CN103295644A - Memory device - Google Patents
Memory device Download PDFInfo
- Publication number
- CN103295644A CN103295644A CN2012100434069A CN201210043406A CN103295644A CN 103295644 A CN103295644 A CN 103295644A CN 2012100434069 A CN2012100434069 A CN 2012100434069A CN 201210043406 A CN201210043406 A CN 201210043406A CN 103295644 A CN103295644 A CN 103295644A
- Authority
- CN
- China
- Prior art keywords
- power supply
- soldered ball
- storage arrangement
- voltage
- weld pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a memory device which can operate under an operation mode. The memory device comprises a plurality of solder balls, a memory circuit as well as a processing circuit; the memory circuit is coupled with the solder balls; under the operation mode, the memory circuit receives a first working voltage as well as a first common terminal voltage so as to perform an memory operation; the processing circuit performs a preset operation; the solder balls comprise a plurality of first power supply solder balls, and under the operation mode, the first power supply solder balls receive a first voltage level. In the first power supply solder balls, at least one first power supply solder ball is coupled with the processing circuit.
Description
Technical field
The invention relates to a kind of storage arrangement, it can be avoided after memory device package, and the test circuit in the storage arrangement under the storage arrangement running maloperation takes place, and causes unnecessary current drain.
Background technology
Storage arrangement with Wind I/O framework is after packed, when being applied to an operating system, the power supply that this storage arrangement is required, comprising operating voltage (VDD) and common terminal voltage (VSS), is that the power supply soldered ball (bumping ball) of operating system by storage arrangement provides thus.Before memory device package, generally can test storage arrangement.Because the volume of soldered ball is very little, memory circuitry and the required power supply of test circuit when probe (probe card) can't directly provide test by the power supply soldered ball in the storage arrangement.Therefore, needing at test circuit power supply weld pad (power pad) to be set in addition at storage arrangement to provide power supply for probe.The power supply weld pad is connected with the power supply soldered ball, and therefore, the power supply that is received from probe by the power supply weld pad can move to test for memory circuitry and test circuit.After test finished and encapsulates, test circuit need be in non-action state.Yet, when the storage arrangement after the encapsulation is applied to an operating system and this operating system power supply soldered ball by storage arrangement power supply is provided, because the power supply weld pad is connected with the power supply soldered ball, therefore power supply still can provide to proving installation, this may make test circuit carry out misoperation, though or be failure to actuate, still consume unnecessary electric current.
Therefore, expectation provides a kind of storage arrangement, and it can be avoided after memory device package, and the test circuit in the storage arrangement under the storage arrangement running maloperation takes place, though or be failure to actuate, still consume unnecessary current drain.
Summary of the invention
The invention provides a kind of storage arrangement, be operable under the operating mode.This storage arrangement comprises a plurality of soldered balls, a memory circuitry and a treatment circuit.Memory circuitry couples these soldered balls.Under operating mode, memory circuitry receives one first operating voltage and one first common terminal voltage to carry out a storage operation.Treatment circuit is carried out a predetermined registration operation.These soldered balls comprise a plurality of first power supply soldered balls, and under this operating mode, these first power supply soldered balls receive one first voltage level.In these first power supply soldered balls, at least one first power supply soldered ball couples treatment circuit.
Storage arrangement of the present invention can be avoided after memory device package, and the test circuit in the storage arrangement under the storage arrangement running maloperation takes place, though or be failure to actuate, still consume unnecessary current drain.
Description of drawings
Figure 1A represents storage arrangement according to an embodiment of the invention;
Figure 1B represents the relation that couples between the interior soldered ball of the storage arrangement of Figure 1A and the memory circuitry;
The power supply reception condition of power supply weld pad when Fig. 2 A～Fig. 2 B represents that the storage arrangement of Figure 1A is in AD HOC;
Fig. 3 A represents storage arrangement according to another embodiment of the present invention;
The relation that couples in the storage arrangement of Fig. 3 B presentation graphs 3A between soldered ball and the memory circuitry;
The power supply reception condition of power supply weld pad when the storage arrangement of Fig. 4 A～Fig. 4 B presentation graphs 3A is in AD HOC.
Drawing reference numeral:
1,3～storage arrangement; 10～memory circuitry;
11～treatment circuit; G1, G2～soldered ball group;
B1-1...B1-n, B2-1...B2-n～soldered ball;
PD110, PD111, PD120, PD121～power supply weld pad;
VDD10, VDD20, VDD21～operating voltage;
VSS10, VSS20, VSS21～common terminal voltage.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Figure 1A represents the storage arrangement according to the embodiment of the invention.Consult Figure 1A, storage arrangement 1 comprises memory circuitry 10 and treatment circuit 11.In Figure 1A, the position of element on storage arrangement 1 is a demonstration example only, in practical application, and the circuit layout that the position of element on storage arrangement 1 can interdependent reservoir device 1 or its specification and decide.Storage arrangement 1 is operable under an operating mode or the AD HOC.Under this AD HOC, treatment circuit 11 is carried out a predetermined registration operation.Storage arrangement 1 disposes a plurality of soldered balls (bumping ball).In the embodiment of Figure 1A, a plurality of soldered balls are configured to a 1x2 array, and wherein, soldered ball B1-1～B1-n is configured in first row, and soldered ball B2-1～B2-n is configured in secondary series.The soldered ball configuration of Figure 1A only is one gives an example, not as limit.In other embodiments, soldered ball configuration can be decided according to the circuit-board laying-out of storage arrangement or its specification.As shown in Figure 1B, first list on soldered ball B1-1～B1-n and the secondary series circuit by the circuit-board laying-out of storage arrangement 1 of B2-1～B2-4 and B2-6～B2-n at least and couple memory circuitry 10.In soldered ball B1-1～B1-n and B2-1～B2-n, comprise a plurality of power supply soldered balls of first G1 of group and a plurality of power supply soldered balls of second G2 of group.Consult Figure 1A, the power supply soldered ball of first G1 of group comprises soldered ball B1-1～B1-5, and the power supply soldered ball of first G2 of group comprises soldered ball B2-1～B2-5.In this embodiment, the power supply soldered ball of first G1 of group is made up of the soldered ball B1-1～B1-5 that lists configuration in regular turn at first of 1x2 array, and the power supply soldered ball of second G2 of group is made up of the soldered ball B2-1～B2-5 that disposes in regular turn on the secondary series of 1x2 array, but non-as limit.In other embodiments, the power supply soldered ball of same group can be made up of the soldered ball of discontinuous configuration on first row or secondary series, or is made up of some soldered balls that are configured in first row and some soldered balls that are configured in secondary series.
According to embodiments of the invention, in power supply soldered ball B2-1～B2-5 of second G2 of group, at least one power supply soldered ball couples treatment circuit 11.In the embodiment of Figure 1A, be that to couple treatment circuit 11 be example for the power supply soldered ball B2-5 that belongs to second G2 of group.In other embodiments, in power supply soldered ball B2-1～B2-5 of second G2 of group, couple quantity and the configuration in first G1 of group of the power supply soldered ball for the treatment of circuit 11, can be according to the circuit-board laying-out of storage arrangement or its specification and decide.
Consult Figure 1A, storage arrangement 1 more comprises power supply weld pad (power pad) PD120 and PD121.Power supply weld pad PD120 couples power supply soldered ball B1-1～B1-5 of first G1 of group.Power supply weld pad PD121 couples the power supply soldered ball B2-1～B2-4 except power supply soldered ball B2-5 among second G2 of group.The personage of this technical field is known, and the volume/area of weld pad is greater than the volume/area of soldered ball.
In one embodiment, treatment circuit 11 can be a test circuit, in order to execute store test operation (being above-mentioned predetermined registration operation) under the above-mentioned AD HOC before storage arrangement 1 encapsulation.Treatment circuit 11 comprises power supply weld pad PD110 and PD111.Power supply soldered ball B2-5 couples power supply weld pad PD110.
Consult Fig. 2 A, when storage arrangement 1 operates in AD HOC following time, provide operating voltage VDD21 and common terminal voltage VSS21 to power supply weld pad PD110 and PD111 respectively by an external probe card, make processing unit 11 move to carry out test operation.Because power supply weld pad PD110 couples power supply soldered ball B2-5, therefore, power supply soldered ball B2-5 is accurate by the position that power supply weld pad PD110 receives operating voltage VDD21.Because power supply soldered ball B2-5 is not coupled to memory circuitry 10, operating voltage VDD21 provides the action that does not influence memory circuitry 10.In addition, the external probe card also provides operating voltage VDD20 and common terminal voltage VSS20 to power supply weld pad PD120 and PD121 respectively.Because power supply weld pad PD120 couples power supply soldered ball B1-1～B1-5 of first G1 of group, and power supply weld pad PD121 couples power supply soldered ball B2-1～B2-4 of second G2 of group, therefore power supply soldered ball B1-1～B1-5 receives the position standard of operating voltage VDD20, and the position of power supply soldered ball B2-1～B2-4 reception common terminal voltage VDD21 is accurate.Thus, 10 of memory circuitries can receive operating voltage VDD20 and common terminal voltage VSS20 by power supply soldered ball B1-1～B1-5 and B2-1～B2-4 and power supply weld pad PD120 and PD121, make memory circuitry 10 actions.Under this AD HOC, treatment circuit 11 is carried out test operation with the operation of control store circuit 10 execute stores, and judges whether the running of memory circuitry 10 makes a mistake.
Return to consult Figure 1A, after storage arrangement 1 encapsulation, storage arrangement 1 is operable under the operating mode.For instance, after storage arrangement 1 encapsulation, storage arrangement 1 can be applicable to an operating system, and operates under the operating mode according to the control of this operating system.Under operating mode, operating system provides power supply soldered ball B1-1～B1-5 of operating voltage VDD10 to the first G1 of group, therefore power supply soldered ball B1-1～B1-5 has received the position standard of operating voltage VDD10, in addition, operating system also provides power supply soldered ball B2-1～B2-5 of common terminal voltage VSS10 to the second G2 of group, so power supply soldered ball B2-1～B2-5 receives the position standard of common terminal voltage VSS10.10 of memory circuitries can receive operating voltage VDD10 and common terminal voltage VSS10 by power supply soldered ball B1-1～B1-5 and B2-1～B2-5, make memory circuitry 10 move to carry out storage operation.According to above-mentioned, because the power supply weld pad PD110 of processing unit 11 couples power supply soldered ball B2-5, therefore, power supply weld pad PD110 is accurate by the position that power supply soldered ball B2-5 receives common terminal voltage VSS10.Thus, receive the power supply weld pad PD110 of operating voltage VDD21 under AD HOC, the position that is pulled down to common terminal voltage VSS10 when operating mode is accurate.In addition, under operating mode, it is accurate that the power supply weld pad PD111 of processing unit 11 also receives the position of common terminal voltage VSS10.Because the power supply weld pad PD110 for the treatment of circuit 11 is accurate with the position that PD111 receives common terminal voltage VSS10, so treatment circuit 11 is failure to actuate, and the minimizing current drain.
In certain embodiments, under AD HOC, it is accurate that the position of operating voltage VDD20 will definitely be same as the position of operating voltage VDD21; In further embodiments, under AD HOC, the position of operating voltage VDD20 will definitely be inequality in the position of operating voltage VDD21 standard.
In the embodiment of Figure 1A～Fig. 2 A figure, under AD HOC, it is accurate that the position of common terminal voltage VSS20 will definitely be same as the position of common terminal voltage VSS21.Therefore, the power supply weld pad PD111 for the treatment of circuit 11 can couple the power supply weld pad PD121 of memory circuitry 10, shown in Fig. 2 B.In the case, the position of common terminal voltage VSS20 and VSS21 will definitely be to be ground voltage position standard.
In further embodiments, under AD HOC, the position of common terminal voltage VSS20 will definitely be inequality in the position of common terminal voltage VSS21 standard, and in the case, one position will definitely be to be ground voltage position standard among common terminal voltage VSS20 and the VSS21.
In Figure 1B, the first soldered ball B1-1～B1-n that lists and the B2-1～B2-4 on the secondary series and B2-6～B2-n couple memory circuitry 10 by circuit separately.Learn that according to above-mentioned no matter be under operating mode or AD HOC, power supply soldered ball B1-1～B1-5 of first G1 of group receives identical voltage level.Therefore, in certain embodiments, power supply soldered ball B1-1～B1-5 of first G1 of group is coupled to memory circuitry after can be connected to each other again.And about power supply soldered ball B2-1～B2-5 of second G2 of group, because under AD HOC, the voltage level that the power supply soldered ball B2-5 that couples with power supply weld pad PD110 is different with other power supply soldered balls B2-1～B2-4 reception.Therefore, power supply soldered ball B2-1～B2-4 of second G2 of group is coupled to memory circuitry 10 after can be connected to each other again.Power supply soldered ball B2-5 is not connected with other power supply soldered balls B2-1～B2-4.In addition, power supply soldered ball B2-5 is not coupled to memory circuitry 10, and after memory device package 1, power supply soldered ball B2-5 and other power supply soldered balls B2-1～B2-4 are coupled to the ground voltage of system, i.e. VSS10.
Fig. 3 A represents storage arrangement according to another embodiment of the present invention.In Figure 1A and Fig. 3 A, components identical indicates with identical reference symbol, and carries out identical operations.At the storage arrangement 3 of the storage arrangement 1 that compares Figure 1A with Fig. 3 A, both different parts are the relation that couples between power supply weld pad and the power supply soldered ball.Consult Fig. 3 A, in power supply soldered ball B1-1～B1-5 of first G1 of group, at least one power supply soldered ball couples the power supply weld pad PD111 for the treatment of circuit 11.In the embodiment of Fig. 3 A, be that to couple treatment circuit 11 be example for the power supply soldered ball B1-5 that belongs to first G1 of group.In other embodiments, in power supply soldered ball B1-1～B1-5 of first G1 of group, couple quantity and the configuration in first G1 of group of the power supply soldered ball for the treatment of circuit 11, can be according to the circuit-board laying-out of storage arrangement or its specification and decide.Power supply weld pad PD120 couples the power supply soldered ball B1-1～B1-4 except power supply soldered ball B1-5 among first G1 of group.Power supply weld pad PD121 couples power supply soldered ball B2-1～B2-5 of second G2 of group.
Consult Fig. 3 B, in this embodiment, first lists the circuit by the circuit-board laying-out of storage arrangement 1 of B2-1～B2-n on the soldered ball B1-1～B1-4 and B1-6～B1-n and secondary series at least couples memory circuitry 10.
Consult Fig. 4 A, when storage arrangement 3 operates in AD HOC following time, provide operating voltage VDD21 and common terminal voltage VSS21 to power supply weld pad PD110 and PD111 respectively by an external probe card, make processing unit 11 move to carry out test operation.Because power supply weld pad PD111 couples power supply soldered ball B1-5, therefore, power supply soldered ball B1-5 is accurate by the position that power supply weld pad PD111 receives common terminal voltage VSS21.Because power supply soldered ball B1-5 is not coupled to memory circuitry 10, operating voltage VSS21 provides the action that does not influence memory circuitry 10.In addition, this outside probe also provides operating voltage VDD20 and common terminal voltage VSS20 to power supply weld pad PD120 and PD121 respectively.Because power supply weld pad PD120 couples power supply soldered ball B1-1～B1-4 of first G1 of group, and power supply weld pad PD121 couples power supply soldered ball B2-1～B2-5 of second G2 of group, therefore power supply soldered ball B1-1～B1-4 receives the position standard of operating voltage VDD20, and the position of power supply soldered ball B2-1～B2-5 reception common terminal voltage VDD21 is accurate.Thus, 10 of memory circuitries can receive operating voltage VDD20 and common terminal voltage VSS20 by power supply soldered ball B1-1～B1-4 and B2-1～B2-5 and power supply weld pad PD120 and PD121, make memory circuitry 10 actions.Under this AD HOC, treatment circuit 11 is carried out test operation with the operation of control store circuit 10 execute stores, and judges whether the running of memory circuitry 10 makes a mistake.
Return to consult Fig. 3 A, after storage arrangement 3 encapsulation, storage arrangement 3 is operable under the operating mode.For instance, after storage arrangement 3 encapsulation, storage arrangement 3 can be applicable to an operating system, and operates under the operating mode according to the control of this operating system.Under operating mode, power supply soldered ball B1-1～B1-5 of operating voltage VDD10 to the first G1 of group is provided by operating system, therefore power supply soldered ball B1-1～B1-5 has received the position standard of operating voltage VDD10, in addition, also provided power supply soldered ball B2-1～B2-5 of common terminal voltage VSS10 to the second G2 of group by operating system, so power supply soldered ball B2-1～B2-5 receives the position standard of common terminal voltage VSS10.10 of memory circuitries can receive operating voltage VDD10 and common terminal voltage VSS10 by power supply soldered ball B1-1～B1-5 and B2-1～B2-5, make memory circuitry 10 move to carry out storage operation.According to above-mentioned, because the power supply weld pad PD111 of processing unit 11 couples power supply soldered ball B1-5, therefore, power supply weld pad PD111 is accurate by the position that power supply soldered ball B1-5 receives operating voltage VDD10.Thus, receive the power supply weld pad PD120 of operating voltage VSS21 under AD HOC, the position that is pulled to operating voltage VDD10 when operating mode is accurate.In addition, under operating mode, it is accurate that the power supply weld pad PD110 of processing unit 11 also receives the position of operating voltage VDD10.Because the power supply weld pad PD120 for the treatment of circuit 11 is accurate with the position that PD121 receives operating voltage VDD10, so treatment circuit 11 is failure to actuate, and the minimizing current drain.
In the embodiment of Fig. 3 A～Fig. 4 A, under AD HOC, it is accurate that the position of operating voltage VDD20 will definitely be same as the position of operating voltage VDD21.Therefore, the power supply weld pad PD111 for the treatment of circuit 11 can couple the power supply weld pad PD121 of memory circuitry 10, shown in Fig. 4 B.
In further embodiments, under AD HOC, the position of working end voltage VDD20 will definitely be inequality in the position of operating voltage VDD21 standard.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limiting scope of the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.
Claims (13)
1. a storage arrangement can operate under the operating mode, it is characterized in that, described storage arrangement comprises:
A plurality of soldered balls;
One memory circuitry couples described soldered ball, and under described operating mode, receives one first operating voltage and one first common terminal voltage to carry out a storage operation;
One treatment circuit is carried out a predetermined registration operation;
Wherein, described soldered ball comprises a plurality of first power supply soldered balls, and under described operating mode, the described first power supply soldered ball receives one first voltage level; And
Wherein, in the described first power supply soldered ball, at least one first power supply soldered ball couples described treatment circuit.
2. storage arrangement as claimed in claim 1 is characterized in that, in the described first power supply soldered ball, other the described first power supply soldered balls except the described at least one first power supply soldered ball that couples described treatment circuit are connected to each other.
3. storage arrangement as claimed in claim 1 is characterized in that, described soldered ball more comprises a plurality of second source soldered balls, and under described operating mode, described second source soldered ball receives one second voltage level.
4. storage arrangement as claimed in claim 3 is characterized in that, described first voltage level is that the position of described first common terminal voltage is accurate, and described second voltage level is the position standard of described first operating voltage.
5. storage arrangement as claimed in claim 1 is characterized in that, described treatment circuit comprises one first power supply weld pad, and the described at least one first power supply soldered ball in the described first power supply soldered ball couples the described first power supply weld pad.
6. storage arrangement as claimed in claim 5, it is characterized in that, described storage arrangement can also operate under the AD HOC, under described AD HOC, described at least one first power supply soldered ball in the described first power supply soldered ball receives one second voltage level by the described first power supply weld pad, and other the described first power supply soldered balls except the described at least one first power supply soldered ball that couples described treatment circuit receive a tertiary voltage position standard in the described first power supply soldered ball.
7. storage arrangement as claimed in claim 6, it is characterized in that, under described AD HOC, described treatment circuit receives one second operating voltage and one second common terminal voltage carrying out a predetermined registration operation, and described storer receives one the 3rd operating voltage and one the 3rd common terminal voltage to carry out described storage operation.
8. storage arrangement as claimed in claim 7 is characterized in that, under described AD HOC, the described first power supply weld pad receives described second operating voltage, makes that described second voltage level is the position standard of described second operating voltage; And
Wherein, described tertiary voltage position standard is that the position of described the 3rd common terminal voltage is accurate.
9. storage arrangement as claimed in claim 8 is characterized in that, described storage arrangement more comprises:
One second source weld pad, wherein, under described AD HOC, other described first power supply soldered balls in the described first power supply soldered ball except the described at least one first power supply soldered ball that couples described treatment circuit receive described the 3rd common terminal voltage by described second source weld pad, make that accurate position for described the 3rd common terminal voltage, described tertiary voltage position is accurate.
10. storage arrangement as claimed in claim 9 is characterized in that, described treatment circuit more comprises one the 3rd power supply weld pad, receives described second common terminal voltage.
11. storage arrangement as claimed in claim 7 is characterized in that, under described AD HOC, the described first power supply weld pad receives described second common terminal voltage, makes that described second voltage level is the position standard of described second common terminal voltage; And
Wherein, described tertiary voltage position standard is that the position of described the 3rd operating voltage is accurate.
12. storage arrangement as claimed in claim 11 is characterized in that, described storage arrangement more comprises:
One second source weld pad, wherein, under described AD HOC, other described first power supply soldered balls in the described first power supply soldered ball except the described at least one first power supply soldered ball that couples described treatment circuit receive described the 3rd operating voltage by described second source weld pad, make that accurate position for described the 3rd operating voltage, described tertiary voltage position is accurate.
13. storage arrangement as claimed in claim 12 is characterized in that, described treatment circuit more comprises one the 3rd power supply weld pad, receives described second operating voltage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210043406.9A CN103295644B (en) | 2012-02-24 | 2012-02-24 | Storage arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210043406.9A CN103295644B (en) | 2012-02-24 | 2012-02-24 | Storage arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103295644A true CN103295644A (en) | 2013-09-11 |
| CN103295644B CN103295644B (en) | 2016-01-27 |
Family
ID=49096370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210043406.9A Active CN103295644B (en) | 2012-02-24 | 2012-02-24 | Storage arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103295644B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115360159A (en) * | 2022-10-19 | 2022-11-18 | 北京登临科技有限公司 | Integrated circuit package, coprocessor chip, printed circuit board, board card and electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656433A (en) * | 2002-04-01 | 2005-08-17 | 英特尔公司 | Providing in package power supplies for integrated circuits |
| KR20080038985A (en) * | 2006-10-31 | 2008-05-07 | 주식회사 하이닉스반도체 | Circuit of switching for test pad for memory device |
-
2012
- 2012-02-24 CN CN201210043406.9A patent/CN103295644B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656433A (en) * | 2002-04-01 | 2005-08-17 | 英特尔公司 | Providing in package power supplies for integrated circuits |
| KR20080038985A (en) * | 2006-10-31 | 2008-05-07 | 주식회사 하이닉스반도체 | Circuit of switching for test pad for memory device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115360159A (en) * | 2022-10-19 | 2022-11-18 | 北京登临科技有限公司 | Integrated circuit package, coprocessor chip, printed circuit board, board card and electronic equipment |
| CN115360159B (en) * | 2022-10-19 | 2023-01-31 | 北京登临科技有限公司 | Integrated circuit package, coprocessor chip, printed circuit board, board card and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103295644B (en) | 2016-01-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11139511B2 (en) | Control circuit, battery having the control circuit and battery control method | |
| US8700817B2 (en) | Detection device | |
| CN103853678A (en) | Board management device and board management system and control card using same | |
| CN105811493A (en) | Power source circuit, power source circuit discharging method, power source circuit charging method and controller | |
| US20130040590A1 (en) | Electronic circuit and radio communications system | |
| CN112859682A (en) | Control chip, control device and electronic equipment | |
| US9927493B2 (en) | Battery monitor system | |
| CN101546216A (en) | Reset circuit | |
| JP2020505894A (en) | Control circuit compatible with battery and external power supply | |
| CN103295644A (en) | Memory device | |
| CN204020594U (en) | A kind of vehicular power-bottle power-fail detection circuit and automobile | |
| CN104137417A (en) | Analog signal compatible cmos switch as an integrated peripheral to a standard microcontroller | |
| CN103092300A (en) | Internal storage power supply control circuit | |
| CN109684762B (en) | Chip and setting circuit of pin thereof | |
| CN104079020B (en) | Computer and charging circuit thereof | |
| CN108762458B (en) | Method and device for simultaneously realizing on-off control and voltage conversion of circuit | |
| CN102708924A (en) | Semiconductor integrated circuit | |
| CN202931279U (en) | Circuit capable of realizing I2C hot plug and I2C device | |
| CN110780108A (en) | Peak detection unit, detection system and detection method | |
| CN116346117B (en) | IIC port expansion circuit, transmission method, transmission system, computer equipment and medium | |
| CN106547232B (en) | A kind of hard switching circuit | |
| JP6213187B2 (en) | Data storage device and communication device including the same | |
| CN105739661A (en) | Voltage conversion circuit | |
| CN219059437U (en) | Power supply circuit of operation panel of clothes treatment combined equipment | |
| CN218768574U (en) | Display screen and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |