CN105120019A - Shell and preparation method thereof - Google Patents
Shell and preparation method thereof Download PDFInfo
- Publication number
- CN105120019A CN105120019A CN201510431436.0A CN201510431436A CN105120019A CN 105120019 A CN105120019 A CN 105120019A CN 201510431436 A CN201510431436 A CN 201510431436A CN 105120019 A CN105120019 A CN 105120019A
- Authority
- CN
- China
- Prior art keywords
- micro
- nano
- transparency carrier
- structure layer
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a shell and a preparation method thereof, and belongs to the field of shells. The shell is applied to electronic equipment. The shell comprises a transparent substrate and a micro-nano structure layer covering the transparent substrate. The micro-nano structure layer is arranged at a side, near the electronic components in the electronic equipment, of the transparent substrate. The micro-nano structure layer is a micro-nano pattern composed of micro-nano trenches and bosses. The shell comprises the transparent substrate and the micro-nano structure layer covering the transparent substrate, the micro-nano structure layer is a micro-nano pattern composed of micro-nano trenches and bosses, the micro-nano pattern is composed of micro-nano trenches and bosses and is a stereoscopic and changing pattern, and the micro-nano structure ensures high pattern accuracy. As the micro-nano pattern is disposed at the inner side of the shell, users are not affected when using the shell, and the failure risk such as pattern fading or film fall-off is avoided.
Description
Technical field
The present invention relates to housing field, particularly a kind of housing and preparation method thereof.
Background technology
Smart mobile phone generally includes housing and electronic component two large divisions, and its middle shell is the support framework of whole mobile phone, positions simultaneously and fix electronic component.Along with the universal of smart mobile phone and development, for the requirement of housing except the performance requirements such as resistance to wear is good, hardness is high, also require the appearance looks elegant of housing.
At present, the housing front of smart mobile phone is nearly all covered completely by one piece of rectangular screen, and for realizing the demand of housing appearance looks elegant, smart mobile phone manufacturer starts to turn to and designs housing rear portion (i.e. cell phone rear cover).Current cell phone rear cover normally carries out ink silk screen printing to present different appearance on transparent material, as CD line, dermatoglyph/woven design and the various geometric error modeling with modern sense.
Realizing in process of the present invention, inventor finds that prior art at least exists following problem:
On the housing that transparent material is made by ink silk screen printing, texture mostly is simple plane effect, can not present stereo-effect.
Summary of the invention
In order to solve the problem of prior art, embodiments provide a kind of housing and preparation method thereof.Described technical scheme is as follows:
First aspect, embodiments provides a kind of housing, and described housing is applicable to electronic equipment, and described housing comprises:
Transparency carrier and the micro nano structure layer covered on described transparency carrier, described micro nano structure layer is located at the side of the electronic component of described transparency carrier in described electronic equipment, and described micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition.
In a kind of implementation of the embodiment of the present invention, described micro nano structure layer comprises the micro-nano layer with described micro-nano pattern covered on described transparency carrier;
Or described micro nano structure layer comprises the transparent membrane matrix covered on described transparency carrier and the micro-nano layer with described micro-nano pattern covered on described transparent membrane matrix.
In the another kind of implementation of the embodiment of the present invention, described transparent membrane matrix is adhesive on described transparency carrier by optical clear.
In the another kind of implementation of the embodiment of the present invention, described transparency carrier is glass substrate, PC substrate, PMMA substrate or PC and PMMA composite substrate.
In the another kind of implementation of the embodiment of the present invention, the thickness of described transparency carrier is 0.2-0.6mm.
In the another kind of implementation of the embodiment of the present invention, described housing also comprises the vacuum coating covered on described micro nano structure layer.
In the another kind of implementation of the embodiment of the present invention, described vacuum coating is at least two kinds of alloy-layers formed in the metal level of a kind of formation in following metal or following metal: Al, Au, Ag, Zn or Ti;
Or described vacuum coating is silicon oxide ceramics film, zinc oxide ceramics film, titanium oxide ceramics film, zinc sulfide ceramic film, nitride ceramics film or carbide ceramics film.
In the another kind of implementation of the embodiment of the present invention, described housing also comprises the ink layer covered on described vacuum coating.
Second aspect, the embodiment of the present invention additionally provides a kind of housing preparation method, and described housing is applicable to electronic equipment, and described method comprises:
One transparency carrier is provided;
Described transparency carrier covers a micro nano structure layer, and described micro nano structure layer is located at the side of the electronic component of described transparency carrier in described electronic equipment, and described micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition.
In a kind of implementation of the embodiment of the present invention, described micro nano structure layer comprises the micro-nano layer with described micro-nano pattern covered on described transparency carrier;
Or described micro nano structure layer comprises the transparent membrane matrix covered on described transparency carrier and the micro-nano layer with described micro-nano pattern covered on described transparent membrane matrix.
In the another kind of implementation of the embodiment of the present invention, describedly on described transparency carrier, cover a micro nano structure layer, comprising:
One transparent membrane matrix is provided;
Coating UV glue on described transparent membrane matrix;
The mode impressed by UV forms described micro-nano pattern on described UV glue, obtains described micro-nano layer;
Described transparent membrane matrix is bonded on described transparency carrier.
In the another kind of implementation of the embodiment of the present invention, described described transparent membrane matrix to be bonded on described transparency carrier, to comprise:
Optical transparent adhesive is adopted to be bonded on described transparency carrier by described transparent membrane matrix.
In the another kind of implementation of the embodiment of the present invention, describedly on described transparency carrier, cover a micro nano structure layer, comprising:
Coating UV glue on described transparency carrier;
The mode impressed by UV forms described micro-nano pattern on described UV glue, obtains described micro-nano layer.
In the another kind of implementation of the embodiment of the present invention, described method also comprises: for the preparation of the impression block of UV impression.
In the another kind of implementation of the embodiment of the present invention, the described impression block for the preparation of UV impression, comprising:
One substrate is provided;
Photoetching process is adopted to form the photoetching agent pattern of a pattern and the identical figure of described micro-nano pattern on the substrate;
Silver mirror reaction and electroplating technology is adopted to form metallic plate on described photoetching agent pattern surface;
Be separated described metallic plate from described substrate, obtain described impression block.
In the another kind of implementation of the embodiment of the present invention, described transparency carrier is glass substrate, PC substrate, PMMA substrate or PC and PMMA composite substrate.
In the another kind of implementation of the embodiment of the present invention, the thickness of described transparency carrier is 0.2-0.6mm.
In the another kind of implementation of the embodiment of the present invention, described method also comprises:
Described micro nano structure layer covers one deck vacuum coating.
In the another kind of implementation of the embodiment of the present invention, described vacuum coating is at least two kinds of alloy-layers formed in the metal level of a kind of formation in following metal or following metal: Al, Au, Ag, Zn or Ti;
Or described vacuum coating is silicon oxide ceramics film, zinc oxide ceramics film, titanium oxide ceramics film, zinc sulfide ceramic film, nitride ceramics film or carbide ceramics film.
In the another kind of implementation of the embodiment of the present invention, described method also comprises:
Described vacuum coating covers one deck ink layer.
The beneficial effect that the technical scheme that the embodiment of the present invention provides is brought is:
The micro nano structure layer that housing comprises transparency carrier and covers on the transparent substrate, wherein micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition, this micro-nano pattern is made up of micro/nano level groove and boss can present solid, changing pattern, and the micro-structural of micro/nano level size ensure that pattern accuracy is higher, simultaneously because this micro-nano pattern is in the inner side of housing, neither affect user to use, pattern can be avoided again to fade or rete such as to come off at the failure risk.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of housing that the embodiment of the present invention provides;
Fig. 2 is the structural representation of the another kind of housing that the embodiment of the present invention provides;
Fig. 3 is the flow chart of a kind of housing preparation method that the embodiment of the present invention provides;
Fig. 4 is the flow chart of the another kind of housing preparation method that the embodiment of the present invention provides;
Fig. 4 a is the structural representation of housing preparation method in housing preparation process that Fig. 4 provides;
Fig. 4 b is the structural representation of housing preparation method in housing preparation process that Fig. 4 provides;
Fig. 4 c is the structural representation of housing preparation method in housing preparation process that Fig. 4 provides;
Fig. 4 d is the structural representation of housing preparation method in housing preparation process that Fig. 4 provides;
Fig. 4 e is the structural representation of housing preparation method in housing preparation process that Fig. 4 provides;
Fig. 4 A is the structural representation in a kind of impression block preparation process of providing of the embodiment of the present invention;
Fig. 4 B is the structural representation in a kind of impression block preparation process of providing of the embodiment of the present invention;
Fig. 4 C is the structural representation in a kind of impression block preparation process of providing of the embodiment of the present invention;
Fig. 4 D is the structural representation in a kind of impression block preparation process of providing of the embodiment of the present invention;
Fig. 5 is the flow chart of the another kind of housing preparation method that the embodiment of the present invention provides;
Fig. 5 a is the structural representation of housing preparation method in housing preparation process that Fig. 5 provides;
Fig. 5 b is the structural representation of housing preparation method in housing preparation process that Fig. 5 provides;
Fig. 5 c is the structural representation of housing preparation method in housing preparation process that Fig. 5 provides;
Fig. 5 d is the structural representation of housing preparation method in housing preparation process that Fig. 5 provides;
Fig. 5 e is the structural representation of housing preparation method in housing preparation process that Fig. 5 provides;
Fig. 5 f is the structural representation of housing preparation method in housing preparation process that Fig. 5 provides.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
Fig. 1 is the structural representation of a kind of housing that the embodiment of the present invention provides, and housing is applicable to electronic equipment, and see Fig. 1, this housing comprises:
Transparency carrier 100 and the micro nano structure layer 101 covered on transparency carrier 100, micro nano structure layer 101 is located at the side of the electronic component of transparency carrier 100 in electronic equipment, and micro nano structure layer 101 comprises the micro-nano pattern of micro/nano level groove and boss composition.
In embodiments of the present invention, the micro nano structure layer that housing comprises transparency carrier and covers on the transparent substrate, wherein micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition, this micro-nano pattern is made up of micro/nano level groove and boss can present solid, changing pattern, and the micro-structural of micro/nano level size ensure that pattern accuracy is higher, simultaneously because this micro-nano pattern is in the inner side of housing, neither affect user to use, pattern can be avoided again to fade or rete such as to come off at the failure risk.
Wherein, in micro-nano pattern, the shape of boss and groove, the degree of depth and width can need to determine according to actual pattern.The boss of same shape different depth and/or width and groove, can cause different reflection/transmission effects to visible ray, thus realize various abundant appearance, as bijouterie appearance such as embossment, the depth of field, schemochrome, sand crystals.Such as, when micro-nano pattern is a width relief painting, the boss of zones of different and groove are discrepant, groove can have the groove of point-like, strip or jagged groove, boss can have wire or polygon-shaped boss, and the height of difformity boss, width can be variant, the degree of depth, the width of difformity groove also can be variant.
In embodiments of the present invention, micro nano structure layer 101 can be adopted and realize in two ways:
The first, as shown in Figure 1, micro nano structure layer 101 comprises the micro-nano layer 1011 with micro-nano pattern covered on transparency carrier 100;
The second, shown in the structural representation of the another kind of housing provided as Fig. 2, compared with the housing that itself and Fig. 1 provide, only the structure of micro nano structure layer 101 is different, in the housing that Fig. 2 provides, micro nano structure layer 101 comprises the transparent membrane matrix 1010 covered on transparency carrier 100 and the micro-nano layer 1011 with micro-nano pattern covered on transparent membrane matrix 1010.
Wherein, transparent membrane matrix 101 is bonded on transparency carrier 100 by OCA (OpticallyClearAdhesive, Optical transparent adhesive).
In embodiments of the present invention, transparency carrier 100 has certain resistance to wear, is specifically as follows glass substrate, polycarbonate substrate, polymetylmethacrylate substrate or PC and PMMA composite substrate.
In embodiments of the present invention, the thickness of transparency carrier 100 can be 0.2-0.6mm.
Refer again to Fig. 1 or Fig. 2, this housing also comprises vacuum coating 102 and ink layer 103.
Particularly, housing also comprises the vacuum coating 102 covered on micro nano structure layer 101.
Wherein, vacuum coating 102 is at least two kinds of alloy-layers formed in the metal level of a kind of formation in following metal or following metal: Al, Au, Ag, Zn or Ti;
Or vacuum coating 102 is silicon oxide ceramics film, zinc oxide ceramics film, titanium oxide ceramics film, zinc sulfide ceramic film, nitride ceramics film or carbide ceramics film.
Particularly, housing also comprises the ink layer 103 covered on vacuum coating 102.
Fig. 3 is the flow chart of a kind of housing preparation method of the embodiment of the present invention, and the method is for the preparation of the housing shown in Fig. 1 or Fig. 2, and see Fig. 3, method comprises:
Step 301 a: transparency carrier is provided.
Step 302: cover a micro nano structure layer on the transparent substrate, micro nano structure layer is located at the side of the electronic component of transparency carrier in electronic equipment, micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition.
In embodiments of the present invention, the micro nano structure layer that housing comprises transparency carrier and covers on the transparent substrate, wherein micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition, this micro-nano pattern is made up of micro/nano level groove and boss can present solid, changing pattern, and the micro-structural of micro/nano level size ensure that pattern accuracy is higher, simultaneously because this micro-nano pattern is in the inner side of housing, neither affect user to use, pattern can be avoided again to fade or rete such as to come off at the failure risk.
Fig. 4 is the flow chart of the another kind of housing preparation method of the embodiment of the present invention, and the method is for the preparation of the housing shown in Fig. 1, and see Fig. 4, method comprises:
Step 401 a: transparency carrier is provided.
Wherein, transparency carrier has certain resistance to wear, is specifically as follows glass substrate, PC substrate, PMMA substrate or PC and PMMA composite substrate.
Wherein, the thickness of transparency carrier can be 0.2-0.6mm.
Step 402: coating UV glue (without shadow glue) on the transparent substrate.As shown in fig. 4 a, transparency carrier 100 is coated with one deck UV glue 101A.
Step 403: the mode impressed by UV forms micro-nano pattern on UV glue, obtains micro-nano layer.As shown in Fig. 4 b-4d, adopt impression block 200 couples of UV glue 101A to impress, obtain micro-nano layer 1011.
Particularly, impression block is fixed on the roller bearing of Embosser; Then impression block is pressed on UV glue to form micro-nano pattern.
Wherein, in micro-nano pattern, the shape of boss and groove, the degree of depth and width can need to determine according to actual pattern.The boss of same shape different depth and/or width and groove, can cause different reflection/transmission effects to visible ray, thus realize various abundant appearance, as bijouterie appearance such as embossment, the depth of field, schemochrome, sand crystals.Such as, when micro-nano pattern is a width relief painting, the boss of zones of different and groove are discrepant, groove can have the groove of point-like, strip or jagged groove, boss can have wire or polygon-shaped boss, and the height of difformity boss, width can be variant, the degree of depth, the width of difformity groove also can be variant.。
Further, the method also comprises: for the preparation of the impression block of UV impression.
Particularly, for the preparation of the impression block of UV impression, comprising:
Step one a: substrate is provided.Wherein, this substrate can adopt the material that transparency carrier is identical.
Step 2: adopt photoetching process to form the photoetching agent pattern of a pattern figure identical with micro-nano pattern on substrate.Particularly, photoetching process mainly comprises: on substrate, be coated with photoresist, then obtains photoetching agent pattern by steps such as exposure, development and cleanings.Wherein, photoresist thickness is determined according to the degree of depth of micro-nano pattern middle slot, and the degree of depth of groove is generally at 200nm-500nm, and consider follow-up moulding process depth loss, light groove depth can be arranged on 200nm-1000nm, then photoresist thickness is at 500nm-1300nm.As shown in Figure 4 A, substrate 201 is coated with photoresist 202; Etching photoresist 202 obtains the photoetching agent pattern 203 shown in Fig. 4 B.
Wherein, micro-nano pattern needs to calculate in conjunction with optical simulation, the appearance of needs is converted into machinable micro-nano structure design drawing, does not repeat here.
Step 3: adopt silver mirror reaction and electroplating technology to form metallic plate on photoetching agent pattern surface.Particularly, silver mirror reaction is first adopted to cover one deck Ag films on the substrate being formed with photoetching agent pattern, Ag films very thin (such as several nanometer thickness), because substrate and photoresist are all nonconducting, directly cannot electroplate on surface, by silver mirror reaction on substrate electroless deposition Ag films as conductive layer, for subsequent electroplating process is prepared.Then at the electroplating surface layer of Ni metallic plate of Ag films, the thickness of metallic plate is 75um ~ 100um.
As shown in Figure 4 C, the substrate 201 being formed with photoetching agent pattern 203 makes metallic plate, i.e. impression block 200.
Step 4: separating metal plate from substrate, obtains impression block.Particularly, be separated from the interface between Ag films and substrate, this interface binding power itself is bad, then adopts reactive ion etching to remove residual photoresist, namely obtains high-precision impression block.
As shown in Figure 4 D, impression block 200 and the substrate 201 being formed with photoetching agent pattern 203 are separated.
Step 404: cover one deck vacuum coating on micro nano structure layer.See Fig. 4 e, the transparency carrier 100 being formed with micro nano structure layer 1011 forms one deck vacuum coating 102.
Wherein, vacuum coating is at least two kinds of alloy-layers formed in the metal level of a kind of formation in following metal or following metal: Al, Au, Ag, Zn or Ti;
Or vacuum coating is silicon oxide ceramics film, zinc oxide ceramics film, titanium oxide ceramics film, zinc sulfide ceramic film, nitride ceramics film or carbide ceramics film.
Wherein, alloy-layer can be nickel-chrome alloy layer, nickel-vanadium alloy layer, alusil alloy layer or titanium-aluminium alloy layer etc.
Further, vacuum coating adopts PVD technique to realize, and vacuum coating thickness range is at 10nm ~ 50nm.
Step 405: cover one deck ink layer on vacuum coating.Refer again to Fig. 1, vacuum coating 102 is formed one deck ink 103.
Fig. 5 is the flow chart of the another kind of housing preparation method of the embodiment of the present invention, and the method is for the preparation of the housing shown in Fig. 2, and see Fig. 5, method comprises:
Step 501 a: transparency carrier is provided.
Wherein, transparency carrier has certain resistance to wear, is specifically as follows glass substrate, PC substrate, PMMA substrate or PC and PMMA composite substrate.
Wherein, the thickness of transparency carrier can be 0.2-0.6mm.
Step 502: a transparent membrane matrix is provided.
Wherein, film matrix can be PET film.
Step 503: coating UV glue on transparent membrane matrix.
As shown in Figure 5 a, coating UV glue 101A on transparent membrane matrix 1010.
Step 504: the mode impressed by UV forms micro-nano pattern on UV glue, obtains micro-nano layer.As shown in Fig. 5 b-5d, adopt impression block 200 couples of UV glue 101A to impress, obtain micro-nano layer 1011.
Particularly, impression block is fixed on the roller bearing of Embosser; Then Rolltoroll technique is adopted by the micro-nano design transfer on impression block to transparency carrier.Compared to step 403, because impression in the present embodiment carries out on transparent membrane matrix, its rigidity is little compared to transparency carrier, can carry out the processing of mass, thus realize the batch machining of specific appearance effect.
Further, the method also comprises: for the preparation of the impression block of UV impression.
Particularly, the method preparing impression block is here identical with impression block preparation method provided above, repeats no more here.
Step 505: cover one deck vacuum coating on micro nano structure layer.See Fig. 5 e, the transparent membrane matrix 1010 being formed with micro nano structure layer 1011 forms one deck vacuum coating 102.
Wherein, vacuum coating is at least two kinds of alloy-layers formed in the metal level of a kind of formation in following metal or following metal: Al, Au, Ag, Zn or Ti;
Or vacuum coating is silicon oxide ceramics film, zinc oxide ceramics film, titanium oxide ceramics film, zinc sulfide ceramic film, nitride ceramics film or carbide ceramics film.
Wherein, alloy-layer can be nickel-chrome alloy layer, nickel-vanadium alloy layer, alusil alloy layer or titanium-aluminium alloy layer etc.
Further, vacuum coating adopts PVD technique to realize, and vacuum coating thickness range is at 10nm ~ 50nm.
Step 506: transparent membrane matrix is glued on the transparent substrate.
Wherein, step 506 can comprise:
Adopt OCA optical cement to be glued on the transparent substrate by transparent membrane matrix, OCA optical cement thickness can be 25um.During bonding, by finger URL, location hole design, and additional frock etc. increases positioning precision.As shown in figure 5f, the transparent membrane matrix 1010 adopting OCA optical cement 104 step 505 to be obtained bonds with transparency carrier 100.
In embodiments of the present invention, first on micro nano structure layer, cover one deck vacuum coating, and then carry out the laminating of transparent membrane matrix and transparency carrier, in laminating process, vacuum coating can play a protective role to micro nano structure layer.
Certainly, in embodiments of the present invention, first can also perform step 506, then perform step 505.
Step 507: cover one deck ink layer on vacuum coating.Refer again to Fig. 2, vacuum coating 102 is formed one deck ink 103.
Particularly, vacuum coating prints black out ink and baking and curing, obtain ink layer.Ink layer can play the effect of shading and protection.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (20)
1. a housing, described housing is applicable to electronic equipment, it is characterized in that, described housing comprises:
Transparency carrier and the micro nano structure layer covered on described transparency carrier, described micro nano structure layer is located at the side of the electronic component of described transparency carrier in described electronic equipment, and described micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition.
2. housing according to claim 1, is characterized in that, described micro nano structure layer comprises the micro-nano layer with described micro-nano pattern covered on described transparency carrier;
Or described micro nano structure layer comprises the transparent membrane matrix covered on described transparency carrier and the micro-nano layer with described micro-nano pattern covered on described transparent membrane matrix.
3. housing according to claim 2, is characterized in that, described transparent membrane matrix is adhesive on described transparency carrier by optical clear.
4. the housing according to any one of claim 1-3, is characterized in that, described transparency carrier is glass substrate, polycarbonate substrate, polymetylmethacrylate substrate or PC and PMMA composite substrate.
5. the housing according to any one of claim 1-3, is characterized in that, the thickness of described transparency carrier is 0.2-0.6mm.
6. the housing according to any one of claim 1-3, is characterized in that, described housing also comprises the vacuum coating covered on described micro nano structure layer.
7. housing according to claim 6, is characterized in that, described vacuum coating is at least two kinds of alloy-layers formed in the metal level of a kind of formation in following metal or following metal: Al, Au, Ag, Zn or Ti;
Or described vacuum coating is silicon oxide ceramics film, zinc oxide ceramics film, titanium oxide ceramics film, zinc sulfide ceramic film, nitride ceramics film or carbide ceramics film.
8. housing according to claim 6, is characterized in that, described housing also comprises the ink layer covered on described vacuum coating.
9. a housing preparation method, described housing is applicable to electronic equipment, it is characterized in that, described method comprises:
One transparency carrier is provided;
Described transparency carrier covers a micro nano structure layer, and described micro nano structure layer is located at the side of the electronic component of described transparency carrier in described electronic equipment, and described micro nano structure layer is the micro-nano pattern of micro/nano level groove and boss composition.
10. method according to claim 9, is characterized in that, described micro nano structure layer comprises the micro-nano layer with described micro-nano pattern covered on described transparency carrier;
Or described micro nano structure layer comprises the transparent membrane matrix covered on described transparency carrier and the micro-nano layer with described micro-nano pattern covered on described transparent membrane matrix.
11. methods according to claim 10, is characterized in that, describedly on described transparency carrier, cover a micro nano structure layer, comprising:
One transparent membrane matrix is provided;
Coating UV glue on described transparent membrane matrix;
The mode impressed by UV forms described micro-nano pattern on described UV glue, obtains described micro-nano layer;
Described transparent membrane matrix is bonded on described transparency carrier.
12. methods according to claim 11, is characterized in that, are describedly bonded on described transparency carrier by described transparent membrane matrix, comprising:
Optical transparent adhesive is adopted to be bonded on described transparency carrier by described transparent membrane matrix.
13. methods according to claim 10, is characterized in that, describedly on described transparency carrier, cover a micro nano structure layer, comprising:
Coating UV glue on described transparency carrier;
The mode impressed by UV forms described micro-nano pattern on described UV glue, obtains described micro-nano layer.
14. methods according to claim 11 or 13, it is characterized in that, described method also comprises: for the preparation of the impression block of UV impression.
15. methods according to claim 14, is characterized in that, the described impression block for the preparation of UV impression, comprising:
One substrate is provided;
Photoetching process is adopted to form the photoetching agent pattern of a pattern and the identical figure of described micro-nano pattern on the substrate;
Silver mirror reaction and electroplating technology is adopted to form metallic plate on described photoetching agent pattern surface;
Be separated described metallic plate from described substrate, obtain described impression block.
16. methods according to any one of claim 9-13, it is characterized in that, described transparency carrier is glass substrate, PC substrate, PMMA substrate or PC and PMMA composite substrate.
17. methods according to any one of claim 9-13, it is characterized in that, the thickness of described transparency carrier is 0.2-0.6mm.
18. methods according to any one of claim 9-13, it is characterized in that, described method also comprises:
Described micro nano structure layer covers one deck vacuum coating.
19. methods according to claim 18, is characterized in that, described vacuum coating is at least two kinds of alloy-layers formed in the metal level of a kind of formation in following metal or following metal: Al, Au, Ag, Zn or Ti;
Or described vacuum coating is silicon oxide ceramics film, zinc oxide ceramics film, titanium oxide ceramics film, zinc sulfide ceramic film, nitride ceramics film or carbide ceramics film.
20. methods according to claim 18, is characterized in that, described method also comprises:
Described vacuum coating covers one deck ink layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510431436.0A CN105120019A (en) | 2015-07-21 | 2015-07-21 | Shell and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510431436.0A CN105120019A (en) | 2015-07-21 | 2015-07-21 | Shell and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105120019A true CN105120019A (en) | 2015-12-02 |
Family
ID=54667900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510431436.0A Pending CN105120019A (en) | 2015-07-21 | 2015-07-21 | Shell and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105120019A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106976350A (en) * | 2016-01-19 | 2017-07-25 | 瑞宏精密电子（太仓）有限公司 | Imprint sheet material and its method for stamping |
| CN107433815A (en) * | 2016-11-14 | 2017-12-05 | 深圳市信濠精密技术股份有限公司 | A kind of method for reaching touch-screen front shroud decorative effect with UV stamping techniques |
| CN107517556A (en) * | 2017-09-21 | 2017-12-26 | 广东欧珀移动通信有限公司 | Cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN109177644A (en) * | 2018-09-12 | 2019-01-11 | 维沃移动通信有限公司 | Shell preparation method and shell |
| CN109743872A (en) * | 2018-11-06 | 2019-05-10 | 睿惢思工业科技（苏州）有限公司 | A kind of preparation method of electromagnetic shielding film |
| CN110062543A (en) * | 2019-04-15 | 2019-07-26 | Oppo广东移动通信有限公司 | Shell, the electronic equipment of electronic equipment |
| CN110226364A (en) * | 2017-10-13 | 2019-09-10 | 华为技术有限公司 | A kind of high intensity anti-fingerprint glass and preparation method thereof, and high-intensitive anti-fingerprint glass appearance part and preparation method thereof |
| WO2020029575A1 (en) * | 2018-08-10 | 2020-02-13 | 华为技术有限公司 | Housing and mobile terminal |
| CN113630992A (en) * | 2020-05-06 | 2021-11-09 | Oppo广东移动通信有限公司 | Preparation method of film-coated part, shell and electronic equipment |
| WO2023109683A1 (en) * | 2021-12-15 | 2023-06-22 | 比亚迪股份有限公司 | Ceramic panel, housing assembly and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568235A (en) * | 2008-04-25 | 2009-10-28 | 深圳富泰宏精密工业有限公司 | Shell and manufacturing method thereof |
| CN101877946A (en) * | 2009-04-30 | 2010-11-03 | 比亚迪股份有限公司 | Electronic product shell and forming method thereof |
| CN103342583A (en) * | 2013-06-28 | 2013-10-09 | 潮州三环（集团）股份有限公司 | Processing method of high-precision metal patterns on surface of ceramic material product |
| CN103862903A (en) * | 2012-12-11 | 2014-06-18 | 黄北江 | Novel water transfer printing coating film |
| JP2014144641A (en) * | 2012-06-13 | 2014-08-14 | Asahi Kasei E-Materials Corp | Functional transfer body, transfer method of functional layer, packaging object and functional transfer film roll |
-
2015
- 2015-07-21 CN CN201510431436.0A patent/CN105120019A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568235A (en) * | 2008-04-25 | 2009-10-28 | 深圳富泰宏精密工业有限公司 | Shell and manufacturing method thereof |
| CN101877946A (en) * | 2009-04-30 | 2010-11-03 | 比亚迪股份有限公司 | Electronic product shell and forming method thereof |
| JP2014144641A (en) * | 2012-06-13 | 2014-08-14 | Asahi Kasei E-Materials Corp | Functional transfer body, transfer method of functional layer, packaging object and functional transfer film roll |
| CN103862903A (en) * | 2012-12-11 | 2014-06-18 | 黄北江 | Novel water transfer printing coating film |
| CN103342583A (en) * | 2013-06-28 | 2013-10-09 | 潮州三环（集团）股份有限公司 | Processing method of high-precision metal patterns on surface of ceramic material product |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106976350A (en) * | 2016-01-19 | 2017-07-25 | 瑞宏精密电子（太仓）有限公司 | Imprint sheet material and its method for stamping |
| CN107433815A (en) * | 2016-11-14 | 2017-12-05 | 深圳市信濠精密技术股份有限公司 | A kind of method for reaching touch-screen front shroud decorative effect with UV stamping techniques |
| CN107517556A (en) * | 2017-09-21 | 2017-12-26 | 广东欧珀移动通信有限公司 | Cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN110226364A (en) * | 2017-10-13 | 2019-09-10 | 华为技术有限公司 | A kind of high intensity anti-fingerprint glass and preparation method thereof, and high-intensitive anti-fingerprint glass appearance part and preparation method thereof |
| WO2020029575A1 (en) * | 2018-08-10 | 2020-02-13 | 华为技术有限公司 | Housing and mobile terminal |
| US11825614B2 (en) | 2018-08-10 | 2023-11-21 | Huawei Technologies Co., Ltd. | Housing and mobile terminal |
| CN110830609A (en) * | 2018-08-10 | 2020-02-21 | 华为技术有限公司 | Shell and mobile terminal |
| CN109177644A (en) * | 2018-09-12 | 2019-01-11 | 维沃移动通信有限公司 | Shell preparation method and shell |
| CN109743872A (en) * | 2018-11-06 | 2019-05-10 | 睿惢思工业科技（苏州）有限公司 | A kind of preparation method of electromagnetic shielding film |
| CN110062543A (en) * | 2019-04-15 | 2019-07-26 | Oppo广东移动通信有限公司 | Shell, the electronic equipment of electronic equipment |
| CN113630992A (en) * | 2020-05-06 | 2021-11-09 | Oppo广东移动通信有限公司 | Preparation method of film-coated part, shell and electronic equipment |
| CN113630992B (en) * | 2020-05-06 | 2023-11-07 | Oppo广东移动通信有限公司 | Preparation method of coated part, shell and electronic equipment |
| WO2023109683A1 (en) * | 2021-12-15 | 2023-06-22 | 比亚迪股份有限公司 | Ceramic panel, housing assembly and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105120019A (en) | Shell and preparation method thereof | |
| CN110475440B (en) | Shell, preparation method thereof and electronic equipment | |
| CN105723817A (en) | Flexible printed circuit board and method for manufacturing same | |
| JP6665781B2 (en) | Housing parts, electronic equipment, and manufacturing method of housing parts | |
| CN106893132B (en) | A kind of organic cambered shell processing method and organic cambered shell | |
| CN107433815B (en) | Method for achieving decoration effect of front cover plate of touch screen by using UV (ultraviolet) imprinting technology | |
| CN110446380B (en) | Diaphragm manufacturing method, shell and intelligent terminal | |
| CN107248618A (en) | Shell production method after decorative membrance, rear shell, terminal and terminal | |
| CN109788693B (en) | Preparation method of cover plate for electronic equipment, battery cover plate and electronic equipment | |
| KR101350428B1 (en) | Display unit for touch screen and method of manufacturing thereof | |
| JP2010141311A (en) | Housing for electronic device, and method of manufacturing the same | |
| EP4020944A1 (en) | Camera module and electronic device | |
| KR101699412B1 (en) | Metal card and method of manufacturing metal card method therefor | |
| CN211591601U (en) | Texture glass cover plate | |
| KR20170113929A (en) | manufacturing method of art cover glass and art cover glass thereby | |
| WO2021136079A1 (en) | Curved glass cover plate and preparation method therefor and terminal | |
| CN209854045U (en) | Gradually-changed color decoration film | |
| CN111347816A (en) | Metal structural member, electronic device, and method for manufacturing metal structural member | |
| CN102843447A (en) | Mobile phone and manufacturing method of surface decorative layer of appearance piece thereof | |
| CN211457614U (en) | Shell assembly and electronic equipment | |
| TWI719313B (en) | Method for manufacturing housing and housing manufactured thereof | |
| CN106274216A (en) | Decoration and preparation method thereof | |
| CN114173518A (en) | Middle frame of electronic equipment, preparation method of middle frame and electronic equipment | |
| WO2020238358A1 (en) | Manufacturing method for explosion-proof mobile phone glass back cover, and glass back cover | |
| CN111873578A (en) | Intelligent household half-lens surface control panel and corresponding manufacturing process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151202 |