CN103354954A - 制作具有正面纹理和平滑背面表面的硅太阳能电池的方法 - Google Patents
制作具有正面纹理和平滑背面表面的硅太阳能电池的方法 Download PDFInfo
- Publication number
- CN103354954A CN103354954A CN2011800673059A CN201180067305A CN103354954A CN 103354954 A CN103354954 A CN 103354954A CN 2011800673059 A CN2011800673059 A CN 2011800673059A CN 201180067305 A CN201180067305 A CN 201180067305A CN 103354954 A CN103354954 A CN 103354954A
- Authority
- CN
- China
- Prior art keywords
- silicon base
- phase mixture
- texture etching
- texture
- dielectric covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 141
- 239000010703 silicon Substances 0.000 title claims abstract description 141
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 136
- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 97
- 239000002585 base Substances 0.000 claims description 110
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 57
- 239000000243 solution Substances 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 56
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Substances [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 31
- 238000009792 diffusion process Methods 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- 229920001223 polyethylene glycol Polymers 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 9
- 238000002161 passivation Methods 0.000 claims description 9
- 239000002202 Polyethylene glycol Substances 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 210000004027 cell Anatomy 0.000 description 33
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 238000005215 recombination Methods 0.000 description 6
- 230000006798 recombination Effects 0.000 description 6
- 150000003376 silicon Chemical class 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000009499 grossing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000006862 quantum yield reaction Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000004446 light reflex Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/056—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means the light-reflecting means being of the back surface reflector [BSR] type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Weting (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010054370A DE102010054370A1 (de) | 2010-12-13 | 2010-12-13 | Verfahren zur Herstellung von Siliziumsolarzellen mit vorderseitiger Textur und glatter Rückseitenoberfläche |
DE102010054370.5 | 2010-12-13 | ||
PCT/DE2011/075306 WO2012083944A2 (de) | 2010-12-13 | 2011-12-09 | Verfahren zur herstellung von siliziumsolarzellen mit vorderseitiger textur und glatter rückseitenoberfläche |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103354954A true CN103354954A (zh) | 2013-10-16 |
CN103354954B CN103354954B (zh) | 2016-06-29 |
Family
ID=45922620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180067305.9A Active CN103354954B (zh) | 2010-12-13 | 2011-12-09 | 制作具有正面纹理和平滑背面表面的硅太阳能电池的方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140051199A1 (zh) |
EP (1) | EP2652802A2 (zh) |
CN (1) | CN103354954B (zh) |
DE (1) | DE102010054370A1 (zh) |
WO (1) | WO2012083944A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107658367A (zh) * | 2016-07-26 | 2018-02-02 | 福建金石能源有限公司 | 一种异质结电池的湿化学处理方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150040983A1 (en) | 2013-08-07 | 2015-02-12 | Solarworld Industries America, Inc. | Acidic etching process for si wafers |
US20180114691A1 (en) * | 2013-08-07 | 2018-04-26 | SolarWorld Americas, Inc. | Methods for etching as-cut silicon wafers and producing solar cells |
US9837259B2 (en) * | 2014-08-29 | 2017-12-05 | Sunpower Corporation | Sequential etching treatment for solar cell fabrication |
JP6513788B2 (ja) * | 2015-03-24 | 2019-05-15 | 株式会社カネカ | 結晶シリコン系太陽電池の製造方法および結晶シリコン系太陽電池モジュールの製造方法 |
DE102018206980A1 (de) | 2018-01-26 | 2019-08-01 | Singulus Technologies Ag | Verfahren und Vorrichtung zur Reinigung von geätzten Oberflächen eines Halbleitersubstrats |
DE102018206978A1 (de) | 2018-01-26 | 2019-08-01 | Singulus Technologies Ag | Verfahren und Vorrichtung zur Behandlung von geätzten Oberflächen eines Halbleitersubstrats unter Verwendung von ozonhaltigem Medium |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040112426A1 (en) * | 2002-12-11 | 2004-06-17 | Sharp Kabushiki Kaisha | Solar cell and method of manufacturing the same |
US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
WO2009067483A1 (en) * | 2007-11-19 | 2009-05-28 | Applied Materials, Inc. | Solar cell contact formation process using a patterned etchant material |
US20090280597A1 (en) * | 2008-03-25 | 2009-11-12 | Kapila Wijekoon | Surface cleaning and texturing process for crystalline solar cells |
US20100015751A1 (en) * | 2008-07-16 | 2010-01-21 | Applied Materials, Inc. | Hybrid heterojunction solar cell fabrication using a metal layer mask |
CN101828265A (zh) * | 2007-10-17 | 2010-09-08 | 费罗公司 | 用于单侧背接触层太阳能电池的介电涂料 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7468485B1 (en) * | 2005-08-11 | 2008-12-23 | Sunpower Corporation | Back side contact solar cell with doped polysilicon regions |
KR101168589B1 (ko) * | 2008-03-26 | 2012-07-30 | 엘지전자 주식회사 | 계면 활성제를 이용한 실리콘 태양전지의 텍스처링 방법 |
US8207444B2 (en) * | 2008-07-01 | 2012-06-26 | Sunpower Corporation | Front contact solar cell with formed electrically conducting layers on the front side and backside |
US7951637B2 (en) * | 2008-08-27 | 2011-05-31 | Applied Materials, Inc. | Back contact solar cells using printed dielectric barrier |
WO2010032933A2 (en) * | 2008-09-16 | 2010-03-25 | Lg Electronics Inc. | Solar cell and texturing method thereof |
DE102008056086A1 (de) * | 2008-11-06 | 2010-05-12 | Gp Solar Gmbh | Additiv für alkalische Ätzlösungen, insbesondere für Texturätzlösungen sowie Verfahren zu dessen Herstellung |
US20110298100A1 (en) * | 2009-02-05 | 2011-12-08 | Kyotaro Nakamura | Semiconductor device producing method and semiconductor device |
KR20120045424A (ko) * | 2010-10-29 | 2012-05-09 | 삼성전자주식회사 | 태양전지 제조방법 |
US8664015B2 (en) * | 2011-10-13 | 2014-03-04 | Samsung Sdi Co., Ltd. | Method of manufacturing photoelectric device |
US9412895B2 (en) * | 2012-04-04 | 2016-08-09 | Samsung Sdi Co., Ltd. | Method of manufacturing photoelectric device |
-
2010
- 2010-12-13 DE DE102010054370A patent/DE102010054370A1/de not_active Ceased
-
2011
- 2011-12-09 US US13/993,757 patent/US20140051199A1/en not_active Abandoned
- 2011-12-09 CN CN201180067305.9A patent/CN103354954B/zh active Active
- 2011-12-09 EP EP11830092.0A patent/EP2652802A2/de not_active Withdrawn
- 2011-12-09 WO PCT/DE2011/075306 patent/WO2012083944A2/de active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040112426A1 (en) * | 2002-12-11 | 2004-06-17 | Sharp Kabushiki Kaisha | Solar cell and method of manufacturing the same |
US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
CN101828265A (zh) * | 2007-10-17 | 2010-09-08 | 费罗公司 | 用于单侧背接触层太阳能电池的介电涂料 |
WO2009067483A1 (en) * | 2007-11-19 | 2009-05-28 | Applied Materials, Inc. | Solar cell contact formation process using a patterned etchant material |
US20090280597A1 (en) * | 2008-03-25 | 2009-11-12 | Kapila Wijekoon | Surface cleaning and texturing process for crystalline solar cells |
US20100015751A1 (en) * | 2008-07-16 | 2010-01-21 | Applied Materials, Inc. | Hybrid heterojunction solar cell fabrication using a metal layer mask |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107658367A (zh) * | 2016-07-26 | 2018-02-02 | 福建金石能源有限公司 | 一种异质结电池的湿化学处理方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2012083944A2 (de) | 2012-06-28 |
CN103354954B (zh) | 2016-06-29 |
DE102010054370A1 (de) | 2012-06-14 |
WO2012083944A3 (de) | 2012-11-01 |
EP2652802A2 (de) | 2013-10-23 |
US20140051199A1 (en) | 2014-02-20 |
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Owner name: KRUEMBERG JENS KRUEMBERG SANDRA Effective date: 20141217 Owner name: TEPPE ANDREAS Free format text: FORMER OWNER: CENTROTHERM PHOTOVOLTAICS AG Effective date: 20141217 |
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Effective date of registration: 20141217 Address after: Konstanz City Christie Ford Street No. 8 78467 Applicant after: Teppe Andreas Applicant after: Kruemberg Jens Applicant after: Kruemberg Sandra Address before: German Bulaobo ylem Applicant before: Centrotherm Photovoltaics AG |
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Free format text: FORMER OWNER: KRUEMBERG JENS KRUEMBERG SANDRA Effective date: 20150520 Owner name: RCT SOLUTION LLC Free format text: FORMER OWNER: TEPPE ANDREAS Effective date: 20150520 |
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Effective date of registration: 20150520 Address after: Konstanz city Teermu Street No. 20 78467 Applicant after: RCT Solution Limited Liability Company Address before: Konstanz City Christie Ford street 878467 Applicant before: Teppe Andreas Applicant before: Kruemberg Jens Applicant before: Kruemberg Sandra |
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