CN103369222A - 具有卡入式闩锁的晶片级相机模块 - Google Patents
具有卡入式闩锁的晶片级相机模块 Download PDFInfo
- Publication number
- CN103369222A CN103369222A CN2013101099170A CN201310109917A CN103369222A CN 103369222 A CN103369222 A CN 103369222A CN 2013101099170 A CN2013101099170 A CN 2013101099170A CN 201310109917 A CN201310109917 A CN 201310109917A CN 103369222 A CN103369222 A CN 103369222A
- Authority
- CN
- China
- Prior art keywords
- image sensor
- sensor module
- protection tube
- snap
- latch component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/435,596 | 2012-03-30 | ||
US13/435,596 US8804032B2 (en) | 2012-03-30 | 2012-03-30 | Wafer level camera module with snap-in latch |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103369222A true CN103369222A (zh) | 2013-10-23 |
CN103369222B CN103369222B (zh) | 2016-12-28 |
Family
ID=49234505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310109917.0A Active CN103369222B (zh) | 2012-03-30 | 2013-03-29 | 具有卡入式闩锁的晶片级相机模块 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8804032B2 (zh) |
CN (1) | CN103369222B (zh) |
TW (1) | TWI530176B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103369221A (zh) * | 2012-03-30 | 2013-10-23 | 全视科技有限公司 | 具有保护管的晶片级相机模块 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8804032B2 (en) | 2012-03-30 | 2014-08-12 | Omnivision Technologies, Inc. | Wafer level camera module with snap-in latch |
US9595553B2 (en) | 2012-11-02 | 2017-03-14 | Heptagon Micro Optics Pte. Ltd. | Optical modules including focal length adjustment and fabrication of the optical modules |
JP2015076569A (ja) * | 2013-10-11 | 2015-04-20 | ソニー株式会社 | 撮像装置およびその製造方法ならびに電子機器 |
EP2942938B1 (en) * | 2014-05-07 | 2021-01-27 | Veoneer Sweden AB | Camera module for a motor vehicle and method of pre-focusing a lens objective in a lens holder |
US9467606B2 (en) | 2014-06-10 | 2016-10-11 | Omnivision Technologies, Inc. | Wafer level stepped sensor holder |
DE102015117780A1 (de) * | 2015-04-30 | 2016-11-03 | Huf Hülsbeck & Fürst Gmbh & Co. Kg | Rückfahrkameraeinrichtung für ein Kraftfahrzeug und Heckklappensystem mit einer solchen Rückfahrkameraeinrichtung |
TWI768103B (zh) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | 光學成像模組、成像系統及其製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1199982A (zh) * | 1997-05-16 | 1998-11-25 | 索尼株式会社 | 图象拾取装置和摄象机 |
US20080278621A1 (en) * | 2007-05-10 | 2008-11-13 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
CN101310414A (zh) * | 2005-09-30 | 2008-11-19 | 莫列斯公司 | 模块插槽 |
CN101326811A (zh) * | 2005-10-11 | 2008-12-17 | 弗莱克斯电子有限责任公司 | 基于晶片的照相模块及其制造方法 |
US20090321861A1 (en) * | 2008-06-26 | 2009-12-31 | Micron Technology, Inc. | Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers |
CN101771057A (zh) * | 2008-12-26 | 2010-07-07 | 佛山普立华科技有限公司 | 相机模组 |
US20110130177A1 (en) * | 2009-11-30 | 2011-06-02 | Stmicroelectronics (Research & Development) Limited | Electromagnetic shielding for camera modules |
US20110286736A1 (en) * | 2010-05-20 | 2011-11-24 | Toyokazu Aizawa | Camera module |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003015400A1 (fr) | 2001-08-07 | 2003-02-20 | Hitachi Maxell, Ltd | Module de camera |
KR100843300B1 (ko) | 2007-04-12 | 2008-07-03 | 삼성전기주식회사 | 카메라 모듈 및 그 제조방법 |
JP2009099591A (ja) | 2007-10-12 | 2009-05-07 | Toshiba Corp | 固体撮像素子及びその製造方法 |
CN101431609A (zh) | 2007-11-09 | 2009-05-13 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
TWI484237B (zh) | 2007-12-19 | 2015-05-11 | Heptagon Micro Optics Pte Ltd | 用於攝影裝置的光學模組、擋板基板、晶圓級封裝、及其製造方法 |
TWI505703B (zh) | 2007-12-19 | 2015-10-21 | Heptagon Micro Optics Pte Ltd | 光學模組,晶圓等級的封裝及其製造方法 |
US20090206431A1 (en) | 2008-02-20 | 2009-08-20 | Micron Technology, Inc. | Imager wafer level module and method of fabrication and use |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
US8804032B2 (en) | 2012-03-30 | 2014-08-12 | Omnivision Technologies, Inc. | Wafer level camera module with snap-in latch |
-
2012
- 2012-03-30 US US13/435,596 patent/US8804032B2/en active Active
-
2013
- 2013-03-29 CN CN201310109917.0A patent/CN103369222B/zh active Active
- 2013-03-29 TW TW102111330A patent/TWI530176B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1199982A (zh) * | 1997-05-16 | 1998-11-25 | 索尼株式会社 | 图象拾取装置和摄象机 |
CN101310414A (zh) * | 2005-09-30 | 2008-11-19 | 莫列斯公司 | 模块插槽 |
CN101326811A (zh) * | 2005-10-11 | 2008-12-17 | 弗莱克斯电子有限责任公司 | 基于晶片的照相模块及其制造方法 |
US20080278621A1 (en) * | 2007-05-10 | 2008-11-13 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
US20090321861A1 (en) * | 2008-06-26 | 2009-12-31 | Micron Technology, Inc. | Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers |
CN101771057A (zh) * | 2008-12-26 | 2010-07-07 | 佛山普立华科技有限公司 | 相机模组 |
US20110130177A1 (en) * | 2009-11-30 | 2011-06-02 | Stmicroelectronics (Research & Development) Limited | Electromagnetic shielding for camera modules |
US20110286736A1 (en) * | 2010-05-20 | 2011-11-24 | Toyokazu Aizawa | Camera module |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103369221A (zh) * | 2012-03-30 | 2013-10-23 | 全视科技有限公司 | 具有保护管的晶片级相机模块 |
CN103369221B (zh) * | 2012-03-30 | 2017-05-17 | 豪威科技股份有限公司 | 具有保护管的晶片级相机模块 |
Also Published As
Publication number | Publication date |
---|---|
US20130258181A1 (en) | 2013-10-03 |
CN103369222B (zh) | 2016-12-28 |
TW201347523A (zh) | 2013-11-16 |
TWI530176B (zh) | 2016-04-11 |
US8804032B2 (en) | 2014-08-12 |
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