CN103376256A - Automatic detector for surface defects of chip of camera module - Google Patents
Automatic detector for surface defects of chip of camera module Download PDFInfo
- Publication number
- CN103376256A CN103376256A CN2012101182506A CN201210118250A CN103376256A CN 103376256 A CN103376256 A CN 103376256A CN 2012101182506 A CN2012101182506 A CN 2012101182506A CN 201210118250 A CN201210118250 A CN 201210118250A CN 103376256 A CN103376256 A CN 103376256A
- Authority
- CN
- China
- Prior art keywords
- chip
- module
- camera module
- target
- core assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides an automatic detector for surface defects of a chip of a camera module, which is applied to the field of tests in a chip packaging process and after the chip is packaged. The quality of the camera module is greatly related to whether the surface of the chip has the defects or not. The detection of the surface quality of the chip of the camera module currently depends on manual observation, the efficiency is low and the accuracy is bad. The automatic detector of the surface defects of the camera module chip adopts a camera shooting microscope to shoot a picture of the surface of the chip of the camera module and the picture is analyzed through a computer to generate a report for detecting whether the defects exist or not; and the automatic detector has the advantages of low cost, high efficiency and high accuracy.
Description
Technical field
Mobile phone is extensively used the camera module (camera module) that comprises camera chip in the electronic equipments such as digital camera.In the manufacture process of camera module, must guarantee that the camera chip surface does not have dust, greasy dirt, the defectives such as scratch.Usually in the manufacturing process of camera module, defect inspection is carried out on the camera chip surface.The present invention relates to camera module core assembly sheet surface imperfection and automatically detect, and output test result, and preserve to be used for that subsequent quality follows the tracks of, the detected image on camera module core assembly sheet surface.
Background technology
Whether defectiveness has very large relation for the quality of camera module and chip surface.The detection of the chip surface quality of camera module still relies on manual observation at present, and efficient is low, poor accuracy.Cause a large amount of defective productss to flow to follow-up finished product test link, cause a large amount of manpowers, the material resources waste.
Summary of the invention
Camera module core assembly sheet surface imperfection automatic detecting machine adopts the photo of the chip surface of photographic microscope picked-up camera module, by Computer Analysis, produces whether defective report, has the advantage of low cost, high-level efficiency, high accuracy.
The present invention is a kind of automatic detecting machine for camera module core assembly sheet surface quality, comprise (1) control box (2) test board, (2) main frame, (3) keyboard of input service instruction, (4) photographic microscope of picked-up camera module core assembly sheet surface image, the display of (5) Display control computer analysis result.Computer test stand, the photographic microscope on the mobile console obtains target image by photographic microscope, and the Computer Analysis image shows the analysis result of target at display.
The basic process that camera module core assembly sheet surface imperfection detects automatically:
The module plate that (1) will be loaded with tested camera chip module is placed on the test board;
(2) computer program is changed the positional value of the relative module plate of photographic microscope in real time according to each module coordinate in the configuration file;
(3) computer program sends move to control box according to positional value;
(4) control box control test board motor, the photographic microscope on the mobile test bench;
(5) computer program obtains the photo of module to photographic microscope;
(6) computer program is analyzed photo, extracts the image parameter on camera module core assembly sheet surface in the target photo;
(7) computer program is according to module chip surface image parameter, judges whether defectiveness of target module chip surface;
(8) if target module chip surface does not have defective, output " by " to display;
(9) if target module chip surface defectiveness is exported " not passing through " to display;
(10) repeat the operation of above-mentioned (1)～(9), realize the robotization of camera module core assembly sheet surface imperfection test;
Description of drawings
Accompanying drawing is camera chip module group routing quality automatic detecting machine overall block-diagram
Embodiment
The assembling of equipment and debugging:
Computing machine connects upper keyboard, display, photographic microscope, control box.Control box connects X-axis and y-axis motor.
Photographic microscope is fixed on the load bearing arm of X-axis.
The operation Computer aided analysis.
According to what obtain on computers, from the photo of photographic microscope, regulate microscopical height, focal length is until obtain clearly chip surface circuit picture.
Test board comprises (1) base, the y-axis motor that (2) are mounted thereon, and the X-axis motor (5) on X-axis beam (4) the X-axis beam that (3) y-axis motor drives is by the photographic microscope along the directions X translation of X-axis driven by motor;
The method of the photographic microscope on the mobile test bench: send X-axis and y-axis motor movement instruction by computing machine through control box, finally drive photographic microscope and move to assigned address.
Computer program obtains the method for the photo of module to photographic microscope: computer constantly reads in the image from photographic microscope output, and after confirming that motor action is complete, the next picture constantly of intercepting is kept in the computing machine with the bmp form.
Configuration file content comprises: the arranging of module plate (carrying a carrier of a plurality of camera chip modules) upper mould piece: laterally, vertically respectively what, mutual spacing what.This content can be that manual input obtains according to target camera chip module CAD drawing.
Computer program is analyzed photo, and the method for the image parameter on extraction target photo chips surface is as follows:
(1) according to the color of each pixel in the target module photo, extract obvious all pixels of pixel value variation in the picture, be designated as the edge point set;
(2) concentrate the coordinate of pixel to classify used criteria for classification according to marginal point: whether adjacent between pixel;
(3) after the classification, obtain the number of neighbor set, and the number of pixels of corresponding each pixel set-inclusion;
(4) to a pixel number of pixels divided by whole photo of each pixel set-inclusion, be designated as marginal point number percent;
(5) judge that marginal point number percent whether less than certain particular value, such as 1%, judges whether it is defect area;
(6) if defectiveness is regional in the target photo, judge that this module group has problem, output " is not passed through " to display;
(7) if do not have defect area in the target photo, judge that this module group is no problem, output " by " to display;
Claims (5)
- Camera module core assembly sheet surface imperfection automatic test machine1. camera module core assembly sheet surface imperfection automatic detecting machine, what this automatic test machine had is characterized as:Comprise (1) control box (2) test board, (2) main frame, the keyboard of (3) input service instruction, the photographic microscope of (4) picked-up module core assembly sheet surface image, the display of (5) Display control computer analysis result; Computer test stand, the photographic microscope on the mobile console obtains target image by photographic microscope, and the Computer Analysis image shows the testing result of target at display.
- 2. according to camera module core assembly sheet surface imperfection automatic detecting machine claimed in claim 1, it is characterized in that:The module plate that (1) will be loaded with tested camera module is placed on the test board;(2) computer program is changed the positional value of the relative module plate of photographic microscope in real time according to each module coordinate in the configuration file;(3) computer program sends move to control box according to positional value;(4) control box control test board motor, the photographic microscope on the mobile test bench;(5) computer program obtains the photo of module to photographic microscope;(6) computer program is analyzed photo, extracts module chip surface image parameter in the target photo;(7) computer program is according to module chip surface image parameter, judges whether defectiveness of target module chip surface;(8) if target module chip surface does not have defective, output " by " to display;(9) if target module chip surface defectiveness is exported " not passing through " to display;(10) repeat the operation of above-mentioned (1)～(9), realize the robotization of camera module core assembly sheet surface defects detection.
- 3. according to camera module core assembly sheet surface imperfection automatic detecting machine claimed in claim 1, it is characterized in that:Described test board comprises (1) base, the y-axis motor that (2) are mounted thereon, and the motor (5) on X-axis beam (4) the X-axis beam that (3) y-axis motor drives is by the photographic microscope along the directions X translation of X-axis driven by motor; Send X-axis and the y-axis motor movement instruction is changed the photographic microscope positional value in real time by computing machine through control box, the photographic microscope auto-translating is arrived above the target camera chip module, thereby obtain the target camera chip module image of high-quality.
- 4. according to camera module core assembly sheet surface imperfection automatic detecting machine claimed in claim 1, it is characterized in that:Target module photo by the photographic microscope acquisition, can be by Computer Analysis, directly find some quality problems on chip module group surface, for example chip collapses the angle, chip surface has dust, chip surface has greasy dirt etc., and the method for discovery is: dust is arranged or greasy dirt is arranged such as stretch tight angle or surface of fruit chip, the relevant position can detect pixel intensity and normal condition is different so.
- 5. according to camera module core assembly sheet surface imperfection automatic detecting machine claimed in claim 1, it is characterized in that: by the sample photo that photographic microscope obtains, through after the Computer Analysis, the photo deposit with all targets supplies subsequent analysis and quality tracing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101182506A CN103376256A (en) | 2012-04-20 | 2012-04-20 | Automatic detector for surface defects of chip of camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101182506A CN103376256A (en) | 2012-04-20 | 2012-04-20 | Automatic detector for surface defects of chip of camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103376256A true CN103376256A (en) | 2013-10-30 |
Family
ID=49461703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101182506A Pending CN103376256A (en) | 2012-04-20 | 2012-04-20 | Automatic detector for surface defects of chip of camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103376256A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103592310A (en) * | 2013-11-22 | 2014-02-19 | 昆山视杰维光电科技有限公司 | System for detecting keyboard |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2782040Y (en) * | 2004-12-22 | 2006-05-24 | 杨新杰 | Microdiagnostic analyzer |
| CN101576508A (en) * | 2009-05-27 | 2009-11-11 | 华南理工大学 | Device and method for automatically detecting chip appearance defects |
| CN102413354A (en) * | 2011-10-05 | 2012-04-11 | 深圳市联德合微电子有限公司 | Automatic optical detection method, device and system of mobile phone camera module |
-
2012
- 2012-04-20 CN CN2012101182506A patent/CN103376256A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2782040Y (en) * | 2004-12-22 | 2006-05-24 | 杨新杰 | Microdiagnostic analyzer |
| CN101576508A (en) * | 2009-05-27 | 2009-11-11 | 华南理工大学 | Device and method for automatically detecting chip appearance defects |
| CN102413354A (en) * | 2011-10-05 | 2012-04-11 | 深圳市联德合微电子有限公司 | Automatic optical detection method, device and system of mobile phone camera module |
Non-Patent Citations (1)
| Title |
|---|
| 赖宇锋等: "基于机器视觉的PCB缺陷自动光学检测系统", 《沈阳工程学院学报（自然科学版）》, vol. 5, no. 3, 31 July 2009 (2009-07-31) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103592310A (en) * | 2013-11-22 | 2014-02-19 | 昆山视杰维光电科技有限公司 | System for detecting keyboard |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102102874B1 (en) | Automatic optical inspection system and operating method thereof | |
| CN112394071B (en) | Substrate defect inspection apparatus and method | |
| Janóczki et al. | Automatic optical inspection of soldering | |
| CN105115979A (en) | Image mosaic technology-based PCB working sheet AOI (Automatic Optic Inspection) method | |
| CN103531500A (en) | Calibration method of wafer defect detection equipment | |
| CN102854195B (en) | Method for detecting defect coordinates on color filter | |
| CN105424721A (en) | Metal strain gauge defect automatic detection system | |
| CN103646889A (en) | A method for detecting wafer defects | |
| CN103308522A (en) | Automatic camera chip module wire bonding quality tester | |
| CN206945905U (en) | One kind one drags four PCB test devices | |
| CN103311148A (en) | Defect detection and observation method | |
| CN103247548A (en) | Wafer defect detecting device and method | |
| CN103531498A (en) | Wafer defect analysis system | |
| US20180114304A1 (en) | Workpiece conductive feature inspecting method and workpiece conductive feature inspecting system | |
| CN117589770A (en) | PCB patch board detection method, device, equipment and medium | |
| CN103376256A (en) | Automatic detector for surface defects of chip of camera module | |
| CN102856214A (en) | Circuit board mounting method | |
| JP2018091771A (en) | Method for inspection, preliminary image selection device, and inspection system | |
| CN103412278B (en) | A kind of electric energy meter component comparison system and method thereof | |
| CN112964723B (en) | Visual detection method and system for double-sided multi-target equidistant array | |
| CN209182254U (en) | Optical detection device | |
| CN201673124U (en) | Automatic optical inspection system | |
| KR102618194B1 (en) | Semiconductor package board processing hole 3d automatic process inspection method and system | |
| CN206132646U (en) | Half automated inspection platform of printed circuit board | |
| Affolder et al. | Automated visual inspection and defect detection of large-scale silicon strip sensors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: Zhao Dun Document name: Notification of Passing Examination on Formalities |
|
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Cao TA Zhen Chun Tang Road 311812 Zhejiang city of Shaoxing province Zhuji City, No. 3 Lane 39 Applicant after: Zhao Dun Address before: Hangzhou City, Zhejiang province Xiaoshan District 310000 days Jincheng Garden Road No. 411 Building 9 Unit 2 Room 202 Applicant before: Zhao Dun |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131030 |