CN103348488A - 具有金属硫氧化物窗口层的光伏装置 - Google Patents
具有金属硫氧化物窗口层的光伏装置 Download PDFInfo
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- 229910052976 metal sulfide Inorganic materials 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 229910052718 tin Inorganic materials 0.000 claims abstract description 8
- 229910052738 indium Inorganic materials 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 5
- 238000000224 chemical solution deposition Methods 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims abstract description 4
- 238000004544 sputter deposition Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 19
- 238000005516 engineering process Methods 0.000 claims description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 3
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 claims description 3
- 150000001768 cations Chemical class 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- 150000001450 anions Chemical class 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000003153 chemical reaction reagent Substances 0.000 claims description 2
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 claims description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 claims description 2
- 229910004613 CdTe Inorganic materials 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005137 deposition process Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 25
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 25
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 229910006404 SnO 2 Inorganic materials 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- -1 wherein Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910004609 CdSn Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- CSBHIHQQSASAFO-UHFFFAOYSA-N [Cd].[Sn] Chemical compound [Cd].[Sn] CSBHIHQQSASAFO-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- UMJICYDOGPFMOB-UHFFFAOYSA-N zinc;cadmium(2+);oxygen(2-) Chemical compound [O-2].[O-2].[Zn+2].[Cd+2] UMJICYDOGPFMOB-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明描述了光伏装置和基底结构的装置和方法。在一个实施例中,光伏装置包括基底和形成在基底上方的MS1-XOX窗口层,其中,M是由Zn、Sn和In组成的组中的元素。另一实施例意在一种制造光伏装置的工艺,所述制造光伏装置的工艺包括通过溅射、蒸发沉积、CVD、化学浴沉积工艺和气相传输沉积工艺中的至少一种在基底上方形成MS1-XOX窗口层,其中,M是由Zn、Sn和In组成的组中的元素。
Description
本申请要求于2010年9月22日提交的第61/385,420号临时申请的优先权,该申请通过引用全部包含于此。
技术领域
本发明的实施例涉及半导体装置和制造方法,更具体地讲,涉及光伏(PV)装置领域。
背景技术
光伏装置通常包括沉积在基底(例如,玻璃)上的多层材料。图1描述了传统的光伏装置。光伏装置100可采用玻璃基底105、沉积在基底105上的透明导电氧化物(TCO)层110、由n型半导体材料制成的窗口层115、金属背面接触125以及由半导体材料制成的吸收层120。传统的装置用碲化镉(CdTe)作为吸收层120,并包括玻璃基底105、作为TCO层110的氧化锡(SnO2)或氧化镉锡(Cd2SnO4)以及作为窗口层115的硫化镉(CdS)。通过示例的方式,传统的光伏装置在基板105上的沉积工艺的顺序可以为:TCO层110,包括掺杂有SnO2和Cd2SnO4中的一种的n型材料;CdS窗口层115;CdTe吸收层120;金属背面接触125。CdTe吸收层120可沉积在窗口层115的顶部上。
图2中描绘了诸如CdTe装置的传统薄膜光伏装置的示例性能带图。作为TCO层的F掺杂的SnO2的带隙能量被描绘为205,作为缓冲层的未掺杂的SnO2的带隙能量被描绘为210,作为窗口层的CdS的带隙能量被描绘为215,作为吸收层的CdTe的带隙能量被描绘为220。通常,CdS相对于CdTe的导带边缘偏移Δ一般为-0.2eV,其中,实验不确定度为+/-0.1eV。
如图2中所描绘的,Δ是导带边缘Ec在窗口层与吸收之间的偏移。在CdS/CdTe堆叠的情况下,Δ为大约-0.2eV。理论上的模型已经示出,由于光生载流子在窗口/吸收界面处复合的速率增加,所以更大的负值Δ导致Voc和FF损耗更大。当Δ是微小的正数(0至0.4eV)时,可使复合速率最小化,这使得Voc和FF得到改善。
CdS是许多类型的薄膜光伏装置中的常见的窗口层,所述薄膜光伏装置包括将CdTe和Cu(In,Ga)Se2中的一种用作吸收层的光伏装置。然而,如图2中所描绘的,CdS的光学带隙仅为2.4eV。
附图说明
图1描绘了传统的光伏装置。
图2描绘了传统的薄膜光伏装置的示例性能带图。
图3A描绘了根据一个实施例的基底结构。
图3B描绘了根据另一实施例的基底结构。
图4描绘了根据另一实施例的基底结构。
图5A描绘了根据一个实施例的薄膜光伏装置。
图5B描绘了根据另一实施例的薄膜光伏装置。
图6描绘了根据另一实施例的薄膜光伏装置。
图7描绘了根据一个实施例的薄膜光伏装置的能带图。
具体实施方式
本公开意在光伏装置和生产方法。在一个实施例中,金属硫氧化物(MS1-XOX)化合物用作基底结构的窗口层。图3A描绘了根据一个实施例的基底结构300。基底结构300包括基底305、透明导电氧化物(TCO)层310、缓冲层315和窗口层320。TCO层310可通常用于允许太阳辐射进入光伏装置,并可进一步作为电极。TCO层310可包括掺杂有SnO2和Cd2SnO4中的一种的n型材料。窗口层320可用于减轻装置中光生载流子(例如,电子和空穴)的内部损耗,并且可以强有力地影响包括开路电压(Voc)、短路电流(Isc)和填充因子(FF)的装置参数。在一个实施例中,窗口层320可允许入射光穿过吸收材料来吸收光。根据一个实施例,为了改善窗口层320的整体光发射效率,基底结构300包括MS1-XOX化合物。如这里所述的金属硫氧化物(MS1-XOX)化合物材料可包括一种或多种材料,其中,金属(M)可包括锌(Zn)、锡(Sn)和铟(In)中的一种。
在一个实施例中,基底结构300可包括玻璃基底305和TCO层310,其中,可省略缓冲层315。窗口层320(例如,MS1-XOX层)可直接位于TCO层310的顶部上,TCO层涉及Cd2SnO4、F掺杂的SnO2和未掺杂的SnO2中的一种或多种。当TCO层310是未掺杂的Cd2SnO4时,TCO层没有外在的掺杂,然而,所述层可因氧空位而是高度的n型。
根据另一实施例,可提供基底结构300来制造光伏装置。如图3A中所描绘的,基底结构包括基底305、TCO层310、低导电缓冲层315和MS1-XOX窗口层320。图3A的基底结构包括MS1-XOX窗口层320,其中,在MS1-XOX窗口层320上可以沉积装置的其他必须的层(例如,吸收层、金属背面接触)。在一个实施例中,MS1-XOX窗口层320可沉积到F-SnO2基基底结构(比如TEC10)上。同样地,这样的基底结构300可以是锡酸镉(CdSn)基底结构。缓冲层315可用于使在半导体窗口层形成的过程中出现不规则的可能性减小。缓冲层315可由诸如未掺杂的氧化锡、氧化锌锡、氧化镉锌或其他透明导电氧化物或它们的组合的导电性比TCO层310导电性小的材料制成。在某些实施例中,如4中所描绘的,基底结构300可以不包括缓冲层。当基底结构300包括低导电缓冲层315时,缓冲层布置在基底305(例如,玻璃)与MS1-XOX窗口层之间。
在一个实施例中,MS1-XOX窗口层320的厚度的范围为从2nm至2000nm。在另一实施例中,MS1-XOX中X的组成大于0小于1。窗口层320可以是相对于传统的窗口层材料(例如,CdS)更导电的材料。另外,窗口层320可包括能够在蓝光不足的环境下大大减少填充因子(FF)损耗的窗口层材料。MS1-XOX窗口层可使蓝色区域(例如,400nm至475nm)中更多的太阳辐射可到达吸收层,这导致短路电流(Isc)更高。
在供选择的实施例中,如图3B所述,诸如基底结构300的光伏装置可包括:MS1-XOX化合物材料,作为窗口层320;阻挡层和CdS窗口层中的一个或多个。基底结构350的阻挡层355可以是氧化硅、氧化硅铝、氧化锡或其他合适的材料或者它们的组合。CdS窗口层360可沉积在MS1-XOX窗口层320上,其中,CdS窗口层360涉及一种用于沉积吸收层的表面。在一个实施例中,光伏装置包括除基底结构(例如,基底结构300)以外的MS1-XOX窗口层。例如,基底结构300可包括包含基底305、TCO层310以及一种或多种附加元件的TCO堆叠件。在另一实施例中,基底结构300可包括缓冲层315。
在光伏装置的窗口层中采用MS1-XOX的优点可包括相对于具有CdS窗口层的装置改善了开路电压(Voc)。与具有CdS窗口层的装置相比,采用MS1-XOX窗口层的装置Voc方面的改进,例如,可以将开路电压从810mV提高到826mV。相对于具有CdS窗口层的光伏装置,从400nm至475nm,具有MS1-XOX窗口层的CdTe装置可额外地利用较高的量子效率。由于可能难于测量特定的改进△,因此这里描述的Voc改进的值是示例性的。源电流可以提高到2mA/cm2,其中,与具有CdS窗口层的光伏装置相比的改进可能依赖于采用的CdS的厚度。
参照图4,根据另一实施例描绘了图3A的基底结构。基底结构400包括基底405、TCO层410和MS1-XOX窗口层415。与图3A的基底结构300相比,基底结构400可以以较低的成本来制造。
根据另一实施例,MS1-XOX可用作薄膜光伏装置的窗口层。图5A和图5B描绘了根据一个或多个实施例的薄膜光伏装置。首先参照图5A,薄膜光伏装置500包括基底505、透明导电氧化物(TCO)层510、缓冲层515、窗口层520、吸收层525和金属背面接触530。吸收层525可根据太阳辐射的吸收用于产生光生载流子。金属背面接触530可用于当作电极。金属背面接触530可由钼、铝、铜或任何其他高导电性材料制成。薄膜光伏装置500的窗口层520可包括MS1-XOX化合物。
更具体地讲,薄膜光伏装置500可包括玻璃基底505、缓冲层515、MS1-XOX窗口层520、CdTe吸收层525、金属背面接触530以及由SnO2或Cd2SnO4制成的TCO层510中的一种或多种。缓冲层515可以是低导电性的缓冲层,例如,未掺杂的SnO2。缓冲层515可用于使在半导体窗口层形成的过程中出现不规则的可能性减小。吸收层525可以是CdTe层。层的厚度和材料不受图5A和图5B中描绘的厚度限制。在一个实施例中,图5A的装置可采用图3A中的基底。
薄膜光伏装置500可包括作为吸收层525的碲化镉(CdTe)、铜铟镓(二)硒化物(CIGS)和无定形硅(Si)中的一种或多种。在一个实施例中,薄膜光伏装置可设置成包括基底结构和吸收层525之间的MS1-XOX窗口层520,其中,基底结构可以包括或者可以不包括低导电缓冲层515。在某些实施例中,装置可以除MS1-XOX窗口层520外还包括CdS窗口层。
在可选择的实施例中,如图5B中所描绘的,薄膜光伏装置550可包括:MS1-XOX化合物材料,作为窗口层520;阻挡层和CdS窗口层中的一个或多个。阻挡层555可以是氧化硅、氧化硅铝、氧化锡或其他合适的材料或它们的组合。CdS窗口层560可沉积在MS1-XOX层520上,其中,CdS窗口层560提供用于沉积吸收层的表面。
在某些实施例中,薄膜光伏装置500可以不包括缓冲层。图6描绘了包括玻璃基底605、由SnO2或Cd2SnO4制成的TCO层610、MS1-XOX窗口层615、CdTe吸收层620和金属背面接触625的薄膜光伏装置600。
图7描绘了根据一个实施例的诸如采用CdTe吸收层的光伏装置的薄膜光伏装置的带结构。在图7中,描绘为作为TCO层的F掺杂的SnO2的带隙能被描绘为705,作为缓冲层的未掺杂的SnO2被描绘为710,作为窗口层的MS1-XOX被描绘为715,作为吸收层的CdTe被描绘为720。正如进一步所描绘的,MS1-XOX相对于CdTe的导带边缘偏移Δ可调整为0至0.4eV。与CdS相比,图3的薄膜光伏装置的另一优点可以是较宽的带隙。
锌、锡或铟(例如,MS1-XOX中的M)的所有氧和硫化合物具有与CdS的带隙相似或者比CdS的带隙大的带隙,CdS的带隙为2.4eV。当适当地选择X时,三元化合物MS1-XOX可具有较宽的带隙(例如,大于2.4eV)。因此,就蓝光而言,MS1-XOX化合物可允许较大的透明度。另一方面,M所有的氧化物相对于CdTe导带边缘具有负性的Δ,而所有的硫化物具有正性的Δ。因此,如图4中所示,三元化合物MS1-XOX的组合物可以证明Δ是略微正性的,其中,ZnS1-XOX示出为示例。
在另一方面,提供了制造光伏装置和基底以包括如图2和图3中描绘的MS1-XOX窗口层的工艺。可通过一种或多种工艺来制造包含MS1-XOX窗口层的基底结构200,其中,可以通过溅射、蒸发沉积和化学气相沉积(CVD)中的一种或多种来制造所述结构中的一层或多层。同样的,可通过下面的工艺(包括溅射、蒸发沉积、CVD、化学浴沉积和气相传输沉积(vapor transportdeposition))中的一种或多种来制造包含MS1-XOX窗口层的薄膜光伏装置300。
在另一实施例中,制造光伏装置的工艺可包括MS1-XOX窗口层的通过DC脉冲溅射、RF溅射、AC溅射以及其他通常制造工艺中的一种的溅射工艺。用于溅射的源材料可以是MS1-XOX三元化合物的一种或多种陶瓷靶,其中,X在0至1的范围内。在一个实施例中,用于溅射的源材料可以是MS1-XOX合金的一种或多种靶,其中,X在0至1的范围内。在另一实施例中,用于溅射的源材料可以是两种或更多种陶瓷靶,其中,一种或多种陶瓷靶由M的氧化物制成,一种或多种陶瓷靶由M的硫化物制成。用于溅射MS1-XOX的工艺气体可以是利用不同混合比例的氩气和氧气的混合物。
在一个实施例中,可以通过大气压化学气相沉积(APCVD)用前驱体来沉积MS1-XOX窗口层,所述前驱体包括但不限于诸如H2O/H2S或臭氧/H2S的试剂的组合与二乙基锌、二乙基锡和三甲基铟。
根据另一实施例,制造光伏装置的工艺可以导致相对于吸收层导带偏移。例如,通过选择X的值可以调节窗口(MS1-XOX)层相对于吸收层的导带偏移使之处于0与+0.4eV之间。此外,可以通过用价位比金属阳离子(M)的价位更高的阳离子杂质掺杂MS1-XOX(例如,用铝(Al)、铬(Cr)、铌(Nb)和锰(Mn)掺杂ZnS1-XOX)或者用诸如氟(F)的单价阴离子杂质掺杂MS1-XOX以及通过引入氧空位(例如,在溅射过程中使氧分压降低)来实现使导电性提高。在一个实施例中,掺杂浓度从大约1×1014cm3至大约1×1019cm3。在一个实施例中,利用具有1×1017cm3至大约1×1018cm3的掺杂浓度的溅射靶来形成窗口层。
Claims (28)
1.一种光伏装置,所述光伏装置包括:
基底;
MS1-XOX窗口层,形成在基底上方,其中,M是Zn;以及
吸收层,形成在基底上方。
2.如权利要求1所述的光伏装置,其中,吸收层是CdTe。
3.如权利要求1所述的光伏装置,其中,吸收层是CIGS。
4.如权利要求1所述的光伏装置,其中,吸收层是无定形Si。
5.如权利要求1所述的光伏装置,其中,MS1-XOX窗口层形成在基底与吸收层之间。
6.如权利要求1所述的光伏装置,所述光伏装置还包括设置在MS1-XOX窗口层与吸收层之间的CdS窗口层。
7.如权利要求1所述的光伏装置,其中,MS1-XOX层相对于吸收层的导带偏移处于从大约0eV至大约+0.4eV的范围内。
8.一种光伏装置,所述光伏装置包括:
基底;
MS1-XOX窗口层,形成在基底上方,其中,M是Sn;以及
吸收层,形成在基底上方。
9.如权利要求8所述的光伏装置,其中,吸收层是CdTe。
10.如权利要求8所述的光伏装置,其中,吸收层是CIGS。
11.如权利要求8所述的光伏装置,其中,吸收层是无定形Si。
12.如权利要求8所述的光伏装置,其中,MS1-XOX层相对于吸收层的导带偏移处于从大约0eV至大约+0.4eV的范围内。
13.一种光伏装置,所述光伏装置包括:
基底;
MS1-XOX窗口层,形成在基底上方,其中,M是In;以及
吸收层,形成在基底上方。
14.如权利要求13所述的光伏装置,其中,吸收层是CdTe。
15.如权利要求13所述的光伏装置,其中,吸收层是CIGS。
16.如权利要求13所述的光伏装置,其中,吸收层是无定形Si。
17.如权利要求13所述的光伏装置,其中,MS1-XOX层相对于吸收层的导带偏移处于从大约0eV至大约+0.4eV的范围内。
18.一种制造光伏装置的工艺,所述工艺包括:
在基底上方形成MS1-XOX窗口层,其中,M是Zn、Sn和In中的一种;
在基底上方形成吸收层。
19.如权利要求18所述的工艺,其中,通过溅射、蒸发沉积、CVD、化学浴沉积工艺和气相传输沉积工艺中的至少一种来形成MS1-XOX层。
20.如权利要求18所述的工艺,其中,MS1-XOX层相对于吸收层的导带偏移处于从大约0eV至大约+0.4eV的范围内。
21.一种光伏装置,所述光伏装置包括:
基底;
MS1-XOX窗口层,通过溅射工艺、蒸发沉积工艺、CVD工艺、化学浴沉积工艺和气相传输沉积工艺中的至少一种形成在基底上方,其中,M是由Zn、Sn和In组成的组中的元素;以及
吸收层,形成在基底上,其中,吸收层由CdTe、CIGS和无定形Si中的一种形成。
22.如权利要求21所述的光伏装置,其中,MS1-XOX窗口层的溅射工艺是DC脉冲溅射、RF溅射和AC溅射中的一种。
23.如权利要求21所述的光伏装置,其中,用于溅射的源材料是两种或更多种陶瓷靶,其中,一种或多种由M的氧化物制成,一种或多种由M的硫化物制成。
24.如权利要求21所述的光伏装置,其中,用于溅射MS1-XOX的工艺气体是氩气和氧气的混合物。
25.如权利要求21所述的光伏装置,其中,MS1-XOX层通过APCVD沉积前驱体来形成,所述前驱体包括但不限于诸如H2O/H2S或臭氧/H2S的试剂的组合以及二乙基锌、二乙基锡和三甲基铟。
26.如权利要求21所述的光伏装置,其中,MS1-XOX层相对于吸收层的导带偏移处于从大约0eV至大约+0.4eV的范围内。
27.如权利要求21所述的光伏装置,其中,MS1-XOX层的导电率处于1mOhm/cm至10Ohm/cm的范围内。
28.如权利要求21所述的光伏装置,其中,用价位比M的价位高的阳离子掺杂MS1-XOX层,或者用诸如F的一价阴离子掺杂MS1-XOX层,或者用氧空位掺杂MS1-XOX层。
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- 2011-09-22 CN CN201180056075.6A patent/CN103348488B/zh not_active Expired - Fee Related
- 2011-09-22 US US13/240,101 patent/US20120067422A1/en not_active Abandoned
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Also Published As
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US20120067422A1 (en) | 2012-03-22 |
WO2012040437A2 (en) | 2012-03-29 |
WO2012040437A3 (en) | 2013-09-12 |
EP2619803A2 (en) | 2013-07-31 |
CN103348488B (zh) | 2016-08-03 |
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