CN103278103A - Method and device for measuring thin substrate deformation - Google Patents
Method and device for measuring thin substrate deformation Download PDFInfo
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- CN103278103A CN103278103A CN2013101878466A CN201310187846A CN103278103A CN 103278103 A CN103278103 A CN 103278103A CN 2013101878466 A CN2013101878466 A CN 2013101878466A CN 201310187846 A CN201310187846 A CN 201310187846A CN 103278103 A CN103278103 A CN 103278103A
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Abstract
The invention relates to a method and a device for measuring thin substrate deformation, belonging to the field of the method and the device for measuring object deformation. The measuring method comprises the following steps of submerging a measured thin substrate into liquid of which the density is close to that of the thin substrate; limiting the thin substrate at a horizontal position in the liquid by adopting a fixing pin; placing a transparent flat plate with high planeness and high parallelism at the junction of the air and the liquid, wherein the upper surface of the transparent flat plate is positioned above the surface of the liquid, and the lower surface of the transparent flat plate is positioned below the surface of the liquid; and scanning and measuring the surface displacement of the thin substrate by adopting an optical displacement sensor. In the measuring device, the optical displacement sensor is fixedly arranged on a vertical translation table through a mounting plate, the thin substrate is supported and limited through three conical pins, and the entire thin substrate is fixed in a solution. Due to the adoption of the method and the device, the influences of the additional deformation of gravity in a thin substrate measuring process are lowered effectively, the deformation of the thin substrate which is small in thickness and is large in planar size can be measured accurately, and the measuring result is accurate and reliable.
Description
Technical field
The invention belongs to measuring method and the device field of deformation of body, be specifically related to measuring method and device to a kind of thin substrate distortion.
Background technology
Thin substrate is the thin plate in the mechanics, and geometric properties is circle, rectangle or other shape, and its gauge is much smaller than planar dimension, and as the major diameter ultra thin silicon wafers in the integrated circuit manufacturing, namely diameter is greater than 200mm, and thickness is less than 0.2mm.Major diameter ultra thin single crystalline sapphire substrate during LED makes, be diameter greater than 100mm, thickness is less than 0.2mm, the size diameter of monocrystal SiC substrate is greater than 3 inches, ultra-thin during thickness is made less than 0.3mm and flat-panel monitor, namely thickness is less than the stainless steel substrate of 0.1mm and glass substrate etc.Thin substrate is easy to generate warpage or flexural deformation in process, in order to detect the machined surface type of thin substrate, perhaps optimize processing technology to reduce machining deformation, need measure the distortion of thin substrate.Because the rigidity of thin substrate is very low, its deformation measurement is subjected to supporting way and external environment, and as the influence of vibration, air-flow and gravity, under the situation that adopts the shielding of vibration isolation and air-flow, the influence of gravity becomes the factor that can not be ignored.When present existing measuring method is measured the substrate distortion, be that thin substrate is vertically lifted placement or 3 vertical placements of radial support etc. with the placement of platform support level, supported at three point horizontal positioned, single-point clamping, warpage or diastrophic thin substrate can produce the annex distortion under the gravity effect, directly influence the result of thin substrate deformation measurement.
Japan Okumura Hirosh is in " silicon warp degree measuring method " patent of invention of JP2002243431A in the patent No., invented supported at three point counter-rotating measuring method, thin substrate is by the supported at three point horizontal positioned, measure the thin substrate of counter-rotating behind the profile pattern on a surface of thin substrate, measure another surperficial profile pattern of thin substrate again.Under the situation that suffered gravity additional deformation is identical when the thin substrate pros and cons of hypothesis is measured, by calculating the thin substrate surface profile pattern of agravic additional deformation, determine the distortion of thin substrate.During the method operating cost, and the Support Position when requiring twice of thin substrate pros and cons to measure is identical, cannot say for sure card in the practical operation, and in addition because substrate tow sides machining stress state difference, the gravity additional deformation is also different.The people such as Kanzaki Toyoki of Japan are in " method measuring flatness and device " patent of invention of JP2000234919A in the patent No., have invented a kind of method of utilizing the transparent and translucent object flatness of interferometer measurement.In the measurement testee is partly immersed in the liquid, the upper surface of testee is in air, and lower surface is in liquid.When adopting the method to measure deformation of body, need the object measured surface on liquid surface, can't measure less and the thin substrate that area is bigger of thickness; And, because testee partly immerses in the liquid and can be subjected to the surface tension of liquid effect, introduce the surface tension additional deformation.Therefore, the measuring method that need reduce or eliminate gravity additional deformation and elimination surface tension of liquid additional deformation is measured thin substrate distortion exactly.
Summary of the invention
The present invention is directed to the technical barrier of thin substrate deformation measurement and the shortcoming of existing measuring technique, invent a kind of thin substrate warpage or flexural deformation measuring method and device that reduces the influence of gravity additional deformation.The present invention is immersed in thin substrate in the liquid that density approaches with it, overcome gravity effect by means of liquid buoyancy, thereby effectively reduce the gravity additional deformation in the thin substrate deformation measurement, eliminate the influence of surface tension of liquid simultaneously, guarantee measurement result accurately and reliably.
The technical solution adopted in the present invention is a kind of measuring method and device of thin substrate distortion, in the measuring method, measured thin substrate is immersed in the liquid that density approaches with it, adopt fixed pin to limit the horizontal level of thin substrate in liquid, between sensor and thin substrate, transparent plate is installed, as glass, quartzy, plane optical windows such as sapphire, the transparent plate upper surface is on liquid surface, the transparent plate lower surface is under liquid surface, transparent plate by air and liquid intersection is eliminated liquid surface fluctuation, adopt the surface displacement of the thin substrate of optical displacement sensor scanning survey, carry out the scanning survey of thin substrate surface displacement by the computer control two-dimension moving platform, according to the coordinate figure of two-dimension moving platform and the reading of optical displacement sensor, use software to fit to thin substrate surface three-dimensional appearance figure, calculate and determine actual warpage and the flexural deformation of thin substrate, the concrete steps of measuring method are as follows:
(1) configuration solution 5, the density of solution 5 is ρ
s, the volume of thin substrate 2 is V, density is ρ
f, the gravity of thin substrate 2 is ρ
fGV, when being immersed in thin substrate 2 integral body in the solution 5, the buoyancy that thin substrate is subjected in liquid is ρ
sGV, thin substrate 2 suffered making a concerted effort are: ρ
fGV-ρ
sGV, when both density near the time, thin substrate 2 because of the additional deformation that is subjected to gravity and produces greatly degree reduce;
(2) thin substrate 2 integral body are immersed in the above-mentioned solution 5, thin substrate is by three tapered pin 6 support limit;
(3) optical displacement sensor 1 is installed in the top of thin substrate 2, and transparent plate 3 is installed between sensor and the thin substrate 2, and transparent plate 3 upper surfaces are on liquid surface, and transparent plate 3 lower surfaces are under liquid surface;
(4) measure the vertical translation stage 9 of the preceding adjusting of beginning and make thin substrate 2 be positioned at optical displacement sensor 1 measurement range, motion platform 7 carries out X, Y-direction two dimensional motion, the whole thin substrate of optical displacement sensor 1 scanning survey 2 surfaces according to the track of setting.
(5) according to the coordinate figure of two-dimension moving platform and the reading of optical displacement sensor, use software to fit to thin substrate surface three-dimensional appearance figure, actual warpage and the flexural deformation of calculating and definite substrate.
In the measurement mechanism that this measuring method adopts, optical displacement sensor 1 is fixed on the vertical translation stage 9 by installing plate 4, and vertically translation stage 9 is fixed on the two-dimension moving platform 7; Solution 5 is housed in the groove 8, and thin substrate 2 is by three tapered pin 6 support limit, and overall fixed is in solution 5, and transparent plate 3 is fixed on the installing plate 4, and transparent plate 3 upper surfaces are on solution 5 surfaces, and transparent plate 3 lower surfaces are under solution 5 surfaces.When the planar dimension of thin substrate 2 hour, adopt planar dimension greater than the transparent plate 10 of thin substrate 2, transparent plate 10 is by support bar 11 support limit, transparent plate 10 upper surfaces are on solution 5 surfaces, transparent plate 10 lower surfaces are under solution 5 surfaces.
The solution 5 that this method adopts is zinc chloride salt solusion, metatungstic acid lithium salt solution or metatungstic acid sodium salt solution; Optical displacement sensor 1 is laser triangulation sensor, laser co-focusing sensor or white light confocal sensor; Transparent plate is the flat board of high flatness and the depth of parallelism, and dull and stereotyped thickness guarantees that it has enough rigidity.Transparent plate is transparent to the light beam of optical sensor, and material is even, can adopt optical windows such as glass, quartz, sapphire.
The invention has the beneficial effects as follows adopt above-mentioned measuring method of the present invention and measurement mechanism after, can reduce the influence of gravity additional deformation in the thin substrate measuring process, can accurately measure less and the thin substrate distortion that planar dimension is bigger of thickness, measurement result is accurately and reliably.
Description of drawings
Fig. 1 is that the measurement mechanism of thin substrate distortion is always schemed, and Fig. 2 is the local figure of thin substrate deformation measuring device when adopting the small size transparent plate, and Fig. 3 is the local figure of thin substrate deformation measuring device when adopting large-area transparent dull and stereotyped.Wherein: 1 is optical displacement sensor, and 2 is thin substrate, and 3 is transparent plate, 3a is transparent plate 3 upper surfaces, and 3b is transparent plate 3 lower surfaces, and 4 is installing plate, 5 is solution, and 5a is solution 5 liquid levels, and 6 is tapered pin, 7 is two-dimension moving platform, and 8 is groove, and 9 is vertical translation stage, 10 is transparent plate, and 11 is support bar, and 12 is worktable, 13 is right column, and 14 is right balladeur train.
Fig. 4 is measurement mechanism scanning pattern synoptic diagram, and X, Y are coordinate axis.
Embodiment
Below in conjunction with accompanying drawing and technical scheme the specific embodiment of the present invention is done to describe in further detail.Accompanying drawing 1, the 2nd, embodiments of the invention 1, optical displacement sensor 1 adopts the laser triangulation displacement transducer, thin substrate 2 is the attenuate silicon chip, optical displacement sensor 1 is fixed on the vertical translation stage 9 by installing plate 4, regulate the position of vertical displacement platform 9 before measuring, thin substrate 2 is within the measurement range of optical displacement sensor 1.Vertically translation stage 9 is fixed on the two-dimension moving platform 7, and in two-dimension moving platform 7, right balladeur train 14 can be mobile at right column 13, and right column 13 is installed on the worktable 12; Solution 5 adopts liquor zinci chloridi, is contained in the groove 8, and allotment solution 5 solute concentrations make its density near the density of thin substrate 2, and thin substrate 2 is positioned in the solution 5, is supported limiting by three tapered pins 6, and overall fixed is in solution 5.The gravity of thin substrate 2 is: ρ
fGV, the buoyancy that is subjected in solution is: ρ
sGV, thin substrate 2 suffered making a concerted effort are: ρ
fGV-ρ
sGV, when both density near the time, thin substrate 2 suffered gravity additional deformations greatly degree reduce.Thin substrate 2 top air and liquid intersection are placed transparent plate 3,, transparent plate 3 is the glass plate of high flatness and the depth of parallelism, has certain thickness, dull and stereotyped thickness guarantees that it has enough rigidity.The light beam of 3 pairs of optical sensors 1 of transparent plate is transparent, and material is even.Transparent plate 3 is fixed on the installing plate 4, and transparent plate 3 upper surface 3a are on liquid level 5a, and transparent plate 3 lower surface 3b are in solution 5.Transparent plate 3 can be eliminated liquid surface fluctuation to the influence of beam propagation, makes measurement result more reliable and more stable.
Two-dimension moving platform 7 carries out X, Y-direction two dimensional motion according to the track of setting, the thin substrate of optical displacement sensor 1 scanning survey 2 surfaces, earlier along Y-direction scanning attenuate silicon chip, after arriving the edge, along the X-direction motion scan at interval, along Y-direction scanning attenuate silicon chip, repeat above-mentioned steps until whole attenuate silicon chip surface scanning is finished again.According to the coordinate figure of two-dimension moving platform and the reading of optical displacement sensor, use software to fit to thin substrate surface three-dimensional appearance figure by computing machine, actual warpage and the flexural deformation of calculating and definite substrate, scanning pattern is as shown in Figure 4.
Accompanying drawing 3 is the present invention thin substrate deformation measurement embodiment when adopting large-area transparent dull and stereotyped, when thin substrate 2 areas hour, adopt large-area transparent dull and stereotyped 10 to measure thin substrate distortion, transparent plate 10 is supported by support bar 11 and limits, overall fixed is in solution 5.Transparent plate 10 keeps static in the measuring process.Other step is identical with a last embodiment.
Measuring method of the present invention is simple and direct, easy to operate, can subdue or remove in the attenuate silicon chip measuring process influence because of the gravity additional deformation, and measurement result accurately and reliably.
Claims (4)
1. the measuring method of a thin substrate distortion, it is characterized in that, measured thin substrate is immersed in the liquid that density approaches with it, adopt fixed pin to limit thin substrate horizontal level in liquid, between sensor and thin substrate, transparent plate is installed, the transparent plate upper surface is on liquid surface, the transparent plate lower surface is under liquid surface, transparent plate by air and liquid intersection is eliminated liquid surface fluctuation, adopt the surface displacement of the thin substrate of optical displacement sensor scanning survey, carry out the scanning survey of thin substrate surface displacement by the computer control two-dimension moving platform, according to the coordinate figure of two-dimension moving platform and the reading of optical displacement sensor, use software to fit to thin substrate surface three-dimensional appearance figure, actual warpage and the flexural deformation of calculating and definite substrate; The concrete steps of measuring method are as follows:
1) configuration solution (5), the density of solution (5) is ρ
sThe volume of thin substrate (2) is V, and density is ρ
f, the gravity of thin substrate (2) is ρ
fGV; When being immersed in thin substrate (2) integral body in the solution (5), the buoyancy that thin substrate is subjected in liquid is ρ
sGV, thin substrate (2) is suffered make a concerted effort be: ρ
fGV-ρ
sGV, when both density near the time, thin substrate (2) reduces because of the additional deformation that produced by gravity;
2) thin substrate is supported by three tapered pins (6), and thin substrate (2) integral body is immersed in the above-mentioned solution (5);
3) optical displacement sensor (1) is installed in the top of thin substrate (2), transparent plate (3) is installed between sensor and the thin substrate (2), transparent plate (3) upper surface is on liquid surface, and transparent plate (3) lower surface is under liquid surface; 4) before the measurement beginning, regulating vertical translation stage (9) makes thin substrate (2) be positioned at optical displacement sensor (1) measurement range, motion platform (7) carries out X, Y-direction two dimensional motion, the whole thin substrate of optical displacement sensor (1) scanning survey (2) surface according to the track of setting;
5) according to the coordinate figure of two-dimension moving platform and the reading of optical displacement sensor, use software to fit to thin substrate surface three-dimensional appearance figure, actual warpage and the flexural deformation of calculating and definite substrate.
2. according to the measuring method of the described a kind of thin substrate distortion of claim 1, it is characterized in that, in the measurement mechanism that this measuring method adopts, optical displacement sensor (1) is fixed on the vertical translation stage (9) by installing plate (4), and vertically translation stage (9) is fixed on the two-dimension moving platform (7); Solution (5) is housed in the groove (8), thin substrate (2) is supported by three tapered pins (6), and overall fixed is in solution (5), transparent plate (3) is fixed on the installing plate (4), transparent plate (3) upper surface is on solution (5) surface, and transparent plate (3) lower surface is under solution (5) surface; When the planar dimension of thin substrate (2) hour, adopt planar dimension greater than the transparent plate (10) of thin substrate (2), transparent plate (10) is by support bar (11) support limit; And transparent plate (10) upper surface is on solution (5) surface, and transparent plate (10) lower surface is under solution (5) surface.
3. according to the measuring method of claim 1 or 2 described a kind of thin substrate distortion, it is characterized in that the solution (5) that this method adopts is zinc chloride salt solusion, metatungstic acid lithium salt solution or metatungstic acid sodium salt solution.
4. according to the measuring method of the described a kind of thin substrate distortion of claim 3, it is characterized in that the optical displacement sensor in the measuring method (1) is laser triangulation sensor, laser co-focusing sensor or white light confocal sensor; Transparent plate adopts glass, quartz or sapphire.
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Cited By (8)
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| CN103499318A (en) * | 2013-10-21 | 2014-01-08 | 中国科学院光电技术研究所 | Method for measuring dead weight deflection of optical element |
| CN104819694A (en) * | 2015-04-14 | 2015-08-05 | 上海大学 | Flexible board-shaped structural form sensing and reconfiguring experiment platform |
| CN105066897A (en) * | 2015-08-13 | 2015-11-18 | 大连理工大学 | Thin substrate deformation measuring method eliminating influence of gravity |
| CN107702675A (en) * | 2017-09-27 | 2018-02-16 | 西安理工大学 | A kind of adaptive support meanss and apply its measuring system |
| CN108458644A (en) * | 2018-05-21 | 2018-08-28 | 东莞塔菲尔新能源科技有限公司 | A kind of pole piece arc degree test device and its workflow |
| CN110530279A (en) * | 2019-06-14 | 2019-12-03 | 广东镭奔激光科技有限公司 | A kind of method and apparatus of the monitoring blade entirety deformation based on laser triangulation |
| CN111457856A (en) * | 2020-05-28 | 2020-07-28 | 合肥工业大学 | Thin substrate deformation measuring device capable of completely eliminating gravity influence |
| CN111699548A (en) * | 2018-03-19 | 2020-09-22 | 东京毅力科创株式会社 | Substrate holding apparatus and shape measuring method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103499318A (en) * | 2013-10-21 | 2014-01-08 | 中国科学院光电技术研究所 | Method for measuring dead weight deflection of optical element |
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| CN104819694A (en) * | 2015-04-14 | 2015-08-05 | 上海大学 | Flexible board-shaped structural form sensing and reconfiguring experiment platform |
| CN105066897A (en) * | 2015-08-13 | 2015-11-18 | 大连理工大学 | Thin substrate deformation measuring method eliminating influence of gravity |
| CN105066897B (en) * | 2015-08-13 | 2018-07-13 | 大连理工大学 | A kind of thin substrate deformation measurement method eliminated gravity and influenced |
| CN107702675A (en) * | 2017-09-27 | 2018-02-16 | 西安理工大学 | A kind of adaptive support meanss and apply its measuring system |
| CN111699548A (en) * | 2018-03-19 | 2020-09-22 | 东京毅力科创株式会社 | Substrate holding apparatus and shape measuring method |
| CN111699548B (en) * | 2018-03-19 | 2023-12-05 | 东京毅力科创株式会社 | Substrate holding apparatus and shape measurement method |
| CN108458644A (en) * | 2018-05-21 | 2018-08-28 | 东莞塔菲尔新能源科技有限公司 | A kind of pole piece arc degree test device and its workflow |
| CN110530279A (en) * | 2019-06-14 | 2019-12-03 | 广东镭奔激光科技有限公司 | A kind of method and apparatus of the monitoring blade entirety deformation based on laser triangulation |
| CN111457856A (en) * | 2020-05-28 | 2020-07-28 | 合肥工业大学 | Thin substrate deformation measuring device capable of completely eliminating gravity influence |
| CN111457856B (en) * | 2020-05-28 | 2021-11-16 | 合肥工业大学 | Thin substrate deformation measuring device capable of completely eliminating gravity influence |
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