CN103369221B - 具有保护管的晶片级相机模块 - Google Patents
具有保护管的晶片级相机模块 Download PDFInfo
- Publication number
- CN103369221B CN103369221B CN201310109567.8A CN201310109567A CN103369221B CN 103369221 B CN103369221 B CN 103369221B CN 201310109567 A CN201310109567 A CN 201310109567A CN 103369221 B CN103369221 B CN 103369221B
- Authority
- CN
- China
- Prior art keywords
- image sensor
- protection pipe
- sensor module
- metal shell
- described image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/435,649 | 2012-03-30 | ||
US13/435,649 US20130258182A1 (en) | 2012-03-30 | 2012-03-30 | Wafer level camera module with protective tube |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103369221A CN103369221A (zh) | 2013-10-23 |
CN103369221B true CN103369221B (zh) | 2017-05-17 |
Family
ID=49234506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310109567.8A Active CN103369221B (zh) | 2012-03-30 | 2013-03-29 | 具有保护管的晶片级相机模块 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130258182A1 (zh) |
CN (1) | CN103369221B (zh) |
TW (1) | TWI488293B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9467606B2 (en) * | 2014-06-10 | 2016-10-11 | Omnivision Technologies, Inc. | Wafer level stepped sensor holder |
US9619137B2 (en) * | 2015-03-26 | 2017-04-11 | Motorola Mobility Llc | Portable device touchscreen optimization |
US11943525B2 (en) * | 2022-02-17 | 2024-03-26 | Omnivision Technologies, Inc. | Electronic camera module with integral LED and light-pipe illuminator |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1199982A (zh) * | 1997-05-16 | 1998-11-25 | 索尼株式会社 | 图象拾取装置和摄象机 |
CN1323550C (zh) * | 2003-05-08 | 2007-06-27 | 富士胶片株式会社 | 固态成像装置、照相机模块和照相机模块制造方法 |
CN101326811A (zh) * | 2005-10-11 | 2008-12-17 | 弗莱克斯电子有限责任公司 | 基于晶片的照相模块及其制造方法 |
CN102088547A (zh) * | 2009-12-04 | 2011-06-08 | 三星电机株式会社 | 照相机模块 |
CN102298247A (zh) * | 2010-06-25 | 2011-12-28 | 美商豪威科技股份有限公司 | 用于晶片级照相机模块的强化结构 |
CN103369222A (zh) * | 2012-03-30 | 2013-10-23 | 全视科技有限公司 | 具有卡入式闩锁的晶片级相机模块 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7262405B2 (en) * | 2004-06-14 | 2007-08-28 | Micron Technology, Inc. | Prefabricated housings for microelectronic imagers |
JP2009099591A (ja) * | 2007-10-12 | 2009-05-07 | Toshiba Corp | 固体撮像素子及びその製造方法 |
US20090206431A1 (en) * | 2008-02-20 | 2009-08-20 | Micron Technology, Inc. | Imager wafer level module and method of fabrication and use |
US20090243051A1 (en) * | 2008-03-28 | 2009-10-01 | Micron Technology, Inc. | Integrated conductive shield for microelectronic device assemblies and associated methods |
JP5329903B2 (ja) * | 2008-10-15 | 2013-10-30 | オリンパス株式会社 | 固体撮像装置、固体撮像装置の製造方法 |
US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
US8203647B2 (en) * | 2010-02-11 | 2012-06-19 | Himax Semiconductor, Inc. | Image sensor module and method for manufacturing the same |
US20110221950A1 (en) * | 2010-03-12 | 2011-09-15 | Doeke Jolt Oostra | Camera device, wafer scale package |
JP5422484B2 (ja) * | 2010-05-20 | 2014-02-19 | 株式会社東芝 | カメラモジュール |
-
2012
- 2012-03-30 US US13/435,649 patent/US20130258182A1/en not_active Abandoned
-
2013
- 2013-03-29 TW TW102111331A patent/TWI488293B/zh active
- 2013-03-29 CN CN201310109567.8A patent/CN103369221B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1199982A (zh) * | 1997-05-16 | 1998-11-25 | 索尼株式会社 | 图象拾取装置和摄象机 |
CN1323550C (zh) * | 2003-05-08 | 2007-06-27 | 富士胶片株式会社 | 固态成像装置、照相机模块和照相机模块制造方法 |
CN101326811A (zh) * | 2005-10-11 | 2008-12-17 | 弗莱克斯电子有限责任公司 | 基于晶片的照相模块及其制造方法 |
CN102088547A (zh) * | 2009-12-04 | 2011-06-08 | 三星电机株式会社 | 照相机模块 |
CN102298247A (zh) * | 2010-06-25 | 2011-12-28 | 美商豪威科技股份有限公司 | 用于晶片级照相机模块的强化结构 |
CN103369222A (zh) * | 2012-03-30 | 2013-10-23 | 全视科技有限公司 | 具有卡入式闩锁的晶片级相机模块 |
Also Published As
Publication number | Publication date |
---|---|
CN103369221A (zh) | 2013-10-23 |
TWI488293B (zh) | 2015-06-11 |
TW201347160A (zh) | 2013-11-16 |
US20130258182A1 (en) | 2013-10-03 |
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