CN103305896A - Continuous-electroplating liquid conduction apparatus and continuous liquid electroplating method - Google Patents
Continuous-electroplating liquid conduction apparatus and continuous liquid electroplating method Download PDFInfo
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- CN103305896A CN103305896A CN2012100573860A CN201210057386A CN103305896A CN 103305896 A CN103305896 A CN 103305896A CN 2012100573860 A CN2012100573860 A CN 2012100573860A CN 201210057386 A CN201210057386 A CN 201210057386A CN 103305896 A CN103305896 A CN 103305896A
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Abstract
The invention discloses a continuous-electroplating liquid conduction apparatus. The apparatus comprises a conduction tank, a water washing tank and an electroplating tank which are sequentially arranged, a member for plating sequentially traverses through the conduction tank, the water washing tank and the electroplating tank to form a continuous electroplating line, first pole plates positioned along the direction of the continuous electroplating line are arranged in the tank bodies of the conduction tank, second pole plates positioned along the direction of the continuous electroplating line are arranged in the tank bodies of the electroplating tank, a power supply is also arranged, the first pole plates are electrically connected with the negative pole of the power supply, and the second pole plates are electrically connected with the positive pole of the power supply; and an electrolyte having a depth higher than the height of the first pole plates is filled in the conduction tank, and an electroplating liquid higher than the second pole plates is filled in the electroplating tank. The apparatus and the method solve an electroplating uniformity problem, and can also solve an electroplating surface damage problem.
Description
Technical field
The present invention relates to a kind of continuous electroplating liquid conduction device and continuous liq electro-plating method.
Background technology
The electric current method of supplying of traditional horizontal continuous electroplating line adopts conductive roller and two kinds in conduction clip.Conductive roller is the metal that is covered with conduction in roller surface, utilizes roller and plating piece contact surface to conduct electricity.Solve the conduction problem although it is so, but because the difference of frictional force between each conductive roller causes local loose contact, conducted electricity inhomogeneously, but also easily caused the damage that is subjected to the plating piece contact surface.The conduction clip is the problem that solves conduction by the to-and-fro movement of conductive clip, but because the to-and-fro movement of conductive clip has intermittence, causes the ununiformity of conducting electricity.The pulling force that produces in the reciprocal motion of conductive clip easily causes the product distortion to elongate.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of continuous electroplating liquid conduction device continuous liq electro-plating method, these apparatus and method have not only solved the problem of electroplating evenness, can also solve the problem of plate surface damage.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of continuous electroplating liquid conduction device, comprise tactic conductive trough, washing bath and plating tank, be subjected to plating piece to pass described conductive trough successively, washing bath and plating tank also form a continuous electroplating line, in the cell body of described conductive trough, be provided with first pole plate along described continuous electroplating line direction, in the cell body of described plating tank, be provided with second pole plate along described continuous electroplating line direction, other is provided with power supply, described first pole plate is electrically connected on described power cathode, and described second pole plate is electrically connected on described positive source; The electrolytic solution that the degree of depth is higher than the described first pole plate height is housed in the described conductive trough, the electroplate liquid that the degree of depth is higher than described second pole plate is housed in the described plating tank.When continuous electroplating, owing to be communicated with by the surfacing that is subjected to of plating piece, and contain conductive liquid in conductive trough and the plating tank respectively, like this, power positive cathode is by the conductive liquid in first and second pole plate, conductive trough and the plating tank and be subjected to the surfacing that is subjected to of plating piece to form the galvanic circle.
As a further improvement on the present invention, described first pole plate is two, and the described both sides that are subjected to plating piece that are placed in.
As a further improvement on the present invention, described second pole plate is two, and the described both sides that are subjected to plating piece that are placed in.
As a further improvement on the present invention, behind described plating tank, also be sequentially with washing bath, conductive trough and washing bath (order of the cell body of this section can be in front or back add pre-treatment or aftertreatment).
As a further improvement on the present invention, be respectively equipped with feed mechanism and cutting agency with least significant end foremost at described continuous electroplating line.
The present invention also provides a kind of continuous liq electro-plating method, allow earlier and be subjected to plating piece to pass conductive trough, washing bath and plating tank successively and form a continuous electroplating line, in conductive trough and plating tank, be respectively equipped with first pole plate and second pole plate along described continuous electroplating line direction, and the conductive liquid in conductive trough and the plating tank and the degree of depth of electroplate liquid are higher than described first pole plate and second pole plate respectively, described first pole plate and a power cathode are electrically connected, and described second pole plate and a positive source are electrically connected.Like this, power positive cathode is by the conductive liquid in first and second pole plate, conductive trough and the plating tank and be subjected to the surfacing that is subjected to of plating piece to form the galvanic circle.
The invention has the beneficial effects as follows: because pole plate is equipped with in the inner transverse both sides of conductive trough and plating tank, be negative pole and the conductive trough pole plate connects, what the plating tank pole plate connect is anodal, because continuously in the plating, workpiece is communicated with by surfacing, and the conductive liquid in plating tank and the conductive trough forms galvanic circle (height of solution must be higher than the height of pole plate).Feed mechanism is delivered to by plating piece band shape or web-like and is utilized the liquid conduction technology the cell body from feeding area, metal or alloy is plated in be subjected on the plating piece.It namely can solve the conduction problem of electroplating device, increases the homogeneity of conduction again but also can't harm to be subjected to the plating piece surface, has further improved the quality of product, and environmental protection again simple in structure.
Description of drawings
Fig. 1 is the structural representation of the preferred embodiment of the present invention.
By reference to the accompanying drawings, make the following instructions:
1---conductive trough 2---washing bath
3---plating tanks 4---are subjected to plating piece
5---first pole plates 6---, second pole plate
7---power supply 8---feed mechanism
9---cutting agency
Embodiment
As shown in Figure 1, a kind of continuous electroplating liquid conduction device, comprise the feed mechanism 8, conductive trough 1, washing bath 2, plating tank 3, washing bath 2, conductive trough 1, washing bath 2 and the cutting agency 9 that arrange in order successively, and form a continuous electroplating line between above-mentioned each parts, be subjected to plating piece 4 (as pcb board) after feed mechanism is electroplated through above-mentioned each cell body successively, to deliver to cutting agency.Be respectively equipped with two first pole plates 5 in each above-mentioned conductive trough cell body, this two first pole plate is distributed near the relative two side of conductive trough cell body, and is parallel to continuous electroplating line, and is placed in and is subjected to the both sides of plating piece.Also be provided with two second pole plates 6 at above-mentioned plating tank cell body, this two first pole plate is distributed near the relative two side of conductive trough cell body, and is parallel to continuous electroplating line, and is placed in and is subjected to the both sides of plating piece.Other has a power supply 7, and the positive pole of this power supply is electrically connected on above-mentioned each second pole plate, and the negative pole of this power supply is electrically connected on respectively on above-mentioned each first pole plate.
Because in the plating, workpiece is communicated with by surfacing continuously, the conductive liquid in plating tank and the conductive trough forms galvanic circle (height of solution must be higher than the height of pole plate).Feed mechanism will be delivered to by plating piece (as the PCB electroplate) from feeding area and utilize the liquid conduction technology the cell body, metal or alloy will be plated in be subjected on the plating piece (as the PCB electroplate).It namely can solve the conduction problem of electroplating device, increases the homogeneity of conduction again but also can't harm to be subjected to the plating surface, has further improved the quality of product, and environmental protection again simple in structure.
Claims (6)
1. continuous electroplating liquid conduction device, comprise tactic conductive trough (1), washing bath (2) and plating tank (3), be subjected to plating piece (4) to pass described conductive trough successively, washing bath and plating tank also form a continuous electroplating line, it is characterized in that: in the cell body of described conductive trough, be provided with first pole plate (5) along described continuous electroplating line direction, in the cell body of described plating tank, be provided with second pole plate (6) along described continuous electroplating line direction, other is provided with power supply (7), described first pole plate is electrically connected on described power cathode, and described second pole plate is electrically connected on described positive source; The electrolytic solution that the degree of depth is higher than the described first pole plate height is housed in the described conductive trough, the electroplate liquid that the degree of depth is higher than described second pole plate is housed in the described plating tank.
2. continuous electroplating liquid conduction device according to claim 1, it is characterized in that: described first pole plate is two, and the described both sides that are subjected to plating piece that are placed in.
3. continuous electroplating liquid conduction device according to claim 1 and 2, it is characterized in that: described second pole plate is two, and the described both sides that are subjected to plating piece that are placed in.
4. continuous electroplating liquid conduction device according to claim 3 is characterized in that: also be sequentially with washing bath, conductive trough and washing bath behind described plating tank.
5. continuous electroplating liquid conduction device according to claim 4 is characterized in that: be respectively equipped with feed mechanism (8) and cutting agency (9) with least significant end foremost at described continuous electroplating line.
6. continuous liq electro-plating method, it is characterized in that: allow earlier be subjected to plating piece to pass conductive trough, washing bath and plating tank successively and form a continuous electroplating line, in conductive trough and plating tank, be respectively equipped with first pole plate and second pole plate along described continuous electroplating line direction, and the conductive liquid in conductive trough and the plating tank and the degree of depth of electroplate liquid are higher than described first pole plate and second pole plate respectively, described first pole plate and a power cathode are electrically connected, and described second pole plate and a positive source are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210057386.0A CN103305896B (en) | 2012-03-07 | 2012-03-07 | Continuous electroplating liquid conduction device and continuous liq electro-plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210057386.0A CN103305896B (en) | 2012-03-07 | 2012-03-07 | Continuous electroplating liquid conduction device and continuous liq electro-plating method |
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| Publication Number | Publication Date |
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| CN103305896A true CN103305896A (en) | 2013-09-18 |
| CN103305896B CN103305896B (en) | 2015-09-09 |
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| CN201210057386.0A Active CN103305896B (en) | 2012-03-07 | 2012-03-07 | Continuous electroplating liquid conduction device and continuous liq electro-plating method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105908245A (en) * | 2016-06-15 | 2016-08-31 | 无锡明鑫金属表面处理科技有限公司 | Multi-passage and multi-groove connected type electroplating bath equipment |
| CN113604848A (en) * | 2021-08-26 | 2021-11-05 | 舒城广源表面处理有限公司 | Continuous plating liquid conductor |
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| JP2006316322A (en) * | 2005-05-13 | 2006-11-24 | Nippon Mektron Ltd | Plating method of sheet-like product |
| CN101260554A (en) * | 2007-12-14 | 2008-09-10 | 华南师范大学 | Metal foil band electroplating system and application thereof |
| CN101532160A (en) * | 2008-03-11 | 2009-09-16 | 上村工业株式会社 | Continuous copper electroplating method |
| WO2010133222A2 (en) * | 2009-05-22 | 2010-11-25 | Huebel Egon | Method and device for controlling electrochemical surface processes |
| CN202492604U (en) * | 2012-03-07 | 2012-10-17 | 昆山东威电镀设备技术有限公司 | Continuous plating liquid conductive device |
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2012
- 2012-03-07 CN CN201210057386.0A patent/CN103305896B/en active Active
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| CN2148766Y (en) * | 1992-11-04 | 1993-12-08 | 鞍山钢铁公司 | Metal prolduct surface electrochemical continuous pretreating apparatus |
| CN1322863A (en) * | 2000-03-27 | 2001-11-21 | 三洋电机株式会社 | Electroplating apparatus |
| JP2006316322A (en) * | 2005-05-13 | 2006-11-24 | Nippon Mektron Ltd | Plating method of sheet-like product |
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| WO2010133222A2 (en) * | 2009-05-22 | 2010-11-25 | Huebel Egon | Method and device for controlling electrochemical surface processes |
| WO2010133222A3 (en) * | 2009-05-22 | 2011-04-14 | Rena Gmbh | Method and device for controlling electrochemical surface processes |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105908245A (en) * | 2016-06-15 | 2016-08-31 | 无锡明鑫金属表面处理科技有限公司 | Multi-passage and multi-groove connected type electroplating bath equipment |
| CN113604848A (en) * | 2021-08-26 | 2021-11-05 | 舒城广源表面处理有限公司 | Continuous plating liquid conductor |
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| Publication number | Publication date |
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| CN103305896B (en) | 2015-09-09 |
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Address after: 215311 East Side of Dongding Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshan Weiwei Science and Technology Co., Ltd. Address before: 215300, No. three, Lane 435-3, West Street, Kunshan Development Zone, Suzhou, Jiangsu Patentee before: Kunshan Dongwei Plating Equipment Technology Co., Ltd. |