CN103337588B - Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter - Google Patents
Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter Download PDFInfo
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- CN103337588B CN103337588B CN201310285081.XA CN201310285081A CN103337588B CN 103337588 B CN103337588 B CN 103337588B CN 201310285081 A CN201310285081 A CN 201310285081A CN 103337588 B CN103337588 B CN 103337588B
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- electrode
- bottom electrode
- piezoelectric
- lead
- wire
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- 238000000034 method Methods 0.000 title abstract description 11
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 239000004332 silver Substances 0.000 claims abstract description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000002955 isolation Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- 229920002472 Starch Polymers 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 230000003252 repetitive effect Effects 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000007772 electrode material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 238000001039 wet etching Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 abstract 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 abstract 1
- 238000010297 mechanical methods and process Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000004537 pulping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses a piezoelectric exciter with a single-sided lead wire structure, which comprises a piezoelectric patch, and electrodes and electrode lead wires which are bonded on the upper surface and the lower surface of the piezoelectric patch, wherein the original upper electrode is divided into two asymmetric electrodes; the larger one forms an upper working electrode; the smaller one is communicated with the original lower electrode by silver paste to form a lower lead wire electrode; and the piezoelectric exciter is located on the lower surface of a vibrating membrane. The invention further discloses a fabrication method of the piezoelectric exciter, which comprises the steps that the upper electrode is divided into the two asymmetric electrodes by wet etching; the piezoelectric patch is bonded with a silicon wafer together; the piezoelectric patch is thinned by a chemical mechanical method; the lower electrode is deposited on the lower surface of the piezoelectric patch by adopting a low-pressure chemical vapor deposition method; the smaller electrode divided by the upper electrode is communicated with the original lower electrode by the silver paste to form the lower lead wire electrode; and the lead wires are welded on the upper and lower electrodes. The upper and lower electrode lead wires are in the same fixed plane, so that the problems that the electrodes are short-circuit and the lead wires drop during periodic vibration of the membrane are solved, and the reliability of a piezoelectric synthetic jet device is improved.
Description
Technical field
The present invention relates to a kind of piezoelectric actuator with one side pin configuration, also relate to the manufacture method of this piezoelectric actuator.
Background technology
Piezoelectric excitation is type of drive common in MEMS.Some piezoelectric actuators of current appearance, are upper and lower surfaces upper/lower electrode being attached at respectively piezoelectric patches, then are welded on respectively on upper/lower electrode by lead-in wire.Piezoelectric actuator is bonded on flexible sheet, and by lead-in wire to top electrode and bottom electrode loading cycle voltage signal, piezoelectric patches produces periodic longitudinal distortion, drives diaphragm vibration, completes driving.But because the feature of MEMS processing technology and device can make bottom electrode lead-in wire occur the situation of upper/lower electrode short circuit because diaphragm periodic vibration touches top electrode, or the bottom electrode lead-in wire of suspension comes off because of diaphragm periodic vibration.
With reference to Fig. 3.Document " patent No. is Chinese patent piezoelectric combining jet device of 200710018045.1 and preparation method thereof " discloses a kind of combining jet device adopting piezoelectric excitation, this combining jet device adopts MEMS lithographic technique on silicon substrate, process cavity 7 and spout 1 structure of combining jet device, by bonding method, silica-based cover plate 2 and silicon substrate 3 are assembled again, complete device fabrication.This technology obtains a millimeter micro jet for magnitude size, but be welded on upper/lower electrode respectively owing to going between in its piezoelectric actuator, when combining jet device works, the lead-in wire of bottom electrode easily contacts with top electrode and causes short circuit in vibration processes, or the bottom electrode lead-in wire of suspension comes off because of diaphragm periodic vibration.
Summary of the invention
In order to overcome the easy short circuit of upper/lower electrode in existing piezoelectric actuator, bottom electrode lead-in wire holds caducous deficiency, the invention provides and a kind ofly has piezoelectric actuator of one side pin configuration and preparation method thereof.
The technical solution adopted in the present invention: a kind of piezoelectric actuator with one side pin configuration, comprises top electrode, piezoelectric patches 6 and bottom electrode 8 successively; Top electrode and adhering object to be driven, top electrode is isolated groove and is divided into separate operative power pole 4 and lead-in wire bottom electrode 10; Lead-in wire bottom electrode 10 starches 11 conductings with bottom electrode 8 by the silver applied; Going between 5 for operative power pole 4 on-load voltage by the top electrode be welded on operative power pole 4, is bottom electrode 10 on-load voltage by the bottom electrode lead-in wire 9 be welded on lead-in wire bottom electrode 10.
In order to avoid the destruction of silver slurry coating to object to be driven, ensure that isolation channel is sealed to avoid silver slurry to enter by piezoelectric patches 6.
In order to cause bottom electrode 8 to touch top electrode and short circuit when etching top electrode and avoid bottom electrode 8 identical with piezoelectric patches 6 area, the appearance profile therefore designing piezoelectric patches 6 is contained within top electrode, and the appearance profile of bottom electrode 8 is contained within piezoelectric patches 6.
Described piezoelectric actuator horizontal cross sectional geometry is square, rectangle or circle.
Described upper and lower electrode material is silver, also can be platinum or other metal.
Described contact conductor material is aluminium, also can adopt gold, copper or other metal.
There is a preparation method for the piezoelectric actuator of one side pin configuration, comprise the steps:
Step 1: etch isolation channel at the top electrode of piezoelectric patches 6, is divided into separate operative power pole 4 and lead-in wire bottom electrode 10 by top electrode;
Step 2: by top electrode together with comprising the adhering object of structure to be driven;
Step 3; Thinning piezoelectric patches 6;
Step 4; At the lower surface deposition bottom electrode 8 of piezoelectric patches;
Step 5; Graphical bottom electrode 8 and piezoelectric patches 6;
Step 6; Lead-in wire bottom electrode 10 and bottom electrode 8 are starched 11 conductings by the silver of coating;
Step 7; Repetitive in the integral device obtained after bonding is divided into small pieces;
Step 8: be welded on operative power pole 4 by top electrode lead-in wire 5, is welded on bottom electrode lead-in wire 9 on lead-in wire bottom electrode 10.
The invention has the beneficial effects as follows: by isolation channel, original top electrode is divided into independently operative power pole 4 and lead-in wire bottom electrode 10, operative power pole 4 wherein forms new top electrode, and wherein less lead-in wire bottom electrode 10 is formed new bottom electrode by silver slurry 11 with bottom electrode 8 conducting.By operative power pole 4 and lead-in wire bottom electrode 10 respectively to upper and lower electrode on-load voltage, because operative power pole 4 and lead-in wire bottom electrode 10 be directly attached at comprise structure to be driven object on, so make the wire bonds of upper/lower electrode like this on same fixed pan, avoiding bottom electrode to go between directly is welded on the bottom electrode 8 of suspension, solve bottom electrode wire contacts that diaphragm occurs in periodic vibration process makes electric pole short circuit problem to top electrode, the bottom electrode suspended can be avoided simultaneously to go between situation about coming off because of diaphragm periodic vibration.
Below in conjunction with drawings and Examples, the present invention is elaborated.
Accompanying drawing explanation
Fig. 1 is the structural representation that the piezoelectric actuator in embodiment with one side pin configuration is installed on combining jet device.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is prior art piezoelectric combining jet device structural representation.
In figure, 1-spout, the silica-based cover plate of 2-, 3-silicon substrate, 4-operative power pole, 5-top electrode goes between, 6-piezoelectric patches, 7-cavity, 8-bottom electrode, and 9-bottom electrode goes between, and 10-go between bottom electrode, and 11-silver is starched.
Embodiment
The present embodiment is drive unit is a combining jet device with the piezoelectric actuator of one side pin configuration.
Combining jet device is one of important device in flowing control field, it adopts the type of drive such as piezoelectricity, electrostatic or electromagnetism to make its flexible sheet produce mounting vibration, thus cause the cyclic variation of cavity volume, thus ambient atmos constantly sucked by spout and discharge cavity, producing synthesis type jet when not needing extra source of the gas, realizing the ACTIVE CONTROL in flow field.Driving type piezoelectric actuator combining jet device has that structure is simple, working band is wide, the response feature such as fast rapidly, is current most study, application prospect the most a kind of combining jet device.
With reference to Fig. 1, Fig. 2.In the present embodiment, drive unit is the combining jet device of the piezoelectric actuator with one side pin configuration, silicon substrate 3 is etched with cavity 7, silicon substrate 3 upper surface and silica-based cover plate 2 bonding, and silica-based cover plate 2 has spout 1 that cavity 7 is in communication with the outside; The non-through part of silicon substrate 3 upper cavity 7 forms the piezoelectric actuator with one side pin configuration and is positioned at below diaphragm; The described piezoelectric actuator with one side pin configuration comprises top electrode, piezoelectric patches and bottom electrode successively; Described top electrode is isolated groove and is divided into separate operative power pole 4 and lead-in wire bottom electrode 10, and top electrode is bonding with vibrating diaphragm; Lead-in wire bottom electrode 10 starches 11 conductings with bottom electrode 8 by the silver applied; Going between 5 for operative power pole 4 on-load voltage by the top electrode be welded on operative power pole 4, is bottom electrode 10 on-load voltage that goes between by the bottom electrode lead-in wire 9 be welded on lead-in wire bottom electrode 10; Isolation channel is avoided silver slurry to enter by piezoelectric patches 6 sealing.
In the present embodiment, a kind of piezoelectric actuator manufacture method with one side pin configuration is as follows:
Step 1: form mask in the top electrode photoetching of piezoelectric patches 6, wet etching goes out isolation channel, is divided into separate operative power pole 4 and lead-in wire bottom electrode 10 by top electrode;
Step 2: top electrode and combining jet device vibrating diaphragm are bonded together;
Step 3; Adopt the thinning piezoelectric patches 6 of chemical mechanical pulping;
Step 4; At the lower surface deposition bottom electrode 8 of piezoelectric patches;
Step 5; Adopt the graphical bottom electrode 8 of method and the piezoelectric patches 6 of wet etching;
Step 6; Lead-in wire bottom electrode 10 and bottom electrode 8 are starched 11 conductings by the silver of coating;
Step 7; By the piezoelectric patches after bonding and wafer dicing, obtain the device of repetitive;
Step 8: be welded on operative power pole 4 by top electrode lead-in wire 5, is welded on bottom electrode lead-in wire 9 on lead-in wire bottom electrode 10.
Claims (7)
1. there is a piezoelectric actuator for one side pin configuration, comprise top electrode, piezoelectric patches (6) and bottom electrode (8); Top electrode and adhering object to be driven, is characterized in that: described top electrode is isolated groove and is divided into separate operative power pole (4) and lead-in wire bottom electrode (10); Lead-in wire bottom electrode (10) starches (11) conducting with bottom electrode (8) by the silver applied; Being operative power pole (4) on-load voltage by top electrode lead-in wire (5) be welded on operative power pole (4), is bottom electrode (10) on-load voltage by bottom electrode lead-in wire (9) be welded on lead-in wire bottom electrode (10).
2. there is a piezoelectric actuator for one side pin configuration as claimed in claim 1, it is characterized in that: the isolation channel on described top electrode is sealed by piezoelectric patches (6).
3. one kind has the piezoelectric actuator of one side pin configuration as claimed in claim 1, it is characterized in that: the appearance profile of described piezoelectric patches (6) is less than top electrode appearance profile, the appearance profile of bottom electrode (8) is less than piezoelectric patches (6) appearance profile.
4. there is a piezoelectric actuator for one side pin configuration as claimed in claim 1, it is characterized in that: described piezoelectric actuator horizontal cross sectional geometry is rectangle or circle.
5. there is a piezoelectric actuator for one side pin configuration as claimed in claim 1, it is characterized in that: described upper and lower electrode material is silver or platinum.
6. there is a piezoelectric actuator for one side pin configuration as claimed in claim 1, it is characterized in that: described contact conductor material is aluminium or golden or copper.
7., as a preparation method with the piezoelectric actuator of one side pin configuration of one of claim 1-6, comprise the steps:
Step 1: etch isolation channel at the top electrode of piezoelectric patches (6), is divided into separate operative power pole (4) and lead-in wire bottom electrode (10) by top electrode;
Step 2: by top electrode together with comprising the adhering object of structure to be driven;
Step 3; Thinning piezoelectric patches (6);
Step 4; At lower surface deposition bottom electrode (8) of piezoelectric patches;
Step 5; Graphical bottom electrode (8) and piezoelectric patches (6);
Step 6; To be gone between bottom electrode (10) and bottom electrode 8 silver slurry (11) conducting by applying;
Step 7; Repetitive in the integral device obtained after bonding is divided into small pieces;
Step 8: be welded on operative power pole (4) by top electrode lead-in wire (5), is welded on bottom electrode lead-in wire (9) on lead-in wire bottom electrode (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310285081.XA CN103337588B (en) | 2013-07-08 | 2013-07-08 | Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310285081.XA CN103337588B (en) | 2013-07-08 | 2013-07-08 | Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter |
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| CN103337588A CN103337588A (en) | 2013-10-02 |
| CN103337588B true CN103337588B (en) | 2015-07-08 |
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| CN105872894B (en) * | 2016-03-24 | 2019-03-26 | 中北大学 | A kind of the sound lining and control method of the double working modes inhibited for broadband noise |
| CN107575417A (en) * | 2017-07-24 | 2018-01-12 | 西北工业大学 | A kind of axial flow compressor treated casing device based on synthesizing jet-flow |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6604431B1 (en) * | 1999-09-29 | 2003-08-12 | International Business Machines Corporation | Apparatus and method for fixing and checking connections of piezoelectric sensor, actuator, and disk unit |
| CN101047364A (en) * | 2006-03-30 | 2007-10-03 | 株式会社大真空 | Piezodectric vibration device |
| CN102601009A (en) * | 2012-03-21 | 2012-07-25 | 西北工业大学 | Silicon-based miniature side nozzle synthetic jet device and method for manufacturing same |
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2013
- 2013-07-08 CN CN201310285081.XA patent/CN103337588B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6604431B1 (en) * | 1999-09-29 | 2003-08-12 | International Business Machines Corporation | Apparatus and method for fixing and checking connections of piezoelectric sensor, actuator, and disk unit |
| CN101047364A (en) * | 2006-03-30 | 2007-10-03 | 株式会社大真空 | Piezodectric vibration device |
| CN102601009A (en) * | 2012-03-21 | 2012-07-25 | 西北工业大学 | Silicon-based miniature side nozzle synthetic jet device and method for manufacturing same |
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| CN103337588A (en) | 2013-10-02 |
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Granted publication date: 20150708 |