CN103337588A - Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter - Google Patents
Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter Download PDFInfo
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- CN103337588A CN103337588A CN201310285081XA CN201310285081A CN103337588A CN 103337588 A CN103337588 A CN 103337588A CN 201310285081X A CN201310285081X A CN 201310285081XA CN 201310285081 A CN201310285081 A CN 201310285081A CN 103337588 A CN103337588 A CN 103337588A
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- electrode
- bottom electrode
- piezoelectric
- lead
- top electrode
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- 238000000034 method Methods 0.000 title abstract description 11
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 239000004332 silver Substances 0.000 claims abstract description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000002955 isolation Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 230000003252 repetitive effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000007772 electrode material Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 238000001039 wet etching Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 abstract 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 abstract 1
- 238000010297 mechanical methods and process Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004537 pulping Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses a piezoelectric exciter with a single-sided lead wire structure, which comprises a piezoelectric patch, and electrodes and electrode lead wires which are bonded on the upper surface and the lower surface of the piezoelectric patch, wherein the original upper electrode is divided into two asymmetric electrodes; the larger one forms an upper working electrode; the smaller one is communicated with the original lower electrode by silver paste to form a lower lead wire electrode; and the piezoelectric exciter is located on the lower surface of a vibrating membrane. The invention further discloses a fabrication method of the piezoelectric exciter, which comprises the steps that the upper electrode is divided into the two asymmetric electrodes by wet etching; the piezoelectric patch is bonded with a silicon wafer together; the piezoelectric patch is thinned by a chemical mechanical method; the lower electrode is deposited on the lower surface of the piezoelectric patch by adopting a low-pressure chemical vapor deposition method; the smaller electrode divided by the upper electrode is communicated with the original lower electrode by the silver paste to form the lower lead wire electrode; and the lead wires are welded on the upper and lower electrodes. The upper and lower electrode lead wires are in the same fixed plane, so that the problems that the electrodes are short-circuit and the lead wires drop during periodic vibration of the membrane are solved, and the reliability of a piezoelectric synthetic jet device is improved.
Description
Technical field
The present invention relates to a kind of piezoelectric actuator with single face pin configuration, also relate to the manufacture method of this piezoelectric actuator.
Background technology
Piezoelectric excitation is type of drive common among the MEMS.Some piezoelectric actuators that occur are the upper and lower surfaces that upper/lower electrode are attached at piezoelectric patches respectively at present, and will go between is welded on the upper/lower electrode respectively again.Piezoelectric actuator is bonded on the flexible sheet, and to top electrode and bottom electrode loading cycle voltage signal, piezoelectric patches produces the periodic longitudinal distortion by lead-in wire, drives the diaphragm vibration, finishes driving.But because the characteristics of MEMS processing technology and device can make the bottom electrode lead-in wire touch the situation that the upper/lower electrode short circuit appears in top electrode because of diaphragm periodic vibration, the bottom electrode lead-in wire that perhaps suspends comes off because of diaphragm periodic vibration.
With reference to Fig. 3.Document " patent No. is Chinese patent piezoelectric combining jet device of 200710018045.1 and preparation method thereof " discloses a kind of combining jet device that adopts piezoelectric excitation, this combining jet device adopts the MEMS lithographic technique to process cavity 7 and spout 1 structure of combining jet device at silicon substrate, with bonding method silica-based cover plate 2 and silicon substrate 3 are assembled again, finish device fabrication.This technology has obtained the miniature jet device of millimeter magnitude size, but because lead-in wire is welded on the upper/lower electrode respectively in its piezoelectric actuator, the lead-in wire of bottom electrode contacts with top electrode easily in vibration processes and causes short circuit when combining jet device is worked, and the bottom electrode lead-in wire that perhaps suspends comes off because of diaphragm periodic vibration.
Summary of the invention
In order to overcome the deficiency that the easy short circuit of upper/lower electrode in the existing piezoelectric actuator, bottom electrode lead-in wire come off easily, the invention provides a kind of piezoelectric actuator with single face pin configuration and preparation method thereof.
The technical solution adopted in the present invention: a kind of piezoelectric actuator with single face pin configuration comprises top electrode, piezoelectric patches 6 and bottom electrode 8 successively; Top electrode and adhering object to be driven, top electrode is divided into separate work top electrode 4 and lead-in wire bottom electrode 10 by isolation channel; Lead-in wire bottom electrode 10 is starched 11 conductings with bottom electrode 8 by the silver of coating; Be work top electrode 4 on-load voltages by the top electrode lead-in wire 5 that is welded on the work top electrode 4, be bottom electrode 10 on-load voltages by the bottom electrode lead-in wire 9 that is welded on the lead-in wire bottom electrode 10.
For fear of the destruction of silver slurry coating to object to be driven, guarantee that isolation channel is sealed to avoid the silver slurry to enter by piezoelectric patches 6.
Described piezoelectric actuator horizontal cross sectional geometry is square, rectangle or circle.
Described upper and lower electrode material is silver, also can be platinum or other metal.
Described contact conductor material is aluminium, also can adopt gold, copper or other metal.
A kind of preparation method with piezoelectric actuator of single face pin configuration comprises the steps:
Step 1: the top electrode at piezoelectric patches 6 etches isolation channel, and top electrode is divided into separate work top electrode 4 and lead-in wire bottom electrode 10;
Step 2: with top electrode and the adhering object that comprises structure to be driven together;
Step 3; Attenuate piezoelectric patches 6;
Step 4; Lower surface deposition bottom electrode 8 at piezoelectric patches;
Step 5; Graphical bottom electrode 8 and piezoelectric patches 6;
Step 8: top electrode lead-in wire 5 is welded on the work top electrode 4, bottom electrode lead-in wire 9 is welded on the lead-in wire bottom electrode 10.
The invention has the beneficial effects as follows: by isolation channel original top electrode is divided into independently work top electrode 4 and lead-in wire bottom electrode 10, work top electrode 4 wherein forms new top electrode, and wherein less lead-in wire bottom electrode 10 is constituted new bottom electrode by silver slurry 11 and bottom electrode 8 conductings.By work top electrode 4 and lead-in wire bottom electrode 10 respectively to upper and lower electrode on-load voltage, because work top electrode 4 and lead-in wire bottom electrode 10 directly are attached on the object that comprises structure to be driven, so make the wire bonds of upper/lower electrode like this on same fixed pan, avoid the bottom electrode lead-in wire directly to be welded on the bottom electrode 8 that suspends, solved that bottom electrode lead-in wire that diaphragm occurs touches top electrode and the problem that makes electric pole short circuit in the periodic vibration process, the situation that the bottom electrode lead-in wire that can avoid simultaneously suspending comes off because of the diaphragm periodic vibration.
Below in conjunction with drawings and Examples the present invention is elaborated.
Description of drawings
Fig. 1 is the structural representation that the piezoelectric actuator that has the single face pin configuration among the embodiment is installed on combining jet device.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is prior art piezoelectric combining jet device structural representation.
Among the figure, 1-spout, the silica-based cover plate of 2-, 3-silicon substrate, the 4-top electrode of working, 5-top electrode lead-in wire, 6-piezoelectric patches, 7-cavity, 8-bottom electrode, 9-bottom electrode lead-in wire, the 10-bottom electrode that go between, 11-silver is starched.
Embodiment
Present embodiment is that drive unit is a combining jet device with piezoelectric actuator of single face pin configuration.
Combining jet device is one of device important in the mobile control field, it adopts type of drive such as piezoelectricity, static or electromagnetism to make its flexible sheet produce the vibration that suspends, thereby cause the cyclic variation of cavity volume, thus ambient atmos is constantly sucked and discharges cavity by spout, under the situation that does not need extra source of the gas, produce the synthesis type jet, realize the ACTIVE CONTROL in flow field.That the driving type piezoelectric actuator combining jet device has is simple in structure, working band is wide, response characteristics such as fast rapidly, be research at present at most, application prospect the most a kind of combining jet device.
With reference to Fig. 1, Fig. 2.Drive unit is the combining jet device with piezoelectric actuator of single face pin configuration in the present embodiment, is etched with cavity 7 on the silicon substrate 3, silicon substrate 3 upper surfaces and silica-based cover plate 2 bondings, and silica-based cover plate 2 has spout 1 to make cavity 7 be in communication with the outside; Silicon substrate 3 upper cavities 7 non-through parts form the piezoelectric actuator with single face pin configuration and are positioned at the diaphragm below; Described piezoelectric actuator with single face pin configuration comprises top electrode, piezoelectric patches and bottom electrode successively; Described top electrode is divided into separate work top electrode 4 and lead-in wire bottom electrode 10 by isolation channel, and top electrode and vibrating diaphragm are bonding; Lead-in wire bottom electrode 10 is starched 11 conductings with bottom electrode 8 by the silver of coating; Be work top electrode 4 on-load voltages by the top electrode lead-in wire 5 that is welded on the work top electrode 4, be lead-in wire bottom electrode 10 on-load voltages by the bottom electrode lead-in wire 9 that is welded on the lead-in wire bottom electrode 10; Isolation channel is avoided the silver slurry to enter by piezoelectric patches 6 sealings.
A kind of piezoelectric actuator manufacture method with single face pin configuration is as follows in the present embodiment:
Step 1: the top electrode photoetching at piezoelectric patches 6 forms mask, and wet etching goes out isolation channel, and top electrode is divided into separate work top electrode 4 and lead-in wire bottom electrode 10;
Step 2: top electrode and combining jet device vibrating diaphragm are bonded together;
Step 3; Adopt chemical mechanical pulping attenuate piezoelectric patches 6;
Step 4; Lower surface deposition bottom electrode 8 at piezoelectric patches;
Step 5; Adopt the graphical bottom electrode 8 of method and the piezoelectric patches 6 of wet etching;
Step 8: top electrode lead-in wire 5 is welded on the work top electrode 4, bottom electrode lead-in wire 9 is welded on the lead-in wire bottom electrode 10.
Claims (7)
1. the piezoelectric actuator with single face pin configuration comprises top electrode, piezoelectric patches (6) and bottom electrode (8) successively; Top electrode and adhering object to be driven is characterized in that: described top electrode is divided into separate work top electrode (4) and lead-in wire bottom electrode (10) by isolation channel; Lead-in wire bottom electrode (10) and bottom electrode (8) silver slurry (11) conducting by coating; Be work top electrode (4) on-load voltage by the top electrode lead-in wire (5) that is welded on the work top electrode (4), be bottom electrode (10) on-load voltage by the bottom electrode lead-in wire (9) that is welded on the lead-in wire bottom electrode (10).
2. piezoelectric actuator with single face pin configuration as claimed in claim 1, it is characterized in that: the isolation channel on the described top electrode is sealed by piezoelectric patches (6).
3. piezoelectric actuator with single face pin configuration as claimed in claim 1, it is characterized in that: the appearance profile of described piezoelectric patches (6) is contained within the top electrode, and the appearance profile of bottom electrode (8) is contained within the piezoelectric patches (6).
4. piezoelectric actuator with single face pin configuration as claimed in claim 1 is characterized in that: described piezoelectric actuator horizontal cross sectional geometry is square, rectangle or circle.
5. piezoelectric actuator with single face pin configuration as claimed in claim 1 is characterized in that: described upper and lower electrode material is silver, platinum or other metal.
6. piezoelectric actuator with single face pin configuration as claimed in claim 1, it is characterized in that: described contact conductor material is aluminium, gold, copper or other metal.
7. the preparation method as the piezoelectric actuator with single face pin configuration of one of claim 1-6 comprises the steps:
Step 1: the top electrode at piezoelectric patches (6) etches isolation channel, and top electrode is divided into separate work top electrode (4) and lead-in wire bottom electrode (10);
Step 2: with top electrode and the adhering object that comprises structure to be driven together;
Step 3; Attenuate piezoelectric patches (6);
Step 4; Lower surface deposition bottom electrode (8) at piezoelectric patches;
Step 5; Graphical bottom electrode (8) and piezoelectric patches (6);
Step 6; Silver slurry (11) conducting by coating of bottom electrode (10) and bottom electrode 8 will go between;
Step 7; Repetitive on the integral device that obtains after bonding is divided into small pieces;
Step 8: top electrode lead-in wire (5) is welded on the work top electrode (4), bottom electrode lead-in wire (9) is welded on the lead-in wire bottom electrode (10).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310285081.XA CN103337588B (en) | 2013-07-08 | 2013-07-08 | Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310285081.XA CN103337588B (en) | 2013-07-08 | 2013-07-08 | Piezoelectric exciter with single-sided lead wire structure, and fabrication method of piezoelectric exciter |
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| Publication Number | Publication Date |
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| CN103337588A true CN103337588A (en) | 2013-10-02 |
| CN103337588B CN103337588B (en) | 2015-07-08 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105872894A (en) * | 2016-03-24 | 2016-08-17 | 中北大学 | Double-working mode acoustic liner for broadband noise suppression and control method |
| CN107575417A (en) * | 2017-07-24 | 2018-01-12 | 西北工业大学 | A kind of axial flow compressor treated casing device based on synthesizing jet-flow |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6604431B1 (en) * | 1999-09-29 | 2003-08-12 | International Business Machines Corporation | Apparatus and method for fixing and checking connections of piezoelectric sensor, actuator, and disk unit |
| CN101047364A (en) * | 2006-03-30 | 2007-10-03 | 株式会社大真空 | Piezodectric vibration device |
| CN102601009A (en) * | 2012-03-21 | 2012-07-25 | 西北工业大学 | Silicon-based miniature side nozzle synthetic jet device and method for manufacturing same |
-
2013
- 2013-07-08 CN CN201310285081.XA patent/CN103337588B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6604431B1 (en) * | 1999-09-29 | 2003-08-12 | International Business Machines Corporation | Apparatus and method for fixing and checking connections of piezoelectric sensor, actuator, and disk unit |
| CN101047364A (en) * | 2006-03-30 | 2007-10-03 | 株式会社大真空 | Piezodectric vibration device |
| CN102601009A (en) * | 2012-03-21 | 2012-07-25 | 西北工业大学 | Silicon-based miniature side nozzle synthetic jet device and method for manufacturing same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105872894A (en) * | 2016-03-24 | 2016-08-17 | 中北大学 | Double-working mode acoustic liner for broadband noise suppression and control method |
| CN105872894B (en) * | 2016-03-24 | 2019-03-26 | 中北大学 | A kind of the sound lining and control method of the double working modes inhibited for broadband noise |
| CN107575417A (en) * | 2017-07-24 | 2018-01-12 | 西北工业大学 | A kind of axial flow compressor treated casing device based on synthesizing jet-flow |
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| CN103337588B (en) | 2015-07-08 |
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