CN113604848A - Continuous plating liquid conductor - Google Patents

Continuous plating liquid conductor Download PDF

Info

Publication number
CN113604848A
CN113604848A CN202110985670.3A CN202110985670A CN113604848A CN 113604848 A CN113604848 A CN 113604848A CN 202110985670 A CN202110985670 A CN 202110985670A CN 113604848 A CN113604848 A CN 113604848A
Authority
CN
China
Prior art keywords
box
electroplating
conductive
wire
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202110985670.3A
Other languages
Chinese (zh)
Inventor
邓贻文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shucheng Guangyuan Surface Treatment Co ltd
Original Assignee
Shucheng Guangyuan Surface Treatment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shucheng Guangyuan Surface Treatment Co ltd filed Critical Shucheng Guangyuan Surface Treatment Co ltd
Priority to CN202110985670.3A priority Critical patent/CN113604848A/en
Publication of CN113604848A publication Critical patent/CN113604848A/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0621In horizontal cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a continuous electroplating liquid conductive device, which belongs to the technical field of electroplating, and comprises a box body, wherein a box cover is arranged at the top end of the box body, a first cleaning box is arranged at the bottom end in the box body, a conductive box is arranged on one side of the first cleaning box, an electroplating box is arranged on one side of the conductive box, a second cleaning box is arranged on one side of the electroplating box, the continuous electroplating liquid conductive device also comprises a limiting structure arranged on the first cleaning box, the second cleaning box, the conductive box and the electroplating box, and an electroplating structure arranged in the conductive box and the electroplating box, wherein the electroplating structure consists of a power supply, conductive liquid, electroplating liquid and a conductive assembly, and the continuous electroplating liquid conductive device has the beneficial effects that: through take-up reel, take-up reel and wash case one, wire wheel one and install wire wheel two, spacing round one, the two production lines that form of spacing round on wasing case two, conductive box, the electroplating box, transmit, wash, electrically conduct, electroplate and the rolling to the electroplating wire for electroplate more evenly, increase product quality.

Description

Continuous plating liquid conductor
Technical Field
The invention relates to the technical field of electroplating, in particular to a continuous electroplating liquid conductive device.
Background
Electroplating is a process of plating a layer of other metals and alloys on the surface of some metals by utilizing the electrolysis principle, and continuous electroplating is also called roll-to-roll electroplating, and the material is strip-shaped and can be rolled up.
The prior art has the following defects: the existing electroplating device drives materials to ascend from a negative electrode conductive box through a lifting rotating machine, the materials are transmitted to an electroplating box to be electroplated in a rotating and descending mode, the materials can only be curled for electroplating due to overlong lengths, the materials are overlapped to enable electroplating to be uneven, the product quality is reduced, and continuous electroplating cannot be carried out to reduce the working efficiency.
Therefore, it is necessary to develop a continuous plating liquid conductive device.
Disclosure of Invention
Therefore, the invention provides a continuous electroplating liquid conductive device, which is characterized in that a production line is formed by a take-up reel, the take-up reel, a first cleaning box, a first wire wheel, a second wire wheel, a first limiting wheel and a second limiting wheel which are arranged on a second cleaning box, a conductive box and an electroplating box, and the first wire wheel, the first limiting wheel and the second limiting wheel are used for transmitting, cleaning, conducting, electroplating and rolling an electroplating line, so that the problems that the existing device is uneven in electroplating and cannot carry out continuous electroplating to reduce the product quality are solved.
In order to achieve the above purpose, the invention provides the following technical scheme: the utility model provides a continuous plating liquid electric installation, includes the box, the case lid is installed on the box top, the bottom is installed and is washd case one in the box, wash case one side and install the electric conduction case, electric conduction case one side is installed and is electroplated the case, electroplating case one side is installed and is washd case two, still including installing spacing structure and the electroplating structure of installing in electric conduction case, electroplating box on wasing case one, washing case two, electric conduction case, electroplating box, electroplating structure comprises power, conducting liquid, plating solution, electrically conductive component, the power is installed between electric conduction case and electroplating box, conducting liquid, plating solution have been placed respectively in electric conduction case and the electroplating box, wash case one side and install the drawing drum, wash case two one side and install the take-up reel, wash case one, wash case two, Wire wheel I is all installed in both ends outside around conducting box and the electroplating box, the winding has the electric plate wire on the drawing drum.
Preferably, the front end and the rear end of the cleaning box I, the cleaning box II, the conductive box and the electroplating box are respectively provided with a groove II, and a wire wheel II is movably connected in each groove II.
Preferably, the conductive assembly comprises a first cathode plate, the first cathode plate is installed in the conductive box, a first anode plate is installed in the electroplating box, and one sides of the first cathode plate and the first anode plate are both connected with a first lead.
Preferably, the first cathode plate is connected with the negative electrode of the power supply through a first lead, and the first anode plate is connected with the positive electrode of the power supply through a first lead.
Preferably, the first anode plate and the first cathode plate are provided with one group.
Preferably, the limiting structure further comprises a first limiting wheel, a second limiting wheel is installed below the first limiting wheel, fixed blocks are movably connected to two sides of the first limiting wheel and the second limiting wheel, a first groove is formed in the first limiting wheel, a protruding block is installed on the second limiting wheel, and the protruding block corresponds to the first groove.
Preferably, the fixed blocks are installed on two sides in the cleaning box I, the cleaning box II, the conductive box and the electroplating box.
Preferably, cleaning layers are arranged on the first groove and the first bump of the first limiting wheel and the second limiting wheel in the first cleaning box.
Preferably, the conductive assembly further comprises a second cathode plate, a second anode plate and a second lead, the second cathode plate and the second anode plate are respectively installed in the conductive box and the electroplating box, one sides of the second cathode plate and the second anode plate are respectively connected with the first lead, the second cathode plate is connected with the negative pole of the power supply through the second lead, the second anode plate is connected with the positive pole of the power supply through the second lead, and the second cathode plate and the second anode plate are respectively provided with three groups.
A continuous electroplating liquid method comprises the following steps:
the method comprises the following steps: opening the tank cover, pouring clear water into the first cleaning tank and the second cleaning tank, pouring the conductive liquid into the conductive tank, and pouring the electroplating solution with the anode metal ions into the electroplating tank;
step two: the method comprises the following steps that a plating line wound on a pay-off reel penetrates through a first wire wheel at the rear end of a first cleaning box and a second wire wheel in a second groove and extends into the first cleaning box, penetrates through the first groove on a first limiting wheel, and extends to the front end of a first conductive box after penetrating through the second wire wheel and the first wire wheel in the second groove at the front end of the first cleaning box;
step three: the electroplating wire passes through a first wire guide wheel arranged at the front end of the conductive box and a second wire guide wheel arranged in the second groove and extends into the conductive box, passes through the first groove on the first limiting wheel, and extends to the rear end of the electroplating box after passing through the second wire guide wheel arranged in the second groove and the first wire guide wheel arranged at the rear end of the conductive box;
step four: the electroplating line penetrates through a first wire guide wheel arranged at the rear end of the electroplating box, a second wire guide wheel arranged in a groove II arranged at the rear end of the electroplating box and penetrates through a first groove on the first limiting wheel, and a second wire guide wheel and a first wire guide wheel penetrating through a second groove at the front end of the electroplating box extend to the front end of a second cleaning box;
step five: the electroplating wire penetrates through a first wire guide wheel arranged at the front end of the second cleaning box and a second wire guide wheel arranged in the second groove, extends into the second cleaning box, penetrates through the first groove on the first limiting wheel, and is connected with the take-up reel after penetrating through the second groove and the second wire guide wheel arranged in the second groove at the rear end of the second cleaning box;
step six: turning on a power supply, respectively transmitting anode electricity and cathode electricity to an anode plate II and a cathode plate I through a first lead, transmitting the anode electricity and the cathode electricity into the conductive liquid through the cathode plate I, and transmitting the conductive liquid into the electroplating liquid through the anode plate II;
step seven: the paying-off reel and the winding reel are rotated, the plating line passes through the first cleaning box to be limited by the first groove and the first bump, and the plating line is cleaned by the cleaning layer;
step eight: the electroplating wire after the washing passes through wire wheel two, wire wheel one transmits to the electric conduction box, transmits negative pole electricity to the electroplating wire through conducting solution on for the electroplating wire has the anion, through wire wheel one, wire wheel two transmit to the electroplating box in, through the anion that has on the electroplating wire and the metal cation opposite phase in the electroplating solution inhale, electroplate for the electroplating wire, the electroplating wire after the electroplating transmits to the washing box two in, washs, is rolling through the take-up reel.
The invention has the beneficial effects that:
1. the electroplating line is movably connected with the cleaning box I, the cleaning box II, the conductive box and the electroplating box through the first wire wheel, the second wire wheel, the first limiting wheel and the second limiting wheel, a power supply is switched on, positive electrode electricity and negative electrode electricity are respectively transmitted to the positive electrode plate II and the negative electrode plate I through the first wire, the positive electrode electricity and the negative electrode electricity are transmitted to the conductive liquid through the negative electrode plate I and are transmitted to the electroplating liquid through the positive electrode plate II, the negative electrode electricity is transmitted to the electroplating line through the conductive liquid, the electroplating line is provided with negative ions, the negative ions on the electroplating line are transmitted to the electroplating box through the first wire wheel and the second wire wheel, and the negative ions on the electroplating line are absorbed with metal cations in the electroplating liquid in a different way, so that the electroplating is carried out on the electroplating line, the electroplating is more uniform, and the product quality and the working efficiency are improved;
2. cleaning layers are respectively arranged on the first groove of the first limiting wheel and the second lug of the second limiting wheel in the first cleaning box, the electroplating wire penetrates through the first groove, and dust adhered to the electroplating wire is cleaned through the cleaning layers on the first groove and the second lug, so that the influence of impurities on the subsequent electroplating quality is avoided.
Drawings
FIG. 1 is a front view provided by the present invention;
FIG. 2 is a top cross-sectional view provided by the present invention;
FIG. 3 is an enlarged view of area A of FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of area B of FIG. 2 according to the present invention;
FIG. 5 is a side cross-sectional view of the cleaning tank of the present invention;
FIG. 6 is a front cross-sectional view of the housing provided by the present invention;
FIG. 7 is a schematic view of the movable connection between a first limit wheel and a second limit wheel;
fig. 8 is a top view of a second conductive element according to an embodiment of the present invention.
In the figure: the electroplating device comprises a box body 1, a box cover 11, a first wire guide wheel 12, a pay-off reel 13, a take-up reel 14, an electroplating wire 2, a first cleaning box 3, a second cleaning box 31, a conductive box 4, an electroplating box 5, a limiting structure 6, a first limiting wheel 61, a first groove 62, a second limiting wheel 63, a lug 64, a fixing block 65, a cleaning layer 66, an electroplating structure 7, a power supply 71, conductive liquid 72, electroplating liquid 73, a conductive component 8, a first cathode plate 81, a second anode plate 82, a first wire guide 83, a second cathode plate 84, a second anode plate 85, a second wire guide 86, a second groove 9 and a second wire guide wheel 10.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example 1:
referring to the attached drawings 1-7, the continuous electroplating liquid conducting device provided by the invention comprises a box body 1, a box cover 11 is installed at the top end of the box body 1, a first cleaning box 3 is installed at the bottom end of the box body 1, a conducting box 4 is installed at one side of the first cleaning box 3, an electroplating box 5 is installed at one side of the conducting box 4, a second cleaning box 31 is installed at one side of the electroplating box 5, a limiting structure 6 installed on the first cleaning box 3, the second cleaning box 31, the conducting box 4 and the electroplating box 5 and an electroplating structure 7 installed in the conducting box 4 and the electroplating box 5 are further included, the electroplating structure 7 is composed of a power supply 71, conducting liquid 72, electroplating liquid 73 and a conducting component 8, the power supply 71 is installed between the conducting box 4 and the electroplating box 5, the conducting liquid 72 and the electroplating liquid 73 are respectively placed in the conducting box 4 and the electroplating box 5, a pay-off reel 13 is installed at one side of the first cleaning box 3, a take-up reel 14 is mounted on one side of the cleaning box II 31, wire guide wheels I12 are mounted on the outer sides of the front end and the rear end of the cleaning box I3, the cleaning box II 31, the conductive box 4 and the electroplating box 5 respectively, and an electroplating wire 2 is wound on the pay-off reel 13;
furthermore, a groove II 9 is formed in the front end and the rear end of each of the cleaning box I3, the cleaning box II 31, the conductive box 4 and the electroplating box 5, and a wire guide wheel II 10 is movably connected in each groove II 9;
further, the conductive assembly 8 comprises a first cathode plate 81, the first cathode plate 81 is installed in the conductive box 4, a first anode plate 82 is installed in the electroplating box 5, and one sides of the first cathode plate 81 and the first anode plate 82 are connected with a first lead 83;
further, the first cathode plate 81 is connected with the negative electrode of the power supply 71 through a first lead 83, the first anode plate 82 is connected with the positive electrode of the power supply 71 through a first lead 83, the positive electrode electricity and the negative electrode electricity are respectively transmitted to the second anode plate 82 and the first cathode plate 81 through the first lead 83, transmitted into the conductive liquid 72 through the first cathode plate 81 and transmitted into the electroplating liquid 73 through the second anode plate 82;
further, a group of anode plates 82 and cathode plates 81 are arranged;
further, the limiting structure 6 further comprises a first limiting wheel 61, a second limiting wheel 63 is mounted below the first limiting wheel 61, fixing blocks 65 are movably connected to two sides of the first limiting wheel 61 and the second limiting wheel 63, a first groove 62 is formed in the first limiting wheel 61, a first bump 64 is mounted on the second limiting wheel 63, and the bump 64 corresponds to the first groove 62;
further, fixing blocks 65 are arranged on two sides in the first cleaning box 3, the second cleaning box 31, the conductive box 4 and the electroplating box 5;
further, cleaning layers 66 are respectively arranged on the first limiting wheel 61 in the first cleaning box 3, the first groove 62 of the second limiting wheel 63 and the lug 64, and when the plating line 2 passes through the first cleaning box 3 through the cleaning layers 66, dust on the plating line 2 is removed through the cleaning layers 66 arranged on the first groove 62 of the first limiting wheel 61 and the lug 64 of the second limiting wheel 63.
The using process of the invention is as follows: when the invention is used, the box cover 11 is movably connected with the top end of the box body 1, the first cleaning box 3, the second cleaning box 31, the conductive box 4 and the electroplating box 5 are all fixedly arranged at the bottom end of the box body 1, the second grooves 9 are arranged on the box walls at the front end and the rear end of the first cleaning box 3, the second cleaning box 31, the conductive box 4 and the electroplating box 5, the second wire guide wheels 10 are movably connected with the second grooves 9, the first wire guide wheels 12 are respectively arranged at the front end and the rear end of the first cleaning box 3, the second cleaning box 31, the conductive box 4 and the electroplating box 5, the fixed blocks 65 are fixedly arranged at two sides in the first cleaning box 3, the second cleaning box 31, the conductive box 4 and the electroplating box 5, the first grooves 62 are arranged on the first limit wheels 61, the bumps 64 are fixedly arranged on the second limit wheels 63, the second limit wheels 63 are arranged below the first limit wheels 61, the bumps 64 are movably connected with the first grooves 62, two sides of the first limit wheels 61 and the second limit wheels 63 are movably connected with the fixed blocks 65, when in use, the box cover 11 is opened, clean water is poured into the first cleaning box 3 and the second cleaning box 31, the conductive liquid 72 is poured into the conductive box 4, the plating solution 73 with anode metal ions is poured into the electroplating box 5, the plating wire 2 wound on the pay-off reel 13 passes through the first wire wheel 12 at the rear end of the first cleaning box 3 and the second wire wheel 10 in the second groove 9 and extends into the first cleaning box 3, passes through the first groove 62 on the first limiting wheel 61, the plating wire 2 passes through the second wire wheel 10 in the second groove 9 at the front end of the first cleaning box 3 and the first wire wheel 12 and extends to the front end of the conductive box 4, the plating wire 2 passes through the first wire wheel 12 at the front end of the conductive box 4 and the second wire wheel 10 in the second groove 9 and extends into the conductive box 4, passes through the first groove 62 on the first limiting wheel 61, and the second wire wheel 10 and the first wire wheel 12 which pass through the rear end of the conductive box 4 and are arranged in the second groove 9 extend to the rear end of the electroplating box 5, the plating line 2 passes through a first wire guide wheel 12 arranged at the rear end of the plating box 5, a second wire guide wheel 10 arranged in a second groove 9 penetrating through the rear end of the plating box 5 extends into the plating box 5, passes through a first groove 62 on a first limiting wheel 61, extends into the front end of a second cleaning box 31 after passing through a second wire guide wheel 10 and a first wire guide wheel 12 in a second groove 9 at the front end of the plating box 5, the plating line 2 passes through the first wire guide wheel 12 arranged at the front end of the second cleaning box 31 and the second wire guide wheel 10 in the second groove 9 and extends into the second cleaning box 31, passes through the first groove 62 on the first limiting wheel 61, is connected with a take-up reel 14 after passing through the second wire guide wheel 10 and the first wire guide wheel 12 arranged in the second groove 9 at the rear end of the second cleaning box 31, a power supply 71 is turned on, positive electrode electricity and negative electrode electricity are respectively transmitted to a second negative electrode plate 82 and a positive electrode plate 81 through a first wire 83, are transmitted to a conductive liquid 72, and are transmitted to plating liquid 73 through the second wire 82, the paying-off reel 13 and the take-up reel 14 are rotated, the plating line 2 is limited through the first groove 62 and the lug 64 in the first cleaning box 3, the plating line 2 is cleaned through the cleaning layer 66, the cleaned plating line 2 is transmitted to the conductive box 4 through the second wire wheel 10 and the first wire wheel 12, the negative electrode is transmitted to the plating line 2 through the conductive liquid 72, the plating line 2 is provided with negative ions, the negative ions are transmitted to the plating box 5 through the first wire wheel 12 and the second wire wheel 10, the negative ions on the plating line 2 and metal cations in the plating solution 73 are absorbed in an opposite-phase mode to electroplate the plating line 2, the electroplated plating line 2 is transmitted to the second cleaning box 31 to be cleaned, and the wire is wound through the take-up reel 14.
Example 2:
referring to fig. 8, the continuous electroplating liquid conductive device provided by the invention comprises a conductive assembly 8, and further comprises a second cathode plate 84, a second anode plate 85 and a second lead 86, wherein the second cathode plate 84 and the second anode plate 85 are respectively installed in the conductive box 4 and the electroplating box 5, one sides of the second cathode plate 84 and the second anode plate 85 are respectively connected with the second lead 86, the second cathode plate 84 is connected with the negative electrode of the power supply 71 through the second lead 86, the second anode plate 85 is connected with the positive electrode of the power supply 71 through the second lead 86, three groups of the second cathode plate 84 and the two anode plate 85 are respectively arranged, and particularly, three groups of the second cathode plate 84 and the two anode plate 85 are respectively arranged, so that the positive electrodes and the negative electrodes in the conductive box 4 and the electroplating box 5 are more uniform.
The using process of the invention is as follows: when the invention is used, the power supply 71 is turned on, the positive electrode electricity and the negative electrode electricity are respectively transmitted to the positive electrode plate II 85 and the negative electrode plate II 84 through the lead wire II 86, transmitted into the conductive liquid 72 through the negative electrode plate II 84 and transmitted into the electroplating liquid 73 through the positive electrode plate II 85, the pay-off reel 13 and the take-up reel 14 are rotated, the electroplating line 2 is limited by the groove I62 and the bump 64 in the cleaning box I3, the electroplating line 2 is cleaned through the cleaning layer 66, the cleaned electroplating line 2 is transmitted to the conductive box 4 through the lead wire wheel II 10 and the lead wire wheel I12, the negative electrode electricity is transmitted to the electroplating line 2 through the conductive liquid 72, so that the electroplating line 2 is provided with negative ions, transmitted into the electroplating box 5 through the lead wire wheel I12 and the lead wire wheel II 10, the negative ions on the electroplating line 2 are absorbed by the metal cations in the electroplating liquid 73 in an opposite way to electroplate the electroplating line 2, and the electroplated electroplating line 2 is transmitted into the cleaning box II 31, the cleaning is performed again, and the wound up is performed by the take-up reel 14.
The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solution described above. Therefore, any simple modifications or equivalent substitutions made in accordance with the technical solution of the present invention are within the scope of the claims of the present invention.

Claims (10)

1. The utility model provides a continuous plating liquid conductor device, includes box (1), case lid (11) are installed on box (1) top, box (1) bottom is installed and is washd case (3), wash case (3) one side and install conductive box (4), electroplating box (5) are installed to conductive box (4) one side, electroplating box (5) one side is installed and is washd case two (31), its characterized in that: the wire cleaning device is characterized by further comprising a limiting structure (6) arranged on the first cleaning box (3), the second cleaning box (31), the conductive box (4) and the electroplating box (5) and an electroplating structure (7) arranged in the conductive box (4) and the electroplating box (5), wherein the electroplating structure (7) consists of a power supply (71), a conductive liquid (72), an electroplating solution (73) and a conductive component (8), the power supply (71) is arranged between the conductive box (4) and the electroplating box (5), the conductive liquid (72) and the electroplating solution (73) are respectively arranged in the conductive box (4) and the electroplating box (5), a pay-off reel (13) is arranged on one side of the first cleaning box (3), a take-up reel (14) is arranged on one side of the second cleaning box (31), the first cleaning box (3), the second cleaning box (31), the conductive box (4) and the electroplating box (5) are respectively provided with a first wire wheel (12) on the outer sides of the front end and the rear end, and the paying-off reel (13) is wound with an electroplating wire (2).
2. A continuous plating liquid conductive apparatus as set forth in claim 1 wherein: the cleaning box I (3), the cleaning box II (31), the conductive box (4) and the electroplating box (5) are respectively provided with a groove II (9) at the front end and the rear end, and a wire wheel II (10) is movably connected in the groove II (9).
3. A continuous plating liquid conductive apparatus as set forth in claim 1 wherein: the conductive assembly (8) comprises a first negative plate (81), the first negative plate (81) is installed in the conductive box (4), a first positive plate (82) is installed in the electroplating box (5), and one sides of the first negative plate (81) and the first positive plate (82) are connected with a first lead (83).
4. A continuous plating liquid conductive apparatus as set forth in claim 3 wherein: the first cathode plate (81) is connected with the negative electrode of the power supply (71) through a first lead (83), and the first anode plate (82) is connected with the positive electrode of the power supply (71) through a first lead (83).
5. A continuous plating liquid conductive apparatus as set forth in claim 3 wherein: and the anode plate I (82) and the cathode plate I (81) are provided with a group.
6. A continuous plating liquid conductive apparatus as set forth in claim 1 wherein: the limiting structure (6) further comprises a first limiting wheel (61), a second limiting wheel (63) is installed below the first limiting wheel (61), fixed blocks (65) are movably connected to two sides of the first limiting wheel (61) and the second limiting wheel (63), a first groove (62) is formed in the first limiting wheel (61), a lug (64) is installed on the second limiting wheel (63), and the lug (64) corresponds to the first groove (62).
7. A continuous plating liquid conductive apparatus as set forth in claim 1 wherein: fixed blocks (65) are installed on two sides in the first cleaning box (3), the second cleaning box (31), the conductive box (4) and the electroplating box (5).
8. A continuous plating liquid conductive apparatus as set forth in claim 1 wherein: cleaning layers (66) are respectively arranged on the first groove (62) and the lug (64) of the first limiting wheel (61) and the second limiting wheel (63) in the first cleaning box (3).
9. A continuous plating liquid conductive apparatus as set forth in claim 1 wherein: the conductive assembly (8) further comprises a second cathode plate (84), a second anode plate (85) and a second lead (86), wherein the second cathode plate (84) and the second anode plate (85) are respectively installed in the conductive box (4) and the electroplating box (5), one sides of the second cathode plate (84) and the second anode plate (85) are respectively connected with the first lead (83), the second cathode plate (84) is connected with the negative pole of the power supply (71) through the second lead (86), the second anode plate (85) is connected with the positive pole of the power supply (71) through the second lead (86), and the second cathode plate (84) and the second anode plate (85) are respectively provided with three groups.
10. A continuous liquid electroplating method is characterized in that: the method also comprises the following specific steps:
the method comprises the following steps: opening the box cover (11), pouring clear water into the first cleaning box (3) and the second cleaning box (31), pouring the conductive liquid (72) into the conductive box (4), and pouring the electroplating liquid (73) with the anode metal ions into the electroplating box (5);
step two: the method comprises the following steps that a plating line (2) wound on a pay-off reel (13) penetrates through a first wire wheel (12) at the rear end of a first cleaning box (3) and a second wire wheel (10) in a second groove (9) to extend into the first cleaning box (3), penetrates through a first groove (62) in a first limiting wheel (61), and the plating line (2) penetrates through the second wire wheel (10) and the first wire wheel (12) in the second groove (9) at the front end of the first cleaning box (3) to extend to the front end of a conductive box (4);
step three: the electroplating wire (2) passes through a first wire wheel (12) arranged at the front end of the conductive box (4) and a second wire wheel (10) in the second groove (9) and extends into the conductive box (4), passes through a first groove (62) on the first limiting wheel (61), and extends to the rear end of the electroplating box (5) after passing through the second wire wheel (10) and the first wire wheel (12) arranged in the second groove (9) at the rear end of the conductive box (4);
step four: the electroplating wire (2) penetrates through a first wire guide wheel (12) arranged at the rear end of the electroplating box (5), a second wire guide wheel (10) arranged in a second groove (9) arranged at the rear end of the electroplating box (5) and extending into the electroplating box (5), penetrates through a first groove (62) on the first limiting wheel (61), and extends to the front end of the second cleaning box (31) after penetrating through the second wire guide wheel (10) and the first wire guide wheel (12) in the second groove (9) at the front end of the electroplating box (5);
step five: the electroplating wire (2) passes through a first wire wheel (12) arranged at the front end of the second cleaning box (31) and a second wire wheel (10) in the second groove (9) and extends into the second cleaning box (31), passes through a first groove (62) on the first limiting wheel (61), and is connected with the take-up reel (14) after passing through the second cleaning box (31) and the second wire wheel (10) and the first wire wheel (12) arranged in the second groove (9);
step six: turning on a power supply (71), respectively transmitting the positive electrode electricity and the negative electrode electricity to a positive electrode plate II (82) and a negative electrode plate I (81) through a lead I (83), transmitting the positive electrode electricity and the negative electrode electricity into the conductive liquid (72) through the negative electrode plate I (81), and transmitting the conductive liquid into the electroplating liquid (73) through the positive electrode plate II (82);
step seven: the paying-off disc (13) and the take-up disc (14) are rotated, the electroplating wire (2) passes through the first cleaning box (3) and is limited by the first groove (62) and the lug (64), and the electroplating wire (2) is cleaned by the cleaning layer (66);
step eight: the cleaned electroplating wire (2) is transmitted to the conductive box (4) through the wire wheel II (10) and the wire wheel I (12), the negative electrode is transmitted to the electroplating wire (2) through the conductive liquid (72), so that the electroplating wire (2) has negative ions, the negative ions on the electroplating wire (2) and the metal cations in the electroplating solution (73) are absorbed in a different phase through the wire wheel I (12) and the wire wheel II (10) and are electroplated for the electroplating wire (2), the electroplated electroplating wire (2) is transmitted to the cleaning box II (31) and is cleaned, and the wire is wound through the take-up reel (14).
CN202110985670.3A 2021-08-26 2021-08-26 Continuous plating liquid conductor Withdrawn CN113604848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110985670.3A CN113604848A (en) 2021-08-26 2021-08-26 Continuous plating liquid conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110985670.3A CN113604848A (en) 2021-08-26 2021-08-26 Continuous plating liquid conductor

Publications (1)

Publication Number Publication Date
CN113604848A true CN113604848A (en) 2021-11-05

Family

ID=78342054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110985670.3A Withdrawn CN113604848A (en) 2021-08-26 2021-08-26 Continuous plating liquid conductor

Country Status (1)

Country Link
CN (1) CN113604848A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201082905Y (en) * 2007-07-09 2008-07-09 唐文玺 Wire electric plating machine
CN202214437U (en) * 2011-09-22 2012-05-09 天诺光电材料股份有限公司 Device for producing strip-shaped composite conducting material
CN202492604U (en) * 2012-03-07 2012-10-17 昆山东威电镀设备技术有限公司 Continuous plating liquid conductive device
CN103305896A (en) * 2012-03-07 2013-09-18 昆山东威电镀设备技术有限公司 Continuous-electroplating liquid conduction apparatus and continuous liquid electroplating method
CN104928739A (en) * 2015-06-30 2015-09-23 西安菲尔特金属过滤材料有限公司 Wire rod continuous electroplating equipment and method
CN205934104U (en) * 2016-07-19 2017-02-08 江西江冶实业有限公司 Copper line tinning stack
CN112176385A (en) * 2020-10-10 2021-01-05 深圳市顺益丰实业有限公司 Continuous electroplating liquid conductive device and continuous liquid electroplating method
CN213113552U (en) * 2020-07-29 2021-05-04 无锡市品鑫智能机电科技有限公司 Electroplating device of buddha's warrior attendant line
CN112981514A (en) * 2021-04-22 2021-06-18 惠州市科伟泰自动化设备有限公司 Horizontal roll-to-roll PET film iron plating production line

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201082905Y (en) * 2007-07-09 2008-07-09 唐文玺 Wire electric plating machine
CN202214437U (en) * 2011-09-22 2012-05-09 天诺光电材料股份有限公司 Device for producing strip-shaped composite conducting material
CN202492604U (en) * 2012-03-07 2012-10-17 昆山东威电镀设备技术有限公司 Continuous plating liquid conductive device
CN103305896A (en) * 2012-03-07 2013-09-18 昆山东威电镀设备技术有限公司 Continuous-electroplating liquid conduction apparatus and continuous liquid electroplating method
CN104928739A (en) * 2015-06-30 2015-09-23 西安菲尔特金属过滤材料有限公司 Wire rod continuous electroplating equipment and method
CN205934104U (en) * 2016-07-19 2017-02-08 江西江冶实业有限公司 Copper line tinning stack
CN213113552U (en) * 2020-07-29 2021-05-04 无锡市品鑫智能机电科技有限公司 Electroplating device of buddha's warrior attendant line
CN112176385A (en) * 2020-10-10 2021-01-05 深圳市顺益丰实业有限公司 Continuous electroplating liquid conductive device and continuous liquid electroplating method
CN112981514A (en) * 2021-04-22 2021-06-18 惠州市科伟泰自动化设备有限公司 Horizontal roll-to-roll PET film iron plating production line

Similar Documents

Publication Publication Date Title
CN1717153B (en) Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
CN209082016U (en) A kind of Electrolytic copper foil generator
JP2021046604A (en) Metal-coating device
CN100420774C (en) Zinc alloy slide fastener electroplating device
US2431065A (en) Continuous wire and strip electro-processing machine
CN204608185U (en) A kind of Electrolytic copper foil generator
CN116837431A (en) Method and device for horizontal electroplating of battery piece
CN102181899A (en) Method for synchronously roughening both surfaces of electrolytic copper foil and equipment thereof
CN215163246U (en) Sand feeding device for electroplated diamond wire
CN209243210U (en) A kind of double photoelectrolysis copper foil anti-oxidation treatment devices
CN113604848A (en) Continuous plating liquid conductor
CN104577133A (en) Production equipment of copper foil of negative current collector of ultra-thin lithium battery
CN105177658B (en) A kind of rolled copper foil surface treating machine
CN212357433U (en) Electroplating device in electroplating production line
CN114318457A (en) Aluminum foil single-side thermoelectric chemical oxidation treatment device
CN203128675U (en) Cathode plate for electrolytic copper powder
CN209397292U (en) A kind of strip electrolytic cleaned electrode plate
CN218385270U (en) Production equipment for positive and negative plates of battery
CN220413558U (en) Lithium electricity copper foil all-in-one
CN203065625U (en) Novel swing type vapor plating device for chip-type gadget
CN104342742A (en) Electrode configuration structure of galvanization electroplating bath
CN206447959U (en) A kind of diamond wire nickel plating apparatus
CN217839178U (en) Diamond wire electroplating conductive wheel
CN211734511U (en) Electroplating device for rear cover of mobile phone
CN210657213U (en) Steel strip electrolysis stripping tank

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20211105