CN115522187A - Ceramic plate coating method based on chemical plating method - Google Patents
Ceramic plate coating method based on chemical plating method Download PDFInfo
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- CN115522187A CN115522187A CN202211231923.9A CN202211231923A CN115522187A CN 115522187 A CN115522187 A CN 115522187A CN 202211231923 A CN202211231923 A CN 202211231923A CN 115522187 A CN115522187 A CN 115522187A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 167
- 238000000576 coating method Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000007747 plating Methods 0.000 title claims abstract description 26
- 239000000126 substance Substances 0.000 title claims abstract description 19
- 238000004140 cleaning Methods 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 239000007888 film coating Substances 0.000 claims abstract description 6
- 238000009501 film coating Methods 0.000 claims abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 25
- 238000001035 drying Methods 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 238000007772 electroless plating Methods 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 15
- 230000001235 sensitizing effect Effects 0.000 claims description 15
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 12
- 238000007788 roughening Methods 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 11
- 239000012153 distilled water Substances 0.000 claims description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- 206010070834 Sensitisation Diseases 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 230000008313 sensitization Effects 0.000 claims description 6
- 239000011780 sodium chloride Substances 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- FWPIDFUJEMBDLS-UHFFFAOYSA-L tin(II) chloride dihydrate Chemical compound O.O.Cl[Sn]Cl FWPIDFUJEMBDLS-UHFFFAOYSA-L 0.000 claims description 6
- 238000005238 degreasing Methods 0.000 claims description 5
- 241000080590 Niso Species 0.000 claims description 3
- 239000008139 complexing agent Substances 0.000 claims description 3
- 239000003995 emulsifying agent Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 239000001488 sodium phosphate Substances 0.000 claims description 3
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000011161 development Methods 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 239000000443 aerosol Substances 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000010923 batch production Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract 1
- 238000000889 atomisation Methods 0.000 description 2
- 238000002144 chemical decomposition reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
A ceramic plate coating method based on a chemical plating method can be applied to the preparation of a ceramic atomizing core in an aerosol generating device and aims to solve the problem that the production efficiency of the current ceramic atomizing core is low, and comprises the following steps: sequentially carrying out pretreatment, coating, exposure, development, chemical plating and cleaning treatment on the porous ceramic plate to form a metal film on the upper surface of the porous ceramic plate; the ceramic plate coating method based on the chemical plating method can realize coating on the whole surface of the porous ceramic plate, and can also prepare a heating metal film with a complex shape on the surface of the porous ceramic plate, thereby realizing fine control on the resistance range of the coated ceramic plate. In the embodiment of the invention, the whole porous ceramic plate is subjected to film coating treatment to prepare the film-coated ceramic plate, and then the film-coated ceramic plate can be cut according to the size requirement to prepare the ceramic atomizing core for the aerosol generating device, so that the batch production of the ceramic atomizing core is facilitated, and the production efficiency of the ceramic atomizing core is improved.
Description
Technical Field
The invention relates to the field of atomizers, in particular to a ceramic plate coating method based on a chemical plating method.
Background
An aerosol generating device is an electronic delivery system for an aerosol for generating an aerosol substrate. The atomizing core in the structure of the aerosol generating device is an important structure for generating aerosol substrate, and with the development of electronic atomization technology, the atomizing core goes through the earliest glass fiber rope plus resistance wire to cotton core plus resistance wire, and gradually develops into a ceramic atomizing core which is generally applied in the market at present. The ceramic atomizing core surface has the one deck heating film for carry out the heating atomization function, the heating film of current ceramic atomizing core generally processes manufacturing through thick film printing technique, heater embedding technique, no matter printing or sintering all need a large amount of manpower and materials, the problem that the production efficiency of ceramic atomizing core is low very easily appears in the production process.
Disclosure of Invention
The embodiment of the invention provides a ceramic plate coating method based on a chemical plating method, and aims to solve the problem of low production and manufacturing efficiency of a ceramic atomizing core in the existing aerosol generating device.
A ceramic plate coating method based on an electroless plating method, the method being used for performing electroless plating on a porous ceramic plate to obtain a coated ceramic plate, the method comprising:
pretreating the porous ceramic plate;
immersing the pretreated porous ceramic plate into a photoresist solution, standing for a preset coating time, placing the coated porous ceramic plate in a drying oven, and drying under a preset drying condition to obtain a coated ceramic plate; wherein the preset coating time is 10-12 hours, and the preset drying condition is 100 ℃ for 5 minutes;
placing the glued ceramic plate in an exposure machine, setting a mask above the glued ceramic plate, and using preset exposure conditions to align the glued ceramic plateCarrying out exposure treatment to obtain an exposed ceramic plate; wherein the preset exposure condition is as follows: the exposure energy is 50-700 mj/cm 2 The exposure time is 1-60 seconds;
spraying the exposed ceramic plate for a preset development time by using a developing solution at a preset development temperature, and then cleaning and drying the exposed ceramic plate by using deionized water to obtain a developed ceramic plate; wherein the preset developing temperature is 23-28 ℃, and the preset developing time is 1-10 minutes;
placing the developed ceramic plate in a chemical plating solution at a preset plating temperature, standing for a preset plating time to obtain an initial plated ceramic plate; the preset coating temperature is 75-85 ℃, and the preset coating time is 70-150 minutes;
and spraying or dipping and cleaning the initial coated ceramic plate by using a cleaning solution and deionized water in sequence to obtain the coated ceramic plate.
Wherein, the pretreatment method comprises the following steps:
placing the porous ceramic plate in deoiling liquid at a preset deoiling temperature for cleaning for a preset deoiling duration, and then sequentially cleaning the deoiling liquid remained on the surface of the porous ceramic plate by using a fan and distilled water and drying; wherein the preset oil removing temperature is 40-80 ℃, and the preset oil removing time is 5-30 minutes;
placing the deoiled porous ceramic plate in a roughening solution at normal temperature for roughening for preset roughening time, and then cleaning the roughening solution remained on the surface of the porous ceramic plate by using a fan and distilled water in sequence and drying; wherein the preset coarsening time is 2-3 minutes;
placing the roughened porous ceramic plate in sensitizing solution at normal temperature to perform sensitizing treatment for preset sensitizing duration, and then sequentially cleaning the residual sensitizing solution on the surface of the porous ceramic plate by using a fan and distilled water and drying; wherein the preset sensitization time is 10-15 minutes.
Specifically, the photoresist is a positive photoresist, and the viscosity of the photoresist is 24-45 mpa · s.
In the embodiment of the invention, the mask is a blank mask, and the surface of the blank mask is not provided with patterns and lines.
Or the surface of the mask plate is provided with fixed patterns and lines.
Specifically, the pH value of the chemical plating solution is 4.8-5.5, and the chemical plating solution comprises the following components in percentage by mass: niSO 4 20 to 30 portions of NaH 2 PO 2 20 to 30 portions of C 3 H 6 O 3 15 to 20 portions of H 3 BO 3 5 to 10 portions of NaCl and 10 to 15 portions of NaCl.
The volume ratio of the hydrogen peroxide to the sulfuric acid in the cleaning solution is between 2/3 and 3/2.
The mass ratio of the degreasing fluid is 5-6 parts of sodium carbonate, 1.5-3 parts of sodium phosphate, 0.1-0.3 part of emulsifier and 10 parts of water.
The mass ratio of the coarsening liquid is 1 to 1.5 portions of sulphuric acid, 0.5 to 2 portions of hydrofluoric acid, 0.5 to 2 portions of chromic anhydride, 0.1 to 0.5 portion of complexing agent and 10 portions of water.
The pH value of the sensitizing solution is more than 1, and the sensitizing solution comprises 3-4 parts of stannous chloride dihydrate, 3-4 parts of hydrochloric acid and 10 parts of water by mass.
According to the ceramic plate coating method based on the chemical plating method, provided by the invention, the whole surface of the porous ceramic plate can be coated, and a heating metal film with a complex shape can be manufactured on the surface of the porous ceramic plate, so that the resistance value range of the coated ceramic plate can be finely controlled; in the embodiment of the invention, the whole porous ceramic plate is subjected to film coating treatment to prepare the film-coated ceramic plate, and then the film-coated ceramic plate is subjected to cutting treatment to prepare the ceramic atomizing core for the aerosol generating device, so that the mass production of the ceramic atomizing core is facilitated, and the production efficiency of the ceramic atomizing core is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a flow chart of a method for manufacturing a coated ceramic plate according to an embodiment of the present invention;
fig. 2 is a schematic view of a manufacturing process of a coated ceramic plate according to a first embodiment of the disclosure;
fig. 3 is a schematic view of a manufacturing process of a coated ceramic plate according to a second embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.
A ceramic plate plating method based on an electroless plating method for electroless plating of a porous ceramic plate to obtain a plated ceramic plate, the method comprising: sequentially carrying out pretreatment, coating, exposure, development, chemical plating and cleaning treatment on the porous ceramic plate to form a metal film on the upper surface of the porous ceramic plate; the flow chart of the coating method of the porous ceramic plate is shown in figure 1, and the coating method comprises the following steps of S1-S6:
s1, preprocessing a porous ceramic plate;
s2, immersing the pretreated porous ceramic plate into a photoresist solution, standing for preset coating time, placing the coated porous ceramic plate in a drying oven, and drying under preset drying conditions to obtain a coated ceramic plate; the coating duration is 12 hours in advance, the drying condition is 100 ℃ and 5 minutes in advance, the photoresist is a positive photoresist, the photoresist model is RZJ-304, the viscosity of the photoresist is 24-45 mpa · s, the main components of the positive photoresist are resin, a photosensitizer, a solvent and the like, and the photosensitizer can generate a chemical decomposition reaction under the irradiation of ultraviolet light. Referring to fig. 2 (b) and 3 (b), which are schematic cross-sectional views of a coated porous ceramic plate 2 according to an embodiment of the present invention, the photoresist coating layer 1 is coated on the outer surface and the inner holes of the coated porous ceramic plate 2.
S3, placing the glued ceramic plate in an exposure machine, arranging a mask plate above the glued ceramic plate, and exposing the glued ceramic plate by using preset exposure conditions to obtain an exposed ceramic plate; wherein the preset exposure condition is as follows: the exposure energy is 50-700 mj/cm 2 The exposure time is 1-60 seconds. During the uv exposure, the sensitizer in the positive photoresist undergoes a chemical decomposition reaction to enhance the dissolution rate of the photoresist coating 1 during development.
S4, spraying the exposed ceramic plate for a preset development time by using a developing solution at a preset development temperature, and then cleaning and drying the ceramic plate by using deionized water to obtain a developed ceramic plate; the preset developing temperature is 23 ℃, the preset developing time is 1-10 minutes, and the type of the developing solution is RZX-3038. During development, the photoresist coating on the ultraviolet exposed part of the upper surface of the coated ceramic plate is washed away by the developing solution, and the photoresist coating 1 on the other unexposed part is not affected, and the cross-sectional views of the developed ceramic plate are shown in fig. 2 (c) and 3 (c').
S5, placing the developed ceramic plate in a chemical plating solution at a preset plating temperature, standing for a preset plating time, and obtaining an initial plated ceramic plate after a metal film 3 is generated on the surface of the ceramic plate; the preset coating temperature is 75-85 ℃, the preset coating time is 70-150 minutes, the pH value of the chemical plating solution is 4.8-5.5, and the chemical plating solution comprises the following components in percentage by mass: niSO 4 20 to 30 portions of NaH 2 PO 2 20 to 30 portions of C 3 H 6 O 3 15 to 20 portions of H 3 BO 3 5 to 10 portions of NaCl and 10 to 15 portions of NaCl. The sectional views of the electroless-plated ceramic plate are shown in fig. 2 (d) and 3 (d'), and the metal film 3 is coated on the photoresist coating 1 on the upper surface and other surfaces of the porous ceramic plate 2.
S6, spraying or dipping and cleaning the initial coated ceramic plate by using cleaning liquid and deionized water in sequence; wherein the volume ratio of the hydrogen peroxide to the sulfuric acid in the cleaning solution is between 2/3 and 3/2. The cleaning solution removes the photoresist coating 1 to prepare a coated ceramic plate having a metal film on the upper surface thereof, and the sectional views of the prepared coated ceramic plate are shown in fig. 2 (e) and 3 (e').
The pretreatment method of the porous ceramic plate comprises the following steps:
s11, placing the porous ceramic plate in deoiling liquid at a preset deoiling temperature for cleaning for a preset deoiling duration, and then cleaning the deoiling liquid remained on the surface of the porous ceramic plate by using a fan and distilled water in sequence and drying; the oil removing method comprises the following steps of pre-setting the oil removing temperature to be 40-80 ℃, setting the oil removing time to be 5-30 minutes, and setting the mass ratio of the oil removing liquid to be 5-6 parts of sodium carbonate, 1.5-3 parts of sodium phosphate, 0.1-0.3 part of emulsifier and 10 parts of water.
S12, placing the deoiled porous ceramic plate in a roughening solution at normal temperature for roughening for a preset roughening time, and then cleaning the roughening solution remained on the surface of the porous ceramic plate by using a fan and distilled water in sequence and drying; wherein the preset coarsening time is 2-3 minutes, and the mass ratio of the coarsening liquid is 1-1.5 parts of sulfuric acid, 0.5-2 parts of hydrofluoric acid, 0.5-2 parts of chromic anhydride, 0.1-0.5 part of complexing agent and 10 parts of water.
S13, placing the porous ceramic plate subjected to the coarsening treatment in sensitizing solution at normal temperature for treatment for preset sensitizing duration, and then cleaning the sensitizing solution remained on the surface of the porous ceramic plate by using a fan and distilled water in sequence and drying the porous ceramic plate; the preset sensitization time is 10-15 minutes, the pH of the sensitization liquid is greater than 1, and the sensitization liquid comprises 3-4 parts of stannous chloride dihydrate, 3-4 parts of hydrochloric acid and 10 parts of water by mass. The chemical reactions that occur during the sensitization process are as follows:
SnCl 2 +H 2 O→Sn(OH)Cl+Cl - +H +
SnCl 2 +2H 2 O→Sn(OH) 2 +2Cl - +2H +
specifically, in the first embodiment, as shown in fig. 2, the mask is a blank mask, the blank mask has no pattern or line, the cross-sectional views of the ceramic plate after coating, exposing, developing, electroless plating and cleaning are respectively shown in fig. 2 (b), 2 (c), 2 (d) and 2 (e), the upper surface of the coated ceramic plate is irradiated by ultraviolet light during exposing, the photoresist coating irradiated by ultraviolet light is washed away by the developing solution during developing, and the cross-sectional view of the developed ceramic plate is shown in fig. 2 (c); subsequently, performing chemical plating treatment on the developed ceramic plate, wherein metal films are generated on all surfaces of the developed ceramic plate to form an initial plated ceramic plate, and the cross-sectional view of the initial plated ceramic plate is shown in fig. 2 (d); and finally, cleaning the initial coated ceramic plate, wherein the cleaning solution reacts with the photoresist on the surface of the initial coated ceramic plate, the photoresist on the surface of the initial coated ceramic plate is washed away, the surface of the prepared coated ceramic plate is a whole metal film, and the cross-sectional view of the coated ceramic plate is shown in fig. 2 (e).
Specifically, in the second embodiment, as shown in fig. 3, the surface of the mask has fixed patterns and lines, and the cross-sectional views of the ceramic plate after coating, exposure, development, electroless plating and cleaning are respectively shown in fig. 3 (b), 3 (c '), 3 (d ') and 3 (e '), during exposure, ultraviolet light is transmitted through the mask to irradiate the glued ceramic plate, and the parts of the glued ceramic plate blocked by the patterns and lines of the mask are not irradiated by the ultraviolet light; during development, the part of the upper surface of the coated ceramic plate irradiated by ultraviolet light is washed away, and the part not irradiated by ultraviolet light is left, and the cross-sectional view of the ceramic plate after development is shown in fig. 3 (c'); subsequently subjecting the developed ceramic plate to electroless plating treatment with metal films applied to respective surfaces of the developed ceramic plate, to form an initial plated ceramic plate having a cross-sectional view as shown in FIG. 3 (d'); and finally, cleaning the initial coated ceramic plate, and washing away the photoresist on the surface of the initial coated ceramic plate, wherein the surface of the prepared coated ceramic plate is provided with a metal film corresponding to the pattern of the mask, and the cross-sectional view of the coated ceramic plate is shown in figure 3 (e').
And cutting the coated ceramic plate according to the size requirement to obtain the ceramic atomizing core for the aerosol generating device.
The ceramic plate coating method based on the chemical plating method can realize whole-surface coating of the porous ceramic plate and also can manufacture a heating metal film with a complex shape on the surface of the porous ceramic plate so as to realize fine control of the resistance range of the coated ceramic plate. In the embodiment of the invention, the whole porous ceramic plate is subjected to film coating treatment to prepare the film-coated ceramic plate, and the film-coated ceramic plate can be cut according to the size requirement to prepare the ceramic atomizing core for the aerosol generating device, so that the batch production of the ceramic atomizing core is facilitated, the production efficiency of the ceramic atomizing core is improved, and the cost is reduced.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A ceramic plate coating method based on an electroless plating method, wherein the method is used for performing electroless plating on a porous ceramic plate to obtain a coated ceramic plate, and the method comprises the following steps:
pretreating the porous ceramic plate;
immersing the pretreated porous ceramic plate into a photoresist solution, standing for a preset coating time, placing the coated porous ceramic plate in a drying oven, and drying under a preset drying condition to obtain a coated ceramic plate; wherein the preset coating time is 10-12 hours, and the preset drying condition is 100 ℃ for 5 minutes;
placing the glued ceramic plate in an exposure machine, arranging a mask plate above the glued ceramic plate, and exposing the glued ceramic plate under a preset exposure condition to obtain an exposed ceramic plate; wherein the preset exposure condition is as follows: the exposure energy is 50-700 mj/cm 2 The exposure time is 1-60 seconds;
spraying the exposed ceramic plate for a preset developing time period by using a developing solution at a preset developing temperature, and then cleaning and drying the exposed ceramic plate by using deionized water to obtain a developed ceramic plate; wherein the preset developing temperature is 23-28 ℃, and the preset developing time is 1-10 minutes;
placing the developed ceramic plate in a chemical plating solution at a preset plating temperature, standing for a preset plating time to obtain an initial plated ceramic plate; the preset coating temperature is 75-85 ℃, and the preset coating time is 70-150 minutes;
and spraying and cleaning the initial coated ceramic plate by using cleaning liquid and deionized water in sequence to obtain the coated ceramic plate.
2. A ceramic plate coating method based on an electroless plating method according to claim 1, wherein the pre-treatment method comprises:
placing the porous ceramic plate in degreasing fluid at a preset degreasing temperature for cleaning for a preset degreasing duration, and then cleaning the degreasing fluid remained on the surface of the porous ceramic plate by using a fan and distilled water in sequence and drying; wherein the preset oil removing temperature is 40-80 ℃, and the preset oil removing time is 5-30 minutes;
placing the deoiled porous ceramic plate in roughening liquid at normal temperature for roughening treatment of preset roughening time, and then cleaning the residual roughening liquid on the surface of the porous ceramic plate by using a fan and distilled water in sequence and drying; wherein the preset coarsening time is 2-3 minutes;
placing the roughened porous ceramic plate in sensitizing solution at normal temperature to perform sensitizing treatment for preset sensitizing duration, and then sequentially cleaning the residual sensitizing solution on the surface of the porous ceramic plate by using a fan and distilled water and drying; wherein the preset sensitization time is 10-15 minutes.
3. A ceramic plate coating method based on electroless plating method according to claim 1, characterized in that said photoresist is a positive photoresist, and the viscosity of said photoresist is 24-45 mpa-s.
4. A ceramic plate coating method based on an electroless plating method according to claim 1, wherein the mask is a blank mask, and the surface of the blank mask has no patterns or lines.
5. A ceramic plate coating method based on an electroless plating method according to claim 1, wherein the surface of the mask has fixed patterns and lines.
6. A ceramic plate coating method based on an electroless plating method according to claim 1, wherein the pH value of the electroless plating solution is 4.8-5.5, and the chemical plating solution comprises the following components in percentage by mass: niSO 4 20 to 30 portions of NaH 2 PO 2 20 to 30 portions of C 3 H 6 O 3 15 to 20 portions of H 3 BO 3 5 to 10 portions of NaCl and 10 to 15 portions of NaCl.
7. A ceramic plate coating method based on an electroless plating method according to claim 1, wherein the volume ratio of hydrogen peroxide to sulfuric acid in the cleaning solution is between 2/3 and 3/2.
8. A ceramic plate film coating method based on an electroless plating method according to claim 2, characterized in that the mass ratio of the deoiling liquid is 5-6 parts of sodium carbonate, 1.5-3 parts of sodium phosphate, 0.1-0.3 part of emulsifier and 10 parts of water.
9. A ceramic plate film coating method based on an electroless plating method according to claim 2, characterized in that the mass ratio of the coarsening liquid is 1-1.5 parts of sulfuric acid, 0.5-2 parts of hydrofluoric acid, 0.5-2 parts of chromic anhydride, 0.1-0.5 part of complexing agent and 10 parts of water.
10. A ceramic plate film coating method based on an electroless plating method according to claim 2, wherein the pH of the sensitizing solution is greater than 1, and the sensitizing solution comprises 3-4 parts of stannous chloride dihydrate, 3-4 parts of hydrochloric acid and 10 parts of water by mass.
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