CN103333387B - 一种高密度聚乙烯为主料的ptc高分子导电材料及其制备方法 - Google Patents
一种高密度聚乙烯为主料的ptc高分子导电材料及其制备方法 Download PDFInfo
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- CN103333387B CN103333387B CN201310206245.5A CN201310206245A CN103333387B CN 103333387 B CN103333387 B CN 103333387B CN 201310206245 A CN201310206245 A CN 201310206245A CN 103333387 B CN103333387 B CN 103333387B
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- Prior art keywords
- hdpe
- density polyethylene
- high density
- ptc
- major ingredient
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- 229920001903 high density polyethylene Polymers 0.000 title claims abstract description 42
- 239000004700 high-density polyethylene Substances 0.000 title claims abstract description 42
- 239000004020 conductor Substances 0.000 title claims abstract description 16
- 239000004615 ingredient Substances 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000000843 powder Substances 0.000 claims abstract description 14
- 229910052624 sepiolite Inorganic materials 0.000 claims abstract description 14
- 235000019355 sepiolite Nutrition 0.000 claims abstract description 14
- 235000002918 Fraxinus excelsior Nutrition 0.000 claims abstract description 11
- 239000002956 ash Substances 0.000 claims abstract description 11
- 239000010902 straw Substances 0.000 claims abstract description 11
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 8
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 8
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 claims abstract description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims abstract description 6
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 claims abstract description 6
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002270 dispersing agent Substances 0.000 claims abstract description 6
- 239000004113 Sepiolite Substances 0.000 claims abstract description 5
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 claims description 6
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229940056319 ferrosoferric oxide Drugs 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- KOVKEDGZABFDPF-UHFFFAOYSA-N n-(triethoxysilylmethyl)aniline Chemical compound CCO[Si](OCC)(OCC)CNC1=CC=CC=C1 KOVKEDGZABFDPF-UHFFFAOYSA-N 0.000 claims description 3
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 3
- 239000000945 filler Substances 0.000 abstract description 2
- 230000006641 stabilisation Effects 0.000 abstract description 2
- 238000011105 stabilization Methods 0.000 abstract description 2
- 230000035882 stress Effects 0.000 description 4
- 238000005485 electric heating Methods 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
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CN201310206245.5A CN103333387B (zh) | 2013-05-29 | 2013-05-29 | 一种高密度聚乙烯为主料的ptc高分子导电材料及其制备方法 |
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CN201310206245.5A CN103333387B (zh) | 2013-05-29 | 2013-05-29 | 一种高密度聚乙烯为主料的ptc高分子导电材料及其制备方法 |
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CN103333387A CN103333387A (zh) | 2013-10-02 |
CN103333387B true CN103333387B (zh) | 2016-08-10 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1581371A (zh) * | 2003-08-15 | 2005-02-16 | 比亚迪股份有限公司 | 一种热敏电阻材料及含该材料的热敏电阻器的制造方法 |
CN101367973A (zh) * | 2008-10-09 | 2009-02-18 | 上海交通大学 | 高强耐热聚乙烯复合材料的制备方法 |
CN102093617A (zh) * | 2010-12-30 | 2011-06-15 | 合肥工业大学 | 正温度系数性能改进的聚乙烯炭黑导电复合材料制备方法 |
CN102543329A (zh) * | 2011-12-31 | 2012-07-04 | 上海长园维安电子线路保护股份有限公司 | 提高ptc热敏电阻芯材强度的热处理方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100454732B1 (ko) * | 2001-08-25 | 2004-11-05 | 엘지전선 주식회사 | 전도성 중합체 조성물. 이 조성물의 특성을 조절하는 방법및 이 조성물을 이용한 전기장치 |
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2013
- 2013-05-29 CN CN201310206245.5A patent/CN103333387B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1581371A (zh) * | 2003-08-15 | 2005-02-16 | 比亚迪股份有限公司 | 一种热敏电阻材料及含该材料的热敏电阻器的制造方法 |
CN101367973A (zh) * | 2008-10-09 | 2009-02-18 | 上海交通大学 | 高强耐热聚乙烯复合材料的制备方法 |
CN102093617A (zh) * | 2010-12-30 | 2011-06-15 | 合肥工业大学 | 正温度系数性能改进的聚乙烯炭黑导电复合材料制备方法 |
CN102543329A (zh) * | 2011-12-31 | 2012-07-04 | 上海长园维安电子线路保护股份有限公司 | 提高ptc热敏电阻芯材强度的热处理方法 |
Non-Patent Citations (1)
Title |
---|
填充型多相聚合物导电复合材料的PTC 效应;熊辉,等;《化学世界》;20071231(第11期);第661-663页 * |
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Inventor after: Luo Yuqi Inventor before: Gu Daorong |
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Effective date of registration: 20170425 Address after: 510800 Guangdong, Huadu District, Xinhua Street, Fengshen Road, building No. 59, the first floor of the dragon building, Guangzhou Patentee after: GUANGZHOU JIANLONG ELECTRIC APPLIANCE Co.,Ltd. Address before: 312365 Zhejiang Province, Shaoxing city Shangyu District Songxia Town City Station International Plaza building 36 unit room 1-101 Patentee before: ZHEJIANG HONGSHENG TECHNOLOGY TRANSFER SERVICES CO.,LTD. Effective date of registration: 20170425 Address after: 312365 Zhejiang Province, Shaoxing city Shangyu District Songxia Town City Station International Plaza building 36 unit room 1-101 Patentee after: ZHEJIANG HONGSHENG TECHNOLOGY TRANSFER SERVICES CO.,LTD. Address before: 230088 Hefei high tech Zone, Zhejiang Province, venture building, room A-914 Patentee before: Anhui Qixunqiang Electronic Technolog Co.,Ltd. |
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Denomination of invention: A PTC polymer conductive material with high-density polyethylene as the main material and its preparation method Effective date of registration: 20230420 Granted publication date: 20160810 Pledgee: Bank of China Limited Guangzhou green finance reform and innovation pilot zone Huadu Branch Pledgor: GUANGZHOU JIANLONG ELECTRIC APPLIANCE Co.,Ltd. Registration number: Y2023980038575 |
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