CN103280253B - Anticorona semiconductor mica tape, preparation method and usage of anticorona semiconductor mica tape - Google Patents
Anticorona semiconductor mica tape, preparation method and usage of anticorona semiconductor mica tape Download PDFInfo
- Publication number
- CN103280253B CN103280253B CN201310208502.9A CN201310208502A CN103280253B CN 103280253 B CN103280253 B CN 103280253B CN 201310208502 A CN201310208502 A CN 201310208502A CN 103280253 B CN103280253 B CN 103280253B
- Authority
- CN
- China
- Prior art keywords
- anticorona
- semiconductor
- layer
- mica tape
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 137
- 239000010445 mica Substances 0.000 title claims abstract description 112
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 112
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000004744 fabric Substances 0.000 claims abstract description 76
- 239000002002 slurry Substances 0.000 claims abstract description 71
- 239000010410 layer Substances 0.000 claims abstract description 70
- 239000012790 adhesive layer Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 30
- 239000000835 fiber Substances 0.000 claims abstract description 16
- 238000004804 winding Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 30
- 229920001296 polysiloxane Polymers 0.000 claims description 30
- 238000007711 solidification Methods 0.000 claims description 23
- 230000008023 solidification Effects 0.000 claims description 23
- 239000003365 glass fiber Substances 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 19
- 230000001070 adhesive effect Effects 0.000 abstract description 19
- 229910000831 Steel Inorganic materials 0.000 abstract description 4
- 239000010959 steel Substances 0.000 abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052799 carbon Inorganic materials 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 12
- 239000011521 glass Substances 0.000 description 9
- 238000012856 packing Methods 0.000 description 7
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical class CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 208000002173 dizziness Diseases 0.000 description 1
- 238000002635 electroconvulsive therapy Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 229920006150 hyperbranched polyester Polymers 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Paper (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an anticorona semiconductor mica tape. The anticorona semiconductor mica tape sequentially comprises a fiber cloth layer (1), a semiconductor slurry layer (2), an adhesive layer (3) and a mica paper layer (4) from bottom to top. A preparation method of the anticorona semiconductor mica tape comprises the steps that fiber cloth is coated by semiconductor slurry, anticorona base materials which are formed by the fiber cloth layer (1) and the semiconductor slurry layer (2) are formed after the semiconductor slurry is solidified, the anticorona base materials are coated by adhesive, then mica paper is compounded, and the anticorona semiconductor mica tape is prepared after the mica paper is solidified. The anticorona semiconductor mica tape has the advantages of being excellent in anticorona performance, high in electric strength and temperature resistance grade, soft and dry after being solidified, small in thickness, high in binding force, not prone to layering, and free of carbon deposition after being combusted. The anticorona semiconductor mica tape is suitable for manufacturing coil winding wires of machines such as anticorona fireproof lifesaving wires and cables, anticorona high-speed traction motors, steel rolling motors, transformers and generators.
Description
Technical field
The present invention relates to a kind of anticorona semiconductor mica tape, preparation method and its usage.
Background technology
At present, large and middle size motor will obtain excellent performance and be generally adopted by continuous wrap-around insulation, insulating materials
Main body is exactly mica tape.With scientific and technological progress, express locomotive traction electric machine, steel mill electric machine, OVDT open-type transformer and high pressure
Generator etc. is proposed higher requirement to the various aspects of insulating materials：Energy-saving and frequency-variable, high output, volume-diminished, insulation
Thickness degree reduces, anticorona, electrical strength is higher, service life is longer.This mica tape there is no manufacturer production both at home and abroad, and it leads
Relate to many problems such as ground, anticorona inorganic agent, adhesive and belt making process.
At present, mostly common anticorona mica tape is to make list using mica paper, corona-resistant polyimide film or glass cloth
Face or two-sided reinforcement, " three-in-one " structure being bonded through adhesive.CN 101961935A discloses a kind of few glue of Inverter fed motor
Mica tape, it includes mica paper layer, corona-resistant polyimide film layer, is attached on described mica paper layer and corona-resistant polyimide
Adhesive-layer between film layer, described adhesive-layer is coated on two faces of alkali-free glass cloth by adhesive and is formed, described adhesive
Mixed by the component of following weight proportion：40～80 parts of number-average molecular weight 20000～50000 Hyperbranched Polyester Resin；Ring
20～40 parts of oxygen tree fat；50～120 parts of organic solvent；0.1～1 part of accelerator；0.2～5 part of fumed silica, described rush
Entering agent is metal salt of organic carboxylic acid, acetyl acetone salt or their mixture.This insulating materials suffers from the drawback that：Poly-
The Inverter fed motor of imide membrane process be a kind of through the high-tension shock treatment of high-frequency, complex process, energy consumption is higher, produces into
This is higher.Conventional adhesive mostly is unsaturated polyester-imide system resin, epoxy-resin systems and modified epoxy.These
Adhesive need to be improved in the performance of the aspect such as temperature resistant grade and holding power.
Another kind of anticorona method be coil after insulation processing, partly lead in coil straight line portion brush low-resistance epoxy resin
Body paint and high resistant alkyd semiconductor varnish, when semiconductor varnish is also dry, put down around glass-fiber-fabric in outer layer, again in glass after being heating and curing
Brush low resistance semiconductor paint and high-resistance semi-conductor paint outside cloth.Finally, except coil carry out anticorona process outer, iron core offline front and also
Need to carry out spraying low resistance semiconductor paint, slot wedge and slot filler all must adopt semiconducting glass silk fabric board.This anticorona process side
Method, substantially but technique is loaded down with trivial details for effect.
Content of the invention
An object of the present invention is to provide a kind of anticorona semiconductor mica tape, using organosilicon（Or other high score
Sub- material）Slurry makes semiconductor slurry layer, and high from holding power, temperature resistant grade height, good electric property silicones is as glue
Glutinous agent, anti-corona effect excellent for semiconductor layer is united two into one with high-temperature insulation mica tape, enables prepared mica tape same
When meet each side such as anticorona, high temperature resistant, thickness of insulating layer is little, electrical strength is high require.
In order to achieve the above object, present invention employs following technical scheme：
A kind of anticorona semiconductor mica tape, includes scrim cloth, semiconductor slurry layer, adhesive layer from bottom to top successively
And mica paper layer.
Anticorona semiconductor mica tape of the present invention includes anticorona ground, mica paper layer and anticorona ground and cloud
Adhesive layer between female ply of paper, described anticorona ground is made up of scrim cloth and semiconductor slurry layer.
The material of described scrim cloth be glass-fiber-fabric, PET film, PI film, PC film, nylon fabric, polyvinyl chloride fibre fabric or
Any one in acrylic fabric, preferably glass-fiber-fabric, further preferred alkali-free glass fiber cloth.
The material of described adhesive layer is silicones, acrylic resin, in polyurethane or epoxy resin any one or
The mixture of person at least two, described silicones has the advantages that holding power is high, temperature resistant grade is high, good electric property, overcomes
Existing anticorona mica tape is temperature resistant grade is low and the poor shortcoming of holding power.
Semiconductor slurry layer of the present invention is known materials, its essence is and semi-conductor powder material is mixed in resin
The slurry obtaining, the material of described semiconductor slurry layer is organosilicon semiconductor slurry, acrylic resin semiconductor slurry, poly- ammonia
In ester semiconductor slurry or epoxy resin semiconductor slurry any one or at least two mixture.Described organosilicon half
Conductor paste is existing material, its essence is by semi-conductor powder material be mixed in organic siliconresin obtained from slurry.
The material of described mica paper layer is natural mica paper or synthetic mica paper.Described natural mica paper and synthetic mica paper
All it is available commercially.
The exemplary a kind of anticorona semiconductor mica tape of the present invention includes scrim cloth, semiconductor slurry from bottom to top successively
The bed of material, adhesive layer and mica paper layer, described scrim cloth is alkali-free glass fiber cloth, and described semiconductor slurry layer is partly led for organosilicon
Somaplasm material, adhesive layer is silicones.
The second object of the present invention is to provide a kind of preparation method of anticorona as above semiconductor mica tape, institute
The method of stating comprises the steps：
（1）Semiconductor slurry is applied on fiber cloth；
（2）It is coated with the fiber cloth solidification of semiconductor slurry, formation is made up of scrim cloth and semiconductor slurry layer
Anticorona ground；
（3）On anticorona ground, coating adhesive is as adhesive layer；
（4）Mica paper is combined with the anticorona ground being coated with adhesive；
（5）By step（4）Product solidified after compound, prepare anticorona semiconductor mica tape.
Methods described is coating semiconductor slurry in fiber cloth, after making anticorona ground after heated baking and curing,
On anticorona ground（The side of semiconductor slurry layer）Coating adhesive is as adhesive layer, then compound on adhesive layer
Mica paper, is obtained anticorona semiconductor mica tape after heating, drying solidification.
Step（3）In on anticorona ground apply adhesive, that is, in the side of the semiconductor slurry layer of anticorona ground
Coating adhesive, includes the anti-of scrim cloth, semiconductor slurry layer, adhesive layer and mica paper layer from bottom to top successively to be formed
Corona semiconductor mica tape.
Described fiber cloth is glass-fiber-fabric, PET film, PI film, PC film, nylon fabric, polyvinyl chloride fibre fabric or acrylic fabric
In any one, preferably glass-fiber-fabric, further preferred alkali-free glass fiber cloth.
Described adhesive is any one or at least two in silicones, acrylic resin, polyurethane or epoxy resin
The mixture planted, described silicones has the advantages that holding power is high, temperature resistant grade is high, good electric property, overcomes existing anti-
Corona mica tape is temperature resistant grade is low and the poor shortcoming of holding power.
Semiconductor slurry layer of the present invention is known materials, its essence is and semi-conductor powder material is mixed in resin
The slurry obtaining, the material of described semiconductor slurry layer is organosilicon semiconductor slurry, acrylic resin semiconductor slurry, poly- ammonia
In ester semiconductor slurry or epoxy resin semiconductor slurry any one or at least two mixture.Described organosilicon half
Conductor paste is existing material, its essence is by semi-conductor powder material be mixed in organic siliconresin obtained from slurry.
Described mica paper is natural mica paper or synthetic mica paper.Described natural mica paper and synthetic mica paper are all commercially available
Obtain.
Preferably, by 5～30g/m2Spread semiconductor slurry is applied on fiber cloth, preferably press 8～30g/m2Upper
Glue amount applies semiconductor slurry in fiber cloth, further preferably presses 10～30g/m2Spread apply in fiber cloth and partly lead
Somaplasm material.Described spread is, for example, 7g/m2、12g/m2、15g/m2、18g/m2、21g/m2、23g/m2、25g/m2、27g/m2、
29g/m2.
Step（2）Described solidification temperature is 50～180 DEG C, preferably 55～175 DEG C, further preferred 60～170 DEG C.Described
For example, 62 DEG C of solidification temperature, 70 DEG C, 75 DEG C, 80 DEG C, 90 DEG C, 100 DEG C, 110 DEG C, 120 DEG C, 130 DEG C, 140 DEG C, 150 DEG C,
160℃、165℃.
Step（2）Described hardening time is 2～10 minutes, such as 3 minutes, 4 minutes, 5 minutes, 6 minutes, 7 minutes, 8 points
Clock, 9 minutes, preferably 2.5～9.5 minutes, further preferred 3～9 minutes.
10～50g/m is pressed on anticorona ground2Spread coating adhesive, preferably press 15～50g/m2Spread
Coating adhesive, further preferably presses 20～50g/m2Spread coating adhesive.Described spread is, for example, 12g/m2、
15g/m2、18g/m2、21g/m2、23g/m2、25g/m2、27g/m2、29g/m2、32g/m2、35g/m2、40g/m2、42g/m2、45g/
m2、48g/m2.
By compound, mica paper is combined with the anticorona ground being coated with adhesive.
Step（5）Described solidification temperature is 50～180 DEG C, preferably 55～175 DEG C, further preferred 60～170 DEG C.Described
For example, 62 DEG C of solidification temperature, 70 DEG C, 75 DEG C, 80 DEG C, 90 DEG C, 100 DEG C, 110 DEG C, 120 DEG C, 130 DEG C, 140 DEG C, 150 DEG C,
160℃、165℃.
Step（5）Described hardening time is 2～10 minutes, such as 3 minutes, 4 minutes, 5 minutes, 6 minutes, 7 minutes, 8 points
Clock, 9 minutes, preferably 2.5～9.5 minutes, further preferred 3～9 minutes.
Preferably, by step（5）The anticorona semiconductor mica tape winding obtaining, cuts discoid finished-product material, then
Carry out finished product packing.
The preparation method of exemplary a kind of anticorona semiconductor mica tape, methods described comprises the steps：
（1’）By 5～30g/m2Spread fiber cloth apply semiconductor slurry；
（2’）It is coated with the fiber cloth solidification of semiconductor slurry, described solidification temperature is 50～180 DEG C, during described solidification
Between be 2～10 minutes, form the anticorona ground that is made up of scrim cloth and semiconductor slurry layer；
（3’）By 10～50g/m2Spread adhesive is applied on anticorona ground as adhesive layer；
（4’）By compound, mica paper is combined with the anticorona ground being coated with adhesive；
（5’）By step（4’）Product solidified after compound, described solidification temperature is 50～180 DEG C, and described hardening time is
2～10 minutes, prepare anticorona semiconductor mica tape.
The preparation method of exemplary a kind of anticorona semiconductor mica tape, methods described comprises the steps：
（1’’）By 5～30g/m2Spread organic silicon semiconductor slurry is applied on alkali-free glass fiber cloth；
（2’’）It is coated with the scrim cloth solidification of organosilicon semiconductor slurry, described solidification temperature is 50～180 DEG C,
Described hardening time is 2～10 minutes, forms the anticorona ground being made up of scrim cloth and semiconductor slurry layer, wherein, institute
Stating scrim cloth is alkali-free glass fiber cloth, and described semiconductor slurry layer is organosilicon semiconductor slurry；
（3’’）By 10～50g/m2Spread silicones is applied on anticorona ground as adhesive layer；
（4’’）By compound, mica paper is combined with the anticorona ground being coated with silicones；
（5’’）By step（4’’）Product solidified after compound, described solidification temperature is 50～180 DEG C, described hardening time
For 2～10 minutes, prepare anticorona semiconductor mica tape, described anticorona semiconductor mica tape, wrap successively from bottom to top
Include scrim cloth, semiconductor slurry layer, adhesive layer and mica paper layer, described scrim cloth is alkali-free glass fiber cloth, described partly leads
The somaplasm bed of material is organosilicon semiconductor slurry, and adhesive layer is silicones；
（6’’）By step（5’’）The anticorona semiconductor mica tape winding obtaining, cuts discoid finished-product material, then
Carry out finished product packing.
The third object of the present invention is to provide a kind of purposes of anticorona as above semiconductor mica tape, described anti-
Corona semiconductor mica tape is used for anticorona fire resisting lifesaving electric wire, anticorona high-speed pulling motor, steel mill electric machine, transformer
Preparation with the coil windings line of generator.
Compared with prior art, the present invention has the advantages that：
（1）The thickness of anticorona semiconductor mica tape of the present invention is 0.1～0.25mm, semiconductor slurry content 2
～10%, SDA～120 silicones contents 6～30%, temperature resistant grade H level or C level, dielectric strength is 15～20kV/mm；
（2）Anticorona performance and mica tape performance are combined together by the present invention, the advantage having the two concurrently：Anticorona, resistance to
High temperature, insulation, thickness is little and electrical strength is high；
（3）Anticorona semiconductor mica tape of the present invention has anticorona excellent performance, electrical strength height, temperature resistant grade
Soft, dry and comfortable after high, solidification, thickness is little, cohesive force is difficult by force layering, the advantages of do not analyse carbon after burning；
（4）Anticorona semiconductor mica tape of the present invention integrates anticorona performance, insulating properties and heat-resisting quantity,
Improve overall performance and the service life of insulating materials, be a kind of new insulation material having broad mass market prospect, be suitable for
In anticorona fire resisting lifesaving electric wire and anticorona high-speed pulling motor, steel mill electric machine, transformer and generators and other machines
The making of coil windings line.
Brief description
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
Fig. 1：The structural representation of the anticorona semiconductor mica tape of the present invention.
Fig. 2：Anticorona ground manufacture craft schematic diagram；
Fig. 3：Combination process schematic diagram.
Mark as follows in description of the invention accompanying drawing：
1- scrim cloth 2- semiconductor slurry layer 3- adhesive layer 4- mica paper layer
5- glass-fiber-fabric 6- sizing roller 7- pressure roller 8- drying tunnel 9- wrap-up
10- anticorona ground 11- mica paper 12- upper glue roller.
Specific embodiment
For the present invention is better described, readily appreciate technical scheme, the present invention's is typical but non-limiting
Embodiment is as follows：
Embodiment 1
As shown in figure 1, a kind of described anticorona semiconductor mica tape, include scrim cloth 1, semiconductor from bottom to top successively
Pulp layer 2, adhesive layer 3 and mica paper layer 4.Described glass fabric layer 1 is alkali-free glass fiber cloth, and described semiconductor slurry layer 2 is to have
Machine silicon semiconductor slurry, described adhesive layer 3 is SDA-120 silicones, and described mica paper layer 4 is natural mica paper.
The preparation method of described anticorona semiconductor mica tape is：
On alkali-free glass fiber cloth, by 5g/m2Spread apply organic silicon semiconductor slurry, baking and curing in 80 DEG C of environment
3min obtains anticorona ground；Press 10g/m again2Spread SDA-120 silicones is applied on anticorona ground as adhesive
Layer 3；By compound, natural mica paper is combined with the anticorona ground being coated with SDA-120 silicones；Dry in 100 DEG C of environment
Solidification 5min obtains anticorona semiconductor mica tape；By the anticorona semiconductor mica tape winding being obtained, cut discoid finished product material
Material, then finished product packing.
Embodiment 2
As shown in figure 1, a kind of described anticorona semiconductor mica tape, include scrim cloth 1, semiconductor from bottom to top successively
Pulp layer 2, adhesive layer 3 and mica paper layer 4.Described glass fabric layer 1 is alkali-free glass fiber cloth, and described semiconductor slurry layer 2 is to have
Machine silicon semiconductor slurry, described adhesive layer 3 is SDA-120 silicones, and described mica paper layer 4 is natural mica paper.
The preparation method of described anticorona semiconductor mica tape is：
On alkali-free glass fiber cloth, by 10g/m2Spread apply organic silicon semiconductor slurry, dry solid in 100 DEG C of environment
Change 5min and obtain anticorona ground；Press 30g/m again2Spread SDA-120 silicones is applied on anticorona ground as gluing
Oxidant layer 3；By compound, natural mica paper is combined with the anticorona ground being coated with SDA-120 silicones, dries in 100 DEG C of environment
Solidization 6min obtains anticorona semiconductor mica tape；By the anticorona semiconductor mica tape winding being obtained, cut discoid finished product
Material, then finished product packing.
Embodiment 3
As shown in figure 1, a kind of described anticorona semiconductor mica tape, include scrim cloth 1, semiconductor from bottom to top successively
Pulp layer 2, adhesive layer 3 and mica paper layer 4.Described glass fabric layer 1 is alkali-free glass fiber cloth, and described semiconductor slurry layer 2 is to have
Machine silicon semiconductor slurry, described adhesive layer 3 is SDA-120 silicones, and described mica paper layer 4 is natural mica paper.
The preparation method of described anticorona semiconductor mica tape is：
On alkali-free glass fiber cloth, by 30g/m2Spread apply organic silicon semiconductor slurry, dry solid in 130 DEG C of environment
Change 8min and obtain anticorona ground；Press 50g/m again2Spread SDA-120 silicones is applied on anticorona ground as gluing
Oxidant layer 3；By compound, natural mica paper is combined with the anticorona ground being coated with SDA-120 silicones；Dry in 150 DEG C of environment
Solidization 5min obtains anticorona semiconductor mica tape；By the anticorona semiconductor mica tape winding being obtained, cut discoid finished product
Material, then finished product packing.
Embodiment 4
As shown in figure 1, a kind of described anticorona semiconductor mica tape, include scrim cloth 1, semiconductor from bottom to top successively
Pulp layer 2, adhesive layer 3 and mica paper layer 4.Described glass fabric layer 1 is alkali-free glass fiber cloth, and described semiconductor slurry layer 2 is to have
Machine silicon semiconductor slurry, described adhesive layer 3 is SDA-120 silicones, and described mica paper layer 4 is synthetic mica paper.
The preparation method of described anticorona semiconductor mica tape is：
On alkali-free glass fiber cloth, by 20g/m2Spread apply organic silicon semiconductor slurry, dry solid in 50 DEG C of environment
Change 10min and obtain anticorona ground；Press 25g/m again2Spread SDA-120 silicones is applied on anticorona ground as gluing
Oxidant layer 3；By compound, synthetic mica paper is combined with the anticorona ground being coated with SDA-120 silicones；Dry in 50 DEG C of environment
Solidization 10min obtains anticorona semiconductor mica tape；By the anticorona semiconductor mica tape winding being obtained, cut discoid finished product
Material, then finished product packing.
Embodiment 5
As shown in figure 1, a kind of described anticorona semiconductor mica tape, include scrim cloth 1, semiconductor from bottom to top successively
Pulp layer 2, adhesive layer 3 and mica paper layer 4.Described glass fabric layer 1 is alkali-free glass fiber cloth, and described semiconductor slurry layer 2 is to have
Machine silicon semiconductor slurry, described adhesive layer 3 is SDA-120 silicones, and described mica paper layer 4 is natural mica paper.
The preparation method of described anticorona semiconductor mica tape is：
On alkali-free glass fiber cloth, by 20g/m2Spread apply organic silicon semiconductor slurry, dry solid in 180 DEG C of environment
Change 2min and obtain anticorona ground；Press 25g/m again2Spread SDA-120 silicones is applied on anticorona ground as gluing
Oxidant layer 3；By compound, natural mica paper is combined with the anticorona ground being coated with SDA-120 silicones；Dry in 180 DEG C of environment
Solidization 2min obtains anticorona semiconductor mica tape；By the anticorona semiconductor mica tape winding being obtained, cut discoid finished product
Material, then finished product packing.
The thickness of anticorona semiconductor mica tape of the present invention is 0.1～0.25mm, semiconductor slurry content 2～
10%, SDA～120 silicones contents 6～30%, temperature resistant grade H level or C level, dielectric strength is 15～20kV/mm, has anti-electric
Dizzy excellent performance, electrical strength are high, temperature resistant grade is high, soft, dry and comfortable after solidification, thickness is little, cohesive force is difficult by force layering, burning
The advantages of do not analyse carbon afterwards.
Applicant states, the present invention illustrates the method detailed of the present invention by above-described embodiment, but the present invention not office
It is limited to above-mentioned method detailed, that is, do not mean that the present invention has to rely on above-mentioned method detailed and could implement.Art
Technical staff is it will be clearly understood that any improvement in the present invention, the equivalence replacement to each raw material of product of the present invention and auxiliary element
Interpolation, selection of concrete mode etc., within the scope of all falling within protection scope of the present invention and disclosure.
Claims (14)
1. a kind of preparation method of anticorona semiconductor mica tape it is characterised in that described anticorona semiconductor mica tape under
And on include scrim cloth (1), semiconductor slurry layer (2), adhesive layer (3) and mica paper layer (4) successively, described scrim cloth
(1) it is alkali-free glass fiber cloth, described semiconductor slurry layer (2) is organosilicon semiconductor slurry, adhesive layer (3) is SDA-120 silicon
Resin；
The method comprising the steps of：
(1) press 5～30g/m2Spread organic silicon semiconductor slurry is applied on alkali-free glass fiber cloth；
(2) it is coated with the alkali-free glass fiber cloth solidification of organosilicon semiconductor slurry, described solidification temperature is 50～180 DEG C, described
Hardening time is 2～10 minutes, forms the anticorona ground being made up of scrim cloth (1) and semiconductor slurry layer (2)；
(3) press 10～50g/m2Spread SDA-120 silicones is applied on anticorona ground as adhesive layer (3)；
(4) pass through to be combined to be combined mica paper with the anticorona ground being coated with SDA-120 silicones；
(5) product solidified after being combined step (4), described solidification temperature is 50～180 DEG C, and described hardening time is 2～10
Minute, prepare anticorona semiconductor mica tape；
(6) the anticorona semiconductor mica tape winding obtaining step (5), cuts discoid finished-product material, then carries out finished product
Packaging.
2. the method for claim 1 is it is characterised in that the material of described mica paper layer (4) is natural mica paper or conjunction
Become mica paper.
3. the method for claim 1 is it is characterised in that press 8～30g/m2Spread organosilicon is applied on fiber cloth
Semiconductor slurry.
4. method as claimed in claim 3 is it is characterised in that press 10～30g/m2Spread apply in fiber cloth organic
Silicon semiconductor slurry.
5. the method for claim 1 is it is characterised in that the described solidification temperature of step (2) is 55～175 DEG C.
6. method as claimed in claim 5 is it is characterised in that the described solidification temperature of step (2) is 60～170 DEG C.
7. the method for claim 1 is it is characterised in that step (2) described hardening time is 2.5～9.5 minutes.
8. method as claimed in claim 7 is it is characterised in that step (2) described hardening time is 3～9 minutes.
9. the method for claim 1 is it is characterised in that press 15～50g/m2Spread coating SDA-120 silicones.
10. method as claimed in claim 9 is it is characterised in that press 20～50g/m2Spread coating SDA-120 silicones.
11. the method for claim 1 are it is characterised in that the described solidification temperature of step (5) is 55～175 DEG C.
12. methods as claimed in claim 11 are it is characterised in that the described solidification temperature of step (5) is 60～170 DEG C.
13. the method for claim 1 are it is characterised in that step (5) described hardening time is 2.5～9.5 minutes.
14. methods as claimed in claim 13 are it is characterised in that step (5) described hardening time is 3～9 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310208502.9A CN103280253B (en) | 2013-05-28 | 2013-05-28 | Anticorona semiconductor mica tape, preparation method and usage of anticorona semiconductor mica tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310208502.9A CN103280253B (en) | 2013-05-28 | 2013-05-28 | Anticorona semiconductor mica tape, preparation method and usage of anticorona semiconductor mica tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103280253A CN103280253A (en) | 2013-09-04 |
| CN103280253B true CN103280253B (en) | 2017-02-08 |
Family
ID=49062743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310208502.9A Active CN103280253B (en) | 2013-05-28 | 2013-05-28 | Anticorona semiconductor mica tape, preparation method and usage of anticorona semiconductor mica tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103280253B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103944327A (en) * | 2014-04-16 | 2014-07-23 | 株洲和诚科技有限责任公司 | H-level little-glue glass powder mica tape for special high-voltage motor and manufacturing method of H-level little-glue glass powder mica tape for special high-voltage motor |
| CN104299693A (en) * | 2014-10-31 | 2015-01-21 | 湖南新新线缆有限公司 | Corona-resistant and high-strength polyimide laminated film copper flat wire |
| CN106273815A (en) * | 2016-08-16 | 2017-01-04 | 中车株洲电机有限公司 | A kind of anti-corona composite insulating foil and motor |
| CN108928052B (en) * | 2018-05-29 | 2020-05-12 | 中国科学院过程工程研究所 | High-temperature-resistant flexible elastic sealing gasket and preparation method and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1236215A (en) * | 1998-05-16 | 1999-11-24 | 亚瑞亚·勃朗勃威力有限公司 | High-voltage insulated stator winding |
| CN201084462Y (en) * | 2007-09-14 | 2008-07-09 | 苏州巨峰绝缘材料有限公司 | Corona-resistant less-glue mica tape |
| CN201099804Y (en) * | 2007-09-20 | 2008-08-13 | 卢儒 | Micanite paper sizing machine |
| CN101854100A (en) * | 2010-04-29 | 2010-10-06 | 中国船舶重工集团公司第七一二研究所 | Dry mica paper tape for insulating motor coil and production method thereof |
| CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
| CN202711885U (en) * | 2012-05-29 | 2013-01-30 | 苏州巨峰电气绝缘系统股份有限公司 | High heat conduction and high air permeability little glue mica tape |
| CN203288270U (en) * | 2013-05-28 | 2013-11-13 | 卢儒 | An anti-corona semi-conductor mica tape |
-
2013
- 2013-05-28 CN CN201310208502.9A patent/CN103280253B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1236215A (en) * | 1998-05-16 | 1999-11-24 | 亚瑞亚·勃朗勃威力有限公司 | High-voltage insulated stator winding |
| CN201084462Y (en) * | 2007-09-14 | 2008-07-09 | 苏州巨峰绝缘材料有限公司 | Corona-resistant less-glue mica tape |
| CN201099804Y (en) * | 2007-09-20 | 2008-08-13 | 卢儒 | Micanite paper sizing machine |
| CN101854100A (en) * | 2010-04-29 | 2010-10-06 | 中国船舶重工集团公司第七一二研究所 | Dry mica paper tape for insulating motor coil and production method thereof |
| CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
| CN202711885U (en) * | 2012-05-29 | 2013-01-30 | 苏州巨峰电气绝缘系统股份有限公司 | High heat conduction and high air permeability little glue mica tape |
| CN203288270U (en) * | 2013-05-28 | 2013-11-13 | 卢儒 | An anti-corona semi-conductor mica tape |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103280253A (en) | 2013-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103280253B (en) | Anticorona semiconductor mica tape, preparation method and usage of anticorona semiconductor mica tape | |
| CN101917080B (en) | Epoxy corona-resistant polyimide film glass powder mica tape and preparation method for manufacturing rotor bar of wind driven generator from same | |
| US20080230253A1 (en) | Roebel winding with conductive felt | |
| CN101834011A (en) | Medium and high-voltage power cable water-blocking conductor and manufacturing method thereof | |
| CN105632660B (en) | High heat conduction low resin mica tape and preparation method thereof | |
| CN103440902B (en) | Be applicable to high-permeability mica tape of pure epoxy VPI insulating resin and preparation method thereof | |
| CN102394125A (en) | Self-adhesive glassfiber wrapped enameled flat copper wire for wind driven generator | |
| CN203288270U (en) | An anti-corona semi-conductor mica tape | |
| CN108376577B (en) | PVF/B self-adhering transposed conductor and preparation method thereof | |
| CN101207312B (en) | Interface strap for generator coil die stamping insulation and production method thereof | |
| CN209657840U (en) | A kind of wrapped sintering copper flat wire of ultrathin type dual-polyester glass fiber | |
| JP2017106032A (en) | Reaction accelerator for copolymerization, electrical-insulation tape, electrical-insulation body, and consolidation body | |
| CN104448705A (en) | Preparation method of nanomaterial modified DMD soft composite | |
| CN113824235B (en) | 10 kV-level motor insulation system | |
| CN202772691U (en) | Metal coil | |
| CN202058488U (en) | Heatproof reinforced mesh belt binding transposed wire | |
| CN206271462U (en) | Electric automobile direct current quick charging cable | |
| CN101894625A (en) | Double-insulated layer copper flat wire and method for manufacturing same | |
| CN101694806B (en) | Waterproof polyimide sintered membrane-covered transposition conductor | |
| CN209692455U (en) | A kind of anti-breakdown rotor | |
| CN106782831A (en) | A kind of high-performance refractory mica tape | |
| CN101804715A (en) | Method for manufacturing electric flexible polyester composite material | |
| CN105398141B (en) | High-thermal-conductivity insulation winding belts and preparation method thereof | |
| CN206332526U (en) | A kind of lenticular wire motor stator slot insulation structure | |
| CN207265765U (en) | A kind of side's copper wire motor stator structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180730 Address after: 226009 31 Tongwang Road, Nantong Economic Development Zone, Jiangsu Patentee after: Shengda Technology (Nantong) Co., Ltd. Address before: 214135 Jiangsu science and Technology Park 530, Qingyuan Road, No. 18 Qingyuan Road, Wuxi New District, Wuxi, A908 Patentee before: Lu Ru |
|
| TR01 | Transfer of patent right |