CN103280412B - For the hot-press arrangement of anisotropy conductiving glue in a kind of back bonding equipment - Google Patents
For the hot-press arrangement of anisotropy conductiving glue in a kind of back bonding equipment Download PDFInfo
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- CN103280412B CN103280412B CN201310095073.9A CN201310095073A CN103280412B CN 103280412 B CN103280412 B CN 103280412B CN 201310095073 A CN201310095073 A CN 201310095073A CN 103280412 B CN103280412 B CN 103280412B
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Abstract
The invention discloses the hot-press arrangement for anisotropy conductiving glue in a kind of back bonding equipment, for carrying out hot pressing to conducting resinl in back bonding equipment, it is characterized in that, this hot-press arrangement comprises: pressure head component (2), for carrying out hot pressing to guiding glue; Guidance set (1), it is arranged on a supporting base (4), and described pressure head component (2) is arranged on this guidance set (1), and described pressure head component (2) carries out guiding movement to complete hot pressing by this guidance set (1); Driven unit (5), it is arranged on described guidance set (1) side, for driving described guidance set (1) to move linearly, to realize its guiding movement to pressure head component (2).Device of the present invention can realize the hot pressing in heat pressing process easily, and possesses pressure stability and precision is good, and the precision of hot pressing is high, the advantages such as compact conformation.
Description
Technical field
The invention belongs to Flip-Chip Using bonding techniques field, be specifically related to a kind of hot-press arrangement for back bonding equipment, be applicable to the hot-press solidifying of anisotropy conductiving glue in heat pressing process.
Background technology
Flip-chip (Flip chip) be a kind of containing circuit unit without pin configuration chip, it is positioned at tin ball (conductive adhesive covered) realization on its face on electric and be mechanically connected to circuit by right quantity.Flip-chip is deposit tin shot on I/Opad, and the tin shot then chip upset being added heat utilization melting combines with ceramic wafer, and this technology has been replaced conventional routing and engaged, and becomes following encapsulation trend gradually.In recent years, Flip-Chip had become the packing forms often adopted in high side device and high-density packages field.The range of application of Flip-Chip encapsulation technology is increasingly extensive, and packing forms is variation more, also improves the requirement of Flip-Chip encapsulation technology thereupon.The chip active district of flip-chip is in the face of substrate, realized the interconnection of chip and substrate by the solder bump in arrayed on chip, silicon chip is directly installed to PCB in back-off mode and draws I/O from silicon chip to surrounding, and interconnected length shortens greatly, reduce RC to postpone, effectively improve electrical property.In all surface mounting technique, flip-chip can reach minimum, the thinnest encapsulation, compared with other technology, in size, outward appearance, flexibility, reliability and cost etc., has very large advantage.
In recent years, the tin ball used in flip-chip is slowly replaced by conducting resinl, conducting resinl is a kind of adhesive solidifying or have certain electric conductivity after drying, it is main constituent with matrix resin and conductive filler and conducting particles usually, by the bonding effect of matrix resin, conducting particles is combined, form conductive path, the conduction realized by gluing material connects.Matrix resin due to conducting resinl is a kind of adhesive, the curing temperature be suitable for can be selected to carry out bonding, as epoxy resin adhesive can in room temperature to 150 DEG C solidification, welding temperature far below more than 200 DEG C that tin lead welding connects, avoiding problems material deformation that welding high temperature may cause, the fire damage of electronic device and the formation of internal stress.Simultaneously, due to the miniaturization of electronic component, microminiaturization and the densification of printed circuit board (PCB) and developing rapidly of Highgrade integration, the minimum pitch of the 0.65mm of slicker solder welding can not meet the actual demand of conduction connection far away, and conducting resinl can make slurry, realizes very high linear resolution.And conducting resinl technique is simple, is easy to operation, can enhances productivity, it also avoid the environmental pollution that heavy metal lead in tin-lead solder causes.So conducting resinl is the welding of alternative slicker solder, realize the ideal chose that conduction connects.Current conducting resinl has been widely used in the encapsulation of the electronic components such as LCDs (LCD), light-emitting diode (LED), integrated circuit (IC) chip, pcb component (PCBA), lattice block, ceramic condenser, thin film switch, smart card, radio-frequency (RF) identification and assembly and bonding.
Anisotropy conductiving glue (ACAs, AnisotropicConductiveAdhesives) refers in one direction as Z-direction conduction, and at X and the nonconducting adhesive of Y-direction.In general the preparation of ACA requires higher to equipment and process, compares and is not easy to realize, be comparatively used for the occasions such as the meticulous printing of plate, as the printing of the plate in flat-panel monitor (FPDs).
In flip chip technology (fct), anisotropy conductiving glue needs to utilize heat pressing process to realize by hot-press arrangement.The structure of a kind of hot-press arrangement of the prior art, it utilizes cylinder as power source, and drive ram realizes Z-direction and moves on guide rail, wherein pressure head is fixed on lead, lead is fixed on guide rail, is placed on lead simultaneously, completes hot pressing by the compression of spring with spring.There is some deficiency in said apparatus: 1, cylinder is as power source, and pressure can not control accurately; 2, the coefficient of elasticity of single spring is also unstable, and in compression process, pressure precision is not high; 3, only use single guide rail, easily there is double swerve in slide block in motion process, affects test accuracy.
Summary of the invention
For prior art Problems existing, the object of the present invention is to provide a kind of hot-press arrangement for anisotropy conductiving glue back bonding equipment, this device can facilitate, realize expeditiously the hot pressing of chip, possess compact conformation, advantage that hot pressing precision is high simultaneously, and it has open platform, be convenient to laying of label.
According to one aspect of the present invention, provide a kind of hot-press arrangement, for carrying out hot pressing to conducting resinl in back bonding equipment, this hot-press arrangement provides power by adopting single axis robot, and adopting stepping motor as power source, Compress Spring produces pressure, to prevent the sudden change of pressure.
This hot-press arrangement comprises:
Pressure head component, for carrying out hot pressing to guiding glue;
Guidance set, it is arranged on a supporting base, and described pressure head component is arranged on this guidance set, and described pressure head component carries out guiding movement to complete hot pressing by this guidance set;
Driven unit, it is arranged on described guidance set side, for driving described guidance set to move linearly, to realize its guiding movement to pressure head component.
As improvement of the present invention, described guidance set also has keyset, and it is fixedly connected with described slide block, and described pressure head component is fixedly mounted on this keyset.
As improvement of the present invention, described guidance set also has the U-shaped plate as bracing frame, and it comprises the baffle plate being positioned at middle backboard and being vertically set on these backboard two ends, and described line slide rail is arranged on described backboard.
As improvement of the present invention, described guidance set also has optical axis, it is symmetrical and two that arrange with described line slideway axis being parallel, one end of each optical axis is fixed on one of them baffle plate of above-mentioned U-shaped plate, the other end stretches out through behind the hole on described keyset, described keyset can move axially by relatively described optical axis, for leading to it when keyset slides.
As improvement of the present invention, two described optical axises are socketed with spring, spring one end is connected to keyset end face, and the other end is connected on the baffle plate of optical axis stiff end, carries out cushioning when hot pressing and promote described keyset and slide block along the oppositely movement of described line slide rail for pressure head component.
As improvement of the present invention, described guidance set also has a multidiameter, and one end that its diameter is less is fixedly connected with described keyset, for leading to the reverse movement of described keyset through after another baffle plate of above-mentioned U-shaped plate.
As improvement of the present invention, described Step Shaft is socketed with spring, cushions for during described keyset reverse mobile, and realize the pretension to described keyset by this spring.
As improvement of the present invention, described pressure head component comprises connecting plate, be fixedly installed on the upper contiguous block of connecting plate bottom, with described upper contiguous block by thermal insulation board every hot linked lower connecting block, magnet is equipped with in described connecting plate, it is for being connected with keyset lower end magnetic, and described lower connecting block lower end is provided with pressure head.
As improvement of the present invention, described driven unit is preferably single axis robot.
Guidance set in the present invention is arranged on the right side of driven unit, comprise the U-shaped backboard be fixed on single axis robot's slide block, be arranged on multidiameter on U-shaped backboard successively from top to bottom, line slideway and slide block, polyurethane block and the optical axis being arranged on backboard lower end and the keyset be enclosed within optical axis, wherein polyurethane block is arranged on the two ends of line slideway, multidiameter and keyset are threaded connection fixing, and optical axis is arranged at U-shaped backboard bottom symmetrical.
Pressure head component of the present invention is arranged on the downside of guidance set, comprise the magnet be connected with described keyset, the contiguous block being followed successively by fixed magnet from top to bottom, upper contiguous block, the thermal insulation board be arranged symmetrically with, the lower connecting block being connected thermal insulation board and the pressure head worked and temperature sensor etc., wherein temperature sensor is installed in pressure head.
Spring assembly of the present invention is arranged at the centre of guidance set, comprise the upper spring be placed on described multidiameter and the lower spring be placed on described optical axis, the coefficient of elasticity wherein going up lower spring is different, the effective elasticity coefficient of the elastic construction of two groups of spring formation is connected by the coefficient of elasticity of two groups of springs and is obtained, and this effective elasticity coefficient is less by the impact of amount of spring compression or variations in temperature.
Driven unit of the present invention is arranged on the upside of supporting base, comprises motor, the shaft coupling be connected with motor output shaft, the ring flange be connected with shaft coupling and is arranged on the single axis robot of ring flange lower end.
Slide block of the present invention, line slideway are linear movement guide mechanism, and slide block connects pressure head by keyset, and two optical axises also slide in keyset simultaneously.
The present invention, in multidiameter, relative sliding between axle and hole, is provided with without oily lining.
Spring of the present invention can be changed, and the spring of different coefficient of elasticity can be used to test.
Pressure head component of the present invention is an independently module, is connected and fixed by magnet.
According to hot-press arrangement of the present invention compared with prior art, following advantage is possessed:
(1) coefficient of elasticity due to single spring is also unstable, the present invention uses the different spring of upper and lower two groups of coefficient of elasticity to carry out controlled pressure, the effective elasticity coefficient of the elastic construction of two groups of spring formation is connected by the coefficient of elasticity of two groups of springs and is obtained, this effective elasticity coefficient is less by the impact of amount of spring compression or variations in temperature, can realize the pressure controling precision being less than 0.1N easily.
(2) if only use line slideway and slide block as guiding mechanism, slide block is easy double swerve in motion process, impact is brought to experiment, the present invention is on the basis of line slideway and slide block, increase by two axis of guides, decreasing slide block double swerve at the volley, ensure that the linearity of pressure head in experimentation, avoiding because pressure head is biased to testing the error brought;
(3) driven by single axis robot, ensure that the linearity of motion;
(4) utilize axle and the relative sliding without oily lining, replace the direct relative sliding in axle and hole, reduce friction, extend the useful life of whole mechanism;
(5) spring is removable, uses the spring of different coefficient of elasticity, can realize the requirement of experiment under different pressures;
(6) U-shaped backboard entirety have employed U-shaped design, simultaneously in envisaged underneath U-type groove, makes the structure of whole hot-press arrangement become compacter, reduces the distance between pressure head component and line slideway, improve guidance quality;
(7) thermal head is a standalone module, and utilize magnet to carry out installation and fix, easy for installation, convertibility is good.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the hot-press arrangement of the embodiment of the present invention;
Fig. 2 is the composition structural representation of guidance set shown in Fig. 1;
Fig. 3 is the composition structural representation of pressure head component shown in Fig. 1.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.In addition, if below in described each execution mode of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
Fig. 1 is the overall structure schematic diagram of the hot-press arrangement of the present embodiment, and as shown in Figure 1, this device comprises guidance set 1, pressure head component 2, spring assembly 3, supporting base 4, driven unit 5.
Guidance set 1 is arranged on the side (being right side in FIG) of driven unit 5, for ensureing the linearity that pressure head component 2 is moved.Pressure head component 2 is arranged on the below of guidance set 1, is driven and the guiding of guidance set 1, do rectilinear motion in the vertical direction, complete autoclave test thus by driven unit 5.Spring assembly 3 is arranged on the centre of guidance set 1, for the deadweight that supports pressure head component 2 and the compression realized in experimentation; Coefficient of elasticity simultaneously due to single spring is also unstable, and the spring assembly 3 in the present embodiment is made up of upper and lower two groups of coefficient of elasticity.The effective elasticity coefficient of the elastic construction of two groups of spring formation is connected by the coefficient of elasticity of two groups of springs and is obtained.This effective elasticity coefficient is less by the impact of amount of spring compression or variations in temperature, can realize the pressure controling precision being less than 0.1N easily.Driven unit 5 is arranged on the upside of supporting base 4, for providing driving power to guidance set 1, ensures that the motion of guidance set 1 in hot pressing is one-dimension.
As shown in greater detail in figure 2, the guidance set 1 of the present embodiment comprises multidiameter 101, U-shaped backboard 102, keyset 103, optical axis 104, line slideway 105, slide block 106 and polyurethane block 107.Wherein, line slideway 105 is arranged on the rectangle boss on backboard 102 by screw, slide block 106 is arranged on line slideway 105, slide block 106 is connected by screw keyset 103, keyset 103 lower end connects pressure head component 2 by magnet, and slide block 106 and line slideway 105 form guiding mechanism, drive ram assembly 2 does rectilinear motion, keyset 103 can slide on optical axis 104 simultaneously, decreases the double swerve of slide block 106 on line slideway 105, ensure that the linearity of ram movement.Polyurethane block 107 is installed by screw in rectangle boss two ends, and anti-limited slip block 106 exceeds stroke in motion process.Optical axis 104 is two, is arranged symmetrically in the bottom of U-shaped backboard 102 by the screw thread bottom axle, and on two optical axises, cover has lower spring respectively.Keyset 103 is enclosed within two optical axises 104, supports its deadweight, be wherein provided with in keyset 103 without oily lining, by optical axis 104 and the relative sliding without oily lining, make pressure head component 2 can realize moving up and down, extend the life-span of structure simultaneously by lower spring.Multidiameter 101 is by the screwed hole being threaded on keyset 103 of bottom, and optical axis portion cover wherein has upper spring, and the coefficient of elasticity of upper spring is transformable, the test requirements document under using the upper spring of different coefficient of elasticity can realize different pressures.Carrying out pretension compression by turning multidiameter 101 pairs of upper springs on pretreatment, making upper spring be in micro-compressive state.Simultaneously the upper end optical axis portion of multidiameter 101 and U-shaped backboard 102 carry out relative sliding, and meet the compression needs of pressure head upper spring in motion process, be also provided with without oily lining equally in the hole of U-shaped backboard upper end, the life-span of playing extending mechanism acts on.
As particularly shown in fig. 3, pressure head component 2 comprises magnet 201, connecting plate 202, upper contiguous block 203, pressure head 204, temperature sensor 205, lower connecting block 206 and thermal insulation board 207.Wherein, magnet 201 one end is adsorbed on keyset 103 lower end, and one end is arranged in the circular hole on contiguous block 202, and pressure head component 2 is fixedly connected with guidance set 1.Contiguous block 202 is fixed on contiguous block 203, and thermal insulation board 207 is arranged symmetrically between upper lower connecting block by screw thread, in experimentation, play heat-blocking action, avoids high temperature on the impact of experiment.Pressure head 204 is fixed on lower connecting plate 206, and temperature sensor 205 is positioned in pressure head 204, is convenient to the situation of change of temperature in real-time monitoring experiment process.
During work, first turning multidiameter 101 and make upper spring be in micro-compressive state, being put on workbench by needing the chip of compacting, start power supply, whole U-shaped backboard 102 moves downward under the driving of single axis robot, simultaneously pressure head 2 guidance set 1 auxiliary under, linearity during motion is very high.When pressure head 204 encounters push-down head, due to pressure effect, keyset 103 and pressure head component 2 are up moved, slide block 106 upward sliding on line slideway 105 simultaneously, optical axis 104, sliding without in oily lining, both ensure that the linearity of pressure head, extends again the life-span of mechanism.Under the prerequisite that now upper spring contracts in minute-pressure, then second compression.When upper spring is compressed to operating pressure, pause the several seconds, then, single axis robot drives whole U-shaped backboard 102 to move upward, return to initial position, complete hot pressing, in whole test, U-shaped backboard is under the driving of single axis robot, and the linearity of motion is high, add the guide effect of guidance set, in whole process, the linearity of ram movement is very good, realizes the accurate control to pressure simultaneously, can realize high-precision test by double-spring structure.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a hot-press arrangement, for carrying out hot pressing to conducting resinl in back bonding equipment, is characterized in that, this hot-press arrangement comprises:
Pressure head component (2), for carrying out hot pressing to conducting resinl;
Guidance set (1), it is arranged on a supporting base (4), described pressure head component (2) is arranged on this guidance set (1), and described pressure head component (2) carries out guiding movement to complete hot pressing by this guidance set (1);
Driven unit (5), it is arranged on described guidance set (1) side, for driving described guidance set (1) to move linearly, to realize its guiding movement to pressure head component (2);
Wherein, described guidance set (1) comprise as bracing frame U-shaped plate (102) and can with the keyset (103) of this U-shaped plate (102) movement, described pressure head component (2) is connected with described keyset (103), described driven unit (5) moves by driving described U-shaped plate (102) and keyset (103), and then realizes driving described pressure head component (2) mobile.
2. a kind of hot-press arrangement according to claim 1, wherein, described U-shaped plate (102) comprises the baffle plate being positioned at middle backboard and being vertically set on these backboard two ends, wherein this backboard is fixedly installed line slide rail (105) with can the slide block (106) that slides of relative this line slide rail (105), described keyset (103) is fixedly connected with this slide block (106), and described keyset (103) realizes with this U-shaped plate (102) mobile by this slide block (106).
3. a kind of hot-press arrangement according to claim 2, wherein, described guidance set (1) also has optical axis (104), its be arranged symmetrically with and with two of described line slide rail (105) axis being parallel, one end of each optical axis (104) is all fixed on one of them baffle plate of above-mentioned U-shaped plate (102), the other end stretches out through behind the hole on described keyset (103), described keyset (103) can relatively described optical axis (104) move axially, during for driving pressure head component (2) mobile at keyset (103), it is led.
4. a kind of hot-press arrangement according to claim 3, wherein, described two optical axises (104) are socketed with spring respectively, spring one end is connected to keyset (103) side, the other end is connected on the baffle plate of optical axis (104) stiff end, carries out cushioning when hot pressing and promote described keyset (103) and slide block (106) realizes oppositely movement along described line slide rail (105) for pressure head component (2).
5. a kind of hot-press arrangement according to claim 4, wherein, described guidance set (1) also has a multidiameter (101), one end that its diameter is less is fixedly connected with described keyset (103), for leading to the reverse movement of described keyset (103) through after another baffle plate of above-mentioned U-shaped plate (102).
6. a kind of hot-press arrangement according to claim 5, wherein, described multidiameter (101) is also socketed with spring, cushion for during described keyset (103) reverse mobile, and realize the pretension to described keyset (103) by this spring.
7. a kind of hot-press arrangement according to any one of claim 1-6, wherein, described pressure head component (2) comprises connecting plate (202), be fixedly installed on the upper contiguous block (203) of this connecting plate (202) bottom, with described upper contiguous block (203) by thermal insulation board (207) every hot linked lower connecting block (206), magnet (201) is equipped with in described connecting plate (202), it is for being connected with keyset (103) lower end magnetic, and described lower connecting block (206) lower end is provided with pressure head.
8. a kind of hot-press arrangement according to any one of claim 1-6, wherein, described driven unit (5) is preferably single axis robot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310095073.9A CN103280412B (en) | 2013-03-22 | 2013-03-22 | For the hot-press arrangement of anisotropy conductiving glue in a kind of back bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310095073.9A CN103280412B (en) | 2013-03-22 | 2013-03-22 | For the hot-press arrangement of anisotropy conductiving glue in a kind of back bonding equipment |
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| Publication Number | Publication Date |
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| CN103280412A CN103280412A (en) | 2013-09-04 |
| CN103280412B true CN103280412B (en) | 2015-09-23 |
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| KR20210022236A (en) * | 2019-08-19 | 2021-03-03 | 삼성디스플레이 주식회사 | Bonding device |
| CN113500337B (en) * | 2021-07-20 | 2023-03-31 | 东风汽车股份有限公司 | Multi-vehicle-type shared workpiece transfer machine gravity center adjusting mechanism |
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| TWI275152B (en) * | 2006-04-12 | 2007-03-01 | Wintek Corp | Package structure and method of optical display |
| CN102655099B (en) * | 2012-04-24 | 2014-10-29 | 华中科技大学 | Pneumatic hot-press device |
| CN203205388U (en) * | 2013-03-22 | 2013-09-18 | 华中科技大学 | Hot pressing apparatus for anisotropy conductive adhesive in flip-chip bonding device |
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