on the second surface of substrate.
4. the manufacturing approach of chip antenna as claimed in claim 1, it is characterized in that: said conductive foil with viscose glue is a conductive foil adhesive tape.
5. chip antenna that obtains according to the described manufacturing approach of claim 1; It is characterized in that: said chip antenna comprises substrate, sticks on conductive foil and feeder line on the substrate; Conductive foil provides the Department of Radiation that can work in a working band, and feeder line is welded on the conductive foil and gives said Department of Radiation feed.
6. chip antenna as claimed in claim 5 is characterized in that: said substrate is processed by the transparent insulation material.
7. chip antenna as claimed in claim 5 is characterized in that: said conductive foil is a Copper Foil.
8. chip antenna as claimed in claim 5; It is characterized in that: said conductive foil comprises first that constitutes antenna ground portion and the second portion that constitutes aerial radiation portion, and said feeder line comprises heart yearn that is connected in second portion and the braid that is connected in first.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910300369 CN101800351B (en) | 2009-02-09 | 2009-02-09 | Slice antenna and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910300369 CN101800351B (en) | 2009-02-09 | 2009-02-09 | Slice antenna and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101800351A CN101800351A (en) | 2010-08-11 |
| CN101800351B true CN101800351B (en) | 2012-12-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910300369 Expired - Fee Related CN101800351B (en) | 2009-02-09 | 2009-02-09 | Slice antenna and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN101800351B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI469442B (en) * | 2010-10-15 | 2015-01-11 | Advanced Connectek Inc | Soft antenna |
| CN103296474A (en) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | Manufacturing method for metamaterial, and manufacturing method for metamaterial antenna housing |
| CN102800957A (en) * | 2012-08-23 | 2012-11-28 | 电子科技大学 | Dual-band wearable microstrip antenna and realization method thereof |
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2009
- 2009-02-09 CN CN 200910300369 patent/CN101800351B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN101800351A (en) | 2010-08-11 |
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Granted publication date: 20121219 Termination date: 20150209 |
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| EXPY | Termination of patent right or utility model |