CN103342583A - Processing method of high-precision metal patterns on surface of ceramic material product - Google Patents
Processing method of high-precision metal patterns on surface of ceramic material product Download PDFInfo
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- CN103342583A CN103342583A CN2013102706452A CN201310270645A CN103342583A CN 103342583 A CN103342583 A CN 103342583A CN 2013102706452 A CN2013102706452 A CN 2013102706452A CN 201310270645 A CN201310270645 A CN 201310270645A CN 103342583 A CN103342583 A CN 103342583A
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Abstract
The invention discloses a processing method of high-precision metal patterns on the surface of a ceramic material product. The processing method comprises the following steps of: carrying out pretreatment on the ceramic material product firstly, plating a metal film with the thickness of 0.01 micron to 100 microns on the surface of the ceramic material product, then coating a corrosion-resistant photosensitive material on the metal film, carrying out exposure and development on the metal film, etching the metal film by virtue of an etching solution finally, removing the cured photosensitive material after etching, exposing metal film layer patterns, and further carrying out electroplating or chemical plating treatment on the surface of a metal film layer according to the needs. The processing method is used for manufacturing high-precision micro-nano metal patterns on the surface of the ceramic material product. With the adoption of the processing method, as the manufactured metal patterns have the characteristics that colors and the electric conductivity are adjustable, the patterns can be arbitrarily designed, the grade and the ornamental value of the ceramic material product can be increased, a ceramic substrate is not damaged, and the cost is low.
Description
Technical field
The present invention relates to a kind of in stupalith product surface processing metal method of patterning, especially a kind of method at stupalith product surface machining high-precision metal pattern.
Background technology
Along with science and technology development, people are more and more higher to the requirement that the stupalith product surface is made high-precision metal circuit or pattern.The working method of at present traditional stupalith product surface metal pattern mainly contains silk screen print method, metal thermal spraying method, ink-jet printing process, laser-induced thermal etching method etc., but all has the not high problem of precision.
Silk screen printing is earlier by silk screen printing, sintering at a certain temperature then, thereby acquisition surface metal pattern.Silk screen printing is limited by half tone silk footpath and pulp property, and its printing precision is difficult to reach below the 100 μ m.Metal thermal spraying need carry out roughening treatment to material surface, otherwise sticking power is difficult to reach requirement, and precision also is difficult to reach micro/nano level.Spray ink Printing is limited by printer head precision and printer ink, also can't realize for the accuracy requirement of 0.5～5 μ m is present.The method of laser-induced thermal etching is to make the laser system carry out laser engraving at the stupalith product surface, because the high heat of high temperature that laser beam moment produces makes the ceramic surface gasification, causes easily problem such as impaired of pattern variable color, ceramic base material easily.
To sum up, more than the metal surface of the stupalith product surface handled of existing method very coarse, surfaceness and surface gloss and surperficial colourity all are difficult to control, and have all that working accuracy is not high, figure is yielding, injure problems such as ceramic base material easily, can't realize the processing of micro/nano level high-precision metal pattern.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art part and a kind of working method that can realize the high-precision metal pattern at the stupalith product surface is provided.
For achieving the above object, the technical scheme that the present invention takes is: a kind of working method of stupalith product surface high-precision metal pattern may further comprise the steps:
(1) pre-treatment: the stupalith product surface is polished, cleans pre-treatment;
(2) metal coating: at pretreated stupalith product surface metal-coated membrane, the thickness of described metallic membrane is 0.01～100 μ m;
(3) apply sensitive materials: apply corrosion resistant sensitive materials at the described metallic membrane of step (2);
(4) exposure imaging: the pattern that designing institute needs is also made the film or mask plate, and on the sensitive materials in step (3), fully exposure is disposed unexposed sensitive materials with developing solution then with the film or mask plate covering;
(5) chemical milling: according to the preparation of the metallic membrane in the step (2) etching solution, the stupalith product surface metallic membrane after handling through step (4) is carried out etching;
(6) remove sensitive materials: the stupalith product surface that etching is good cleans with solvent or basic solution, removes the sensitive materials of curing, exposes the metallic diaphragm pattern and gets final product.
In the step described above (4), the film of making or the precision of mask plate reach 0.5 μ m and following precision.
Select to use suitable etching solution according to the material of metallic membrane in the step described above (5), for example when metallic membrane is stainless steel, can select volumetric molar concentration be 0.1～0.5mol/L liquor ferri trichloridi, add a small amount of rare nitric acid as etching solution, the etching spray time is 0.1～60min, and the temperature of etching solution is 10～60 ℃.The material difference of described metallic membrane, the composition difference of the etching solution of selection certainly, when the material of metallic membrane is determined, also can be selected different etching solutions, as long as this etching solution can be realized chemical milling to the metal of this material.In the etching process, according to the material of metallic membrane, the composition of etching solution, the conditions such as concentration of etching solution, determine etching period etc.
Aforesaid method is earlier to carrying out suitable pre-treatment to the stupalith product surface as required, plate the metallic membrane that a layer thickness is 0.01～100 μ m at the stupalith product surface, apply corrosion resistant sensitive materials at described metallic membrane then, the film that will design and produce or mask plate hide in sensitive materials at last, expose and develop, the sensitive materials that is exposed is partly solidified, and the sensitive materials that is not exposed is disposed with developing solution, finally make the sensitive materials for the curing of design desirable pattern shape that covers on the metallic membrane, the metallic membrane that the sensitive materials that is not cured covers is partly exposed, because sensitive materials is corrosion-resistant, so etching solution suitable according to the material accessories of metallic membrane, metallic membrane to the stupalith product surface carries out the chemical milling processing, the metallic membrane part that is coated with the sensitive materials of curing can not be corroded, and exposed metallic membrane part is corroded gradually under the effect of etching solution and removes from the stupalith product surface.Because be exposed the pattern that the sensitive materials of after fixing presents the designing institute needs, therefore finally form the needed metal pattern that designs at the stupalith product surface.The film of making or the precision of mask plate can reach 0.5 μ m and following precision, therefore the metal pattern that finally forms at the stupalith product surface can reach the linear resolution of 0.5～5 μ m, processes high-precision metal pattern thereby be implemented in the stupalith product surface.Method described above can realize that arbitrary graphic comprises the high precision making of pierced pattern, pattern after the moulding have do not injure ceramic base material, advantages such as sticking power is good, pattern color is adjustable, adjustable surface gloss, be particularly suitable for making high degree of accuracy circuit such as RFID, NFC antenna etc., or make high-grade, exquisite decorative pattern such as metal LOGO etc., and have that tooling cost is low, good process repeatability, can realize the high-precision characteristics of micro/nano level.
As the preferred implementation of the working method of stupalith product surface high-precision metal pattern of the present invention, the polished finish in described step (1) pre-treatment comprises mechanical mill polishing, polishing powder polishing or other physics, chemical polishing; Clean in the described pre-treatment comprises plasma cleaning, ultrasonic cleaning, matting or other cleaning surfaces treatment process; Can be particularly, be the abrasive flour of 0.001～5 μ m with powder diameter, its abrasive flour material can be corundum, silicon carbide, zirconium white, silicon nitride, cerium oxide, lanthanum trioxide, yttrium oxide etc., the stupalith goods are polished to mirror status by mechanical mill, make its surface roughness Ra control at 0.5 μ m and following.In the practice, can adopt suitable mode that the stupalith product surface is carried out pre-treatment according to the needs of post-processed.
Preferred implementation as the working method of stupalith product surface high-precision metal pattern of the present invention, adopt in the described step (2) physical vapor deposition, chemical vapour deposition, magnetron sputtering, multi-arc ion plating film or other vacuum plating modes at pretreated stupalith product surface metal-coated membrane, the material of described metallic membrane can be the alloy of a kind of in gold and silver, platinum, tantalum, tungsten, zirconium, zinc, manganese, nickel, titanium, chromium, magnesium, aluminium, stainless steel, iron, the copper or at least two kinds.Usually, adopt physical vapor deposition, chemical vapour deposition, magnetron sputtering, multi-arc ion plating film or other vacuum plating modes are at pretreated stupalith product surface metal-coated membrane, when selecting to adopt every kind of concrete plated film mode, can select appropriate parameters as required, be example to adopt magnetron sputtering for example, the stupalith goods can be hung stove, vacuumize, control stove in temperature be 50～350 ℃, feed argon gas or nitrogen then, with stainless steel as target, open magnetron sputtering target and carry out sputter, keep vacuum tightness at 0.001～10Pa, sputter 1～100min is to obtain the coating of 0.01～100 μ m.When selecting additive method at stupalith product surface metal-coated membrane for use, processing condition in the coating process reach situation as required and select suitably, certainly, the mode of described plated film is not limited to above several method, as long as can be implemented in the metallic membrane that the stupalith product surface plates 0.01～100 μ m.The material of described metallic membrane can be one or more the alloy in gold and silver, platinum, tantalum, tungsten, zirconium, zinc, manganese, nickel, titanium, chromium, magnesium, aluminium, stainless steel, iron, the copper, and certainly, the material of described metallic membrane also can be other alloys.
Preferred implementation as the working method of stupalith product surface high-precision metal pattern of the present invention, feed the gas that responds in the described step (2) in the process of pretreated stupalith product surface metal-coated membrane, described reactant gases is the mixed gas of a kind of in argon gas, nitrogen, acetylene, oxygen, methane, ethane, ethene, the hydrogen or at least two kinds.When in the process of pretreated stupalith product surface metal-coated membrane, passing through above reactant gases, the feeding of described reactant gases, can make color, hardness and the wear resistance of the metallic membrane that is plated to the stupalith product surface to select, in the practice, can select to feed suitable reactant gases according to the demand of color, hardness and the wear resistance of final institute metal-coated membrane.
As the preferred implementation of the working method of stupalith product surface high-precision metal pattern of the present invention, the sensitive materials in the described step (3) is the light-curable ink of photoresist material or high-res; Preferably, the light-curable ink of described high-res is UV printing ink or other sensitization curing inks.The light-curable ink of the preferred photoresist material of described sensitive materials or high-res, the preferred UV printing ink of the light-curable ink of described high-res, the selection of described sensitive materials is not limited to above-mentioned, if the corrosion that the sensitive materials of selecting can etching resistant liquid, and can in subsequent step, get final product by exposure imaging.
As the preferred implementation of the working method of stupalith product surface high-precision metal pattern of the present invention, adopt the mode of spin coating, dip-coating, spraying, roller coat, blade coating or silk screen printing to apply sensitive materials at metallic membrane in the described step (3).
As the preferred implementation of the working method of stupalith product surface high-precision metal pattern of the present invention, described step is exposed under various laser, visible light, infrared light or UV-light in (4), and the time shutter is 0.1～10min.
As the preferred implementation of the working method of stupalith product surface high-precision metal pattern of the present invention, the developing solution in the described step (4) is Na
2CO
3, NaHCO
3, NaOH, KOH, Ba (OH)
2, K
2CO
3, KHCO
3, a kind of in the ammoniacal liquor or at least two kinds mixed solution; Preferably, the concentration of described developing solution is that 0.01～5wt%, temperature are 10～80 ℃, and scavenging period is 0.1～30min.Described developing solution can be selected one or both and the above mixed solution in above-mentioned each solution, be mixed with basic solution, for example, when the concentration of the developing solution that is mixed with is 0.01～5wt%, when disposing unexposed sensitive materials with developing solution, scavenging period is 0.1～30min, and the temperature control of developing solution is at 10～80 ℃.When the concentration of the developing solution that is mixed with is other scopes, can according to circumstances control the temperature of suitable scavenging period and developing solution.
Preferred implementation as the working method of stupalith product surface high-precision metal pattern of the present invention, solvent in the described step (6) is a kind of or at least two kinds mixed solution in ethanol, Virahol, butanols, acetic acid, ethyl acetate, butylacetate, toluene, acetone, butanone, ether, gasoline, the diethylene glycol monobutyl ether, and basic solution is Na
2CO
3, K
2CO
3, NaOH, KOH, Ba (OH)
2, K
2CO
3, KHCO
3, a kind of in the ammoniacal liquor or at least two kinds mixed solution.The good stupalith product surface of etching adopts above several solvents or basic solution or wherein two kinds and above mixed solution clean, to remove the sensitive materials of curing, expose the metallic diaphragm pattern, usually, solvent or basic solution are 0.1～60min to the scavenging period of the good stupalith product surface of etching, the temperature of solvent or basic solution is 20～60 ℃, and the concentration of solvent or basic solution is 1～50wt%.Certainly, described solvent or basic solution also can clean the pattern that remove, expose metallic diaphragm with the sensitive materials that solidifies as long as realize not in above-mentioned scope to the temperature of the scavenging period of stupalith product surface and basic solution and concentration etc.
As the preferred implementation of the working method of stupalith product surface high-precision metal pattern of the present invention, described method also comprises:
(7) post-production is handled: patterned surfaces is carried out electroless plating or electroplating processes, make that the metal pattern thickness of stupalith product surface is 0.01～1000 μ m.Determine whether the metal pattern surface after the processing is carried out electroless plating or electroplating processes as required, the material of electroless plating or plating comprises: gold, silver, platinum, titanium, copper, chromium, zinc, tin, nickel, iron, wherein a kind of such as aluminium or at least two kinds, can make the metal pattern of stupalith product surface can further obtain oxidation-resistance, wear resistance, electroconductibility, effect such as ornamental, as make the electronic conduction circuit and then carry out electroless plating or the processing of plated metal deposition techniques, make the thickness of handling back stupalith product surface metal pattern reach 0.01～1000 μ m, to increase the electroconductibility of metal pattern, also can carry out electroplate handles, concentration and the time of control plating bath, thereby the coating of acquisition different thickness.
The preferred zirconia ceramics material product of stupalith goods of the present invention, described zirconium white can be selected black, white or other colors.Certainly, stupalith goods of the present invention are not limited to the zirconia ceramics material goods, also can be stupalith goods such as aluminum oxide, silicon carbide, aluminium nitride, silicon nitride, ferrite.
The working method of stupalith product surface high-precision metal pattern of the present invention, integrated use the ceramic surface polishing technology, the metal sputtering technology, chemical etch technique etc., be used for making nano level high-precision metal pattern at the stupalith product surface, the metal pattern of making has color tunable, electric conductivity is adjustable, pattern is design characteristic arbitrarily, the precision height of described metal pattern particularly, can promote product specification and the sight of stupalith goods, be particularly suitable for making the high-grade ceramic wrist-watch, china ornament, the ceramic mobile phone device, high-precision ceramic circuit etc.Described method does not injure ceramic base material, can keep the speciality of ceramic base material itself, has overcome the problem of difficult processing that pottery causes because hardness height, rigidity are strong, frangible etc.
Embodiment
For the purpose, technical solutions and advantages of the present invention better are described, the invention will be further described below in conjunction with specific embodiment.
Embodiment 1
Present embodiment provide a kind of on the ceramic mobile phone base plate machining high-precision metal LOGO method of patterning, said method comprising the steps of:
(1) pre-treatment: with the corundum powder of powder diameter at 0.001～5 μ m, white or black zirconia ceramics mobile phone base plate are polished to mirror status by mechanical mill, make the surface roughness Ra control of ceramic mobile phone base plate at 0.5 μ m and following;
(2) metal coating: after pretreated ceramic mobile phone base plate cleaned up, adopt the magnetron sputtering mode at ceramic mobile phone backplate surface plating magnalium film, be specially the ceramic mobile phone base plate is hung stove, vacuumize, temperature is 50～350 ℃ in the control stove, feed argon gas then,, open magnetron sputtering target and carry out sputter as target with magnalium, keep vacuum tightness at 0.001～10Pa, sputter 1～10min is to plate the magnalium film that thickness is 0.01～100 μ m at the ceramic mobile phone base plate;
(3) apply sensitive materials: be coated with on the magnalium film of mode with the ceramic mobile phone base plate with spin coating and be covered with photoresists, rotating speed (for example 1500rpm) and the spin coating time (for example 10min) of control spin coater, the photoresists gauge control at 0.01～50 μ m, is kept 20～135 ℃ of oven dry down then;
(4) exposure imaging: the film or the mask plate pattern that design are hidden on the photoresists of ceramic mobile phone backplate surface, under the laser explosure machine, expose then, period is 10min, pattern can fully be exposed, clean with developing solution then and remove the photoresists that are not exposed, described developing solution is selected the mixed solution of NaOH and KOH, and the concentration of described developing solution is 5wt%, scavenging period is 0.1min, and developer temperatur is 40 ℃;
(5) chemical milling: the preparation volumetric molar concentration is the hydrochloric acid soln of 0.1～0.5mol/L, add a small amount of rare nitric acid, as etching solution, the ceramic mobile phone base plate is put in the etching machine, to ceramic mobile phone base plate spray etching solution, spray time is that the temperature of 0.1min, etching solution is 60 ℃, and the magnalium film of ceramic mobile phone backplate surface is carried out etching;
(6) remove sensitive materials: the ceramic mobile phone base plate solvent cleaning that etching is good, described solvent is selected butyl acetate solvent, scavenging period is 10min, the temperature of described basic solution is that 60 ℃, concentration are 50wt%, the sensitive materials of curing is removed in cleaning, thereby exposes magnalium rete pattern;
(7) post-production is handled: determine whether patterned surfaces is carried out electroless plating or electroplating processes as required, as want to increase the oxidation-resistance of metal plating, can be in the silver-plated processing of magnalium patterned surfaces, concentration and the time of control plating bath are the metal pattern of 0.01～1000 μ m thereby obtain thickness at the ceramic mobile phone backplate surface.
Embodiment 2
Present embodiment provide a kind of on the ceramic mobile phone base plate machining high-precision metal LOGO method of patterning, said method comprising the steps of:
(1) pre-treatment: with the silicon carbide powder of powder diameter at 0.001～5 μ m, white or black zirconia ceramics mobile phone base plate are polished to mirror status by mechanical mill, make the surface roughness Ra control of ceramic mobile phone base plate at 0.5 μ m and following;
(2) metal coating: after pretreated ceramic mobile phone base plate cleaned up, adopt the multi-arc ion coating formula at ceramic mobile phone backplate surface titanizing film, be specially ceramic wrist-watch is hung stove, vacuumize, temperature is 50～350 ℃ in the control stove, with titanium as target, feed nitrogen, ethene, the mixed gas of argon gas, the feasible color that is plated to the metallic membrane of stupalith product surface, hardness and wear resistance can be selected, open sputtering target and carry out sputter, keep vacuum tightness at 0.001～10Pa, sputter 1～10min is to plate the titanium film that thickness is 0.01～100 μ m at ceramic wrist-watch;
(3) apply sensitive materials: apply photoresist material on the titanium film of mode with the ceramic mobile phone base plate with dip-coating, the gauge control of photoresist material at 0.01～50 μ m, is kept drying for 20～135 ℃ times then;
(4) exposure imaging: the film or the mask plate pattern that design are hidden on the photoresist material of ceramic mobile phone backplate surface, under visible light light, expose then, period is 5min, pattern can fully be exposed, clean with developing solution then and remove the photoresist material that is not exposed, described developing solution is selected NaHCO
3, KOH and ammoniacal liquor mixed solution, the concentration of described developing solution is 0.01wt%, scavenging period is 5min, developer temperatur is 20 ℃;
(5) chemical milling: preparation etching solution, described etching solution is that 10% hydrochloric acid, 30% nitric acid and 60% water are formed by volume percent, the ceramic mobile phone base plate is put in the etching machine, to ceramic mobile phone base plate spray etching solution, spray time is that the temperature of 20min, etching solution is 40 ℃, and the titanium film of ceramic mobile phone backplate surface is carried out etching;
(6) remove sensitive materials: the ceramic mobile phone base plate that etching is good cleans with basic solution, and described basic solution is selected K
2CO
3, NaOH mixed solution, scavenging period is 10min, the temperature of described basic solution is that 22 ℃, concentration are 30wt%, cleans and removes the sensitive materials of curing, thereby expose the titanium film layer pattern;
(7) post-production is handled: determine whether patterned surfaces is carried out electroless plating or electroplating processes as required, as want to increase oxidation-resistance and the sight of metal plating, can be in the gold-plated processing of titanium patterned surfaces, concentration and the time of control plating bath are the metal pattern of 0.01～1000 μ m thereby obtain thickness at the ceramic mobile phone backplate surface.
Embodiment 3
Present embodiment provide a kind of on alumina substrate the method for machining high-precision metallic circuit, said method comprising the steps of:
(1) pre-treatment: with the zirconia ceramics powder of powder diameter at 0.001～5 μ m, alumina substrate is polished to mirror status by mechanical mill, makes the surface roughness Ra control of alumina substrate at 0.5 μ m and following;
(2) metal coating: after pretreated alumina substrate cleaned up, adopt the physical vapor deposition mode at ceramic wrist-watch copper coating nickelalloy film, the thickness of described cupronickel film is 0.01～100 μ m;
(3) apply sensitive materials: be coated with on the cupronickel film of mode with alumina substrate with blade coating and be covered with UV printing ink, the UV ink thickness is controlled at 0.01～50 μ m, keeps 20～135 ℃ of oven dry down then;
(4) exposure imaging: the film or the mask plate pattern that design are hidden on the UV on alumina substrate surface printing ink, under ultraviolet light, expose then, period is 4min, pattern can fully be exposed, clean with developing solution then and remove the UV printing ink that is not exposed, described developing solution is selected NaOH, KOH, Na
2CO
3With the mixed solution of ammoniacal liquor, the concentration of described developing solution is 3wt%, and scavenging period is 20min, and developer temperatur is 30 ℃;
(5) chemical milling: the preparation volumetric molar concentration is the liquor ferri trichloridi of 0.1～0.5mol/L, add a small amount of rare nitric acid, as etching solution, alumina substrate is put in the etching machine, to alumina substrate spray etching solution, spray time is that the temperature of 50min, etching solution is 15 ℃, and the cupronickel film on alumina substrate surface is carried out etching;
(6) remove sensitive materials: the alumina substrate that etching is good cleans with basic solution, and described basic solution is selected Ba (OH)
2Solution, scavenging period are 40min, and the temperature of described basic solution is that 35 ℃, concentration are 10wt%, cleans and removes the sensitive materials of curing, thereby expose cupronickel rete pattern;
(7) post-production is handled: patterned surfaces is carried out electroless plating or electroplating processes, increase the electroconductibility of metallic circuit, can be in the silver-plated processing of cupronickel patterned surfaces, concentration and the time of control plating bath are the metallic circuit pattern of 0.01～1000 μ m thereby obtain thickness on the alumina substrate surface.
Embodiment 4
Present embodiment provide a kind of on ceramic wrist-watch machining high-precision metal LOGO method of patterning, said method comprising the steps of:
(1) pre-treatment: with the ceria oxide powder of powder diameter at 0.001～5 μ m, the zirconia ceramics wrist-watch is polished to mirror status by mechanical mill, makes the surface roughness Ra control of ceramic wrist-watch at 0.5 μ m and following;
(2) metal coating: after pretreated ceramic wrist-watch cleaned up, adopt the magnetron sputtering mode at ceramic wrist-watch surface aluminium plating film, be specially ceramic wrist-watch is hung stove, vacuumize, temperature is 50～350 ℃ in the control stove, feed the mixed gas of nitrogen and oxygen then,, open magnetron sputtering target and carry out sputter as target with aluminium, keep vacuum tightness at 0.001～10Pa, sputter 1～10min is to plate the aluminium film that thickness is 0.01～100 μ m at ceramic wrist-watch;
(3) apply sensitive materials: be coated with on the aluminium film of mode with ceramic wrist-watch with spin coating and be covered with photoresists, rotating speed (for example 1500rpm) and the spin coating time (for example 10min) of control spin coater, the photoresists gauge control at 0.01～50 μ m, is kept 20～135 ℃ of oven dry down then;
(4) exposure imaging: the film or the mask plate pattern that design are hidden on the photoresists on ceramic wrist-watch surface, expose under ultraviolet lamp then, the period is 5min, and pattern can fully be exposed, clean with developing solution then and remove the photoresists that are not exposed, described developing solution is selected NaHCO
3, KOH and ammoniacal liquor mixed solution, the concentration of described developing solution is 0.1wt%, scavenging period is 5min, developer temperatur is 80 ℃;
(5) chemical milling: preparation etching solution, described etching solution is that 10% hydrofluoric acid, 30% nitric acid and 60% water are formed by volume percent, ceramic wrist-watch is put in the etching machine, to ceramic wrist-watch spray etching solution, spray time is that the temperature of 20min, etching solution is 40 ℃, and the aluminium film on ceramic wrist-watch surface is carried out etching;
(6) remove sensitive materials: the ceramic wrist-watch solvent cleaning that etching is good, described solvent is selected the mixed solution of ethanol, butanols, and scavenging period is 10min, and the temperature of described solvent is that 22 ℃, concentration are 30wt%, the sensitive materials of curing is removed in cleaning, thereby exposes the aluminum membranous layer pattern;
(7) post-production is handled: determine whether patterned surfaces is carried out electroless plating or electroplating processes as required, as want to increase the wear resistance of metal pattern, can handle in the platinum plating of aluminium patterned surfaces, concentration and the time of control plating bath are the metal pattern of 0.01～1000 μ m thereby obtain thickness on ceramic wrist-watch surface.
Embodiment 5
Present embodiment provide a kind of on ceramic wrist-watch machining high-precision metal LOGO method of patterning, said method comprising the steps of:
(1) pre-treatment: with the lanthanum oxide powder of powder diameter at 0.001～5 μ m, the zirconia ceramics wrist-watch is polished to mirror status by mechanical mill, makes the surface roughness Ra control of ceramic wrist-watch at 0.5 μ m and following;
(2) metal coating: after pretreated ceramic wrist-watch cleaned up, adopt chemical gaseous phase depositing process at ceramic wrist-watch surface plating stainless steel membrane, feed color, hardness and the wear resistance of methane control stainless steel membrane in coating process, the thickness of described stainless steel membrane is 0.01～100 μ m;
(3) apply sensitive materials: apply photoresist material on the stainless steel membrane of mode with ceramic wrist-watch with roller coat, the photoresist material gauge control keeps 20～135 ℃ of oven dry down then at 0.01～50 μ m;
(4) exposure imaging: the film or the mask plate pattern that design are hidden on the photoresist material on ceramic wrist-watch surface, under ultraviolet lamp, expose then, period is 8min, pattern can fully be exposed, clean with developing solution then and remove the photoresist material that is not exposed, described developing solution is selected KOH solution, and the concentration of described developing solution is 1wt%, scavenging period is 10min, and developer temperatur is 50 ℃;
(5) chemical milling: the preparation volumetric molar concentration is the liquor ferri trichloridi of 0.1～0.5mol/L, add a small amount of rare nitric acid, as etching solution, ceramic wrist-watch is put in the etching machine, to ceramic wrist-watch spray etching solution, spray time is that the temperature of 40min, etching solution is 20 ℃, and the stainless steel membrane on ceramic wrist-watch surface is carried out etching;
(6) remove sensitive materials: the ceramic wrist-watch that etching is good cleans with basic solution, and described basic solution is selected K
2CO
3, NaOH, KOH mixing solutions, scavenging period is 20min, the temperature of described basic solution is that 30 ℃, concentration are 25wt%, cleans and removes the sensitive materials of curing, thereby expose the stainless steel membrane layer pattern;
(7) post-production is handled: determine whether patterned surfaces is carried out electroless plating or electroplating processes as required, as want to increase the light of metal LOGO pattern, can handle in the bright nickel plating of stainless steel patterned surfaces, concentration and the time of control plating bath are the metal pattern of 0.01～1000 μ m thereby obtain thickness on ceramic wrist-watch surface.
Embodiment 6
Present embodiment provide a kind of on ceramic wrist-watch machining high-precision metal LOGO method of patterning, said method comprising the steps of:
(1) pre-treatment: with the alpha-silicon nitride powders of powder diameter at 0.001～5 μ m, the zirconia ceramics wrist-watch is polished to mirror status by mechanical mill, makes the surface roughness Ra control of ceramic wrist-watch at 0.5 μ m and following;
(2) metal coating: after pretreated ceramic wrist-watch cleaned up, adopt the physical vapor deposition mode at ceramic wrist-watch surface plating iron film, feed color, hardness and the wear resistance of nitrogen control iron film in coating process, the thickness of described iron film is 0.01～100 μ m;
(3) apply sensitive materials: be coated with on the iron film of mode with ceramic wrist-watch with blade coating and be covered with UV printing ink, the UV ink thickness is controlled at 0.01～50 μ m, keeps 20～135 ℃ of oven dry down then;
(4) exposure imaging: the film or the mask plate pattern that design are hidden on the UV printing ink on ceramic wrist-watch surface, under ultraviolet lamp, expose then, period is 4min, pattern can fully be exposed, clean with developing solution then and remove the UV printing ink that is not exposed, described developing solution is selected NaOH, KOH, Na
2CO
3With the mixed solution of ammoniacal liquor, the concentration of described developing solution is 3wt%, and scavenging period is 20min, and developer temperatur is 60 ℃;
(5) chemical milling: the preparation volumetric molar concentration is the liquor ferri trichloridi of 0.1～0.5mol/L, add a small amount of rare nitric acid, as etching solution, ceramic wrist-watch is put in the etching machine, to ceramic wrist-watch spray etching solution, spray time is that the temperature of 50min, etching solution is 15 ℃, and the iron film on ceramic wrist-watch surface is carried out etching;
(6) remove sensitive materials: the ceramic wrist-watch solvent cleaning that etching is good, described solvent is selected the mixing solutions of ethyl acetate, butylacetate and ether, scavenging period is 40min, the temperature of described solvent is that 35 ℃, concentration are 10wt%, the sensitive materials of curing is removed in cleaning, thereby exposes iron rete pattern;
(7) post-production is handled: determine whether patterned surfaces is carried out electroless plating or electroplating processes as required, as want to increase the oxidation-resistance of metal pattern, can be in the silver-plated processing of iron patterned surfaces, concentration and the time of control plating bath are the metal pattern of 0.01～1000 μ m thereby obtain thickness on ceramic wrist-watch surface.
Last institute should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention but not limiting the scope of the invention; although with reference to preferred embodiment the present invention has been done detailed description; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (10)
1. the working method of a stupalith product surface high-precision metal pattern is characterized in that, may further comprise the steps:
(1) pre-treatment: the stupalith product surface is polished, cleans pre-treatment;
(2) metal coating: at pretreated stupalith product surface metal-coated membrane, the thickness of described metallic membrane is 0.01～100 μ m;
(3) apply sensitive materials: apply corrosion resistant sensitive materials at the described metallic membrane of step (2);
(4) exposure imaging: the pattern that designing institute needs is also made the film or mask plate, and on the sensitive materials in step (3), fully exposure is cleaned with developing solution then and removed unexposed sensitive materials with the film or mask plate covering;
(5) chemical milling: according to the preparation of the metallic membrane in the step (2) etching solution, the stupalith product surface metallic membrane after handling through step (4) is carried out etching;
(6) remove sensitive materials: the stupalith product surface that etching is good cleans with solvent or basic solution, removes the sensitive materials of curing, exposes the metallic diaphragm pattern and gets final product.
2. the working method of stupalith product surface high-precision metal pattern as claimed in claim 1 is characterized in that, the polished finish in described step (1) pre-treatment comprises mechanical mill polishing, polishing powder polishing or other physics, chemical polishing; Clean in the described pre-treatment comprises plasma cleaning, ultrasonic cleaning, matting or other cleaning surfaces treatment process.
3. the working method of stupalith product surface high-precision metal pattern as claimed in claim 1, it is characterized in that, adopt in the described step (2) physical vapor deposition, chemical vapour deposition, magnetron sputtering, multi-arc ion plating film or other vacuum plating modes at pretreated stupalith product surface metal-coated membrane, the material of described metallic membrane can be the alloy of a kind of in gold and silver, platinum, tungsten, zirconium, zinc, manganese, nickel, titanium, chromium, magnesium, aluminium, stainless steel, iron, the copper or at least two kinds.
4. as the working method of claim 1 or 3 described stupalith product surface high-precision metal patterns, it is characterized in that, feed the gas that responds in the described step (2) in the process of pretreated stupalith product surface metal-coated membrane, described reactant gases is the mixed gas of a kind of in argon gas, nitrogen, acetylene, oxygen, methane, ethane, ethene, the hydrogen or at least two kinds.
5. the working method of stupalith product surface high-precision metal pattern as claimed in claim 1 is characterized in that, the sensitive materials in the described step (3) is the light-curable ink of photoresist material or high-res; Preferably, the light-curable ink of described high-res is UV printing ink.
6. as the working method of claim 1 or 5 described stupalith product surface high-precision metal patterns, it is characterized in that, adopt the mode of spin coating, dip-coating, spraying, roller coat, blade coating or silk screen printing to apply sensitive materials at metallic membrane in the described step (3).
7. the working method of stupalith product surface high-precision metal pattern as claimed in claim 1 is characterized in that, described step is exposed under laser, visible light, infrared light or UV-light in (4), and the time shutter is 0.1～10min.
8. as the working method of claim 1 or 7 described stupalith product surface high-precision metal patterns, it is characterized in that the developing solution in the described step (4) is Na
2CO
3, NaHCO
3, NaOH, KOH, Ba (OH)
2, K
2CO
3, KHCO
3, a kind of in the ammoniacal liquor or at least two kinds mixed solution; Preferably, the concentration of described developing solution is that 0.01～5wt%, temperature are 10～80 ℃, and scavenging period is 0.1～30min.
9. the working method of stupalith product surface high-precision metal pattern as claimed in claim 1, it is characterized in that, solvent in the described step (6) is a kind of or at least two kinds mixed solution in ethanol, Virahol, butanols, acetic acid, ethyl acetate, butylacetate, toluene, acetone, butanone, ether, gasoline, the diethylene glycol monobutyl ether, and basic solution is Na
2CO
3, K
2CO
3, NaOH, KOH, Ba (OH)
2, K
2CO
3, KHCO
3, a kind of in the ammoniacal liquor or at least two kinds mixed solution.
10. the working method of stupalith product surface high-precision metal pattern as claimed in claim 1 is characterized in that described method also comprises:
(7) post-production is handled: patterned surfaces is carried out electroless plating or electroplating processes, make that the metal pattern thickness of stupalith product surface is 0.01～1000 μ m.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508224A (en) * | 2009-03-23 | 2009-08-19 | 萧华 | Production method of ceramic wafer art picture |
| CN102285299A (en) * | 2010-06-21 | 2011-12-21 | 圣维可福斯(广州)电子科技有限公司 | Object surface metallized decoration method |
| CN102950958A (en) * | 2011-08-22 | 2013-03-06 | 陈章武 | Porcelain plate containing patterns formed by random distribution of powders with predetermined colours and production method |
-
2013
- 2013-06-28 CN CN201310270645.2A patent/CN103342583B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508224A (en) * | 2009-03-23 | 2009-08-19 | 萧华 | Production method of ceramic wafer art picture |
| CN102285299A (en) * | 2010-06-21 | 2011-12-21 | 圣维可福斯(广州)电子科技有限公司 | Object surface metallized decoration method |
| CN102950958A (en) * | 2011-08-22 | 2013-03-06 | 陈章武 | Porcelain plate containing patterns formed by random distribution of powders with predetermined colours and production method |
Non-Patent Citations (2)
| Title |
|---|
| 徐滨士 等: "《表面工程技术手册[下]》", 31 July 2009, 化学工业出版社, article "《表面工程技术手册[下]》", pages: 138 - 139 * |
| 欧雪梅 等: "《工程材料》", 30 November 2009, 中国矿业大学出版社, article "《工程材料》", pages: 183 * |
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