CN103358031A - 用于钻孔质量管理和分析的工艺和系统 - Google Patents

用于钻孔质量管理和分析的工艺和系统 Download PDF

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CN103358031A
CN103358031A CN2013103082193A CN201310308219A CN103358031A CN 103358031 A CN103358031 A CN 103358031A CN 2013103082193 A CN2013103082193 A CN 2013103082193A CN 201310308219 A CN201310308219 A CN 201310308219A CN 103358031 A CN103358031 A CN 103358031A
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capture pad
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drilling
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松本久
马克·辛格
利奥·鲍德温
杰弗里·豪尔顿
戴维·V·奇尔德斯
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Abstract

一种用于在具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层中激光形成盲孔的工艺可包含：对于待形成于电路衬底的至少一个层中的至少一个盲孔，相对于待形成于钻凿位置处的盲孔几何形状值（例如，面积和/或体积）来估算在距所述钻凿位置预定距离内的定位焊盘几何形状值（例如，面积和/或体积）。所述工艺可包含基于所述估算而设置至少一个激光操作参数，以便在盲孔形成之后获得所需的定位焊盘外观。所述工艺可包含：对在电路衬底的至少一个层中被界定为距盲孔钻凿位置预定距离内的区域的定位焊盘区域进行成像；量化所述经成像的定位焊盘区域的至少一个外观值；以及基于所述经量化的外观值而确定所述经成像的定位焊盘区域的可接受性。

Description

用于钻孔质量管理和分析的工艺和系统
本申请是申请日为2007年7月10日、申请号为200780025881.0、发明名称为“用于钻孔质量管理和分析的工艺和系统”的发明专利申请的分案申请。
技术领域
本发明涉及一种用于在具有呈变化几何形状的多个定位焊盘（capture pad）的电路衬底的至少一个层中激光形成盲孔（blind via）的工艺和系统。
背景技术
将经预蚀刻的窗作为掩模用于在多层电路板中激光钻凿盲孔一般是已知的。多层电路板或基于聚合物的多芯片模块上的密集插脚数和/或密集组件放置可能产生互连密度问题，此问题在工业上称为“孔缺乏（via starvation）”。“孔缺乏”问题的一种解决方案是形成盲孔，所述盲孔使多层电路板或多芯片模块中的一个或一个以上层互连。
盲孔形成中的一个质量标准是铜定位焊盘外观。定位焊盘外观有时被称为“有光泽的”、“过度熔融的”或“暗淡的”，且趋向于是非常主观的标准。除了通过量考虑因素之外，某些顾客通过此主观测量来指定所需的工艺参数。已经观测到，激光操作参数影响铜定位焊盘的外观。对于高能量密度工艺来说，焊盘趋向于熔融，从而展示“有光泽的”外观。当将能量密度设置为非常低时，外观就稍“暗淡”。施加到材料的脉冲的数目也可能影响外观。另一观测结果是，外观视激光操作参数或特性（例如，脉冲宽度）而变化。还已观测到，甚至在使用相同激光处理参数时，外观也视定位焊盘几何形状而变化。当在整个面板工艺中观测到质量变化时，往往难以解析质量变化的来源，因为来自计算机辅助设计（CAD）系统的数据只与所需的钻凿位置有关。
紫外线（UV）激光和图像投影处理已用于在集成电路（IC）封装衬底中钻凿盲孔。当前工艺通常将单一组激光操作参数应用于所有孔或孔穴，在印刷电路设计中，希望所述孔或孔穴在两个层之间产生相同的几何形状。然而，归因于变化的定位焊盘几何形状，最终结果往往不甚理想。当应用一组固定的激光操作参数时，结果从在固体铜平面中钻凿时的“暗淡的”铜到110微米（Mm）铜定位焊盘上的剥层铜（delaminated copper）而变化。
发明内容
一种用于在具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层中激光形成盲孔的工艺可包含：对于待形成于电路衬底的至少一个层中的至少一个盲孔，相对于待形成于钻凿位置处的盲孔几何形状值（例如，面积和/或体积）来估算在距所述钻凿位置预定距离内的定位焊盘几何形状值（例如，面积和/或体积）。所述工艺还可包含基于所述估算而设置至少一个激光操作参数，以便在盲孔形成之后获得所需的定位焊盘外观。
一种用于在具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层中激光形成盲孔的工艺可包含：使在电路衬底的至少一个层中被界定为在距盲孔钻凿位置预定距离内的区域的定位焊盘区域成像；量化经成像的定位焊盘区域的外观值；以及基于经量化的外观值而确定经成像的定位焊盘区域的可接受性。
当结合附图阅读以下对预期用于实践本发明的最佳模式的描述时，本发明的其它应用对于所属领域的技术人员来说将变得明显。
附图说明
本文的描述内容参考附图，其中相同参考标号在若干视图中始终指代相同部分，且其中：
图1是用于在具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层中激光形成孔的系统的简化示意图；
图2是具有呈变化几何形状的多个定位焊盘的CAD/CAM电路布局图案的详图，其中将在定位焊盘的中心钻凿盲孔，且其中假想圆圈界定距钻孔位置预定距离内的定位焊盘区域；
图3是从图2所示的视图截取的横截面图，其说明在呈变化几何形状的多个定位焊盘中所钻凿的堆叠孔和孔；
图4A到图4E说明使用不同激光操作参数或将一组固定的激光操作参数应用于呈变化几何形状的定位焊盘所钻成的盲孔中的铜外观的比较，其中图4A对应于主观上“有光泽的”表面纹理，图4C对应于主观上“无光泽的”或“粒状”表面纹理，且图4E对应于主观上“暗淡的”表面纹理；以及
图5说明用于在具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层中激光形成盲孔的工艺的简化示意流程图。
具体实施方式
现参看图1，用于盲孔的质量管理和分析的工艺或方法可包含CAD/CAM系统10，CAD/CAM系统10包含电路布局设计数据。CAD设计数据可包含具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层，所述至少一个层包含用于在其中形成孔和/或盲孔的钻凿位置和尺寸。CAD设计数据可通过任何合适的构件传送到激光处理系统14（如箭头12示意性地说明）。通过使用待钻凿的孔和/或盲孔的位置以及焊盘位置和/或几何形状作为参考图像，激光操作参数可经设置或与从CAD/CAM系统接收到的CAD设计数据相关联，以便在电路衬底的至少一个层中激光形成孔或盲孔。所述工艺可接着包含在线（或联机）或离线定位的成像装置或台16，以分析焊盘和孔位置，从而产生质量指数或外观值。质量指数值信息可通过任何合适的构件反馈给激光处理系统14（如箭头18示意性地说明），以用于激光操作参数检验、调整或优化，且/或可通过任何合适的构件反馈给CAD/CAM系统10（如箭头20示意性地说明），以用于检验、调整或优化所形成的孔和定位焊盘的位置/几何形状，且用于映射对应于每一位置/几何形状的质量指数或外观值。
应认识到，本发明可用于质量管理和分析，且/或用作到达先前设计和/或处理系统的反馈信号，以便检验且/或调整当前位置、几何形状和/或操作参数，从而在盲孔形成之后获得所需的定位焊盘外观。
现参看图2和图3，详细说明CAD/CAM电路布局图案22，其中呈变化几何形状的多个定位焊盘24将在与定位焊盘相关联的钻凿位置中形成有盲孔26。外部假想周边28说明供分析的径向距离或其它预定距离，其中铜定位焊盘外观在周边28的边界之外不受影响。铜焊盘几何形状数据连同孔钻凿尺寸可用于估算在距钻凿位置预定距离内与钻凿位置相联系的定位焊盘几何形状值对所述钻凿位置处将形成的盲孔几何形状值。所述估算可包含值比较，和/或查找表，和/或计算，或其类似方面。作为实例而非限制，可计算定位焊盘几何形状值与盲孔几何形状值的比率，以便将所述比率列入与不同激光处理参数的使用相关联的预定范围中。CAD系统10可将盲孔钻凿位置/几何形状信息、定位焊盘位置/几何形状信息和/或焊盘/孔几何形状比率或对应的激光操作参数发送给激光钻凿系统14。或者，可执行定位焊盘几何形状值相对于盲孔几何形状值的估算，且/或所述值可由激光钻凿系统进行排列，使得可应用不同的激光操作参数。或者，CAD系统可基于定位焊盘几何形状值（例如，面积和/或体积）相对于盲孔几何形状值（例如，面积和/或体积）的估算（如CAD系统中所估算）而将几何形状值（例如，单工具钻凿文件（drill file））分离到多工具钻凿文件中。分析还可包含与早先钻凿步骤进行比较，以确定是否存在堆叠孔（例如，图3左侧所说明的堆叠孔）。作为实例而非限制，可基于列入不同群组中的定位焊盘几何形状值与盲孔几何形状值比率而产生单独的激光钻凿文件，以针对每一群组设置不同的激光操作参数，例如，目标层（destination layer）、激光能量密度（laser fluence）、脉冲数目、脉冲宽度或其任一组合。作为实例而非限制，可向堆叠盲孔指配目标层值14；可向在1%到13%的范围内的比率指配目标层值15；可向大于13%且至多达17%的比率指配目标层值16；可向大于17%且至多达20%的比率指配目标层值17；且可向大于20%且至多达100%的比率指配目标层值18。可基于如CAD系统中或激光处理系统中或其任一组合中所估算出的孔几何形状值（例如，面积或体积）对定位焊盘几何形状值（例如，面积或体积）的比率而产生多工具钻凿文件。
成像装置或台16可在孔形成之后估算并量化定位焊盘的外观。如可在图4A到图4E中看到，当应用一组固定的激光处理参数时，定位焊盘的外观可从在固体铜平面中钻凿时的“暗淡的”铜（图4E中所说明）到110微米（μm）铜焊盘上的剥层铜（图4A中所说明）变化。铜外观还可能在使用不同激光参数的钻成盲孔中发生变化。举例来说，通常通过描述性主观术语“有光泽的”表面纹理来指代图4A所说明的外观。通常通过描述性主观术语“无光泽的”或“粒状”表面纹理来指代图4C所说明的铜外观。通常通过描述性主观术语“暗淡的”表面纹理来指代图4E所说明的铜外观。图4B说明处于主观上称为“有光泽的”与“无光泽的”表面纹理的外观之间的铜外观。图4D说明处于主观上称作“暗淡的”与“无光泽的”表面纹理之间的铜外观。用以描述盲孔形成之后的铜定位焊盘外观的术语的主观特征已防碍了质量控制和处理控制努力。根据一个实施例，本发明可使用视觉系统16来量化定位焊盘的外观。这使得用户能够将铜外观作为数字而非仅作为描述性主观术语来参考。根据本发明一个实施例的工艺或方法可包含执行直方图分析和/或分数维分析，以提供至少一个数字外观值。举例来说，如果在盲孔的激光加工期间保留铜定位焊盘的“无光泽的”或“粒状”表面纹理，那么分数维将较高（椒盐效应“salt and pepper effect”），且直方图中的强度分布将为双峰的，其中每一强度群组中具有粗略相等的面积。可通过用于分数维的数字且通过用于直方图中两个群体之间的对称性的数字来量化定位焊盘的图像的特性。较高分数维值可对应于铜定位焊盘的“无光泽的”或“粒状”表面纹理。较低分数维值可对应于铜定位焊盘的“有光泽的”表面纹理。近似1（一）的直方图值可对应于铜定位焊盘的“无光泽的”或“粒状”表面纹理。小于1（一）的直方图值可对应于铜定位焊盘的“有光泽的”表面纹理。大于1（一）的直方图值可对应于铜定位焊盘的“暗淡的”表面纹理。经量化的数字可传回到激光处理系统14和/或CAD/CAM系统10，以检验、调整和/或优化激光处理参数，从而使整个电路图案上的钻凿结果的质量变化减到最小。CAD/CAM系统可使用来自视觉成像装置或台16的经量化的数字来分析焊盘几何形状与孔质量之间的关系。视觉成像装置或台16还可执行其它测量，例如顶部/底部直径和圆度测量。
在操作中，一种用于在具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层中激光形成盲孔的工艺可包含：对于待形成于电路衬底的至少一个层中的至少一个盲孔来说，相对于待形成于钻凿位置处的盲孔几何形状值（例如，面积和/或体积）来估算在距钻凿位置预定距离内的定位焊盘几何形状值（例如，面积和/或体积）。所述工艺可包含基于所述估算而设置至少一个激光操作参数，以在盲孔形成之后获得所需的定位焊盘外观。待设置的至少一个激光工艺参数可选自由激光能量密度、激光脉冲数目、激光脉冲宽度及其任一组合所组成的群组。所述工艺可包含对给定钻凿层与邻近的钻凿层进行比较，以确定盲孔是否彼此上下堆叠。
根据本发明一个实施例的工艺可包含：界定钻凿层；在经界定的钻凿层中界定邻近钻凿位置的扫描区域；界定一组估算范围，其中所述估算范围可包含计算出的比率，所述计算出的比率被界定为距钻凿位置预定距离内的定位焊盘几何形状值（例如，面积和/或体积）相对于待形成于钻凿位置处的盲孔几何形状值（例如，面积和/或体积）；以及为对应于一组特定比率范围的钻具选择目标层。
根据本发明一个实施例的工艺可包含：对在电路衬底的至少一个层中被界定为距盲孔钻凿位置预定距离内的区域的定位焊盘区域进行成像；量化经成像的定位焊盘区域的外观值；以及基于经量化的外观值而确定经成像的定位焊盘区域的可接受性。可将外观值量化为经成像的定位焊盘区域的数字外观值，以使经成像的定位焊盘区域中激光形成的盲孔的质量判断中的主观性减到最小。根据本发明的实施例，可通过对经成像的定位焊盘区域执行分数维分析以获得用于分数维的数值来获得数字外观值，其中较高的值对应于经成像的定位焊盘区域的主观上“无光泽的”或“粒状”表面纹理，且较低的值对应于经成像的定位焊盘区域的主观上“有光泽的”表面纹理。根据本发明的实施例，可通过对经成像的定位焊盘区域执行直方图分析以获得用于直方图中群体之间的对称性的数值来获得数字外观值，其中近似1（一）的值对应于经成像的定位焊盘区域的主观上“无光泽的”或“粒状”表面纹理，小于1（一）的值对应于经成像的定位焊盘区域的主观上“有光泽的”表面纹理，且大于1（一）的值对应于经成像的定位焊盘区域的主观上“暗淡的”表面纹理。根据本发明的实施例的数字外观值可包含对经成像的定位焊盘区域执行直方图分析和分数维分析，以量化经成像的定位焊盘区域的一个或一个以上数字外观值。
根据本发明的实施例的经成像的定位焊盘区域的可接受性可基于经量化的外观值。工艺可包含分析定位焊盘几何形状值（例如，面积和/或体积）相对于盲孔几何形状值（例如，面积和/或体积）之间的关系，以相对于多个经成像的定位焊盘区域的至少一个外观值而进行估算/比较，从而使整个电路图案上激光形成的盲孔的质量变化减到最小。可基于在定位焊盘几何形状值（例如，面积和/或体积）相对于盲孔几何形状值（例如，面积和/或体积）之间所分析出的关系以及多个经定位焊盘区域的至少一个外观值而检验、调整和/或优化至少一个激光处理参数，其中激光形成的盲孔位于所述多个定位焊盘区域中。
虽然已结合目前认为是最实用且优选的实施例的实施例而描述了本发明，但应理解，本发明不限于所揭示的实施例，相反，本发明意在涵盖所附权利要求书的精神和范围内所包含的各种修改和均等配置，将赋予所述范围最广泛的解释，以便如法律所允许包括所有此些修改和均等结构。

Claims (11)

1.一种用于在具有呈变化几何形状的多个定位焊盘的电路衬底的至少一个层中激光钻凿盲孔的工艺，所述工艺包括：
在通过钻凿形成盲孔前，估算距一定位焊盘的钻凿位置预定距离内的定位焊盘几何形状值相对于待形成于钻凿位置处的盲孔几何形状值的关系；以及
基于所述估算的结果而设置至少一个激光操作参数，以便在盲孔钻凿之后获得所需的定位焊盘外观，其中理想的定位焊盘外观是在钻凿盲孔后的定位焊盘的主观上的表面纹理。
2.根据权利要求1所述的工艺，其进一步包括：
在盲孔钻凿之后分析定位焊盘外观。
3.根据权利要求2所述的工艺，其中在盲孔形成之后分析定位焊盘外观进一步包括：
对在电路衬底的至少一个层中被界定为距盲孔钻凿位置预定距离内的区域的定位焊盘区域进行成像；以及
量化所述经成像的定位焊盘区域的外观值以作为数值外观值表示所述成像定位焊盘区域的主观上的表面纹理。
4.根据权利要求1-3中任一项所述的工艺，其中设置至少一个激光参数包括：
基于来自定位焊盘几何形状值与盲孔几何形状值的比率与多个定位焊盘区域的经分析出的定位焊盘外观之间的关系的反馈而调整至少一个激光工艺参数，其中钻凿的盲孔位于所述多个定位焊盘区域中。
5.根据权利要求1-4-中任一项所述的工艺，其所述至少一个激光工艺参数的设置包括至少一个激光能量密度、激光脉冲数目和激光脉冲宽度。
6.根据权利要求1或2所述的工艺，进一步包括：
对位于给定钻凿层上的真实的或预期的盲孔和位于邻近钻凿层上的真实的或预期的盲孔进行比较，以确定多个盲孔是否逐层堆叠。
7.根据权利要求1所述的工艺，进一步包括：
界定钻凿层；
在所述经界定的钻凿层中界定邻近钻凿位置的扫描区域；
界定一组比率范围，其每比率被界定为在所述预定距离内的各个盲孔的定位焊盘的几何形状值与将被钻凿在钻凿位置上的所述各个盲孔的盲孔几何形状值的比；并且
为对应于每一比率范围的钻具选择目标层。
8.根据权利要求3所述的工艺，其中量化所述外观值包括：
对所述经成像的定位焊盘区域进行分数维分析，以获得分数维的数值外观值，其中所述数值外观值的级别对应于所述经成像的定位焊盘区域的所述主观上的表面纹理。
9.根据权利要求3所述的工艺，其中量化所述外观值包括：
对所述经成像的定位焊盘区域进行直方图分析，以获得用于所述直方图中群体之间的对称的数值外观值，其中所述对称的级别对应于所述经成像的定位焊盘区域的所述主观上的表面纹理。
10.根据权利要求1所述的工艺，其中估算所述关系包括：
计算距所述定位焊盘的所述钻凿位置所述预定距离内的所述定位焊盘几何形状值相对于待形成于所述钻凿位置处的所述盲孔几何形状值的比率。
11.根据权利要求1或2所述的工艺，进一步包括：
设置所述至少一个层的操作参数后，使用激光在所述电路衬底的一个层中钻凿一个盲孔。
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